Datasheet TLE4274DV50ATMA2 Specification

Page 1
PG-TO220-3-1
P-TO252-3-11
PG-TO252-3-11
P-TO263-3-1
PG-TO263-3-1
Low Drop Voltage Regulator
Features
Output voltage 5 V, 8.5 V or 10 V
Output voltage tolerance ≤ ±4%
Current capability 400 mA
Low-drop voltage
Very low current consumption
Short-circuit proof
Reverse polarity proof
Suitable for use in automotive electronics
Green Product (RoHS compliant) version of TLE 4274
AEC qualified
Functional Description
The TLE 4274 is a low drop voltage regulator available in a TO220, TO252 and TO263 package. The IC regulates an input voltage up to 40
V to V (V85) and 10 V (V10). The maximum output current is 400 mA. The IC is short-circuit proof and incorporates temperature protection that disables the IC at overtemperature. A 3.3 V and 2.5 V version is also available. For information about the low output voltage types please refer to the data sheet TLE
2.5 V.
= 5.0 V (V50), 8.5 V
Qrated
4274 / 3.3 V;
TLE 4274
^
Type Package
TLE 4274 V10 PG-TO220-3-1 (RoHS compliant)
TLE 4274 V50 PG-TO220-3-1 (RoHS compliant)
TLE 4274 V85 PG-TO220-3-1 (RoHS compliant)
TLE 4274 DV50 PG-TO252-3-11 (RoHS compliant)
TLE 4274 GV10 PG-TO263-3-1 (RoHS compliant)
TLE 4274 GV50 PG-TO263-3-1 (RoHS compliant)
TLE 4274 GV85 PG-TO263-3-1 (RoHS compliant)
Data Sheet 1 Rev. 1.7, 2011-01-20
Page 2
TLE 4274
Dimensioning Information on External Components
The input capacitor CI is necessary for compensating line influences. Using a resistor of approx. 1 Ω in series with CI, the oscillating of input inductivity and input capacitance can be damped. The output capacitor CQ is necessary for the stability of the regulation circuit.
C
Stability is guaranteed at values temperature range.
Circuit Description
The control amplifier compares a reference voltage to a voltage that is proportional to the output voltage and drives the base of the series transistor via a buffer. Saturation control as a function of the load current prevents any oversaturation of the power element. The IC also includes a number of internal circuits for protection against:
Overload
Overtemperature
Reverse polarity
22 μF and an ESR of 3 Ω within the operating
Q
Data Sheet 2 Rev. 1.7, 2011-01-20
Page 3
PG-TO220-3-1.vsd
123
I
GND
Q
GND
PG-TO263-3-1.vsd
123
I GND Q
GND
PG-TO252-3-11.vsd
132
I
GND
Q
GND
PG-TO220-3-1 PG-TO252-3-11 PG-TO263-3-1
TLE 4274
Figure 1 Pin Configuration (top view)
Table 1 Pin Definitions and Functions
Pin No. Symbol Function
1 I Input; block to ground directly at the IC with a ceramic capacitor.
2 GND Ground
3 Q Output; block to ground with a 22 μF capacitor, ESR 3 Ω.
TAB - TAB; conn
ect to heatsink and GND to improve thermal
performance
Data Sheet 3 Rev. 1.7, 2011-01-20
Page 4
Ι
1
AEB01959
GND
2
Q
3
Bandgap
Reference
Control
Amplifier
Sensor
Temperature
Buffer
Saturation
Control and
Protection
Circuit
TLE 4274
Figure 2 Block Diagram
Data Sheet 4 Rev. 1.7, 2011-01-20
Page 5
TLE 4274
Table 2 Absolute Maximum Ratings
T
= -40 to 150 °C
j
Parameter Symbol Limit Values Unit Test Condition
Min. Max.
Input
Voltage V
Current
I
I
I
Output
Voltage V
Current
Q
I
Q
Ground
Current I
GND
Temperature
Junction temperature T
Storage temperature
j
T
stg
Note: Maximum ratings are absolute ratings; exceeding any one of these values may
cause irreversible damage to the integrated circuit.
-42 45 V
Internally limited
-1.0 40 V
Internally limited
100 mA
150 °C
-50 150 °C
Table 3 Operating Range
Parameter Symbol Limit Values Unit Remarks
Min. Max.
Input voltage; V50, DV50,
V
I
5.5 40 V
GV50
Input voltage, V85, GV85
Input voltage, V10, GV10
Junction temperature
V
I
V
I
T
j
9.0 40 V
10.5 40 V
-40 150 °C
Thermal Resistance
Junction ambient R
Junction ambient R
Junction ambient R
Junction case R
1) Worst case; regarding peak temperature, zero airflow mounted on PCB 80 × 80 × 1.5 mm3, 300 mm2 heat sink
area.
Data Sheet 5 Rev. 1.7, 2011-01-20
thja
thja
thja
thjc
65 K/W TO220
78 K/W TO252
52 K/W TO263
4 K/W
1)
1)
1)
Page 6
TLE 4274
Table 4 Characteristics
V
= 13.5 V; -40 °C < Tj < 150 °C (unless otherwise specified)
I
Parameter Symbol Limit Values Unit Measuring Conditions
Min. Typ. Max.
Output voltage V50-Ve
rsion
Output voltage V50-Ve
rsion
Output voltage V85-Ve
rsion
Output voltage V85-Ve
rsion
Output voltage V10-Ve
rsion
Output voltage V10-Ve
rsion
Output current limitatio
1)
n
Current consu
mption;
I
= II - I
q
Q
Current consu
mption;
I
= II - I
q
Q
Drop voltage
Load regulation ΔV
Line regulation Δ
Power supply ripp
le rejection
Temperature ou
tput voltage drift
1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V.
V
Q
V
Q
V
Q
V
Q
V
Q
V
Q
I
Q
I
q
I
q
I
q
1)
V
dr
Q
V
Q
4.8 5 5.2 V 5 mA < IQ < 400 mA
4.8 5 5.2 V 5 mA < IQ < 200 mA
8.16 8.5 8.84 V 5 mA < IQ < 400 mA
8.16 8.5 8.84 V 5 mA < IQ < 200 mA
9.6 10 10.4 V 5 mA < IQ < 400 mA
9.6 10 10.4 V 5 mA < IQ < 200 mA
400 600 mA
100 220 μA IQ = 1 mA
– –
8 20
250 500 mV IQ = 250 mA
20 50 mV IQ = 5 mA to 400 mA
10 25 mV ΔVl = 12 V to 32 V
PSRR 60 dB f
dVQ/dT 0.5 mV/K –
15 30
6 V < VI < 28 V
6 V < VI < 40 V
9.5 V < VI < 28 V
9.5 V < VI < 40 V
11 V < VI < 28 V
11 V < VI < 40 V
mA
I
mA
Q
I
Q
V
I
Q
r
V
= 250 mA = 400 mA
= VI - V
dr
= 5 mA
= 100 Hz;
= 0.5 Vpp
r
Q
Data Sheet 6 Rev. 1.7, 2011-01-20
Page 7
TLE 4274
Input
Ι
100 nF
μ
100 F
V
Ι
C
Ι
Ι
2
1
C
22 F
μ
Q
3
Q
Ι
AES01960
V
Q
R
L
Output
TLE 4274
C
Input
Ι
1
2
AES01961
C
3
Q
Output
Figure 3 Measuring Circuit
TLE 4274
Figure 4 Application Circuit
Data Sheet 7 Rev. 1.7, 2011-01-20
Page 8
AED01962
0
0
dr
V
200
400
600
mV
500
300
100
T
j
= 125 ˚C
Q
I
100 200 300 mA 400
= 25 ˚C
T
j
AED02267
0
0
Q
I
q
I
10
20
30
40
50
60
100 200 300 400 600
mA
I
V
= 13.5 V
mA
= 25 ˚C
T
j
AED01963
0
0
V
Q
= 0 V
= 25 ˚C
T
j
I
V
Q
I
10 20 30 40 50V
200
400
600
mA
800
AED02268
0
0
Q
I
q
I
0.1
0.2
0.3
0.4
0.5
0.6
10 20 30 40 mA 60
mA
I
V
= 13.5 V
= 25 ˚C
T
j
Typical Performance Characteristics (V50, V85 and V10)
V
Drop Voltage Output Current I
versus
dr
Q
Output Current IQ versus Input Voltage V
TLE 4274
I
Current Consumption Iq versus Output Current IQ (high load)
Current Consumption Iq versus Output Current IQ (low load)
Data Sheet 8 Rev. 1.7, 2011-01-20
Page 9
AED01966
-40 04080120 ˚C 160
4.8
j
T
Q
V
5.2
V
V
I
= 13.5 V
4.9
5.0
5.1
AED01968
0 2468 V10
0
Q
V
2
4
6
V
V
I
=
5
3
1
Q
V
T
j
= 25 ˚C
L
R
= 20
Ω
I
V
V
Q
0
0
20
30
10
mA
50
AED02269
q
Ι
10 20
30
V
R
L
= 20
Ω
V
Ι
T
j
= 25 C
AED01977
-50
-2
I
V
I
I
T
= 25 ˚C
L
R
= 8.2 k
-25 0 25
50
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5 mA
V
Ω
j
6.8kΩ
Typical Performance Characteristics (V50)
V
Output Voltage Junction Temperature T
versus
Q
j
TLE 4274
Current Consumption Iq versus Input Voltage V
I
Output Voltage VQ versus Input Voltage V
Data Sheet 9 Rev. 1.7, 2011-01-20
I
Input Current II versus Input Voltage V
I
Page 10
AED01970
-40 04080120 ˚C 160
j
T
Q
V
8.4
8.6
V
V
I
= 13.5 V
8.3
8.2
8.5
8.7
8.8
6
4
08
0
2
4
R
T
Q
V
Q
V
8
Ι
=
V
V
10
12
V
161220
V
Ι
= 25 C = 34
L
j
Ω
AED01972
Q
V
0
0
20
30
10
mA
50
AED02270
q
Ι
10 20
30
V
R
L
= 20
Ω
V
Ι
T
j
= 25 C
AED03051
-50
-2
I
V
I
I
T
= 25 ˚C
L
R
= 12 k
-25 0 25
50
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
mA
V
Ω
j
Typical Performance Characteristics for V85
V
Output Voltage
versus
Q
Junction Temperature T
j
Current Consumption Iq versus Input Voltage V
TLE 4274
I
Output Voltage VQ versus Input Voltage V
Data Sheet 10 Rev. 1.7, 2011-01-20
I
Input Current II versus Input Voltage V
I
Page 11
AED01974
-40 04080120 ˚C 160
9.7
j
T
Q
V
9.9
10.1
10.3
V
V
I
= 13.5 V
10.2
9.8
10.0
AED01976
0 481216 V20
0
Q
V
4
8
12
V
V
I
=
10
6
2
Q
V
T
j
= 25 ˚C
L
R
= 34
Ω
I
V
V
Q
0
0
20
30
10
mA
50
AED02270
q
Ι
10 20
30
V
R
L
= 20
Ω
V
Ι
T
j
= 25 C
AED03048
-50
-2
I
V
I
I
T
= 25 ˚C
L
R
= 15 k
-25 0 25
50
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
mA
V
Ω
j
Typical Performance Characteristics for V10
V
Output Voltage
versus
Q
Junction Temperature Tj
Current Consumption Iq versus Input Voltage V
TLE 4274
I
Output Voltage VQ versus Input Voltage VI
Data Sheet 11 Rev. 1.7, 2011-01-20
Input Current II versus Input Voltage VI
Page 12
A
BA0.25
M
Typical
9.9
±0.2
2.8
1)
15.65
±0.3
12.95
0...0.15
2.54
0.75
±0.1
1.05
±0.1
1.27
4.4
B
9.25
±0.2
0.05
1)
All metal surfaces tin plated, except area of cut.
C
±0.2
17
±0.3
8.5
1)
10
±0.2
3.7
-0.15
C
2.4
0.5
±0.1
±0.2
4.55
13.5
±0.5
3x
Metal surface min. x=7.25, y=12.3
0...0.3
2x
2.4
GPT09361
You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
Package Outlines
TLE 4274
Figure 5 PG-TO220-3-1 (Plastic Transistor Single Outline)
Green Product (RoHS-Compliant)
To meet the world-wide customer requirements for en and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
Data Sheet 12 Rev. 1.7, 2011-01-20
vironmentally friendly products
Page 13
5.4
±0.1
-0.05
6.5
+0.15
A
±0.5
9.98
6.22
-0.2
1
±0.1
±0.15
0.8
0.15 MAX.
±0.1
per side
0.75
2.28
4.57
+0.08
GPT09277
-0.04
0.5
2.3
-0.10
+0.05
B
0.51 MIN.
+0.08
-0.04
0.5
0...0.15
B
A0.25
M
0.1
All metal surfaces tin plated, except area of cut.
3x
(5)
(4.24)
-0.01
+0.20
0.9
B
TLE 4274
You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
Figure 6 PG-TO252-3-11 (Plastic Transistor Single Outline)
Green Product (RoHS-Compliant)
To meet the world-wide customer requirements for en and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
Data Sheet 13 Rev. 1.7, 2011-01-20
vironmentally friendly products
Page 14
MAX.
BA0.25
M
0.1
Typical
±0.2
10
8.5
1)
7.55
1)
(15)
±0.2
9.25
±0.3
1
0...0.15
5.08
2.54
0.75
±0.1
1.05
±0.1
1.27
4.4
B
0.5
±0.1
±0.3
2.7
4.7
±0.5
0.05
1)
0.1
All metal surfaces: tin plated, except area of cut.
2.4
Metal surface min. x=7.25, y=6.9
A
0...0.3
B
˚
8
GPT09362
TLE 4274
You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
Figure 7 PG-TO263-3-1 (Plastic Transistor Single Outline)
Green Product (RoHS-Compliant)
To meet the world-wide customer requirements for en and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
Data Sheet 14 Rev. 1.7, 2011-01-20
vironmentally friendly products
Page 15
TLE 4274
Revision History: 2011-01-20 Re
Previous Version: 1.5
Page Subjects (major changes since last revision)
general Updated Infineon logo
#1 Added “AEC” and “Green” logo
#1 Added “Green Product” and “AEC qu
alified” to the feature list
#1 Updated Package Names to “PG-xxx”
general Removed leadframe variant “P-TO-252-1”
#12, #13, #14 Added “Green Product” remark
#16 Disclaimer Update
#17 Updated Package Outlines (added TAB potential)
TLE 4274
v. 1.7
Data Sheet 15 Rev. 1.7, 2011-01-20
Page 16
Edition 2011-01-20 Published by
Infineon Technologies AG 81726 München, Germany
© Infineon Technologies AG 2007. All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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