Datasheet UMA1014T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

UMA1014

Low-power frequency synthesizer
for mobile radio communications

Product specification
Supersedes data of October 1991
File under Integrated circuits, IC03

October 1992

Philips Semiconductors Product specification

Low-power frequency synthesizer for
mobile radio communications

FEATURES

• Single chip synthesizer; compatible with Philips cellular
radio chipset

• Fully programmable RF divider

• I2C interface for two-line serial bus

• On-chip crystal oscillator/TCXO buffer from 3 to 16 MHz

• 16 reference division ratios allowing 5 to 100 kHz

channel spacing

• 1/8 crystal frequency output

• On-chip out-of-lock indication

• Two extra VCO control outputs

• Latched synthesizer alarm output

• Status register including out-of-lock indication and

power failure

• Power-down mode.

APPLICATIONS

UMA1014

GENERAL DESCRIPTION

The UMA1014 is a low-power universal synthesizer which
has been designed for use in channelized radio
communication. The IC is manufactured in bipolar
technology and is designed to operate at 5 to 100 kHz
channel spacing with an RF input from 50 to 1100 MHz.
The channel is programmed via a standard I
low-power sensitive RF divider is incorporated together
with a dead-zone eliminated, 3-state phase comparator.
The low-noise charge pump delivers 1 mA or 1/2 mA
output current to enable a better compromise between fast
switching and loop bandwidth. A power-down circuit
enables the synthesizer to be set to idle mode.

2

C-bus. A

• Cellular mobile radio (NMT, AMPS, TACS)

• Private mobile radio (PMR)

• Cordless telephones.

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

CC

I

CC

I

CCpd

f

ref

f

RF

T

amb

, V

+ I

CP

CP

supply voltage range 4.5 5.0 5.5 V
supply current − 13 − mA
ICC in power-down − 2.5 − mA
phase comparator reference frequency 5 − 100 kHz
RF input frequency 50 − 1100 MHz
operating ambient temperature range −40 − 85 °C

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

UMA1014T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

October 1992 2

October 1992 3

BLOCK DIAGRAM

mobile radio communications

Philips Semiconductors Product specification

Low-power frequency synthesizer for

oscillator input

oscillator output

RF input

hardware

power-down

slave address

select input A

1

BUFFER/

2

OSCILLATOR

8

31/32

11

12

15 9 10 7 13

synthesizer

alarm

output

MAIN

CONTROL

1/8 crystal

ground+5 V supply

4 6 16 14 3

frequency

output

internally

connected

UMA1014

PHASE

COMPARATOR

OUT-OF-

LOCK

3-BITS

MAIN

DIVIDER

18-BITS 4-BITS 1-BIT 1-BIT

VCO buffer switch output B
VCO buffer switch output A
serial data input/output
serial clock input

REFERENCE

DIVIDER

+5 V charge

pump supply

CHARGE

PUMP

MRA396 - 1

charge

5

pump
output

handbook, full pagewidth

Fig.1 Block diagram.

UMA1014

Philips Semiconductors Product specification

Low-power frequency synthesizer for
mobile radio communications

PINNING

SYMBOL PIN DESCRIPTION

OSCIN 1 oscillator or TCXO input
OSCOUT 2 oscillator output
V

CP

V

CC

PCD 5 charge pump output
GND 6 ground
VCOA 7 VCO buffer switch output A

RF 8 RF input
SCL 9 serial clock input
SDA 10 serial data input/output
HPD 11 hardware power-down (active LOW)
SAA 12 slave address select input A
VCOB 13 VCO buffer switch output B
i.c. 14 internally connected
SYA 15 synthesizer alarm output
FX8 16 1/8 crystal frequency output

3 5 V charge pump supply
4 5 V supply

(including out-of-lock)

handbook, halfpage

OSCOUT

OSCIN

VCOA

1

215

V

3

CP

4

V

CC

PCD

GND

RF

UMA1014

5

6

7

8

MRA397 - 1

Fig.2 Pin configuration.

UMA1014

16

FX8

SYA

14

i.c.

13

VCOB

12

SAA

11

HPD

10

SDA

9

SCL

October 1992 4

Philips Semiconductors Product specification

Low-power frequency synthesizer for
mobile radio communications

FUNCTIONAL DESCRIPTION

The UMA1014 is a low-power frequency synthesizer for
radio communication which operates in the
50 to 1100 MHz range. The device includes an
oscillator/buffer circuit, a reference divider, an RF divider,
a 3-state phase comparator, a charge pump and a main
control circuit to transfer the serial data into the four
internal 8-bit registers. The VCC supply feeds the logic part,
the VCP supply feeds the charge-pump only. Both supplies
are +5 V (±10%). The power-down facility puts the
synthesizer in the idle mode (all current supplies are
switched off except in the control part). This allows any I
transfer and all information in the registers is retained thus
enabling fast power-up.

Main divider

The main divider is a pulse swallow type counter which is
fully programmable. After a sensitive input amplifier
(50 mV, −13 dBm), the RF signal is applied to a 31/32
duo-modulus counter. The output is then used as the clock
for the 5-bit swallow counter R = (MD4 to MD0) and the
13-bit main counter N = (MD17 to MD5). The ratio is
transferred via the I
then buffered in an 18-bit latch. The ratio in the divider
chain is updated with the new information when the least
significant bit is received (i.e. D0). This update is
synchronized to the output of the divider in order to limit the
phase error during small jumps of the synthesized
frequency.

The main divider can be programmed to any value
between 2048 and 262143 (i.e. 218−1). If ratio X, below
2048, is sent to the divider, the ratio (X + 2048) will be
programmed. When it is required to switch between
adjacent channels it is possible to program register D only,
thus allowing shorter I2C programming time.

Oscillator

The oscillator is a common collector Colpitts type with
external capacitive feedback. The oscillator has very small
temperature drift and high voltage supply rejection. A
TCXO or other type of clock can be used to drive the
oscillator by connecting the source (preferably
AC-coupled) to pin 1 and leaving pin 2 open-circuit. The
oscillator acts as a buffer in this mode and requires no
additional external components. The signal from the clock
source should have a minimum space width of 31 ns.

2

C-bus to the registers B, C and D, and

2

UMA1014

Reference divider

The reference divider is semi-programmable with 16
division ratios which can be selected via the I
programming uses four bits of the register A (A3 to A0) as
listed in Table 2. These ratios allow the use of a large
number of crystal frequencies from 3 MHz up to 16 MHz.
All main channel spacings can be obtained with a single
crystal/TXCO frequency of 9.6 MHz.

Phase comparator

A diagram of the phase comparator and charge pump is

C

illustrated in Fig.3.
The phase comparator is both a phase and frequency

detector. The detector comprises dual flip-flops together
with logic circuitry to eliminate the dead-zone. When a
phase error is detected the UP or DOWN signal goes
HIGH. This switches on the corresponding current
generator which produces a source or sink current for the
loop filter. When no phase error is detected PCD goes high
impedance. The final tuning voltage for the VCO is
provided by the loop filter. The charge pump current is
programmable via the I
logic 1 the charge pump delivers 1 mA; when IPCD is set
to logic 0 the charge pump delivers 0.5 mA.

The phase comparator has a phase inverter logic input
(PHI). This allows the use of inverted or non-inverted loop
filter configurations. It is thus possible to use a passive
loop filter which offers higher performances without an
operational amplifier. The function of the phase
comparator is given in Table 3 and a typical transfer curve
is illustrated in Fig.4.

Out-of-lock detector

An out-of-lock detector using the UP and DOWN signals
from the phase comparator is included on-chip. The pin
VCOA is an open collector output which is forced LOW
during an out-of-lock condition. The same information is
also available via the I
OOL). When the phase error (measured at the phase
comparator) is greater than approximately 200 ns, an
out-of-lock condition is immediately flagged. The flag is
only released after 6 reference cycles when the phase
error is less than 200 ns.

2

C-bus. When IPCD (bit 5) is set to

2

C-bus in the status register (bit

2

C-bus. The

October 1992 5

Philips Semiconductors Product specification

Low-power frequency synthesizer for

UMA1014

mobile radio communications

Table 1 Division ratio in the main divider

MAIN COUNTER: N SWALLOW COUNTER: R

MD17 MD16 MD15 ... MD8 MD7 ... MD5 MD4 ... MD0

B1 B0 C7 ... C0 D7 ... D5 D4 ... D0

MSB LSB

Table 2 Reference divider programming

A3(RD3) A2(RD2) A1(RD1) A0(RD0)

REFERENCE DIVISION

RATIO

0000 128 75 kHz
0001 160 60 kHz
0010 192 50 kHz
0011 240 40 kHz
0100 256 37.5 kHz
0101 320 30 kHz
0110 384 25 kHz
0111 480 20 kHz
1000 512 18.75 kHz
1001 640 15 kHz
1010 768 12.5 kHz
1011 960 10 kHz
1100 1024 9.375 kHz
1101 1280 7.5 kHz
1110 1536 6.25 kHz
1111 1920 5 kHz

CHANNEL SPACING FOR 9.6 MHz AT

OSCIN

Table 3 Operation of the phase comparator

PHI = 0 (PASSIVE LOOP FILTER) PHI = 1 (ACTIVE LOOP FILTER)

f

ref

< f

var

f

ref

> f

var

f

ref

= f

var

f

ref

< f

var

f

ref

> f

var

f

= f

ref

var

UP010100

DOWN 100010

I

pcd

−1 mA 1 mA <±5 nA 1 mA −1 mA <±5 nA

October 1992 6

Philips Semiconductors Product specification

Low-power frequency synthesizer for
mobile radio communications

MAIN CONTROL

The control part consists mainly of the I2C-bus control
interface and a set of four registers A, B, C and D. The
serial input data (SDA) is converted into 8-bit parallel
words and stored in the appropriate registers. The data
transmission to the synthesizer is executed in the burst
mode with the following format:

//slave addr./subaddr./data1/data2/.../datan//; n up to 4
Data byte 1 is written in the register indicated by the

subaddress. An auto-increment circuit, if enabled

Table 4 Slave address

110001

SAA is the slave address. When SAA goes HIGH then
SAA = 0, when SAA goes LOW then SAA = 1. This allows
the use of two UMA1014s on the same bus but using a
different address. R/W should be set to logic 0 when
writing to the synthesizer or set to logic 1 when reading the
status register.

(AVI = 1), then provides the correct addressing for the
ensuing data bytes. Since the length of the data burst is
not fixed, it is possible to program only one register or the
whole set. The registers are structured in such a way so
that the burst, for normal operation, is kept as short as
possible. The bits that are only programmed during the
set-up (reference division ratio, power-down, phase
inversion and current on PCD) are stored in registers A
and B.

In the slave address six bits are fixed, the remaining two
bits depend on the application.

The subaddress includes the register pointer, and sets the
two flags related to the auto-increment (AVI) and the alarm
disable (DI).

UMA1014

SAA R/W

Table 5 Subaddress

X X X DI AVI X SB1 SB0

Where:
X = not used
DI (Disable Interrupt):

DI = 1 disables the alarm on SYA
DI = 0 enables the alarm.

AVI (Auto Value Increment):
AVI = 1 enables the automatic increment
AVI = 0 disables the auto-increment.

Table 6 Pointer of the registers

SB1 SB0 REGISTER POINTED

00 A
01 B
10 C
11 D

SB1/SB0 are the pointers of the register where DATA1 will
be written (see Table 6).

When the auto-increment is disabled (AVI = 0), the
subaddress pointer will maintain the same value during the
I2C-bus transfer. All the data bytes will then be written
consecutively in the register pointed by the subaddress.

October 1992 7

Philips Semiconductors Product specification

Low-power frequency synthesizer for
mobile radio communications

Status register and synthesizer alarm

When an out-of-lock condition or a power dip occurs,
SYA, which is an open collector output, is forced LOW
and latched. The pin SYA will be released after the status
register is read via the I2C-bus.

The status register contains the following information:

Table 7 Status register

0 0 0 OOL 0 LOOL LPD DI

Where:
OOL = momentary out-of-lock

LOOL = latched out-of-lock
LPD = latched power dip
DI = disable interrupt (of the last write cycle).

2

C-bus protocol to read this internal register is a single byte without subaddressing:

The I
//slave address (R/W = 1)/status register (read)//

UMA1014

Table 8 Bit allocation

REGISTER POINTER BIT ALLOCATION PRESET

76543210
A 00 PD X IPCD X RD3 RD2 RD1 RD0 00001110
B 01 1 0 1 PHI VCOB VCOA MD17 MD16 10100101
C 10 MD15 MD14 MD13 MD12 MD11 MD10 MD9 MD8 00111000
D 11 MD7 MD6 MD5 MD4 MD3 MD2 MD1 MD0 10000000

Where X = not used

Table 9 Register allocation

REGISTER

NAME

A PD power down PD = 0 normal operation 0

B PHI phase inverter PHI = 0 passive loop filter 0

C MD15 to MD8 bits 15 to 8 main divider ratio 00111000
D MD7 to MD0 bits 7 to 0 main divider ratio 10000000;

BIT NAME FUNCTION

IPCD programmable charge

pump current

RD3...RD0 reference ratio see Table 2 1110; r = 1536

VCOA VCO switch A set pin 7 1
VCOB VCO switch B set pin 13 0
MD17, MD16 bits 17 and 16 MSB of main divider ratio 01

IPCD = 1=1mA;
IPCD = 0 = 0.5 mA

PRESET

VALUE

0

r = 80000

October 1992 8

Philips Semiconductors Product specification

Low-power frequency synthesizer for
mobile radio communications

handbook, full pagewidth

f

var

PHASE

COMPARATOR

f

ref

PHI

Fig.3 Phase comparator block diagram.

UP

DOWN

on/off

on/off

UMA1014

V

CP

1 mA
(source)

PCD

1 mA
(sink)

MRA399

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

CC

V

i

T

stg

T

amb

supply voltage range −0.3 7.0 V
voltage range to ground (all pins) 0 V

CC

V
IC storage temperature range −55 +125 °C
operating ambient temperature range −40 +85 °C

HANDLING

Every pin referenced to ground withstands ESD (HMB) tests in accordance with MIL-STD-883C method 3015 class 2.
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling Integrated Circuits.

October 1992 9

Philips Semiconductors Product specification

Low-power frequency synthesizer for

UMA1014

mobile radio communications

CHARACTERISTICS

T

= 25 °C; VCC = 4.5 to 5.5 V; unless otherwise specified.

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pins V

V

CC

I

CC

I

CCpd

V

CP

I

CP

I

CPpd

RF dividers (pin RF)

f

RF

V

RF(rms)

R

I

C

I

R

RF

Oscillator and reference divider (pins OSCIN and OSCOUT)

f

OSC

V

OSC(RMS)

V

OSC(p-p)

t

OSC_mk

t

OSC_sp

Z

OSC

R

ref

1/8 crystal frequency (open collector output) (pin FX8)

I

OL

Phase comparator (pin PCD)

f

PCD

I

PCD

I

PCDL

V

PCD

and VCP)

CC

supply voltage range 4.5 − 5.5 V
supply current − 11.5 13.5 mA
supply current power-down − 2.5 3.3 mA
charge pump supply voltage 4.5 − 5.5 V
charge pump supply current IPCD = 0.5 mA − 1.4 1.8 mA
charge pump supply current power-down − 0.01 − mA

frequency range 50 − 1100 MHz
input voltage level (RMS value) 50 to 100 MHz 150 − 200 mV

100 to 1100 MHz 50 − 150 mV

input resistance at 1 GHz − 200 −Ω

at 100 MHz − 600 −Ω
input capacitance note 1 − 2.0 − pF
division ratios 2048 − 262143 −

oscillator frequency range 3 − 16 MHz
input level sine wave (RMS value) 0.15 − VCC/2.8 V
input level square wave

0.45 − V

CC

V

(peak-to-peak value)
input mark width see Fig.8 10 −−ns
input space width 31 −−ns
output impedance at pin

−−2kΩ

OSCOUT
reference division ratio see Table 1 128 − 1920

LOW level output current VOL≥ 0.6 V 1.0 −−mA

frequency range 5 − 100 kHz
output current V

PCD

= 2.5 V
bit IPCD = 1 0.9 1.2 1.4 mA
bit IPCD = 0 0.45 0.6 0.75 mA

output leakage current −5 ±1+5nA
output voltage 0.4 − VCP−0.5 V

October 1992 10

Philips Semiconductors Product specification

Low-power frequency synthesizer for

UMA1014

mobile radio communications

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Serial clock and serial data input (pins SCL and SDA)

f

CLK

V

IH

V

IL

I

IH

I

IL

C

I

I

sink

Slave address select input (pin SAA) and Hardware power-down input (pin HPDN)

V

IH

V

IL

I

IH

I

IL

VCO output switches (pins VCOA and VCOB) and synthesizer alarm (pin SYA); note2
I

OL

Notes

1. CI is in parallel with RI.

2. Pin VCOA is forced to logic 0 during out-of-lock condition.

clock frequency 0 − 100 kHz
HIGH level input voltage 3 −−V
LOW level input voltage −−1.5 V
HIGH level input current − 310µA
LOW level input current −10 −5 −µA
input capacitance −−10 pF
SDA sink current VOL = 0.4 V 3 −−mA

HIGH level input voltage 3 −−V
LOW level input voltage −−0.4 V
HIGH level input current −−0.1 µA
LOW level input current −10 −−µA

LOW level sink current VOL≥ 0.4 V 400 −−µA

The current I

2.0

I

(µA)

1.0

0

-1.0

-2.0

-20 0 20

is averaged over a reference period of 24 µs.

PCD

Fig.4 Gain of phase detector and charge pump.

MRA400

phase difference (t = ns)

I = 1 mA

PCD

I = 0.5 mA

PCD

October 1992 11

Philips Semiconductors Product specification

Low-power frequency synthesizer for
mobile radio communications

UP or DOWN

REF

OOL

VCOA

UMA1014

MRA401

RF input

(mV RMS)

MRA402 - 1

Fig.5 Out-of-lock function.

200

100

0

50 100 200 500

guaranteed area

of operation

1000

typical RF
sensitivity
(T = 25 C)

amb

1100

f (MHz)

RF

o

1200

Fig.6 RF input high frequency sensitivity.

October 1992 12

Philips Semiconductors Product specification

Low-power frequency synthesizer for
mobile radio communications

200

RF input

(mV RMS)

150

100

50

0

MRA403 - 1

50

guaranteed area

of operation

100

150

f (MHz)

RF

UMA1014

typical RF
sensitivity
(T = 25 C)

amb

200

o

handbook, halfpage

OSCIN

t

OSC mk

Fig.7 RF input low frequency sensitivity.

t

OSC sp

MLA436 - 1

Fig.8 Oscillator input timing.

October 1992 13

Philips Semiconductors Product specification

Low-power frequency synthesizer for
mobile radio communications

APPLICATION INFORMATION

V

CP

V

CC

low

current

LED

V

C6

R6

18 Ω

Ω

CC

R11
56Ω

R5
18Ω

control voltage

C1
33 nF

100 nF

modulation

input

V

CC

R3
12Ω

C5

+

47 Fµ

VOLTAGE

CONTROLLED

OSCILLATOR

870 to 910

MHz

1 nF

R4
18

C17
1 nF

9.6 MHz

C8
2-20 pF

R7
68Ω

R8
12Ω

V3

G1

+

R9

3.9 kΩ

RF output

R1

18 kΩ

C3
180 nF

+

C13
120 pF

C11
39 pF

C9
47 Fµ

C10
47 Fµ

C12
68 pF

C2

2.2 nF

1

2

3

4

UMA 1014

5

6

7

8

UMA1014

V

CC

R10
10 k

Ω

16

15

14

13

12

11

10

9

V

10 kΩ

V

10 kΩ

SDA

SCL

MRA404 - 1

CC

CC

ETACS application for:
VCO sensitivity = 11 MHz/V.
Channel spacing = 12.5 kHz.

Fig.9 Typical cellular mobile radio application.

October 1992 14

R2
10 kΩ

Philips Semiconductors Product specification

Low-power frequency synthesizer for
mobile radio communications

PACKAGE OUTLINE

SO16: plastic small outline package; 16 leads; body width 3.9 mm

D

c

y

Z

16

9

UMA1014

SOT109-1

E

H

E

A

X

v M

A

pin 1 index

1

e

0 2.5 5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.0100

0.019

0.0075

0.014

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

10.0

9.8

0.39

0.38

8

b

p

scale

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

w M

6.2

5.8

0.244

0.228

A

2

1.05

0.041

Q

A

1

detail X

1.0

0.7

0.4

0.6

0.028

0.039

0.020

0.016

(A )

L

p

L

0.25 0.1

0.25

0.01

0.01 0.004

A

3

θ

0.7

0.3

0.028

0.012

o

8

o

0

OUTLINE
VERSION

SOT109-1

IEC JEDEC EIAJ

076E07S MS-012AC

REFERENCES

October 1992 15

EUROPEAN

PROJECTION

ISSUE DATE

95-01-23
97-05-22

Philips Semiconductors Product specification

Low-power frequency synthesizer for
mobile radio communications

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

(order code 9398 652 90011).

UMA1014

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of this specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not from part of the specification.

October 1992 16

Philips Semiconductors Product specification

Low-power frequency synthesizer for

UMA1014

mobile radio communications

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

2

PURCHASE OF PHILIPS I

C COMPONENTS

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C components conveys a license under the Philips’ I2C patent to use the

October 1992 17