Dell T110 II User Manual

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PowerEdge T110 II

Technical Guide

Ideal for collaboration, file sharing, and data protection, the T110 II is an ideal first server for

small businesses.

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Dell

This document is for informational purposes only. Dell reserves the right to make changes without further notice to any products herein. The content provided is as is and without express or implied warranties of any kind.

Dell, PowerEdge, Dell OpenManage, and ReadyRails are trademarks of Dell, Inc. Intel, Xeon, Pentium, and Celeron are registered trademarks and Core is a trademark of Intel Corporation in the U.S. and other countries. Broadcom is a registered trademark and NetXtreme is a trademark of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Linux is a registered trademark of Linus Torvalds. Matrox is a registered trademark of Matrox Electronic Systems Ltd. Microsoft, Windows, Windows Server, SQL Server, Active Directory, and SharePoint are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Novell and SUSE are registered trademarks of Novell, Inc., in the United States and in other countries. Red Hat is a registered trademark of Red Hat, Inc. in the United States and other countries. Other trademarks and trade names may be used in this document to refer to either the entities claiming the marks and names or their products. Dell disclaims proprietary interest in the marks and names of others.

©Copyright 2011 Dell Inc. All rights reserved. Reproduction or translation of any part of this work beyond that permitted by U.S. copyright laws without the written permission of Dell Inc. is unlawful and strictly forbidden.

June 2011

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Table of Contents

1 Product Comparison ........................................................................................... 6

1.1 Overview .................................................................................................... 6

1.2 Business Value .............................................................................................. 6

1.3 Easy Access.................................................................................................. 6

1.4 Secure Technology ......................................................................................... 6

1.5 Business Friendly ........................................................................................... 7

1.6 Comparison ................................................................................................. 7

2 New Technologies ............................................................................................. 9

2.1 Overview .................................................................................................... 9

2.2 Processor Features ......................................................................................... 9

3 System Information .......................................................................................... 10

3.1 Overview .................................................................................................. 10

4 Mechanical .................................................................................................... 12

4.1 Chassis Description....................................................................................... 12

4.2 Dimensions and Weight .................................................................................. 12

4.3 Front-Panel View and Features ........................................................................ 13

4.4 Back-Panel View and Features ......................................................................... 14

4.5 Internal-Chassis View .................................................................................... 15

4.6 Power Indicator .......................................................................................... 15

4.7 NIC Indicators ............................................................................................. 15

4.8 Rails and Cable Management ........................................................................... 15

4.9 Fans ........................................................................................................ 15

4.10 LED Control Panel ........................................................................................ 16

4.11 Security .................................................................................................... 16

4.11.1 Cover Latch ....................................................................................... 16

4.11.2 Bezel ............................................................................................... 16

4.11.3 Hard Drive ......................................................................................... 16

4.11.4 TPM ................................................................................................. 16

4.11.5 Power Off Security ............................................................................... 16

4.11.6 Intrusion Alert .................................................................................... 16

4.11.7 Secure Mode ...................................................................................... 16

4.12 USB Key .................................................................................................... 17

4.13 Battery ..................................................................................................... 17

4.14 Field Replaceable Units (FRU).......................................................................... 17

4.15 User Accessible Jumpers, Sockets, and Connectors ................................................. 17

5 Power, Thermal, Acoustic .................................................................................. 18

5.1 Power Supplies ........................................................................................... 18

5.2 Power Supply Specifications ............................................................................ 18

5.3 Heat Dissipation .......................................................................................... 18

5.4 Environmental Specifications........................................................................... 19

5.5 Maximum Input Amps .................................................................................... 20

5.6 Thermal.................................................................................................... 20

5.7 Acoustics .................................................................................................. 20

6 Processors ..................................................................................................... 23

6.1 Overview .................................................................................................. 23

6.2 Processor Features ....................................................................................... 23

6.3 Supported Processors .................................................................................... 23

6.4 Processor Configurations ................................................................................ 23

6.5 Processor Installation .................................................................................... 23

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7 Memory ........................................................................................................ 24

7.1 Overview .................................................................................................. 24

7.2 DIMMs Supported ......................................................................................... 24

7.3 DIMM Slots ................................................................................................. 24

7.4 Speed ...................................................................................................... 24

7.5 Sparing ..................................................................................................... 24

7.6 Mirroring ................................................................................................... 24

7.7 RAID ........................................................................................................ 24

7.8 Supported Configurations ............................................................................... 24

8 Chipset ........................................................................................................ 26

8.1 Overview .................................................................................................. 26

8.2 Direct Media Interface .................................................................................. 26

8.3 PCI Express Interface .................................................................................... 26

8.4 SATA interface: ........................................................................................... 26

8.5 AHCI: ....................................................................................................... 26

8.6 PCI Interface: ............................................................................................. 26

8.7 Low Pin Count (LPC) Interface: ........................................................................ 26

8.8 Serial Peripheral Interface (SPI): ...................................................................... 27

8.9 Compatibility Module .................................................................................... 27

8.10 Advanced Programmable Interrupt Controller (APIC): .............................................. 27

8.11 USB interface: ............................................................................................ 27

8.12 RTC: ........................................................................................................ 27

8.13 GPIO: ....................................................................................................... 28

8.14 Enhanced Power Management.......................................................................... 28

8.15 System Management Features .......................................................................... 28

8.15.1 TCO Timer ......................................................................................... 28

8.15.2 Processor Present Indicator ..................................................................... 28

8.15.3 Error Code Correction (ECC) Reporting ....................................................... 28

8.15.4 Function Disable .................................................................................. 28

8.16 System Management Bus (SMBus 2.0) ................................................................. 28

8.17 Intel Virtualization Technology for Directed I/O .................................................... 29

9 BIOS ............................................................................................................ 30

9.1 Overview .................................................................................................. 30

9.2 Supported ACPI States ................................................................................... 30

9.2.1 Power Management .............................................................................. 30

10 Embedded NICs/LAN on Motherboard (LOM) ............................................................. 32

10.1 Overview .................................................................................................. 32

10.2 NICs ........................................................................................................ 32

11 PCI Slots ....................................................................................................... 33

11.1 Overview .................................................................................................. 33

11.2 Quantities and Priorities ................................................................................ 33

11.3 PCI Card Dimensions ..................................................................................... 33

12 Storage ........................................................................................................ 34

12.1 Overview .................................................................................................. 34

12.2 Hard Drives ................................................................................................ 34

12.3 RAID Configurations ...................................................................................... 34

12.4 Storage Controllers ...................................................................................... 35

12.5 Optical Drives ............................................................................................. 36

12.6 Tape Drives ............................................................................................... 36

13 Video .......................................................................................................... 37

14 Rack Information ............................................................................................. 38

15 Operating Systems ........................................................................................... 39

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16 Systems Management ....................................................................................... 40

16.1 Overview .................................................................................................. 40

16.2 Server Management ...................................................................................... 40

16.3 Embedded Server Management ........................................................................ 40

16.3.1 Unified Server Configurator .................................................................... 41

16.3.2 Base Management Functionality ............................................................... 41

17 Peripherals .................................................................................................... 42

Appendix A. Statement of Volatility ......................................................................... 43

Appendix B. Certifications .................................................................................... 46

Regulatory Certifications ............................................................................... 46B 1.

Product Safety Certifications ........................................................................... 46B 2.

Electromagnetic Compatibility ......................................................................... 47B 3.

Ergonomics, Acoustics and Hygienics ................................................................. 47B 4.

Appendix C. Industry Standards .............................................................................. 48

Tables

PowerEdge T110 II Product Comparison to T110 and T310 ....................................... 7 Table 1.

Product Features Summary .......................................................................... 10 Table 2.

Power Supply Specifications ........................................................................ 18 Table 3.

Environmental Specifications ....................................................................... 19 Table 4.

Formulas for Maximum Operating Temperature at Given Altitude ............................ 19 Table 5.

Shock and Vibration Specifications ................................................................. 20 Table 6.

Acoustical Specifications ............................................................................ 21 Table 7.

Table 8.

Supported Processors ................................................................................ 23

Supported Memory Configurations ................................................................. 25 Table 9.

Power Management Features ....................................................................... 30 Table 10.

Supported Hard Drives ............................................................................... 34 Table 11.

Factory RAID Configurations ........................................................................ 34 Table 12.

Graphics Video Modes ................................................................................ 37 Table 13.

Unified Server Configurator Features and Description .......................................... 41 Table 14.

Volatility Table ........................................................................................ 43 Table 15.

Product Safety Certifications ....................................................................... 46 Table 16.

Electromagnetic Compatibility Certifications .................................................... 47 Table 17.

Ergonomics, Acoustics and Hygienics .............................................................. 47 Table 18.

Industry Standards .................................................................................... 48 Table 19.

Figures

Figure 1. Dimensions (mm) and Weight (kg) ................................................................. 12

Figure 2. Front Panel View ...................................................................................... 13

Figure 3. Back Panel View ...................................................................................... 14

Figure 4. Internal Chassis View ................................................................................. 15

Figure 5. Power Button .......................................................................................... 15

Figure 6. LED Control Panel..................................................................................... 16

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1 Product Comparison

1.1 Overview

The Dell™ PowerEdge™ T110 II is a powerful and reliable server in a tower form factor that is designed to deliver the right combination of performance, data protection and value. It is an ideal first server for small businesses considering or implementing desktop consolidation, file sharing, printer sharing or wishing to reduce software licensing charges. The T110 II delivers continuity and confidence, allowing you to focus on running your business instead of running your computers.

1.2 Business Value

The PowerEdge T110 II is designed to meet the needs of your small business environment, both now and as it grows into the future. It has sizeable performance headroom and its data-storage capability can be expanded by adding more hard drives or higher-capacity hard drives. Your data can be secured using RAID options for added data protection. The T110 II also provides straightforward systems management for easy deployment, monitoring and ongoing administration.

1.3 Easy Access

Run applications, share information or access your data from any workstation in the office and let employees work collaboratively by moving to a server-based network.

Adding a server to your business gives you the ability to connect with collaboration suites to meet and share documents or desktops over the Internet, deliver instant messages, make calls over the Internet and share desktops during conference calls—all without adding an IT staff.

The PowerEdge T110 II is ideally suited to give your business the flexibility and access you and your employees need to get more done.

1.4 Secure Technology

Keep data secure and control file access with built-in encryption, security and data protection options. When coupled with the latest version of Microsoft® Windows® Small Business Server 2011 (SBS 2011), the PowerEdge T110 II delivers an integrated solution that can further protect your data by providing automatic backup and restore functionality, as well as email, remote access and collaboration to help take your business to the next level.

With the PowerEdge T110 II, you can:

 Avoid costly business interruptions and potentially catastrophic security breaches with

hardware-enabled advanced security and encryption features.

 Configure your system with an optional RAID controller to make copies of data automatically,

preventing downtime in the event of a hard drive failure.

 Protect your files with the Microsoft

features that let you restore files and recover data, including automatic backups on PowerEdge servers.

Windows Small Business Server 2011 standard backup

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Feature

T110 (Predecessor)

T110 II

T310

Processor

Quad-core Intel® Xeon® processor 3400 series

Dual-core Intel Celeron® G1101

Dual-core Intel Pentium® G6950

Dual-core Intel Core™ i3 530 processors

Dual-core Intel Core i3 540 processors

Dual-core Intel Core i3 550 processors

Intel® Xeon® processor E3-1200 product family

Intel Core™ i3-2100 product family

Intel Pentium® processors (when available)

Quad-core Intel® Xeon® processor 3400 series

Dual-core Intel Celeron® G1101

Dual-core Intel Pentium® G6950

Dual-core Intel Core™ i3 530 processors

Dual-core Intel Core i3 540 processors

Dual-core Intel Core i3 550 processors

Front Side Bus

DMI

DMI II

DMI

Sockets

Cores

2 or 4

L2/L3 Cache

4MB or 8MB

3MB or 8MB

4MB or 8MB

Chipset

Intel 3420

Intel C202

Intel 3420

DIMMs

4 DDR3 Unbuffered with ECC

1333/1066MHz

4 DDR3 Unbuffered with ECC

1333/1066MHz

6 DDR3 Unbuffered with ECC

1333/1066MHz

Min/Max RAM

1GB/16GB

1GB/32GB

Hard Drive Bays

4 x 3.5‖

4 x 3.5‖ or 6 x 2.5‖ (available Q2

2011)

4 x 3.5‖ Optional hot-plug Support 2.5" hard drives

with hot-plug tray

Hard Drive Types

Default SATA Optional SAS with add-in

controller

Default SATA Optional SAS with add-in

controller

Default SATA Optional SAS and SSD

with add-in controller

External Drive Bays

2 x 5.25‖

1.5 Business Friendly

Easy to install, tailorable to your specific requirements and offering room for growth, the PowerEdge T110 II is the ideal server for small businesses and for remote offices of larger organizations.

 Get the processing power your business demands with options from the Intel

Xeon® processor

E3-1200 product family or the Intel Core™ i3-2100 product family.

 Choose processor options and memory configurations that are balanced to run typical business

applications, including Microsoft Windows Small Business Server, SQL Server® Workgroup/Standard, Active Directory®, SharePoint® Server and file and print.

 Meet the needs of noise-sensitive environments, thanks to a design that gives you

business-class performance with similar sound levels as a standard desktop computer.

1.6 Comparison

Comparison of PowerEdge T110 II to T110 and T310 Table 1.

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Feature

T110 (Predecessor)

T110 II

T310

Embedded Hard Drive Controller

Chipset-based SATA PERC S100 (Embedded

SW RAID)

Chipset-based SATA PERC S100 (Embedded

SW RAID)

Chipset-based SATA PERC S100 (Embedded SW

RAID)

Optional Storage Controller

Non-RAID:

SAS 5/E LSI 2032 (for tape backup

unit only)

RAID:

SAS 6/iR Adapter PERC S300 PERC H200

Non-RAID:

6GB SAS HBA

RAID:

PERC S300 PERC H200

Non-RAID:

SAS 5/E LSI 2032 (for tape backup

unit only)

RAID:

SAS 6/iR PERC S300 PERC H200 PERC 6/i PERC 6/E

Availability

ECC memory, add-in RAID, TPM/CTPM

Hot-plug hard drives Redundant power Quad-pack LED or LCD

diagnostic with hot-plug hard drive chassis

Server Management

Baseboard Management Controller (BMC), IPMI

2.0 compliant

Baseboard Management Controller (BMC), IPMI

2.0 compliant

Baseboard Management Controller (BMC), IPMI

2.0 compliant, Full Dell OpenManage™ suite

Optional: iDRAC6 Express, iDRAC6 Enterprise, vFlash media

I/O Slots

1 PCIe x16 (x8 routing) (under 25W only)

1 PCIe x8 (x8 routing) 1 PCIe x8 (x4 routing) 1 PCIe x1 (x1 routing)

1 PCIe x16 (x8 routing) (under 25W only)

1 PCIe x8 1 PCIe x8 (x4 routing) 1 PCIe x1

1 PCIe x16 (x8 routing) 1 PCIe x8 (x8 routing) 1 PCIe x8 (x4 routing) 2 PCIe x1 (x1 routing)

NIC/LOM

1 x GbE LOM Optional: various NICs

available

1 x GbE LOM Optional: various NICs

available

2 x GbE LOM Optional: various NICs

available

USB

2 front, 4 back, 2 internal

Power Supplies

Non-redundant, 305W

Non-redundant, auto-sensing, 305W (80+)

Non-redundant, 375W (80+ SILVER)

Optional redundant, 400W (80+ GOLD)

Auto-ranging (100V~240V)

Fans

Non-redundant, non-hot pluggable

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2 New Technologies

2.1 Overview

The PowerEdge T110 II uses the latest Intel® C202 chipset and supports the Intel Xeon® processor E3-1200 product family and the Intel Core™ i3-2100 product family.

New technologies include the following:

 Significant performance improvement (up to 25%) over previous generation  Twice the memory footprint at 32GB  Direct Media Interface (DMI) Gen 2  Support for up to four 3.5‖ SAS, nearline SAS, or SATA drives; support for up to six 2.5‖ SAS or

SSD hard drives (six 2.5‖ hard drive support available Q2 2011)

2.2 Processor Features

The Intel Xeon processor E3-1200 product family features:

 New micro architecture on 32 nm processor provides higher performance and lower power  Next generation Intel  Dynamic Turbo  Dual-core and quad-core processing  New Advanced Encryption Standard (AES) for improved encryption and decryption

performance

Turbo Boost Technology

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Feature

Technical Specification

Form Factor

Tower

Processors

Quad-core Intel® Xeon® processor E3-1200 product family Dual-core Intel Core™ i3-2100 product family

Processor Sockets

Front Side Bus or HyperTransport

DMI II (Direct Media Interface)

Cache

8MB

Chipset

Intel C202

Memory1

Up to 32GB (4 DIMMs): 1GB/2GB/4GB/8GB DDR3 up to 1333MHz

I/O Slots

4 PCIe slots:

Two x8 slots (one with x16 connector) One x4 slot (with x8 connector) One x1 slot

RAID Controller

Internal:

PERC H200 PERC S100 (software based) PERC S300 (software based)

External:

6GB/s SAS HBA

Drive Bays

Up to four 3.5‖ cabled SAS, nearline SAS, or SATA drives or Up to six 2.5‖ cabled SSD or SAS drives (available Q2 2011)

Maximum Internal Storage

Up to 8TB

Hard Drives

3.5‖ SAS (15K), nearline SAS (7.2K), SATA (7.2K, 5.4K)

2.5‖ SAS SSD, SAS (10K)

Embedded LOM/ NIC

Integrated Broadcom® BCM5722 Gigabit Ethernet Controller

3 System Information

3.1 Overview

Table 2 summarizes the features for the PowerEdge T110 II. For the latest information on supported features, visit Dell.com.

Product Features Summary Table 2.

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Feature

Technical Specification

Communications

Optional add-in NICs :

Broadcom NetXtreme® II 5722 Single Port Ethernet PCI-Express Network Interface Card

Broadcom NetXtreme II 5709 Dual Port Ethernet PCIe Card with TOE Broadcom NetXtreme II 5709 Dual Port Ethernet PCIe Card with TOE and

iSCSI Offload Intel PRO/1000 PT Server Adapter Intel Gigabit ET Dual Port Server Adapter

Power Supply

Single cabled power supply (305W)

Availability

Quad-pack LED diagnostics, ECC memory, add-in RAID, TPM/TCM

Video

Matrox® G200eW with 8MB memory

Remote Management

N/A

Systems Management

BMC, IPMI 2.0 compliant Dell™ OpenManage™ featuring Dell Management Console (DMC) Unified Server Configurator

Operating Systems

Microsoft® Windows® Small Business Server 2011 Microsoft Windows Server® 2008 R2 Foundation SP12 Microsoft Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V™) Microsoft Windows Server 2008 R2 SP1, x64 (includes Hyper-V™ v2) Novell® SUSE® Linux® Enterprise Server Red Hat® Enterprise Linux®

For more information on the specific versions and additions, visit

www.dell.com/OSsupport.

Featured Database Applications

Microsoft® SQL Server® solutions (see Dell.com/SQL)

GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded

material and operating environment and will be less.

Windows Server 2008 R2 Foundation SP1 allows only 15 user accounts and requires certain Active Directory (AD) configurations. If not configured according to the product documentation, the software will generate warnings to correct the configuration. After a certain amount of time, the software will only run for one hour at a time until the configuration is corrected. For more information about these features review the product documentation located at http://go.microsoft.com/fwlink/?LinkId=143551

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Za (with bezel)

Za (without

bezel)

Zb*

Max Weight

189.35

N/A

417.90

420.3

N/A

37.50

N/A

407.20

426.22

15.50

4 Mechanical

4.1 Chassis Description

The PowerEdge T110 II is a tower chassis design that supports the following features:

 Four 3.5‖ cabled hard drives or six 2.5‖ cabled hard drives (available Q2 2011)  Single non-redundant power supply  Diagnostic LED panel

4.2 Dimensions and Weight

*Note: Zb goes to the nominal rear wall external surface where the motherboard I/O connectors reside.

Figure 1. Dimensions (mm) and Weight (kg)

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4.3 Front-Panel View and Features

Figure 2 shows the front-panel view of the PowerEdge T110 II.

Figure 2. Front-Panel View

See the Front-Panel Features and Indicators section in the About Your System chapter of the PowerEdge T110 II Systems Owner’s Manual on Support.Dell.com for more information on features.

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4.4 Back-Panel View and Features

Figure 3 shows the back-panel view of the PowerEdge T110 II.

Figure 3. Back-Panel View

See the Back-Panel Features and Indicators section in the About Your System chapter of the PowerEdge T110 II Systems Owner’s Manual on Support.Dell.com for more information on features.

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4.5 Internal-Chassis View

Figure 4 shows the internal-chassis view of the PowerEdge T110 II.

Figure 4. Internal-Chassis View

4.6 Power Indicator

All Dell PowerEdge servers have a green LED integrated in the power button which indicates the system‘s power state. Figure 5 shows the power button.

Figure 5. Power Button

4.7 NIC Indicators

See the NIC Indicator Codes section in the About Your System chapter of the PowerEdge T110 II Systems Owner’s Manual on Support.Dell.com for more information.

4.8 Rails and Cable Management

The PowerEdge T110 II is not a rackable system and does not have a rack kit. However, the T110 II can be stored in a rack using a third-party rack tray.

4.9 Fans

There is one cabled system fan located at back of the system. It is not hot-pluggable.

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4.10 LED Control Panel

Figure 6 shows the LED control panel located on the front of the T110 II system.

Figure 6. LED Control Panel

For a complete description of LED indicators, their causes, and possible courses of action to take to resolve an error, see the Diagnostic Lights (Optional) section in the About Your System chapter in the PowerEdge T110 II Systems Owner’s Manual on Support.Dell.com.

4.11 Security

For additional information regarding the following security features, see the PowerEdge T110 II Systems Owner’s Manual on Support.Dell.com.

4.11.1 Cover Latch

The PowerEdge RT10 II comes with a lockable entry latch on the side cover of the unit and provides security for the entire system. The latch provides for toolless access to the chassis.

4.11.2 Bezel

The bezel is a one piece plastic bezel that cannot be removed from the front of the chassis.

4.11.3 Hard Drive

The hard drives are secured by the lockable cover latch on the side of the system.

4.11.4 TPM

The Trusted Platform Module (TPM) is used to generate and store keys, protect and authenticate passwords, and create and store digital certificates. The TPM can also be used to store Microsoft®

BitLocker™ keys for hard drive encryption features in Microsoft Windows Server® 2008. TPM is

enabled through a BIOS option.

4.11.5 Power Off Security

There is a setting in the CMOS setup that disables the power button function.

4.11.6 Intrusion Alert

A switch mounted on the inside of the chassis detects chassis intrusion. When the cover is opened, the switch circuit closes to indicate intrusion.

4.11.7 Secure Mode

BIOS has the ability to enter a secure boot mode through Setup. This mode includes the option to lock out the power or set up a system password.

For more information, see System and Setup Password Features section in the About Your System chapter in the PowerEdge T110 II Systems Owner’s Manual on Support.Dell.com.

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4.12 USB Key

The PowerEdge T110 II has two internal USB keys.

4.13 Battery

A replaceable coin cell CR2032 3V battery is mounted on the planar provides backup power for the Real-Time Clock and CMOS RAM on the PCH C202 chip.

4.14 Field Replaceable Units (FRU)

The planar contains a 32K bit serial EEPROM to store FRU information including Dell part number, part revision level, and serial number. This part will also be used as SEL (system event log) especially

to be used by the baseboard management controller (BMC).

4.15 User Accessible Jumpers, Sockets, and Connectors

See the Jumpers and Connectors chapter in the PowerEdge T110 II Hardware Owner’s Manual on Support.Dell.com.

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Feature

Non-redundant Power Supply

Dimensions

L-140mm x W-150mm x H-98mm

Status Indicators

N/A

Integrated Fans

Yes

Fixed Input Plug

Yes

AC Cord Rating

15A @ 120 VAC, 10A @ 240 VAC

Input Voltage

90–264 VAC

Auto-ranging

Yes

Line Frequency

47Hz–63Hz

Maximum Inrush Current

58A for 10 ms or less

Hot-Swap Capability

Output Power

305 Watts

Maximum Heat Dissipation

1300 BTU per hour

Efficiency (20% - 100% Load)

80% @ 115 VAC

5 Power, Thermal, Acoustic

5.1 Power Supplies

The base PowerEdge T110 II system includes a single 305W power supply. This unit provides power to the planar, the internal hard drive bays, and the two 5.25‖ internal drive bays. Power is soft-switched, allowing power cycling using a switch on the front of the system enclosure or through software control (server management functions). The power system is compatible with industry standards, such as ACPI and Server 2000.

5.2 Power Supply Specifications

Table 3.

Power Supply Specifications

5.3 Heat Dissipation

The heat dissipation for the T110 II power supply is measured at 1300 BTU/hr (maximum).

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Specification

Operating Requirements

Non-Operating Requirements

Temperature Ranges (For altitude ≤ 900m or 2952.75ft)

10°C to 35°C (50°F to 95°F)

-40°C to 65°C (-40°F to 149°F)

Temperature Ranges (For altitude > 900m or 2952.75ft)

10°C to T

°C

(50°F to T1°F)

Temperature Gradient (maximum per 60 minutes)

10°C

20°C

Humidity Percent Ranges (noncondensing)

20% to 80% (maximum wet bulb

temperature = 29°C)

5% to 95% (maximum wet bulb

temperature = 38°C)

Humidity Gradient (maximum per 60 minutes)

10%

Altitude Ranges

Low Limits

-50ft (-15.2m)

High Limits

10,000ft (3048m)

35,000ft (10,668m)

Temperature Scale

Formula

Altitude in Meters

Altitude in Feet

Celsius 35 –

Maximum Altitude (meters) - 900

300

°C

35 –

Maximum Altitude (feet) - 2952.75

984.25

°C

Fahrenheit 95 –

(Maximum Altitude (meters) - 900) x 1.8

300

°F

95 –

(Maximum Altitude (feet) - 2952.75) x 1.8

984.25

°F

5.4 Environmental Specifications

Table 4 summarizes the environmental specifications for the PowerEdge T110 II.

Environmental Specifications Table 4.

Use the formulas in Table 5 to calculate the maximum operating temperature, T (°C or °F), for the given

altitude (in meters or feet).

Formulas for Maximum Operating Temperature at Given Altitude Table 5.

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Maximum Vibration

Operating

0.26Grms at 5–350Hz for 15 minutes

Storage

1.88Grms at 10–500Hz for 15 minutes

Maximum Shock

Operating

One shock pulse in the positive z axis (one pulse on each side of the system) of 31G for 2.6ms in the operational orientation

Storage

Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71G for up to 2ms.

Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of Half-sine shock 71G for up to 2ms and square-wave shock 32G, 270 in/sec.

Table 6 shows the shock and vibration specifications for the PowerEdge T110 II.

Shock and Vibration Specifications Table 6.

5.5 Maximum Input Amps

Maximum input current (high-output power supply):

 9A @ 90 VAC  4.5A @ 180 VAC

5.6 Thermal

The thermal design of the PowerEdge T110 II reflects the following:

 Closed-loop thermal fan speed control: The closed-loop thermal control method uses

feedback temperatures to dynamically determine proper fan speeds.

 Comprehensive thermal management: The PowerEdge T110 II controls system cooling fan

speed based on several different responses from critical component sensors, such as processor temperature, inlet ambient temperature, and system configurations. The thermal management adjusts proper cooling for the system according to what the system really needs.

 Optimized Ventilation: The T110 II chassis has a custom ventilation design for optimized air

flow path. Each component and peripheral is ensured sufficient air for cooling.

 Environmental Specifications: The optimized thermal management makes the T110 II

reliable under a wide range of operating environments.

5.7 Acoustics

The acoustical design of the PowerEdge T110 II reflects the following:

 Adherence to Dell’s high standards for sound quality: Sound quality is different from sound

power level and sound pressure level in that it describes how humans respond to annoyances

PowerEdge T110 II Technical Guide 20

in sound, like whistles and hums. One of the sound quality metrics in the Dell specification is prominence ratio of a tone, which is listed in Table 7.

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Minimum Configuration @ 23°C Ambient

Operating

Mode

LwA-UL

(bels)

LpA

(dBA)

Prominent

Tones

Processor

Hard Drives

Power Supply

Tape Drives

PCI

Cards

RAID

Intel®

CoreTM

i3-2100

(65W)

2 x 3.5‖

SATA

(7.2K) 500GB

1 x

305W

None

Standby

2.7

None

Idle

4.2

None

Active hard

drives

4.2

None

Stressed

processor

4.2

None

Typical Configuration @ 23°C Ambient

Operating

Mode

LwA-UL

(bels)

LpA

(dBA)

Prominent

Tones

Processor

Hard Drives

Power Supply

Tape Drives

PCI

Cards

RAID

Intel®

Xeon® E3-1200 product

family

(80W)

4 x 3.5‖

SATA

(7.2K)

1TB

1 x

250W

1 x Dell™

PowerVault™

RD1000

1 x

dual-

port NIC

PERC H200

Standby

2.7

None

Idle

4.9

None

Active hard

drives

4.9

None

Stressed

processor

4.9

None

 Hardware configurations affect system noise levels: Dell‘s thermal control provides for

cooling flexible to varying hardware configurations. Acoustical performances associated with two common configurations are listed in Table 7.

 Quiet office acoustics: Compare the values for LpA in Table 6 and note that they are lower

than ambient measurements of typical office environments. The minimal configuration of the T110 II shown in Table 6 (LpA ~27 dBA, which is similar to a quiet bedroom) would be inaudible in most environments.

 Noise ramp and descent at Boot-up: Fan speeds (hence noise levels) ramp up during the boot

process to add a layer of protection for component cooling (in the case that the system does not boot properly).

Acoustical Specifications Table 7.

Definitions

Standby: AC Power is connected to power supplies but the system is not turned on.

Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other specific

activity.

Active Hard Drives: An operating mode per ISO7779 (1999) definition 3.1.6; Section C.9 of ECMA-74 9th ed. (2005) is followed in exercising the hard disk drives.

Stressed Processor: An operating mode per ISO7779 (1999) definition 3.1.6; SPECPower set to 50% loading is used.

LwA–UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988) and measured in accordance to ISO 7779 (1999).

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LpA-Op: A-Weighted sound pressure level. The system is placed in center of ISO7779 table, while the acoustic transducer is located 150 cm above the floor and 50 cm in front of the equipment.

Prominent tones: Criteria of D.6 and D.11 of ECMA-74 11th ed. (2010) are followed to determine if discrete tones are prominent. The system is placed in a rack with its bottom at 75-cm from the floor. The acoustic transducer is at front bystander position, ref ISO7779 3rd (2010), Section 8.6.2.

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Model

Speed

Power

Cache

Cores

Intel Xeon E3-1270

3.40GHz

80W

Intel Xeon E3-1240

3.30GHz

80W

8M 4 Intel Xeon E3-1230

3.20GHz

80W

8M 4 Intel Xeon E3-1220

3.10GHz

80W

8M 4 Intel Core™ i3-2100

3.10GHz

65W

3M 2 Intel Pentium® G850

2.90GHz

65W

3M 2 Intel Pentium G620

2.60GHz

65W

6 Processors

6.1 Overview

The Dell™ PowerEdge™ T110 II system is a 1-socket entry-level server, supporting the Intel® Xeon® processor E3-1200 product family and the Intel Core™ i3-2100 product family.

6.2 Processor Features

Key features of the T110 II processors include:

 New micro architecture with 32 nm process provides higher performance and lower power  Intel Advanced Vector Extensions (AVX) accelerate FP-intensive applications  Next generation Intel Turbo Boost Technology  New Advanced Encryption Standard (AES) improves encryption and decryption performance  Dynamic Turbo  Dual-core and quad-core

6.3 Supported Processors

Processors supported on the T110 II are listed in Table 6. For the most up-to-date listings, see

Dell.com.

Supported Processors Table 8.

6.4 Processor Configurations

The PowerEdge T110 II operates with a single processor only. The memory controller is embedded in the processor.

6.5 Processor Installation

Refer to the Processors section in the Installing System Components chapter of the Dell PowerEdge T110 II Systems Owner’s Manual on Support.dell.com for processor installation and removal

instructions.

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7 Memory

7.1 Overview

The PowerEdge T110 II supports DDR3 memory, providing a high performance, high-speed memory interface capable of low latency response and high throughput. The T110 II supports Unbuffered ECC DDR3 DIMMs (UDIMM).

Key features of the T110 II memory system include:

 2 channels per processor  Support for Unbuffered (UDIMM) ECC DDR3 DIMMs  DDR3 speeds of 1066/1333 MHz  4 DIMM sockets (32 GB maximum capacity)  Support for single-rank and dual-rank DIMMs

7.2 DIMMs Supported

The T110 II supports the following DIMM types:

 1 GB, DDR3 UDIMM, 1333 with ECC  2 GB, DDR3 UDIMM, 1333 with ECC  4 GB, DDR3 UDIMM, 1333 with ECC  8 GB, DDR3 UDIMM, 1333 with ECC

7.3 DIMM Slots

The PowerEdge T110 II has four 72-bit (240-pin) DIMM slots for memory, supporting up to 2 DIMMs per channel. The modules are configured as 72 bits wide to provide for ECC. The memory controller in the CPU performs the ECC.

7.4 Speed

The PowerEdge T110 II supports 1066 MHz and 1333 MHz DDR3 memory.

7.5 Sparing

Memory sparing is not supported.

7.6 Mirroring

Memory mirroring is not supported.

7.7 RAID

Memory RAID is not supported.

7.8 Supported Configurations

Supported memory configurations for the T110 II are listed in Table 9. For the latest information on memory options, visit Dell.com.

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DIMM Slot

System

Capacity (GB)

DIMM B1 (2)

DIMM B2 (4)

DIMM A1 (1)

DIMM A2 (3)

1 — —

1GB — 2

1GB

—

1GB — 2

— — 2GB

—

1GB

2GB

—

2GB

—

4GB

—

2GB

4GB

—

4GB

—

4GB

8GB

—

8GB

—

8GB

Supported Memory Configurations Table 9.

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8 Chipset

8.1 Overview

The PowerEdge T110 II planar incorporates the Intel® C200 Series PCH chipset. The features listed below are part of the chipset.

8.2 Direct Media Interface

Direct Media Interface (DMI) is the chip-to-chip connection between the processor and C200 series chipset. This high-speed interface integrates advanced priority-based servicing allowing for concurrent traffic and true isochronous transfer capabilities. Base functionality is completely software-transparent, permitting current and legacy software to operate normally.

8.3 PCI Express Interface

The C200 series chipset provides up to 8 PCI Express root ports, supporting bandwidths of 2.5 GT/s and 5 GT/s. PCI Express Root Ports 1-4 can be statically configured as four x1 ports or ganged together to form one x4 port. Ports 5 and 6 can only be used as two x1 ports.

8.4 SATA interface:

The chipset supports up to six Serial ATA (SATA) ports capable of independent DMA operation. The SATA controllers are completely software transparent with an IDE interface, providing a lower pin count and higher performance. PCH SATA interface supports data transfer rates up to 3 Gb/s (300 MB/s) per port. The SATA controller contains two modes of operation— a legacy mode using I/O space and an AHCI mode using memory space.

The chipset supports the Serial ATA Specification, Revision 3.0. Additionally, the chipset is capable of supporting data transfer rates up to 3 Gb/s (300 MB/s) external SATA (eSATA) to ease the addition of external high performance storage devices.

8.5 AHCI:

The C200 series chipset provides hardware support for Advanced Host Controller Interface (AHCI), a new programming interface for SATA host controllers. Platforms supporting AHCI may take advantage of performance features, such as having no master/slave designation for SATA devices—each device is treated as a master—and hardware-assisted native command queuing. AHCI also provides usability enhancements such as hot-plugging. AHCI requires appropriate software support (an AHCI driver) and for some features, it requires hardware support in the SATA device or additional platform hardware.

8.6 PCI Interface:

The chipset PCI interface provides a 33 MHz, Revision 2.3 implementation. It integrates a PCI arbiter that supports up to four external PCI bus masters in addition to the internal chipset requests. This allows for combinations of up to four PCI down devices and PCI slots.

8.7 Low Pin Count (LPC) Interface:

The C200 series chipset implements an LPC Interface as described in the LPC 1.1 Specification. The Low Pin Count (LPC) bridge function of the chipset resides in PCI Device 31: Function 0. In addition to the LPC bridge interface function, D31:F0 contains other functional units including DMA, interrupt controllers, timers, power management, system management, GPIO, and RTC.

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8.8 Serial Peripheral Interface (SPI):

The chipset implements an SPI Interface as an alternative interface for the BIOS flash device. The chipset supports up to two SPI flash devices with speeds up to 20 MHz, 33 MHz utilizing two chip select pins.

8.9 Compatibility Module

The DMA controller incorporates the logic of two 82C37 DMA controllers, with seven independently programmable channels. Channels 0–3 are hardwired to 8-bit, count-by-byte transfers, and channels 5–7 are hardwired to 16-bit, count-by-word transfers. Any two of the seven DMA channels can be programmed to support fast Type-F transfers. Channel 4 is reserved as a generic bus master request.

The chipset supports LPC DMA, which is similar to ISA DMA, through the DMA controller. LPC DMA is handled through the use of the LDRQ# lines from peripherals and special encoding on LAD[3:0] from the host. Single, Demand, Verify, and Increment modes are supported on the LPC interface.

The timer/counter block contains three counters that are equivalent in function to those found in one 82C54 programmable interval timer. These three counters are combined to provide the system timer function, and speaker tone. The 14.31818 MHz oscillator input provides the clock source for these three counters.

The chipset provides an ISA-Compatible Programmable Interrupt Controller (PIC) that incorporates the functionality of two, 82C59 interrupt controllers. The two interrupt controllers are cascaded so that 14 external and two internal interrupts are possible. In addition, the chipset supports a serial interrupt scheme.

All of the registers in these modules can be read and restored. This is required to save and restore system state after power has been removed and restored to the platform.

8.10 Advanced Programmable Interrupt Controller (APIC):

In addition to the standard ISA compatible Programmable Interrupt Controller (PIC) described in the previous section, the chipset incorporates the Advanced Programmable Interrupt Controller (APIC).

8.11 USB interface:

The C200 series Essential supports twelve USB 2.0 ports that support high-speed, full-speed, and lowspeed USB devices. The PCH has two EHCI Host Controllers: EHCI#1 with 8 ports, and EHCI#2 with 6 ports. Each EHCI has an integrated USB 2.0 Rate Matching Hub (RMH). The RMHs replace the functionality of the UHCI controllers by converting high-speed traffic into low- and full-speed traffic. When the RMHs are enabled the UHCI controllers are disabled.

8.12 RTC:

The chipset contains a Motorola MC146818A-compatible real-time clock with 256 bytes of batterybacked RAM.

The real-time clock performs two key functions: keeping track of the time of day and storing system data, even when the system is powered down. The RTC operates on a 32.768 KHz crystal and a 3 V battery.

The RTC also supports two lockable memory ranges. By setting bits in the configuration space, two 8byte ranges can be locked to read and write accesses. This prevents unauthorized reading of passwords or other system security information.

The RTC also supports a date alarm that allows for scheduling a wake up event up to 30 days in advance, rather than only 24 hours in advance.

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8.13 GPIO:

Various general purpose inputs and outputs are provided for custom system design. The number of inputs and outputs varies depending on C200 series configuration.

8.14 Enhanced Power Management

The C200 series power management functions include enhanced clock control and various low-power (suspend) states (for example, Suspend-to-RAM and Suspend-to-Disk). A hardware-based thermal management circuit permits software-independent entrance to low-power states. The chipset contains full support for the Advanced Configuration and Power Interface (ACPI) Specification, Revision 3.0a.

8.15 System Management Features

The C200 series chipset integrates several functions designed to manage the system and lower the total cost of ownership (TCO) of the system. These system management functions are designed to report errors, diagnose the system, and recover from system lockups without the aid of an external microcontroller.

8.15.1 TCO Timer

The chipset‘s integrated programmable TCO timer is used to detect system locks. The first expiration of the timer generates an SMI# that the system can use to recover from a software lock. The second expiration of the timer causes a system reset to recover from a hardware lock.

8.15.2 Processor Present Indicator

The chipset looks for the processor to fetch the first instruction after reset. If the processor does not fetch the first instruction, the chipset will reboot the system.

8.15.3 Error Code Correction (ECC) Reporting

When detecting an ECC error, the host controller has the ability to send one of several messages to the chipset. The host controller can instruct the chipset to generate an SMI#, NMI, SERR#, or TCO interrupt.

8.15.4 Function Disable

The chipset provides the ability to disable the following integrated functions: LAN, USB, LPC, Intel HD Audio, SATA, PCI Express or SMBus. Once disabled, these functions no longer decode I/O, memory, or PCI configuration space. Also, no interrupts or power management events are generated from the disabled functions.

8.16 System Management Bus (SMBus 2.0)

The chipset contains an SMBus Host interface that allows the processor to communicate with SMBus slaves. This interface is compatible with most I2C devices. Special I2C commands are implemented.

The chipset‘s SMBus host controller provides a mechanism for the processor to initiate communications with SMBus peripherals (slaves). Also, the chipset supports slave functionality, including the Host Notify protocol. Hence, the host controller supports eight command protocols of the SMBus interface: Quick Command, Send Byte, Receive Byte, Write Byte/Word, Read Byte/Word, Process Call, Block Read/Write, and Host Notify.

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8.17 Intel Virtualization Technology for Directed I/O

The chipset provides hardware support for implementation of Intel Virtualization Technology with Directed I/O (Intel VT-d). Intel VT-d Technology consists of technology components that support the virtualization of platforms based on Intel Architecture Processors. Intel VT-d Technology enables multiple operating systems and applications to run in independent partitions. A partition behaves like a virtual machine (VM) and provides isolation and protection across partitions. Each partition is allocated its own subset of host physical memory.

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Feature

Type

Enable/Status/ Ctrl bit location

Description

ACPI Mode Switch

Fixed

PCH

The OS uses the SCI_EN bit in PCH to switch from legacy mode to ACPI mode.

Sleep States

Fixed

PCH

Supported states: S0 (Working), S4-OS (‗Hibernation‘), and S5 (Softoff).

S1 (also called standby or suspend) and S3 are not supported.

Power Button

Fixed

PCH

In ACPI mode, OS has control of the power button. In nonACPI mode, SMI handler owns power button events.

Real-Time Clock

Fixed

PCH

The OS is able to configure the system to wake on the RTC alarm.

Power Mgmt. Timer

Fixed

PCH

PCH 32-bit power management timer is used

Power Mgmt. Event (PME)

Generic

PCH

When a device signals PME, the system wakes (if necessary), the OS detects the event, and a Dell-defined ASL routine handles the event. Wake-onLAN is one example of a PME.

9 BIOS

9.1 Overview

The PowerEdge T110 II BIOS supports ACPI and power management features.

9.2 Supported ACPI States

The PowerEdge T110 II BIOS is compliant with ACPI version 2.0a.

9.2.1 Power Management

Power management features come in two types: fixed or generic. Fixed features use bits defined in the ACPI specification for specific capabilities. The fixed feature bits give the OS complete control over the power management of a device, since the location of the bits is given to the OS in the FACP

table. Thus, a driver can directly access bits to control a device‘s power management. Generic

features have defined enable and status bits, but the functionality is not fully visible to the OS. Dell provides ASL code to handle the details of generic features, allowing the OS to intelligently communicate with system-specific hardware.

Table 10 summarizes the power management features on this system:

Power Management Features Table 10.

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Feature

Type

Enable/Status/ Ctrl bit location

Description

USB Wake

Generic

N/A

This feature is not supported on this system since the S1 state is not supported.

DBS

N/A

Processor MSRs

This feature handles P state transition under Windows.

C State Support

N/A

Processor and PCH registers

This feature allows multiple Cstate support for the processor. This feature will work under Windows and an ACPI OS that understands C states.

Power Profile Support

N/A

Processor and PCH chipset registers

In addition to P, C, and T states, the BIOS will expose the Power Profiles to the OS. Each Power profile will have a specific settings and it will fine tune the processor and South Bridge.

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10 Embedded NICs/LAN on Motherboard (LOM)

10.1 Overview

The PowerEdge T110 II has an embedded dual-port Gigabit Ethernet controller. The embedded Broadcom® 5722 LAN controller is on the T110 II planar as an independent Gigabit Ethernet interface device. There is one RJ-45 connector on the back of the system. The firmware for the LOM chip resides in a flash part. The PowerEdge T110 II supports Wake-On-LAN (WOL) from either port. The Broadcom 5722 chip supports IPv6.

10.2 NICs

The following add-on NICs are supported on the T110 II:

 Broadcom  Broadcom NetXtreme II 5709 Dual Port Ethernet PCIe Card with TOE  Broadcom NetXtreme II 5709 Dual Port Ethernet PCIe Card with TOE and iSCSI Offload  Intel  Intel Gigabit ET Dual Port Server Adapter

For the latest information on NIC offerings for the T110 II, see Dell.com.

NetXtreme® II 5722 Single Port Ethernet PCI-Express Network Interface Card

PRO/1000 PT Server Adapter

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11 PCI Slots

11.1 Overview

The PowerEdge T110 II planar provides four PCI Express expansion slots as follows:

 Two x8 PCIe Gen2 slots for full-height cards, connected to the CPU  One x4 PCIe Gen2 slot for a full-height card, connected to the PCH  One x1 PCIe Gen2 slot for a full-height card, connected to the PCH

The system supports 25 W maximum power for all four PCIe cards.

11.2 Quantities and Priorities

For information on expansion-card quantities and priorities, see the Expansion Cards section in the Installing System Components chapter of the Dell PowerEdge T110 II Systems Owner’s Manual on Support.Dell.com.

11.3 PCI Card Dimensions

For information about PCIe slots and card dimensions, see the Expansion Cards section in the Installing System Components chapter in the Dell PowerEdge T110 II Systems Owner’s Manual on Support.Dell.com.

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Form Factor

Capacity

Speed

Type

3.5‖

250GB, 500GB, 1TB, 2TB

7.2K

SATA

3.5‖

2TB

5.4 K

SATA

3.5‖

500GB, 1TB, 2TB

7.2 K

NL SAS

3.5‖

146GB, 300GB, 450GB, 600GB

15 K

SAS

2.5‖

200GB, 400GB

SAS SSD

2.5‖

146GB, 300GB, 600GB, 900GB

10 K

SAS

Factory Configuration

Non Mixed drives, all SATA or all SAS

Configuration Type

Configuration

Description

Min HDD

Max HDD

No Hard drive

NCZCBL

No controller/No hard drive

SATA—No RAID

MSTCBL

On-board SATA Controller

SATA RAID

MSTR0CBL

Embedded SATA SW RAID—RAID 0 with 2 hard drives

MSTR0CBL

Embedded SATA SW RAID—RAID 0 with above 2 hard drives

3 4 3

MSTR1CBL

Embedded SATA SW RAID—RAID 1

2 2 4

MSTR5CBL

Embedded SATA SW RAID—RAID 5

12 Storage

12.1 Overview

The PowerEdge T110 II supports up to four 3.5‖ internal hard drives or up to six 2.5‖ internal hard drives (available Q2 2011). The following drive configurations are supported:

 4 x 3.5‖ cabled SATA from motherboard SATA connector  4 x 3.5‖ cabled SAS or SATA with add-on storage controller  6 x 2.5‖ cabled SAS with add-on storage controller (available Q2 2011)

12.2 Hard Drives

Table 9 lists the supported hard drives for the PowerEdge T110 II. For the latest information on supported hard drives, visit Dell.com.

Supported Hard Drives Table 11.

2.5‖ drives available Q2 2011.

12.3 RAID Configurations

Table 12 details the factory RAID configurations for the PowerEdge T110 II.

Factory RAID Configurations Table 12.

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Factory Configuration

Non Mixed drives, all SATA or all SAS

Configuration Type

Configuration

Description

Min HDD

Max HDD

MSTR10CBL

Embedded SATA SW RAID—RAID 10

SAS/SATA RAID

ASSCBL

Add-in SAS/SATA RAID card, No RAID (PERC S300) with 1 hard drive

ASSCBL

Add-in SAS/SATA RAID card, No RAID (PERC S300) with 2 hard drives

ASSCBL

Add-in SAS/SATA RAID card, No RAID (PERC S300) with above 2 hard drives

ASSR0CBL

Add-in SAS/SATA RAID card, RAID 0 (PERC S300) with 2 hard drives

2 2 7b

ASSR0CBL

Add-in SAS/SATA RAID card, RAID 0 (PERC S300) with above 2 hard drives

ASSR1CBL

Add-in SAS/SATA RAID card, RAID 1 (PERC S300)

ASSR5CBL

Add-in SAS/SATA RAID card, RAID 5 (PERC S300)

3 6 10

ASSR10CBL

Add-in SAS/SATA RAID card, RAID 10 (PERC S300)

4 6 11

ASSCBL

Add-in SAS/SATA RAID card, No RAID (PERC H200)

1 6 12

ASSR0CBL

Add-in SAS/SATA RAID card, RAID 0 (PERC H200)

2 6 13

ASSR1CBL

Add-in SAS/SATA RAID card, RAID 1 (PERC H200)

2 2 14

ASSR10CBL

Add-in SAS/SATA RAID card, RAID 10 (PERC H200)

No hard drive

NCZCBL

No controller/No hard drive

Additional restrictions for RAID configurations are as follows:

 Configurations 0 to 5 are for 3.5‖ hard drives only  Configurations 6 to 14 are for 2.5‖ or 3.5‖ hard drives (2.5‖ drives available Q2 2011)

12.4 Storage Controllers

T110 II supports software RAID (PERC S100, PERC S300) and hardware RAID (PERC H200) for internal storage.

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12.5 Optical Drives

The PowerEdge T110 II supports two internal optical drives and an optional external USB DVD-ROM. The T110 II is able to boot from any internal optical drive. The following internal optical drives configurations are available on the PowerEdge T110 II:

 No optical drive configuration  DVD-ROM (SATA)  DVD+RW (SATA)

12.6 Tape Drives

Internal and external tape drives and tape libraries are supported. For more information on supported tape drives and tape libraries, see Dell.com/Storage.

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Resolution

Refresh Rate (Hz)

Color Depth

(bit)

640 x 480

60, 72, 75, 85

8, 16, 32

800 x 600

60, 72, 75, 85

8, 16, 32

1024 x 768

60, 70, 75, 85

8, 16

1280 x 10241

1280 x 10242

60, 75, 85

8, 16

32 bit color only supported at 60Hz for this resolution.

85Hz for KVM and 1600x1200 at 60Hz for video out.

13 Video

The PowerEdge T110 II includes a Matrox® G200eW with 8 MB memory integrated in Winbond® WPCM450 (BMC controller).

Supported resolutions are listed in Table 13.

Graphics Video Modes Table 13.

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14 Rack Information

Dell does not provide rack support for the PowerEdge T110 II. However, the system can be placed in a rack enclosure using a 3rd party tray.

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15 Operating Systems

For detailed information, see the following:

 Operating System Support Matrix for Dell PowerEdge Systems on www.Dell.com  Dell PowerEdge T110 II Systems Getting Started Guide on Support.Dell.com

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16 Systems Management

16.1 Overview

Dell delivers open, comprehensive, and integrated solutions that help you reduce the complexity of managing disparate IT assets. Combining Dell PowerEdge Servers with a wide selection of Dell developed systems management solutions gives you choice and flexibility, so you can simplify and save in IT environments of any size. To help you meet your server management demands, Dell offers Dell OpenManage™ systems management solutions for:

• Monitoring of server and storage health and maintenance

• Update of system, operating system, and application software

Dell offers IT management solutions for organizations of all sizes—priced and sized appropriately and supported comprehensively.

16.2 Server Management

A Dell Systems Management and Documentation DVD and a Dell Management Console DVD are included with the product. ISO images are also available. A brief description of available content:

• Dell Systems Build and Update Utility (SBUU): Dell Systems Build and Update Utility assists in

OS install and pre-OS hardware configuration and updates.

• Server Update Utility (SUU): This DVD has an inventory tool for managing updates to

firmware, BIOS, and drivers for either Linux or Windows varieties.

• OpenManage Server Administrator (OMSA): The OpenManage Server Administrator tool

provides a comprehensive, one-to-one (one console to one server) systems management solution, designed for system administrators to manage systems locally and remotely over a network. OMSA allows system administrators to focus on managing their entire network by providing comprehensive one-to-one systems management.

• Management Console: Dell IT Assistant (ITA) is also included as a one-to-many monitoring

solution, providing at-a-glance health status for multiple servers. ITA also includes tools to allow access to the Baseboard Management Controller (BMC) Utility.

• Dell Management Console (DMC): The Dell Management Console is a systems management

console that enables systems administrators to discover and inventory devices on your network. It provides functions such as health and performance monitoring of networked devices and patch management capabilities for Dell systems. Similar to the IT Assistant management console (ITA) described above, DMC is a one-to-many system monitoring solution. Both ITA and DMC provide at-a-glance health status for servers. DMC differs from the ITA in that with DMC, value-add plug-ins that enable advanced functionality can be purchased and added to the base DMC product.

• Dell Systems Service Diagnostics Tools: Dell Systems Service and Diagnostics tools deliver the

latest Dell optimized drivers, utilities, and operating system-based diagnostics that you can use to update your system.

• eDocs: The section includes PDF files for PowerEdge systems, storage peripherals, and Dell

OpenManage™ software.

16.3 Embedded Server Management

Embedded management for the PowerEdge T110 II includes the Unified Server Configurator (USC), along with base management functionality features.

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Feature

Description

Faster O/S Installation

Drivers and the installation utility are embedded on system, so no need to scour Dell.com.

Faster System Updates

Integration with Dell support automatically directed to latest versions of the Unified Server Configurator, RAID, BIOS, NIC, and power supply.

Update Rollback

Ability to recover to previous ―known good state‖

for all updatable components.

More Comprehensive Diagnostics

Diagnostic utilities are embedded on system.

Simplified Hardware Configuration

Detects RAID controller and allows user to configure virtual disk and choose virtual disk as boot device, eliminating the need to launch a separate utility. Also provides configuration for BIOS and NIC/LOM.

16.3.1 Unified Server Configurator

The Unified Server Configurator (USC) is a graphical user interface (GUI) that aids in local server provisioning in a pre-OS environment. To access the Unified Server Configurator, press the <F10> key within 10 seconds of the Dell logo appearance during the system boot process. Table 14 details current functionality enabled by the USC.

Unified Server Configurator Features and Description Table 14.

16.3.2 Base Management Functionality

The following base management features are supported on the PowerEdge T110 II:

 IPMI v2.0 support  Conductivity:

o Shared/failover network modes o IPv4 o VLAN tagging o Dynamic DNS

 Security and authentication:

o Role-based authority o Local users

 Remote management and remediation:

o Server power control o Serial-over-LAN (with proxy)

 Monitoring:

o Sensor monitoring and alerting o Real-time power monitoring o Real-time power graphing o Historical power counters

 System Event Log

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17 Peripherals

The PowerEdge T110 II supports the following USB devices:

 DVD (bootable; requires two USB ports)  USB key (bootable)  Keyboard (only one USB keyboard is supported)  Mouse (only one USB mouse is supported)

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Server BIOS Memory

Details

Size:

64 Mbit

Type [Flash PROM, EEPROM]:

Flash EEPROM

Can user programs or operating system write data to it during normal operation?

No Purpose? [boot code]

Boot Code and Configuration Information

How is data input to this memory?

Loading flash memory requires a vendor provided firmware file and loader program which is executed by booting up the system from a floppy or OS based executable containing the firmware file and the loader. System loaded with arbitrary data in firmware memory would not operate.

How is this memory write protected?

Software write protected

Remarks

Server CMOS (Complementary Metal-Oxide Semiconductor) Memory

Details

Size:

512 Bytes

Type [Flash PROM, EEPROM]:

Battery-backed NVRAM

Can user programs or operating system write data to it during normal operation?

No Purpose? [boot code]

RTC and Configuration settings

How is data input to this memory?

F2 Setup Menu during POST

How is this memory write protected?

N/A

Appendix A. Statement of Volatility

The Dell PowerEdge T110 II contains both volatile and non-volatile (NV) components. Volatile components lose their data immediately upon removal of power from the component. Non-volatile components continue to retain their data even after the power has been removed from the component. Components chosen as user-definable configuration options (those not soldered to the motherboard) are not included in the Statement of Volatility. Configuration option information (pertinent to options such as microprocessors, system memory, remote access controllers, and storage controllers) is available by component separately. The NV components detailed in Table 15 are present in the PowerEdge T110 II server.

Volatility Table Table 15.

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LOM (LAN [Network Interface] on Motherboard) Memory

Details:

Size:

4Mb (512KB)

Type [Flash PROM, EEPROM]:

Flash

Can user programs or operating system write data to it during normal operation?

Yes, under software control. Purpose? [boot code]

Contains LOM boot code and config data

How is data input to this memory?

Requires vendor provided firmware file and loader program used during factory assembly or possible field update. A system loaded with arbitrary data in firmware memory would not operate.

How is this memory write protected?

Software control.

Remarks:

Server System Event Log Memory/FRU

Details

Size:

4 KB

Type [Flash PROM, EEPROM]:

SEEPROM

Can user programs or operating system write data to it during normal operation?

No Purpose? [boot code]

Store System Events

How is data input to this memory?

BMC controller write

How is this memory write protected?

Not write protected

Remarks

TPM (Trusted Platform Module; For boards shipped outside of China; Boards sold to destinations in China do not have TPM at this time)

Details:

Size:

Unspecified size of user ROM, RAM, EEPROM; 128 bytes of OTP memory included

Type [Flash PROM, EEPROM]:

ROM, RAM, EEPROM

Can user programs or operating system write data to it during normal operation?

Yes, OS and applications that conform to the TCG standard can write data to the TPM during normal operation. Access to the NV Storage is controlled by the TPM owner.

Purpose? [boot code]

Trusted Platform Module NV storage. May be used to securely storage of encryption keys.

How is data input to this memory?

TCG TPM Specification defined command interface or Using TPM Enabled operating systems

How is this memory write protected?

As defined by the TCG TPM Specification, protection of this NV memory area is configurable by the TPM owner.

Remarks

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Server BMC (Baseboard Management Controller) Firmware Flash Memory

Details

Size:

16MB Flash

Type [Flash PROM, EEPROM]:

SPI Flash

Can user programs or operating system write data to it during normal operation?

No Purpose? [boot code]

Stores the BMC Firmware

How is data input to this memory?

How is this memory write protected?

Software write protected

Remarks

To obtain optional component information, please refer to the Dell Statement of Volatility for the individual components. Please direct any questions to your Dell Marketing contact.

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Country/Region

Authority or Mark

Argentina

IRAM

Belarus

BELLIS

Canada

SCC

China

CNCA or CCC

Croatia

KONCAR

European Union

Germany

TUV

IECEE

IECEE CB

Israel

SII

Kazakhstan

OTAN – CKT

Kenya

KEBS

Kuwait

KUCAS

Mexico

NYCE or NOM

Moldova

INSM

Nigeria

SONCAP

Norway

NEMKO

Russia

GOST

Saudi Arabia

KSA ICCP

South Africa

NRCS

Taiwan

BSMI

Ukraine

UKRTEST or UKRSERTCOMPUTER

United States

NRTL

Uzbekistan

STZ

Appendix B. Certifications

Regulatory Certifications B 1.

Regulatory compliance certificates can be located at the following sites:

 http://ausreactorprd01/reactor/xCertSearch.asp  http://www.dell.com/content/topics/global.aspx/about_dell/values/regulatory_compliance

/dec_conform?c=us&l=en&s=corp

Product Safety Certifications B 2.

The product has been certified and bears the Mark, as applicable, of the Product Safety authorities as indicated in Table 16.

Product Safety Certifications Table 16.

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Country/Region

Authority or Mark

Class

Australia/New Zealand

ACMA or C-Tick Class B

Belarus

BELLIS

Class B

Bosnia & Herzegovina,

Montenegro, Serbia

KVALITET Class B

Canada

ICES

Class B

China

CNCA or CCC

Class B

Croatia

KONCAR

Class B

European Union

Class B

Israel

SII

Class B

Japan

VCCI

Class B

Kazakhstan

OTAN – CKT

Class B

Moldova

INSM

Class B

Norway

NEMKO

Class B

Russia

GOST

Class B

South Africa

SABS

Class B

South Korea

KCC

Class B

Taiwan

BSMI

Class B

Ukraine

UKRTEST or UKRSERTCOMPUTER

Class B

United States

FCC

Class B

Uzbekistan

STZ

Class B

Vietnam

ICT

Class B

Country/Region

Authority or Mark

Belarus

BELLIS

Germany

Russia

GOST

Electromagnetic Compatibility B 3.

The product has been certified and bears the Mark, as applicable, of the EMC authorities as indicated in Table 17.

Electromagnetic Compatibility Certifications Table 17.

Ergonomics, Acoustics and Hygienics B 4.

The product has been certified and bears the Mark, as applicable, of the Ergonomics, Acoustics and Hygienics authorities as indicated in Table 18.

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Ergonomics, Acoustics and Hygienics Table 18.

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Standard

URL for Information and Specifications

ACPI

Advance Configuration and Power Interface Specification, v2.0c

http://www.acpi.info/ Energy Star

EPA Version 1.0 of the Computer Server specification

http://www.energystar.gov/index.cfm?c=archives.enterprise _servers

Ethernet

IEEE 802.3-2005

http://standards.ieee.org/getieee802/802.3.html

IPMI

Intelligent Platform Management Interface, v2.0

http://www.intel.com/design/servers/ipmi/

DDR3 Memory

DDR3 SDRAM Specification, Rev. 3A

http://www.jedec.org/download/search/JESD79-3A.pdf

LPC

Low Pin Count Interface Specification, Rev. 1.1

http://developer.AMD.com/design/chipsets/industry/lpc.ht m

PCI Express

PCI Express Base Specification Rev. 2.0

http://www.pcisig.com/specifications/pciexpress/

PMBus

Power System Management Protocol Specification, v1.1

http://pmbus.info/specs.html

SAS

Serial Attached SCSI, v1.1

http://www.t10.org/cgi-bin/ac.pl?t=f&f=sas1r10.pdf

SATA

Serial ATA Rev. 2.6; SATA II, Extensions to SATA

1.0a, Rev. 1.2

http://sata-io.org/

SMBIOS

System Management BIOS Reference Specification, v2.6

http://www.dmtf.org/standards/smbios/

TPM

Trusted Platform Module Specification, v1.2

http://www.trustedcomputinggroup.org/resources/tpm_mai n_specification

UEFI

Unified Extensible Firmware Interface Specification, v2.1

http://www.uefi.org/specs/

Appendix C. Industry Standards

The PowerEdge T110 II system conforms to the industry standards detailed in Table 19.

Industry Standards Table 19.

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Standard

URL for Information and Specifications

USB

Universal Serial Bus Specification, Rev. 2.0

http://www.usb.org/developers/docs/

Windows Logo Windows Logo Program System and Device Requirements, v3.10

http://www.microsoft.com/whdc/winlogo/hwrequirements. mspx

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Dell T110 II User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual