Freescale MCF5253 DATA SHEET

Freescale Semiconductor

Data Sheet: Technical Data

MCF5253 ColdFire®

Document Number: MCF5253DS

Rev. 2, 03/2007

MCF5253

Package Information

MAPBGA–225

Microprocessor Data
Sheet

1 Introduction

This document provides an overview of the MCF5253
ColdFire processor and general descriptions of the
MCF5253 features and modules. Also provided are
electrical specifications, pin assignments, and package
diagrams for MCF5253 ColdFire® processor. For
functional characteristics, refer to the MCF5253
Reference Manual (MCF5253RM).

The MCF5253 is a general purpose system controller
with over 125 Dhrystone 2.1 MIPS @ 140 MHz
performance. The integrated peripherals and EMAC
allow the MCF5253 to replace both the microcontroller
and the DSP in certain applications. Most peripheral pins
can also be remapped as general purpose I/O pins.

Ordering Information: See Table 1 on page 2

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 Orderable Part Numbers . . . . . . . . . . . . . . 2

1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . 3

2 Functional Description . . . . . . . . . . . . . . . . . . . 4

2.1 Version 2 ColdFire Core . . . . . . . . . . . . . . . 4

2.2 Module Inventory . . . . . . . . . . . . . . . . . . . . 4

3 Signal Description . . . . . . . . . . . . . . . . . . . . . . 6

4 Electrical Specifications . . . . . . . . . . . . . . . . . 11

4.1 SDRAM Bus Timing . . . . . . . . . . . . . . . . . 14

4.2 SPDIF Timing . . . . . . . . . . . . . . . . . . . . . . 15

4.3 Serial Audio Interface Timing . . . . . . . . . . 16

4.4 DDATA/PST/PSTCLK Debug Interface . . 16

4.5 BDM and JTAG Timing . . . . . . . . . . . . . . 16

5 Package Information and Pinout . . . . . . . . . . 18

5.1 Pin Assignment . . . . . . . . . . . . . . . . . . . . 18

5.2 Package Drawing . . . . . . . . . . . . . . . . . . . 24

6 Product Documentation . . . . . . . . . . . . . . . . . 31

6.1 Revision History . . . . . . . . . . . . . . . . . . . . 31

Low power features include flexible PLL (with
power-down mode) with dynamic clock switching, a
hardwired CD ROM decoder, advanced 0.13 µm CMOS
process technology, 1.2 V core power supply, and
on-chip 128K-byte SRAM.

Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its
products.

© Freescale Semiconductor, Inc., 2007. All rights reserved.

Introduction

For additional information regarding software drivers and applications, refer to

http://www.freescale.com/coldfire.

1.1 Orderable Part Numbers

Table 1 lists the orderable part numbers for the MCF5253 processor.

Table 1. Orderable Part Numbers

Orderable Part

Number

MCF5253VM140 140 MHz 225 MAPBGA -20 to +70°C Lead free

Maximum Clock

Frequency

Package Type

Operating Temperature

Range

Part Status

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

2 Freescale Semiconductor

1.2 Block Diagram

Figure 1 illustrates the functional block diagram of the MCF5253 processor.

Introduction

Instruction

8K

Cache

64K

KRAM1

64K

KRAM0

“Backdoor” Interface

FlexCAN Pins

Debug

Module

with JTAG

ColdFire

CF2 Core

140 MHz

2x FlexCAN

Controller

Standard ColdFire Peripheral Blocks

Timer

I2C

5x08
DMA

5x08

Arbiter

Translator

UART (3)

5x08

Interrupt

E-bus

SDRAM

Interface

E-bus

Interrupt

Controller

MUX

SmartMedia

Timer Pins

I2C Pins

UART P ins

SDRAM
SRAM
IDE

BUFENB1

BUFENB

IDE

IDE_DIOW

IDE_IORDY

2

_DIOR

CRIN/CROUT Pins

RTC Pins

16 Kbyte

SRAM

Clock

PLL

XTAL

Oscillator

Real-Time

Clock

ARB

DMA

SPI

Interface

Audio

Interfaces

AD

Logic

Memory Stick/SD

Interface

USB 2.0

OTG Controller

ATA

Controller

USB
PHY

USB XTAL

Oscillator

Figure 1. MCF5253 Block Diagram

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

SPI Pins

Audio Interface
Pins

AD IN Pins

FlashMedia
Pins

USB Analog

USB XTAL Pins

ATA Pins

Freescale Semiconductor 3

Functional Description

2 Functional Description

2.1 Version 2 ColdFire Core

The V ersion 2 ColdFire (CF2) core consists of two independent, decoupled pipeline structures to maximize
performance while minimizing core size. The instruction fetch pipeline (IFP) is a two-stage pipeline for
prefetching instructions. The prefetched instruction stream is then gated into the two-stage operand
execution pipeline (OEP), which decodes the instruction, fetches the required operands, and then executes
the required function.

2.2 Module Inventory

Table 2 shows an alphabetical listing of the modules in the processor.

Table 2. Digital and Analog Modules

Block

Mnemonic

ATA Advanced Technology

ADC Battery Level/Keypad

AB Audio Bus Audio

AIM Audio Interface Audio

BROM Bootloader Boot ROM The MCF5253 incorporates a ROM Bootloader, which enables booting

FlexCAN Twin Controller Area

CSM Chip Select Module Connectivity

DMAC Direct Memory

Block Name

Attachment Controller

Analog/Digital
Converter

Network 2.0B
Communication Unit

Access Controller
Module

Functional

Grouping

Connectivity
Peripheral

Analog Input The six-channel ADC is based on the Sigma-Delta concept with 12-bit

Interface

Interface

Connectivity
Peripheral

Peripheral

Connectivity
Peripheral

The ATA block is an AT attachment host interface. Its main use is to
interface with IDE hard disc drives and ATAPI optical disc drives.

resolution. Both the analog comparator and digital sections are integrated
in the MCF5253.

The audio interfaces connect to an internal bus that carries all audio data.
Each receiver places its received data on the audio bus and each
transmitter takes data from the audio bus for transmission.

The audio interface module provides the necessary input and output
features to receive and transmit digital audio signals over serial audio
interfaces (IIS/EIAJ) and over digital audio interfaces (IEC958).

from UART, I2C, SPI, or IDE devices.

The FlexCan module is a full implementation of the Bosch CAN protocol
specification 2.0B, which supports both standard and extended message
frames.

Three programmable chip-select outputs (CS0
provide signals that enable glueless connection to external memory and
peripheral circuits.

There are four fully programmable DMA channels for quick data transfer.

Brief Description

/CS4, CS1, and CS2)

eMAC enhanced Multiply

Accumulate Module

MBUS Memory Bus Interface Bus Operation The bus interface controller transfers data between the ColdFire core or

MMC/SD Multimedia

Card/Secure Digital
Interface

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

4 Freescale Semiconductor

Core The integrated eMAC unit provides a common set of DSP operations and

enhances the integer multiply instructions in the ColdFire architecture.

DMA and memory, peripherals, or other devices on the external bus.

Flash Memory
Card Interface

The interface is Sony® Memory Stick®, SecureDigital, and Multi-Media
card compatible.

Note: The Sony Memory Interface does not support Sony MagicGate™.

Table 2. Digital and Analog Modules (continued)

Functional Description

Block

Mnemonic

Block Name

GPIO General Purpose I/O

Interface

GPT General Timer

Module

IDE Integrated Drive

Electronics

Functional

Grouping

System
integration

Timer
peripheral

Connectivity
peripheral

Brief Description

GPIO signals are multiplexed with various other signals.

The timer module includes two general-purpose timers, each of which
contains a free-running 16-bit timer.

The IDE hardware consists of bus buffers for address and data and are
intended to reduce the load on the bus and prevent SDRAM and Flash
accesses from propagating to the IDE bus.

INC Instruction Cache Core The instruction cache improves system performance by providing cached

instructions to the execution unit in a single clock cycle.

2

C Inter IC

I

Communication
Module

SRAM Internal 128-KB

SRAM

LIN Internal Voltage

Regulator

Connectivity
peripheral

Internal
memory

Linear
regulator

The two-wire I2C bus interfaces, compliant with the Philips I2C bus
standard, are bidirectional serial buses that exchange data between
devices.

The 128-Kbyte on-chip SRAM is split over two banks, SRAM0 (64K) and
SRAM1 (64K). It provides single clock-cycle access for the ColdFire core.

An internal 1.2 V regulator is used to supply the CPU and PLL sections of
the MCF5253, reducing the number of external components required and
allowing operation from a single supply rail, typically 3.3 volts.

JTAG Joint Test Action

Group

Test and
debug

To help with system diagnostics and manufacturing testing, the MCF5253
includes dedicated user-accessible test logic that complies with the IEEE

1149.1A standard for boundary scan testability, often referred to as Joint
Test Action Group, or JTAG.

QSPI Queued Serial

Peripheral Interface

Connectivity
Interface

RTC Real-Time Clock Timer

Peripheral

BDM Background Debug

Interface

SDRAMC Synchronous DRAM

Memory Controller

SIM System Integration

Module

PLL System Oscillator and

Phase Lock Loop

Test and
debug

Peripheral
Interface

System
Integration

System
Clocking

The QSPI module provides a serial peripheral interface with queued
transfer capability.

The RTC is a clock that keeps track of the current time even if the clock is
turned off.

A background-debug mode (BDM) interface provides system debug.

The SDRAM controller provides a glueless interface for one bank of
SDRAM, and can address up to 32MB. The controller supports a 16-bit
data bus. The controller operates in page mode, non-page mode, and
burst-page mode and supports SDRAMs.

The SIM provides overall control of the internal and external buses and
serves as the interface between the ColdFire core and the internal
peripherals or external devices. The SIM is responsible for the two
interrupt controllers (setting priorities and levels). And it also configures
the GPIO ports.

The oscillator operates from an external crystal connected across CRIN
and CROUT. The circuit can also operate from an external clock
connected to CRIN. The on-chip programmable PLL, which generates the
processor clock, allows the use of almost any low frequency external clock
(5–35 MHz).

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

Freescale Semiconductor 5

Signal Description

UART Universal

Asynchronous
Receiver
/Transmitter Module

USBOTG USB 2.0 High-Speed

On-The-Go

Connectivity
Peripheral

Connectivity
Peripheral

Three UARTs handle asynchronous serial communication.

The USB module is used for communication to a PC or communication to
slave devices; for example, to download data from a hard disc player to a
flash player, and to other devices.

3 Signal Description

This chapter describes the MCF5253 input and output signals. The signal descriptions as shown in Table 3
are grouped according to relevant functionality. For additional signal information, see “Chapter 2, Signal
Description” in the MCF5253 reference manual.

Table 3. MCF5253 Signal Index

Signal Name Mnemonic Function

Address A[24:1]

A[23]/GPO54

Read-write control RW Bus write enable—indicates if read

24 address lines—address 23 is
multiplexed with GPO54 and
address 24 is multiplexed with A20
(SDRAM access only).

or write cycle in progress.

Input/

Output

Out X

Out H

Reset

State

Output enable OE

Output enable for asynchronous
memorier TD-0.6(e5(e7(tc25)5.h(.)-4.8pus l6(es(.)]TJ18.1133 1.67 TD-0.0604 Tc0 Tw[(Out230m)4.n(l)-6.6ga(l)-6.te(l)-6.d(H)]TJ-47.3133 -3.67 TD-0.0025 Tc0.3005 TwData(l909)12.D[31:16]or)-23012.Data 4(b)2211()221 is uson)-5.7( )6.7(ttrmm)1)85non f3r l17158[(/[(Out261012.Hi-Zs )]TJ0267 TD-0.0019 Tc0.0039 TwSasynchrotp)-5.9s r do
addre sontbe1]

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

6 Freescale Semiconductor

Out230mlllH

SDMo

Signal Description

ISA bus read strobe IDE_DIOR/GPIO31

(CS2)

ISA bus write strobe IDE_DIOW/GPIO32

)

(CS2

1 ISA bus read strobe and 1 ISA bus
write strobe—allow connection of an
independent ISA bus peripheral,
such as an IDE slave device.

ISA bus wait signal IDE_IORDY/GPIO33 ISA bus wait line available for both

busses

Chip Selects[2:0] CS0/CS4

CS1/QSPICS3/GPIO28

Chip selects bits 2 through 0—
enable peripherals at programmed
addresses. C

S0 provides boot ROM

selection.

Buffer enable 1 BUFENB1/GPIO29 Two programmable buffer

In/Out –

In/Out –

In/Out –

Out

negated

In/Out

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

Freescale Semiconductor 7

Signal Description

Table 3. MCF5253 Signal Index (continued)

Signal Name Mnemonic Function

Serial data out SDATAO1/TOUT0/GPIO18

SDATAO2/GPIO34

Word clock LRCK1/GPIO19

Audio interfaces to serial data
outputs

Audio interfaces to serial word clocks In/Out –

Input/

Output

In/Out

Out

Reset

State

LRCK2/GPIO23
LRCK3/AUDIOCLOCK/GPIO43

Bit clock SCLK1/GPIO20

Audio interfaces to serial bit clocks In/Out –
SCLK2/GPIO22
SCLK3/GPIO35

Serial input EF/RXD2/GPIO6 Error flag serial in In/Out –

Serial input CFLG/GPIO5 C-flag serial in In/Out –

Subcode clock RCK/QSPIDIN/QSPIDOUT/

Audio interfaces to subcode clock In/Out –
GPIO26

Subcode sync QSPIDOUT/SFSY/GPIO27 Audio interfaces to subcode sync In/Out –

Subcode data QSPICLK/SUBR/GPIO25 Audio interfaces to subcode data In/Out –

Clock frequency trim XTRIM/TXD2/GPIO0 Clock trim control Out –

Audio clocks out MCLK1/GPIO11

DAC output clocks Out –
QSPICS2/MCLK2/GPIO24

Audio clock in LRCK3/AUDIOCLOCK/GPIO43 Optional audio clock input –

–

MemoryStick/
SecureDigital interface

EBUIN3/CMD_SDIO2/GPIO14 Secure Digital command lane—

In/Out –

MemoryStick interface 2 data I/O

EBUIN2/SCLKOUT/GPIO13 Clock out for both MemoryStick

In/Out –

interfaces and for Secure Digital

DDATA0/CTS1

/SDATA0_SDIO1/GPIO1 SecureDigital serial data bit 0—

In/Out –

MemoryStick interface 1 data I/O

SCL0/SDATA1_BS1/GPIO41 SecureDigital serial data bit 1—

In/Out –

MemoryStick interface 1 strobe

DDATA1/RTS1

/SDATA2_BS2/GPIO2 SecureDigital serial data bit 2—

In/Out –
MemoryStick interface 2 strobe
Reset output signal

SDA0/SDATA3/GPIO42 SecureDigital serial data bit 3 In/Out –

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

8 Freescale Semiconductor

Table 3. MCF5253 Signal Index (continued)

Signal Description

Signal Name Mnemonic Function

AT attachment interface
(IDE interface)

ATA_DIOW ATA write strobe signal Out –

ATA_DIOR ATA read strobe signal Out –

Input/

Output

Reset

State

ATA_IORDY ATA I/O ready input In –

ATA_DMARQ ATA DMA request In –

ATA_DMACK ATA DMA acknowledge Out –

ATA_INTRQ ATA interrupt request In –

ATA_CS0 ATA chip select 0 Out –

ATA_CS1 ATA chip select 1 Out –

ATA_A[2:0] 3-bit ATA address bus Out –

ATA_D[15:0] 16-bit ATA data bus In/Out –

CAN interface CAN0_TX CAN 0 transmit Out –

CAN0_RX CAN 0 receive In –

CAN1_TX CAN 1 transmit Out –

CAN1_RX CAN 1 receive In –

USB PHY interface USBVBUS USB Vbus input In –

USBID USB ID input In –

USBRES USB current programming resistor

Analog –

pin

USBDN USB DM signalling line In/Out –

USBDP USB DP signalling line In/Out –

USB oscillator USB_CRIN

USB_CROUT

RTC oscillator RTC_CRIN

RTCCROUT

AD IN ADIN0/GPI52

ADIN1/GPI53

Connections for USB oscillator
crystal (24 MHz)

Connections for real-time clock
crystal (32.768 kHz)

Analog-to-Digital Converter input
signals

In

Out

In

Out

In –

ADIN2/GPI54
ADIN3/GPI55
ADIN4/GPI56
ADIN5/GPI57

AD OUT ADREF

ADOUT/SCLK4/GPIO58

Analog-to-Digital Converter output
signal—connects to ADREF via

In/Out –

integrator network.

QSPI clock QSPICLK/SUBR/GPIO25 QSPI clock signal In/Out –

QSPI data in RCK/QSPIDIN/QSPIDOUT/GPIO26 QSPI data input In/Out –

–

–

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

Freescale Semiconductor 9

Signal Description

Table 3. MCF5253 Signal Index (continued)

Signal Name Mnemonic Function

QSPI data out RCK/QSPIDIN/QSPIDOUT/GPIO26

QSPI data out In/Out –

Input/

Output

Reset

State

QSPIDOUT/SFSY/GPIO27

QSPI chip selects QSPICS0/EBUIN4/GPIO15

QSPI chip selects In/Out –

QSPICS1/EBUOUT2/GPIO16
QSPICS2/MCLK2/GPIO24
CS1/QSPICS3/GPIO28

System oscillator in CRIN System input In –

System oscillator out CROUT System output Out –

Reset In RSTI Processor reset input In –

Freescale Test Mode TEST[2:0] TEST pins. In –

Linear regulator output LINOUT Output of 1.2 V to supply core Out –

Linear regulator input LININ Input, typically I/O supply (3.3V) In –

Linear regulator ground LINGND –

High Impedance HI_Z Assertion tri-states output signal pins In

Debug Data DDATA0/CTS1/SDATA0_SDIO1/GPIO1

DDATA1/RTS1

/SDATA2_BS2/GPIO2

Display of captured processor data
and break-point statuses

In/Out Hi-Z

DDATA2/CTS0/GPIO3
DDATA3/RTS0/GPIO4

Processor Status PST0/GPIO50

PST1/GPIO49

Indication of internal processor
status.

In/Out Hi-Z

PST2/INTMON2/GPIO48
PST3/INTMON1/GPIO47

Processor clock PSTCLK/GPIO51 Processor clock output Out –

Test Clock TCK Clock signal for IEEE 1149.1A JTAG In –

Test Reset/
Development Serial
Clock

DSCLK/TRST

Multiplexed signal that is
asynchronous reset for JTAG
controller. Also, clock input for debug

In –

module.

Test Mode Select/Break
Point

TMS/BKPT

Multiplexed signal that is test mode
select in JTAG mode and a hardware

In –

break-point in debug mode

Test Data Input/
Development Serial

TDI/DSI Multiplexed serial input for the JTAG

or background debug module.

In –

Input

Test Data
Output/Development

TDO/DSO Multiplexed serial output for the

JTAG or background debug module

Out –

Serial Output

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

10 Freescale Semiconductor

Electrical Specifications

4 Electrical Specifications

Table 4 through Table 9 provide the electrical characteristics for the MCF5253 processor. The remaining

figures and tables in this section provide the timing diagrams and the timing parameters for the MCF5253
processor.

Table 4 provides the maximum rating parameters for the MCF5253 processor.

Table 4. Maximum Ratings

Rating Symbol Value Units

Supply Core Voltage V

Maximum Core Operating Voltage V

Minimum Core Operating Voltage V

Supply I/O Voltage V

Maximum I/O Operating Voltage V

Minimum I/O Operating Voltage V

Input Voltage V

Storage Temperature Range T

cc

cc

cc

cc

cc

cc

in

stg

-0.5 to +2.5 V

+1.32 V

+1.08 V

-0.5 to +4.6 V

+3.6 V

+3.0 V

–0.5 to +6.0 V

–65 to +150

Table 5 provides the recommended operating temperatures for the MCF5253 processor.

Table 5. Operating Temperature

Characteristic Symbol Value Units

1

Maximum Operating Ambient Temperature T

Minimum Operating Ambient Temperature T

1

This published maximum operating ambient temperature should be used only as a system design guideline. All
device operating parameters are guaranteed only when the junction temperature does not exceed 86.5

Amax

Amin

+70

-20

o

C

o

C

o

C

o

C.

Table 6 provides the recommended operating supply voltages for the MCF5253 processor.

Table 6. Recommended Operating Supply Voltages

Pin Name Min Typ Max Unit

COREVDD 1.08 1.2 1.32 V

PADVDD 3.0 3.3 3.6 V

ADVDD 3.0 3.3 3.6 V

ADGND – GND – V

OSCPADVDD 3.0 3.3 3.6 V

OSCPADGND – GND – V

USBVDD – 3.3 – V

USBVDDP – 1.2 – V

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

Freescale Semiconductor 11

Electrical Specifications

Table 6. Recommended Operating Supply Voltages (continued)

Pin Name Min Typ Max Unit

USBGND – GND – V

RTCVDDA 3.0 – 4.2 V

RTCVSSA – GND – V

PLLCOREVDD 1.08 1.2 1.32 V

PLLCOREGND – GND – V

LININ 3.0 3.3 3.6 V

GND – GND – V

Table 7 provides the operating parameters for the linear regulator.

Table 7. Linear Regulator Operating Parameters

Characteristic Symbol Min Typ Max Units

Input Voltage (LININ) Vin 3.0 3.3 3.6 V

Output Voltage (LINOUT) Vout 1.08 1.2 1.32 V

Output Current Iout – 100 – mA

Power Dissipation Pd – – 500 mW

Load Regulation

10% Iout ≥ 90% Iout

Power Supply Rejection PSRR – 40 – dB

– – 50 60 mV

NOTE

A pmos regulator is used as a current source in this linear regulator, so a
10 µF capacitor (ESR 0... 5 Ohm) is needed on the output pin (LINOUT) to
integrate the current. Typically, this requires the use of a tantalum type
capacitor.

Table 8 provides the operating parameters for the ADC DC electrical characteristics.

Table 8. Operating Parameters for ADC DC Electrical Characteristics

Characteristic Symbol Min Typ Max Units

Operation Voltage Range for ADC ADVDD 3 – 3.6 V

Common Mode Rejection CMR 0 – ADVDD–1.1 v

Reference Voltage (external) ADREF 0 – ADVDD–1.1 v

Input offset voltage V

Input Hysteresis (ADINx = ADVDD/2) V

ADC Input Linear Operating Range ADINx 0 – ADVDD–1.1 V

offset

hyst

–10 – mV

0.73 0.78 0.85 mV

Table 9 provides the DC electrical specifications for the digital pins.

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

12 Freescale Semiconductor

Table 9. DC Electrical Specifications (I/O Vcc = 3.3 Vdc + 0.3 Vdc)

Characteristic Symbol Min Max Units

Electrical Specifications

Operation Voltage Range for I/O V

Input High Voltage V

Input Low Voltage V

Input Leakage Current @ 0.0 V/3.3 V
During Normal Operation

Hi-Impedance (Three-State) Leakage Current
@ 0.0 V/3.3 V During Normal Operation

Output High Voltage I

Output Low Voltage I

= 11.9 mA1, 6.3 mA2,3.1 mA

OH

= 7.1m A1, 3.5 mA2, 1.8 mA

OL

Schmitt Trigger Low to High Threshold Point

Schmitt Trigger High to Low Threshold Point

4

4

3

3

V

V

Load Capacitance:
D[31:16], SCLK[4:1], SCLKOUT, EBUOUT[2:1], LRCK[3:1], SDATAO[2:1], CFLG, EF,

_DIOR, IDE_DIOW, IDE_IORDY, MCLK1, MCLK2

IDE

Load Capacitance:
A[24:9], ATA_CS0, ATA_CS1, ATA_A[2:0], ATA_DIOR, ATA_DIOW, ATA_DMACK,
ATA_D[15:0], SDATAI[3,1]

Load Capacitance:
A[8:1], ADOUT, ATA_RST
BCLK, BCLKE, SDCAS, SDRAS, SDLDQM, SDCS0, SDUDQM, SDWE, BUFENB[2:1],
CAN0_TX, CAN1_TX, EBUIN1, RXD[2:0]

I

V

V

C

C

C

I

in

TSI

OH

OL

T+

cc

IH

IL

3.0 3.6 V

25.5 V

-0.3 0.8 V

– ±1 µA

– ±1 µA

2.4 – V

–0.4 V

1.67 1.79 V

1.01 1.15 V

T-

L

L

L

–50pF

15 40 pF

–30pF

Load Capacitance:

C

L

–20pF
SDA0, SDA1, SCL0, SCL1, CMD_SDIO2, SDATA2_BS2, SDATA1_BS1, SDATA0_SDIO1,
CS0/CS4, CS1, OE, RW, TA, TXD[2:0], XTRIM, TDO/DSO, RCK, SFSY, SUBR, SDATA3,
TOUT0, QSPID_OUT, QSPICS[3:0], QSPICLK, GPIO[6:5]

Load Capacitance:

C

L

–15pF
DDATA[3:0], PST[3:0], PSTCLK

Capacitance

1

8.0 mA: SCL0, SDA0, SCL1, SDA1, PST[3:0], DDATA[3:0], TDSO, RW, ATA_RST, MCLK1, QSPICS2_MCLK2

2

4.0 mA: BUFENB1, BUFENB2, EBUOUT1, SCLKOUT, CMDSDIO, IDE_DIOR, IDE_DIOW, TOUT0, RTS[1:0], TXD[1:0],

5

, Vin = 0 V, f = 1 MHz

C

IN

–6pF

SCLK[4:1], LRCK[4:1], SDATAO1, SDATAO2, QSPICLK, QSPICS0, QSPICS1_EBUOUT2, QSPICS3, QSPIDOUT, RCK,
XTRIM, A[8:1], ATA_CS0, ATA_CS1, ATA_A[2:0]

3

2.0 mA: TMS/BKPT, DSI/TDI, TRST/DSCLK

4

SCLK[4:1], SCL0, SCL1, SDA0, SDA1, ATA_DMARQ, ATA_INTRQ, ATA_IORDY

5

Capacitance CIN is periodically sampled rather than 100% tested.

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

Freescale Semiconductor 13

Electrical Specifications

Figure 2 and Table 10 provide the clock timing diagram and timing parameters.

CRIN

C5

PSTCLK

C6 C6

C7

BCLK

C8 C8

Figure 2. Clock Timing Definition

NOTE

Signals shown in Figure 2 are in relation to the SYSCLK clock. No
relationship between signals is implied or intended.

Table 10. Clock Timing Parameters

140 MHz CPU

ID Characteristic

Min Max

– CRIN Frequency with external oscillator 5.00 33.86 MHz

– CRIN Frequency with internal oscillator 5 16.94 MHz

C5 PSTCLK cycle time 7 – ns

C6 PSTCLK duty cycle 40 60 %

C7 BCLK cycle time 14.0 – ns

C8 BCLK duty cycle 35 65 %

Units

4.1 SDRAM Bus Timing

The SDRAM bus is a synchronous bus. Propagation delays, set-up times and hold times with respect to
the SDRAM clock BCLK are shown in Figure 3 and the parameters provided in Table 11. When BCLK
clock is not active, SDRAM interface is not valid and the external bus cannot be used.

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

14 Freescale Semiconductor

BCLK

D1

data (write)

D2

BCLKE, SDXDQM, SDWE

SDCS0

, SDRAS, SDCAS

,

D3

A[24:9]

data (read)

Figure 3. SDRAM Bus Timing Diagram

Electrical Specifications

D4

D5

Table 11. SDRAM Bus Timing Parameters

Timing to 50% Points

Maximum

ID Characteristic

30 pF

Load

D1 Propagation delay BCLK rising to data valid 7.88 8.8 9.6 ns

D2 Propagation delay BCLK rising to BCLKE, SDLDQM

SDUDQM, SDWE, SDCS0, SDRAS, SDCAS valid

D3 Propagation delay BCLK rising to A[24:9] valid 8.3 9.2 – ns

D4 Set-up time data valid to BCLK rising 0 0 0 ns

D5 Hold time BCLK rising to data valid 0.7 0.7 0.7 ns

,

40 pF

Load

8.7 – – ns

50 pF

Load

Units

4.2 SPDIF Timing

The Sony/Philips Digital Interface (SPDIF) timing parameters are provided in Table 12. SPDIF timing is
totally asynchronous, therefore there is no need for relationship with the clock. Table 12 shows the
differences between high-low and low-high propagation delay which is called the skew.

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

Freescale Semiconductor 15

Electrical Specifications

Table 12. SPDIF Propagation Skew and Transition Parameters

Characteristic Pin Load

EBUIN1, EBUIN2, EBUIN3, EBUIN4:
asynchronous inputs, no specs apply

EBUOUT1, EBUOUT2 output 40 pF – 1.5 24.2 31.3 ns

EBUOUT1, EBUOUT2 output 20 pF – 1.5 13.6 18.0 ns

1

Skew value does not include the skew introduced by different rise and fall times.

2

Transition times between 10% Vdd and 90% Vdd.

––0.7 – –ns

Prop Delay

Maximum

Maximum

Skew

1

Transit ion

2

Rise

Maximum

Transition Fall

Maximum

Units

4.3 Serial Audio Interface Timing

The Serial Audio Interface fully complies with the Industry standard Philips IIS (InterIC Serial Audio Bus)
timings.

4.4 DDATA/PST/PSTCLK Debug Interface

Table 13 provides the timing parameters.

Table 13. DDATA/PST/PSTCLK Debug Interface Timing Parameters

Characteristic Pin Load Min Max Units

PSTCLK clock rise edge to DDATA/PSTDATA1 invalid

PSTCLK clock rise edge to DDATA/PSTDATA

1

Note that output data may go invalid before rising edge of the clock. To clock data in reliably, you need to sample data, for
example, 2 ns before rising edge of clock.

2

Timing figure given takes 50% margin for noise and uncertainty on pin capacitance. Simulated clock-to-data, not taking noise
effects into account is 2.7 ns.

2

valid

15 pF –1.0 — ns

15 pF — 4.0 ns

4.5 BDM and JTAG Timing

Table 14 provides the BDM timing parameters.

Table 14. BDM Interface Timing Parameters

Characteristic Min Max Units

Clock period for DSCLK clock — 5T

Set-up time DSI, BKPT

Hold time DSI, BKPT to DSCLK rising edge — T+ 4.0 ns

Propagation delay DSCLK rising edge to TDO/DSO change 3T 4T + 32 ns

1

T denotes the CPU clock period. E.g. if the CPU is running at 100 MHz, T = 10 ns

, to DSCLK rising edge 4.0 — ns

1

Figure 4 provides the JTAG timing diagram and Table 15 provides the JTAG timing parameters.

ns

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

16 Freescale Semiconductor

Electrical Specifications

TCK

TDI, TMS

Boundary Scan

Data

Input

TRST

TDO

Boundary Scan

Data

Output

J2A

J1

J9

J11

J6

J4

J5

J7

J1

J10

J12

J2B

J3A

J3B

Figure 4. JTAG Timing Diagram

Table 15. JTAG Timing Parameters

ID Characteristic Min Max Units

– TCK Frequency of Operation 0 10 MHz

J1 TCK Cycle Time 100 — ns

J2A TCK Clock Pulse High Width 25 — ns

J2B TCK Clock Pulse Low Width 25 — ns

J3A TCK Fall Time (V

J3B TCK Rise Time (V

J4 TDI, TMS to TCK rising (Input Setup) 8 — ns

J5 TCK rising to TDI, TMS Invalid (Hold) 10 — ns

J6 Boundary Scan Data Valid to TCK (Setup) 1 — ns

J7 TCK to Boundary Scan Data Invalid to rising edge (Hold) 10 — ns

J8 TRST

Pulse Width (asynchronous to clock edges) 12 — ns

J9 TCK falling to TDO Valid (signal from driven or three-state) — 15 ns

J10 TCK falling to TDO High Impedance 2 15 ns

=2.4 V to VIL=0.5 V) — 5 ns

IH

=0.5 v to VIH=2.4 V) — 5 ns

IL

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

Freescale Semiconductor 17

Package Information and Pinout

Table 15. JTAG Timing Parameters (continued)

ID Characteristic Min Max Units

J11 TCK falling to Boundary Scan Data Valid (signal from driven or three-state) — 15 ns

J12 TCK falling to Boundary Scan. Data High Impedance 1 15 ns

5 Package Information and Pinout

This section includes the pin assignment information, contact connection diagram, and the mechanical
package drawing.

The MCF5253 device is available in the following package:

• 225 MAPBGA 13 x 13 mm 0.8 mm pitch package as shown in Figure 5.

5.1 Pin Assignment

Table 16 defines all the settings of each pad. See Figure 6 for the ball map of pin locations and Table 18

for the device pin list, sorted by signal identification.

Table 16. 225 MAPBGA Pin Assignment

Pinconfig

Register

Bit

GP

Reset Notes

Pin

Name

Drive Type/

Strength

Load

(pF)

1st

Function

2nd

Function

Address Bus

A1 O / 2 mA 30 –– ––X
A2 O / 2 mA 30 –– ––X
A3 O / 2 mA 30 –– ––X
A4 O / 2 mA 30 –– ––X
A5 O / 2 mA 30 –– ––X
A6 O / 2 mA 30 –– ––X
A7 O / 2 mA 30 –– ––X
A8 O / 2 mA 30 –– ––X

A9 O / 8 mA 30 –– ––X
A10 O / 8 mA 30 –– ––X
A11 O / 8 mA 30 –– ––X
A12 O / 8 mA 30 –– ––X
A13 O / 8 mA 30 –– ––X
A14 O / 8 mA 30 –– ––X
A15 O / 8 mA 30 –– ––X
A16 O / 8 mA 30 –– ––X
A17 O / 8 mA 30 –– ––X
A18 O / 8 mA 30 –– ––X
A19 O / 8 mA 30 –– ––X

A20/A24 O / 8 mA 30 A20 A24 31 – X

A21 O / 8 mA 30
A22 O / 8 mA 30 –– ––X

A23/GPO54 O / 8 mA 30 A23 ––O54 X

–– ––X

H

3

H

2

H

1

H

5

G

1

G

3

G

2

H

4

H

6

F

2

G

5

F

3

F

1

E

1

G

4

E

2

F

4

E

3

F

5

F

6

Audio Clock Select: 1-LRCK3
pin; 0-CRIN pin

D

3

D

1

D

2

Boot Mode Select:1-Memory
connected to CS0

–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–

–
–

; 0-Internal

boot rom

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

18 Freescale Semiconductor

Table 16. 225 MAPBGA Pin Assignment (continued)

Package Information and Pinout

Pinconfig

Register

Bit

GP

Reset Notes

Pin

Name

Drive Type/

Strength

Load

(pF)

1st

Function

2nd

Function

Data Bus

D16 IO / 8 mA 40 –– ––HI_Z
D17 IO / 8 mA 40 –– ––HI_Z
D18 IO / 8 mA 40 –– ––HI_Z
D19 IO / 8 mA 40 –– ––HI_Z
D20 IO / 8 mA 40 –– ––HI_Z
D21 IO / 8 mA 40 –– ––HI_Z
D22 IO / 8 mA 40 –– ––HI_Z
D23 IO / 8 mA 40 –– ––HI_Z
D24 IO / 8 mA 40 –– ––HI_Z
D25 IO / 8 mA 40 –– ––HI_Z
D26 IO / 8 mA 40 –– ––HI_Z
D27 IO / 8 mA 40 –– ––HI_Z
D28 IO / 8 mA 40 –– ––HI_Z
D29 IO / 8 mA 40 –– ––HI_Z
D30 IO / 8 mA 40 –– ––HI_Z
D31 IO / 8 mA 40 –– ––HI_Z

Bus Control

OE O / 4 mA 30 –– ––Negated

RW O / 4 mA 30 –– ––H

TA /GPIO12 IO / 2 mA 30 TA ––IO12 –
BUFENB1/GPIO29 IO / 2 mA 30 BUFENB1 ––IO29 –
BUFENB2/GPIO30 IO / 2 mA 30 BUFENB2 ––IO30 –
IDE_DIOR/GPIO31 IO / 2 mA 30 IDE_DIOR ––IO31 –

IDE_DIOW

IDE_IORDY

/GPIO32 IO / 2 mA 30 IDE_DIOW ––IO32 –

/GPIO33 IO / 2 mA 30 IDE_IORDY ––IO33 –

Chip Selects

CS0/CS4 O / 4 mA 30 CS0 CS4 ––Negated

CS1/QSPICS3/

IO / 2 mA 30 CS1 QSPICS3 25 IO28 Negated

GPIO28

SDRAM Controller

BCLK/GPIO40 IO / 8 mA 15 BCLK ––IO40 –

BCLKE/GPIO63 IO / 8 mA 20 BCLKE ––IO63 –

SDLDQM/GPO52 O / 8 mA 20 SDLDQM ––O52 –

SDUDQM/GPO53 O / 8 mA 20 SDUDQM ––O53 –

SDWE/GPIO38 IO / 8 mA 20 SDWE ––IO38 Negated

SDCS0/GPIO60 IO / 8 mA 20 SDCS0 ––IO60 Negated
SDRAS/GPIO59 IO / 8 mA 20 SDRAS ––IO59 Negated
SDCAS/GPIO39 IO / 8 mA 20 SDCAS ––IO39 Negated

ATA Interface

ATA_A0 O / 2 mA 40 –– –––
ATA_A1 O / 2 mA 40 –– –––

ATA_A2 O / 2 mA 40 –– –––
ATA_D0 IO / 8 mA 40 –– –––
ATA_D1 IO / 8 mA 40 –– –––

C

1

E

4

E

5

B

1

C

2

D

4

C

3

B

2

A

2

B

3

A

3

C

4

B

4

D

5

A

4

C

5

R

3

J

4

N

5

P

5

K

6

M

5

Controlled by CS2 registers

P

4

Controlled by CS2 registers

R

4

J

3

Boot Mode Select:1-CS0;

–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–

–
–
–
–
–

–

0-CS4

M

7

B

5

E

6

C

6

A

5

C

7

B

6

A

6

D

6

A

8

B

7

B

8

B

9

A

9

–

–
–
–
–
–
–
–
–

–
–
–
–
–

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

Freescale Semiconductor 19

Package Information and Pinout

Table 16. 225 MAPBGA Pin Assignment (continued)

Pinconfig

Register

Bit

GP

Reset Notes

Pin

Name

Drive Type/

Strength

Load

(pF)

1st

Function

2nd

Function

ATA_D2 IO / 8 mA 40 –– –––
ATA_D3 IO / 8 mA 40 –– –––
ATA_D4 IO / 8 mA 40 –– –––
ATA_D5 IO / 8 mA 40 –– –––
ATA_D6 IO / 8 mA 40 –– –––
ATA_D7 IO / 8 mA 40 –– –––
ATA_D8 IO / 8 mA 40 –– –––
ATA_D9 IO / 8 mA 40 –– –––

ATA _ D 10 IO / 8 m A 40 –– –––
ATA _ D 11 IO / 8 m A 40 –– –––
ATA _ D 12 IO / 8 m A 40 –– –––
ATA _ D 13 IO / 8 m A 40 –– –––
ATA _ D 14 IO / 8 m A 40 –– –––
ATA _ D 15 IO / 8 m A 40 –– –––
ATA_CS0 O / 2 mA 40 –– –––
ATA_CS1 O / 2 mA 40 –– –––

ATA_DIOR O / 8 mA 40 –– –––

ATA _ D IOW O / 8 m A 40 –– –––
ATA _I O R DY I –– – – ––
ATA _ IN T R Q I –– – – ––

ATA_DMARQ I –– – –––
ATA_DMACK O / 8 mA 40 –– –––

ATA _ RS T O / 2 mA 40 –– –––

Clock Generation

CRIN ––– – –––

CROUT

RTC_CRIN A

RTCCROUT A

USB_CRIN A

USB_CROUT A

XTRIM/TXD2/GPIO0 IO / 2 mA 30 XTRIM TXD2 0 IO0

––– – –––

–– – –––

–– – –––

–– – –––
–– – –––

–

JTAG/BDM/Test

TDO/DSO O / 4 mA 30 –– –––

TDI/DSI I

TMS/BKPT

I –– – – ––

TCK I

TRST/DSCLK I –– – –––

HI_Z

I –– – – ––

PSTCLK/GPIO51 IO / 8 mA 30 PSTCLK

PST0/GPIO50 IO / 4 mA 30 PST0 ––IO50 HI_Z
PST1/GPIO49 IO / 4 mA 30 PST1 ––IO49 HI_Z

PST2/INTMON2/

IO / 4 mA 30 PST2 INTMON2 17 IO48 HI_Z

GPIO48

PST3/INTMON1/

IO / 4 mA 30 PST3 INTMON1 18 IO47 HI_Z

GPIO47

–– – –––

–– – –––

––IO51 –

F

8

F

9

B

1

0

C

1

0

A

1

0

D

1

0

D

1

1

B

1

1

C

1

1

A

1

1

A

1

2

E

1

1

B

1

2

D

1

2

C

9

D

9

B

1

5

A

1

3

D

7

D

8

A

7

C

1

2

C

8

M

3

Main Processor Clock Input

N

2

Main Processor Clock Output

J

1

Real Time Clock (32.768 kHz)
Input

K

2

Real Time Clock (32.768 kHz)

–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–

Output

L

1

USB Clock (24 MHz) Input

4

L

1

USB Clock (24 MHz) Output

5

R

6

Interrupt Capable Input

G

1

See TEST0 Description

3

F

1

See TEST0 Description

5

F

1

See TEST0 Description

2

F

1

3

F

1

See TEST0 Description

4

B

1

For Normal Operation Tie This

3

Pin High

G

1

4

G

1

5

G

1

2

H

1

4

H

1

3

–

–
–
–
–

–

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

20 Freescale Semiconductor

Table 16. 225 MAPBGA Pin Assignment (continued)

Package Information and Pinout

Pinconfig

Register

Bit

GP
Pin

14,13 IO1 HI_Z

24,23 IO2 HI_Z

Name

DDATA0/CTS1/

SDATA0_SDIO1/GPIO1

DDATA1/RTS1

SDATA2_BS2/GPIO2

DDATA2/CTS0

DDATA3/RTS0

TEST0 I

TEST1 I

TEST2 I

/

/GPIO3 IO / 4 mA 30 DDATA2 CTS0 22 IO3 HI_Z

/GPIO4 IO / 4 mA 30 DDATA3 RTS0 21 IO4 HI_Z

Drive Type/

Strength

Load

(pF)

1st

Function

2nd

Function

IO / 4 mA 30 DDATA0 CTS1/SDATA

0_SDIO1

IO / 4 mA 30 DDATA1 RTS1/SDATA

2_BS2

–– – –––

–– – –––

–– – –––

Reset/Wake-up

RSTI I –– – –––

WAKEUP/GPIO21 IO / 2 mA 30 WAKEUP ––IO21 –

USB

USBDN A –– – –––

USBDP A –– – –––

USBID I –– – –––

USBVBUS A –– – –––

USBRES A –– – –––

TESTOUT

1

O –– – –––

NC ––– – –––

Audio Interface

SDATAI1/GPIO17 IO / 2 mA 30 SDATAI1 ––IO17 –

SDATAO1/TOUT0/

GPIO18

SCLK1/GPIO20 IO / 2 mA 30 SCLK1 ––IO20 –
LRCK1/GPIO19 IO / 2 mA 30 LRCK1 ––IO19 –

SDATAO2/GPIO34 IO / 2 mA 30 SDATAO2 ––IO34 –

SCLK2/GPIO22 IO / 2 mA 30 SCLK2 ––IO22 –
LRCK2/GPIO23 IO / 2 mA 30 LRCK2 ––IO23 –

SDATAI3/GPIO8 IO / 2 mA 30 SDATAI3 ––IO8 –

SCLK3/GPIO35 IO / 2 mA 30 SCLK3 ––IO35 –

LRCK3/AUDIOCLK/

GPIO43

EBUIN1/GPIO36 IO / 2 mA 30 EBUIN1

EBUIN2/SCLKOUT/

GPIO13

EBUIN3/

CMD_SDIO2/GPIO14

QSPICS0/EBUIN4/

GPIO15

EBUOUT1/GPIO37 IO / 2 mA 30 EBUOUT1 ––IO37 –

QSPICS1/

EBUOUT2/GPIO16

CFLG/GPIO5 IO / 2 mA 30 CFLG ––IO5 –

EF/RXD2/GPIO6 IO / 2 mA 30 EF RXD2

IO / 2 mA 30 SDATAO1 TOUT0 8 IO18 –

IO / 2 mA 30 LRCK3 AUDIOCLK – IO43 –

––IO36 –

IO / 2 mA 30 EBUIN2 SCLKOUT 16 IO13 –

IO / 2 mA 30 EBUIN3 CMDSDIO2 15 IO14 –

IO / 2 mA 30 QSPICS0 EBUIN4 30 IO15 –

IO / 2 mA 30 QSPICS1 EBUOUT2 29 IO16 –

– IO6 –

Reset Notes

K

1

Interrupt Capable Input

0

R

1

Interrupt Capable Input

1

J

1

Interrupt Capable Input

4

J

1

Interrupt Capable Input

2

F

1

BDM/JTAG Select: 1-BDM;

1

0-JTAG

G

1

For normal operation, tie this

0

pin low.

H

1

For normal operation, tie this

0

pin low.

E

1

5

R

5

N

1

5

M

1

5

M

1

1

N

1

4

M

1

4

P

1

3

R

1

4

N

9

R

8

K

8

P

8

D

1

5

E

1

3

E

1

4

N

1

0

R

1

0

M

1

See A20/A24 Description

0

N

6

M

6

K

7

R

7

P

6

N

8

M

9

Interrupt Capable Input

R

9

Interrupt Capable Input

–
–

–
–
–
–
–
–
–

–
–

–
–
–
–
–
–
–

–
–

–

–

–
–

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

Freescale Semiconductor 21

Package Information and Pinout

Table 16. 225 MAPBGA Pin Assignment (continued)

Pinconfig

Register

Bit

GP

Reset Notes

Pin

Name

Drive Type/

Strength

Load

(pF)

1st

Function

2nd

Function

MCLK1/GPIO11 IO / 4 mA 30 MCLK1 ––IO11 –

QSPICS2/MCLK2/

IO / 4 mA 30 QSPICS2 MCLK2 28 IO24 –

GPIO24

Analog-to-Digital Converter

ADIN0/GPI52 A – ADIN0 ––I52 –
ADIN1/GPI53 A – ADIN1 ––I53 –
ADIN2/GPI54 A – ADIN2 ––I54 –
ADIN3/GPI55 A – ADIN3 ––I55 –
ADIN4/GPI56 A – ADIN4 ––I56 –
ADIN5/GPI57 A – ADIN5 ––I57 –

ADREF A –– – –––

ADOUT/SCLK4/

IO / 2 mA 30 ADOUT SCLK4 9 IO58 –

GPIO58

FlexCAN

CAN0_TX O / 8 mA 30 –– –––

CAN0_RX I –– – – ––

CAN1_TX O / 8 mA 30 –– –––

CAN1_RX I –– – – ––

QSPI

QSPICLK/SUBR/

GPIO25

RCK/QSPIDIN/

QSPIDOUT/GPIO26

QSPIDOUT/SFSY/

GPIO27

IO / 2 mA 30 QSPICLK SUBR 27 IO25 –

IO / 2 mA 30 RCK QSPIDIN/

26 IO26 –

QSPIDOUT

IO / 2 mA 30 QSPIDOUT SFSY 10 IO27 –

I2C

SDA0/SDATA3/

GPIO42

SCL0/SDATA1_BS1/

GPIO41

SDA1/RXD1/GPIO44 IO / 4 mA 30 SDA1 RXD1 19 IO44 –

SCL1/TXD1/GPIO10 IO / 4 mA 30 SCL1 TXD1 20 IO10 –

IO / 4 mA 30 SDA0 SDATA3 11 IO42 –

IO / 4 mA 30 SCL0 SDATA1_BS1 12 IO41 –

UART

TXD0/GPIO45 IO / 2 mA 30 TXD0 ––IO45 –
RXD0/GPIO46 IO / 2 mA 30 RXD0 ––IO46 –

Power/Ground Pins

LININ ––– – –––

LINOUT

LINGND

PLLCOREVDD

(3 Balls)

PLLCOREGND

(3 Balls)

USBVDD (2 Balls)

USBVDDP

––– – –––

––– – –––
––– – –––

––– – –––

––– – –––

––– – –––

D

1

4

P

9

K

3

L

1

L

2

L

3

M

1

J

6

M

2

J

5

C

1

5

D

1

3

C

1

4

E

1

2

P

7

N

7

M

8

K

9

P

1

0

J

1

5

J

1

3

H

1

2

H

1

5

A

1

3.3 Volt Supply Required

4

B

1

1.2 Volt Output (Approx 50%

4

Efficient)

C

1

3

S

e

1.2 Volt Supply Required (M4,

e

N

ot

N3, P2)

e

s

S

e

N4,P3,R2

e

N

ot

e

s

S

e

3.3 Volt Supply Required (L13,

e

N

ot

M13)

e

s

L

1

1.2 Volt Supply Required

2

–
–

–
–
–
–
–
–
–
–

–
–
–
–

–

–

–

–

–

–
–

–
–

–

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

22 Freescale Semiconductor

Table 16. 225 MAPBGA Pin Assignment (continued)

Package Information and Pinout

Pinconfig

Register

Bit

GP

Reset Notes

Pin

Name

Drive Type/

Strength

Load

(pF)

1st

Function

2nd

Function

USBGND (3 Balls) ––– – –––

OSCPADVDD

OSCPADGND

––– – –––
––– – –––

RTC_VDDA ––– – –––

RTCVSSA

––– – –––

ADVDD ––– – –––

ADGND

––– – –––

PADVDD (10 Balls) ––– – –––

COREVDD

––– – –––

(4 Balls)

COREVSS/PADVSS

(18 Balls)

1

For test purposes only. Leave ball as open circuit.

2

These pads are listed as “GND” in the ball map and the rest of the tables.

2

––– – –––

S

e

K11, L11, M12

e

N

ot

e

s

N

1

3.3 Volt Supply Required

P

1

J

2

3.3 Volt Supply Required

K

1

K

4

3.3 Volt Supply Required

L

4

S

e

3.3 Volt Supply Required (E7,

e

N

ot

E9, F10, H8, H11, K5, L6, L8,

e

s

L10, R13)

S

e

1.2 Volt Supply Required (G8,

e

N

ot

H7, H9, J8)

e

s

S

e

A1, A15, E8, E10, F7, G6, G7,

e

N

ot

G9, G11, J7, J9, J10, J11, L5,

e

s

L7, L9, R1, R15

–

–

–

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

Freescale Semiconductor 23

Package Information and Pinout

5.2 Package Drawing

Figure 5 shows the package outline diagram for the MCF5253 processor.

TOP VIEW

Notes:

BOTTOM VIEW

1. All dimensions in millimeters.

2. Dimensioning and tolerancing per ASME Y14. 5M–1994.

3. Maximum solder ball diameter measured parallel to datum A.

4. Datum A, the seating plane, is determined by the spherical crown of the solder balls.

5. Parallelism measurement shall exclude any effect of mark on top surface of package.

SIDE VIEW

Figure 5. MCF5253 Package Drawing

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

24 Freescale Semiconductor

Freescale Semiconductor 25

5.2.1 MAPBGA Pinout

Figure 6 shows the MCF5253 ball map of pad locations.

123456789101112131415

GND D24 D26 D30

A

SDUDQM

GPO53

/

SDRAS/
GPIO59

ATA_DMAR

Q

ATA_A0 ATA_D1 ATA_D6 ATA_D11 ATA_D12 ATA_DIOW LININ

GND

A

D19 D23 D25 D28

B

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

D16 D20 D22 D27 D31

C

A22A23/GPO54A21 D21 D29

D

A14 A16 A18 D17 D18

E

A13 A10 A12 A17 A19 A20/A24 G ND ATA _ D 2 ATA _ D3 PADVDD TEST0 TMS/BKPT TCK

F

A5 A7 A6 A15 A11 GND GND COREVDD GND TEST1 GND

G

A3 A2 A1 A8 A4 A9 COREVDD PA DV D D COREVDD TEST2 PA DV D D

H

RTC_CRIN RTC_VDDA CS0/CS4 RW

J

RTCVSSA RTCCROUT

K

ADIN1/

L

GPI53

M

N

P

R

ADIN4/

GPI56

OSCPAD

VDD

OSCPAD

GND

GND

ADREF CRIN

CROUT

PLLCORE

PLLCORE

ADIN2/

GPI54

VDD

GND

ADIN0/

GPI52

ADIN3/

GPI55

PLLCORE

VDD

PLLCORE

GND

OE

ADVDD PAD V DD

ADGND

PLLCORE

VDD

PLLCORE

GND

IDE_DIOW/

GPIO32

IDE_IORDY/

GPIO33

BCLK/

GPIO40

ADOUT/
SCLK4/
GPIO58

GND PADV D D GND PA DV DD GND PA DV DD USBGND USBVDDP USBVDD USB_CRIN

IDE_DIOR

GPIO31

TA

/GPIO12

BUFENB1/

GPIO29

WAKEUP/

GPIO21

SDCS0
GPIO60

SDLDQM

GPO52

SDCAS
GPIO39

BCLKE/

GPIO63

ADIN5/

GPI57

BUFENB2

GPIO30

EBUIN2/

/

SCLKOUT/

GPIO13

EBUIN1/
GPIO36

EBUOUT1/

GPIO37

XTRIM/

TXD2/

GPIO0

/

ATA_A1 ATA_A2 ATA_D0 ATA_D4 ATA_D9 ATA_D14 HI_Z

/

SDWE/

GPIO38

/

ATA_IORDY ATA_INTRQ ATA_CS1 ATA_D7 ATA_D8 ATA_D15 CAN0_RX

PA DV D D GND PAD VD D GND ATA_D13 CAN1_RX

GND COREVDD GND GND GND

EBUIN3/CM

/

D_SDIO2/

GPIO14

CS1

QSPICS3/

GPIO28

RCK/QSPID

IN/QSPIDO

UT/GPIO26

QSPICLK/

SUBR/

GPIO25

QSPICS0/

EBUIN4/

GPIO15

ATA_RST ATA_CS0 ATA_D5 ATA_D10

DDATA0/

/SDAT

CTS1

A0_SDIO1/

GPIO1

LRCK3/

AUDCLK/

GPIO43

SDATAI3/

GPIO8

SCL0/SDAT

A1_BS1/

GPIO41

SCLK3/
GPIO35

/

SCLK1/
GPIO20

QSPIDOUT/

SFSY/

GPIO27

QSPICS1/

EBUOUT2/

GPIO16

LRCK1/
GPIO19

SDATAO1/

TOUT0/
GPIO18

SDA0/

SDATA3/

GPIO42

CFLG/
GPIO5

SDATAI1/

GPIO17

QSPICS2/

MCLK2/
GPIO24

EF/RXD2/

GPIO6

USBGND N/C N/C N/C N/C

USBID

DDATA1/RT
S1/SDATA2

_BS2/

GPIO2

ATA _D M AC

K

PST1/

GPIO49

TXD0/

GPIO45

DDATA3/

RTS0/

GPIO4

USBGND USBVDD USBRES USBDP

N/C N/C N/C USBVBUS USBDN

N/C N/C TESTOUT N/C N/C

N/C PADVDD NC

TDO/DSO

INTMON1/

SCL1/TXD1/

LINOUT ATA_DIOR

LINGND CAN1_TX CAN0_TX

SCLK2/

GPIO22

PST3/

GPIO47

GPIO10

MCLK1/
GPIO11

LRCK2/
GPIO23

TRST

DSCLK

PSTCLK/

GPIO51

PST2/

INTMON2/

GPIO48

DDATA2/

CTS0
GPIO3

/

SDA1/RXD1

/

USB_CROU

SDATAO2/

GPIO34

RSTI

TDI/DSI

PST0/

GPIO50

RXD0/

GPIO46

/GPIO44

T

GND

B

C

D

E

F

G

H

J

K

L

M

Package Information and Pinout

N

P

R

123456789101112131415

Figure 6. MCF5253 Ball Map

Package Information and Pinout

Table 17 shows the signal color and signal name legend.

Table 17. Signal Color/Name Legend

Color Name

None Signal name as listed

GND

PA DV D D

COREVDD

USBGND

Table 18 shows the device pin list, sorted by signal identification.

3

Table 18. MCF5253 13 x 13 BGA (225 Signal ID by Pad Grid Location)

Signal ID Pad Location

A1 H03
A10 F02
A11 G05
A12 F03
A13 F01
A14 E01
A15 G04
A16 E02
A17 F04
A18 E03
A19 F05

A2 H02

A20/A24 F06

A21 D03
A22 D01

A23/GPO54 D02

A3 H01

A4 H05

A5 G01

A6 G03

A7 G02

A8 H04

A9 H06

ADGND L04
ADIN0/GPI52 K03
ADIN1/GPI53 L01
ADIN2/GPI54 L02
ADIN3/GPI55 L03
ADIN4/GPI56 M01
ADIN5/GPI57 J06

ADOUT/SCLK4/GPIO58 J05

ADREF M02
ADVDD K04

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

26 Freescale Semiconductor

Package Information and Pinout

Table 18. MCF5253 13 x 13 BGA (225 Signal ID by Pad Grid Location) (continued)

Signal ID Pad Location

ATA_A0 A08

ATA_A1 B07

ATA_A2 B08

ATA _C S0 C 09
ATA _C S1 D 09

ATA_D0 B09

ATA_D1 A09

ATA _ D1 0 C1 1
ATA _ D1 1 A 11
ATA _ D1 2 A 12
ATA _ D1 3 E 11
ATA _ D1 4 B 12
ATA _ D1 5 D1 2

ATA _D 2 F0 8

ATA _D 3 F0 9

ATA_D4 B10

ATA_D5 C10

ATA_D6 A10

ATA_D7 D10

ATA_D8 D11

ATA_D9 B11

ATA_DIOR B15

ATA_DIOW A13
ATA _ DM A CK C 1 2
ATA_DMARQ A07

ATA _ IN T R Q D 08
ATA _I OR DY D 0 7

ATA _R ST

BCLK/GPIO40 B05

BCLKE/GPIO63 E06
BUFENB1
BUFENB2

/GPIO29 P05
/GPIO30 K06

CAN0_RX D13

CAN0_TX C15

CAN1_RX E12

CAN1_TX C14

CFLG/GPIO5 M09

COREVDD G08
COREVDD H07
COREVDD H09
COREVDD J08

CRIN M03

CROUT N02

/CS4 J03

CS0

/QSPICS3/GPIO28 M07

CS1

D16 C01

C08

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

Freescale Semiconductor 27

Package Information and Pinout

Table 18. MCF5253 13 x 13 BGA (225 Signal ID by Pad Grid Location) (continued)

Signal ID Pad Location

D17 E04
D18 E05
D19 B01
D20 C02
D21 D04
D22 C03
D23 B02
D24 A02
D25 B03
D26 A03
D27 C04
D28 B04
D29 D05
D30 A04
D31 C05

DDATA0/CTS1

DDATA1/RTS1

/SDATA0_SDIO1/GPIO1 K10

/SDATA2_BS2/GPIO2 R11
DDATA2/CTS0/GPIO3 J14
DDATA3/RTS0

/GPIO4 J12

EBUIN1/GPIO36 N06

EBUIN2/SCLKOUT/GPIO13 M06

EBUIN3/CMD_SDIO2/GPIO14 K07

EBUOUT1/GPIO37 P06

EF/RXD2/GPIO6 R09

GND A01
GND A15
GND E08
GND E10
GND F07
GND G06
GND G07
GND G09
GND G11
GND J07
GND J09
GND J10
GND J11
GND L05
GND L07
GND L09
GND R01
GND R15
HI_Z

_DIOR/GPIO31 M05

IDE

_DIOW/GPIO32 P04

IDE

_IORDY/GPIO33 R04

IDE

B13

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

28 Freescale Semiconductor

Package Information and Pinout

Table 18. MCF5253 13 x 13 BGA (225 Signal ID by Pad Grid Location) (continued)

Signal ID Pad Location

LINGND C13

LININ A14

LINOUT B14
LRCK1/GPIO19 P08
LRCK2/GPIO23 E14

LRCK3/AUDIOCLK/GPIO43 M10

MCLK1/GPIO11 D14

NC R14
OE

OSCPADGND P01

OSCPADVDD N01

PA DV D D E0 7
PA DV D D E0 9
PA DV D D F 10
PADVDD H08
PADVDD H11
PA DV D D K0 5
PA DV D D L 0 6
PA DV D D L 0 8
PA DV D D L 1 0
PADVDD R13

PLLAVDD M04
PLLCOREGND N04
PLLCOREGND P03
PLLCOREGND R02

PLLCOREVDD N03
PLLCOREVDD P02

PST0/GPIO50 G15

PST1/GPIO49 G12
PST2/INTMON2/GPIO48 H14
PST3/INTMON1/GPIO47 H13

PSTCLK/GPIO51 G14

QSPICLK/SUBR/GPIO25 P07

QSPICS0/EBUIN4/GPIO15 R07

QSPICS1/EBUOUT2/GPIO16 N08

QSPICS2/MCLK2/GPIO24 P09

QSPIDOUT/SFSY/GPIO27 M08

RCK/QSPIDIN/QSPIDOUT/GPIO26 N07

RSTI E15

RTC_CRIN J01

RTC_VDDA J02

RTCCROUT K02

RTCVSSA K01

RW J04

RXD0/GPIO46 H15

SCL0/SDATA1_BS1/GPIO41 P10

R03

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

Freescale Semiconductor 29

Package Information and Pinout

Table 18. MCF5253 13 x 13 BGA (225 Signal ID by Pad Grid Location) (continued)

Signal ID Pad Location

SCL1/TXD1/GPIO10 J13

SCLK1/GPIO20 K08
SCLK2/GPIO22 E13
SCLK3/GPIO35 R10

SDA0/SDATA3/GPIO42 K09

SDA1/RXD1/GPIO44 J15

SDATAI1/GPIO17 N09

SDATAI3/GPIO8 N10

SDATAO1/TOUT0/GPIO18 R08

SDATAO2/GPIO34 D15

SDCAS

/GPIO39 D06

SDCS0/GPIO60 B06

SDLDQM

SDRAS

/GPO52 C06

/GPIO59 A06

SDUDQM/GPO53 A05

/GPIO38 C07

SDWE

/GPIO12 N05

TA

TCK F13

TDI/DSI F15

TDO/DSO G13

TEST0 F11
TEST1 G10
TEST2 H10

TESTOUT P13

TMS/BKPT

/DSCLK F14

TRST

F12

TXD0/GPIO45 H12

USB_CRIN L14

USB_CROUT L15

USBDN N15

USBDP M15
USBGND K11
USBGND L11
USBGND M12

USBID M11

USBRES M14

USBVBUS N14

USBVDD L13
USBVDD M13

USBVDDP L12

WAKEUP

/GPIO21 R05

XTRIM/TXD2/GPIO0 R06

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

30 Freescale Semiconductor

Product Documentation

6 Product Documentation

This section includes the related product documentation and references to information posted on
Freescale’s external web page.

This document is labeled as the type: Data Sheet: Technical Data. Definitions for all Freescale document
types are available at: http://www.freescale.com.

You can also obtain information on the mechanical characteristics of the MCF5253 integrated
microprocessor at http://www.freescale.com/coldfire.

The following documents are required for a complete description of the device and are necessary for
proper design:

MCF5253 Reference Manual (order number: MCF5253RM)
MCF5253 Product Brief (order number: MCF5253PB)

6.1 Revision History

Table 19 summarizes revisions to this document.

Table 19. MCF5253DS Revision History

Rev. No. Substantive Change(s)

2 First public version.

MCF5253 ColdFire Processor Data Sheet: Technical Data, Rev. 2

Freescale Semiconductor 31

How to Reach Us:

Home Page:

www.freescale.com

E-mail:

[e-mail]

USA/Europe or Locations Not Listed:

Freescale Semiconductor
Technical Information Center, CH370
1300 N. Alma School Road
Chandler, Arizona 85224
[phone] or [phone]
[e-mail]

Europe, Middle East, and Africa:

Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
[phone] (English)
[phone] (English)
[phone] (German)
[phone] (French)
[e-mail]

Japan:

Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064, Japan
0120 191014 or [phone]
[e-mail]

Asia/Pacific:

Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
[phone]
[e-mail]

For Literature Requests Only:

Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-521-6274 or 303-675-2140
Fax: [phone]
[e-mail]

Information in this document is provided solely to enable system and software implementers to use
Freescale Semiconductor products. There are no express or implied copyright licenses granted
hereunder to design or fabricate any integrated circuits or integrated circuits based on the information
in this document.

Freescale Semiconductor reserves the right to make changes without further notice to any products
herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages. “Typical” parameters
that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating parameters,
including “Typicals”, must be validated for each customer application by customer’s technical experts.
Freescale Semiconductor does not convey any license under its patent rights nor the rights of others.
Freescale Semiconductor products are not designed, intended, or authorized for use as components
in systems intended for surgical implant into the body, or other applications intended to support or
sustain life, or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer purchase or use
Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall
indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and
distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney
fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was
negligent regarding the design or manufacture of the part.

Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other
product or service names are the property of their respective owners.

© Freescale Semiconductor, Inc. 2007. All rights reserved.

Document Number : MCF5253DS
Rev. 2
03/2007