Product specification
Supersedes data of October 1992
File under Integrated Circuits, IC01
Philips Semiconductors
September 1994
Page 2
Philips SemiconductorsProduct specification
AM/FM stereo radio circuitTEA5711; TEA5711T
FEATURES
• Wide supply voltage range: 1.8 or 2.1 to 12 V
• Low current consumption: 15 mA at AM, 16 mA at FM
• Designed for simple and reliable printed-circuit board
layout
• High impedance MOSFET input on AM.
• High selectivity with distributed IF gain
• LED driver for stereo indication
• High input sensitivity: 1.6 mV/m (AM), 2.0 µV (FM) for
26 dB S/N
• Good strong signal behaviour: 10 V/m at AM,
APPLICATIONS
• Portable AM/FM stereo radio
• Mini/midi receiver sets
• Personal headphone radio.
500 mV at FM
• Low output distortion: 0.8% at AM, 0.3% at FM
• Signal level output
• Soft mute
• Signal dependent stereo
DESCRIPTION
The TEA5711 is a high performance Bimos IC for use in
AM/FM stereo radios. All necessary functions are
integrated: from AM and FM front-end to AM detector and
FM stereo output stages.
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.TYP.
V
P
V
P
I
P
dynamic supply voltage1.8−12V
static supply voltage2.1−12V
supply current
AM mode11.915.018.9mA
FM mode13.516.520.2mA
T
amb
operating ambient temperature−15−+60°C
AM performance
V
in1
V
28
RF sensitivity405570µV
AF output voltage364570mV
THDtotal harmonic distortion−0.82.0%
FM performance
V
in3
V
28
RF sensitivity1.02.03.8µV
AF output voltage506172mV
The AM circuit incorporates a double balanced mixer, a
one pin low-voltage oscillator (up to 30 MHz) a
field-strength indicator output and is designed for
distributed selectivity.
The AM input is designed to be connected to the top of a
tuned circuit. AGC controls the IF amplification and for
large signals it lowers the input impedance.
The first AM selectivity can be an IFT as well as an IFT
combined with a ceramic filter; the second one is an IFT.
The FM circuit incorporates a tuned RF stage, a double
balanced mixer, a one-pin oscillator, a field-strength
indicator output and is designed for distributed IF ceramic
filters. The FM quadrature detector uses a ceramic
resonator.
The PLL stereo decoder incorporates a signal dependent
stereo circuit, a soft-mute circuit and a stereo indicator
LED driver.
Supply voltage behaviour
The TEA5711 incorporates internal stabilized power
supplies. The maximum supply voltage is 12 V, the
minimum voltage can go down temporarily to 1.8 V without
any loss in performance.
Due to the capacitor at pin 19 (RIPPLE) the IC gives
excellent performance, even when the actual supply
voltage at pin 25 (V
) drops below the voltage at pin 19
P
(RIPPLE).
Figures 4, 5 and 6 show that V
, which is dominant for
stab
the overall IC performance, remains unaffected, even if V
drops down to 1.8 V or less. In this typical example the
static or average VP is equal to 2.5 V. Dips in V
stab
appear
only when the peak-to-peak value of the AC-component of
VP> 2 V, i.e. when the dynamic value of VP drops down to
N1-2 = 2.5 turns
unloaded Q = 150T
TOKO type S18
TOKO number 301SS-0200
L3FM-OSCL1-2 = 40 nH
N1-2 = 1.5 turns
unloaded Q = 150
TOKO type S18
TOKO number 301SS-0100
L4AM-OSCL1-3 = 270 µH
N1-2 = 18
N2-3 = 70
unloaded Q = 100
wire diameter 0.07 mm
TOKO type 7P
material TOKO 7BRS
L5AM-IF1L1-3 = 625 µH
N1-2 = 17 turns
N2-3 = 141 turns
N4-6 = 10 turns
C1-3 = 180 pF
unloaded Q = 90
wire diameter 0.07 mm
TOKO type 7P
material TOKO 7MCS
L6AM-IF2L1-3 = 625 µH
N1-2 = 28 turns
N2-3 = 130 turns
C1-3 = 180 pF
unloaded Q = 90
wire diameter 0.07 mm
TOKO type 7P
material TOKO 7MCS
L7FM-AERIALprintcoil
L1-2=60nH
N1-2 = 2.5 turns
September 199420
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Philips SemiconductorsProduct specification
BBBB
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AM/FM stereo radio circuitTEA5711; TEA5711T
NUMBERTYPEDESCRIPTIONCIRCUIT
L8AM-RFtest circuit only:
L1-3 = 40 µH
N1-3 = 34 turns
unloaded Q = 85
wire diameter 0.09 mm
TOKO type 7P
material TOKO 7BRS
Ceramic filters
K1FM-IF1Murata SFE 10.7 MS 2
K2FM-IF2Murata SFE 10.7 MS 2
K3FM-DETMurata CDA 10.7 MC 40
Capacitors
C1VARICONAM: 140/82 pF
FM: 2 × 20 pF
trimmer: 4 × 8pF
TOKO type number HU-22124
Application remarks
• Short circuiting: all pins are short-circuit proof except pin 16 (FM-RFI) with respect to the supply voltage pin.
• For an example of printed-circuit board layout: see Figs 9 and 10.
• Align VCO with aerial signal present.
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Fig.11 Typical AM audio voltage (VAF; signal at m = 0.3), noise and THD as a function of RF input
voltage (V
= 1 kHz). Measured in test circuit Fig.7 with VP= 3.0 V.
in1;fi
September 199421
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Philips SemiconductorsProduct specification
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AM/FM stereo radio circuitTEA5711; TEA5711T
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Fig.12 Typical AM audio voltage (VAF; signal at m = 0.3), noise and THD as a function of field-strength (fi= 1 kHz).
Measured in application circuit Fig.8 with VP= 3.0 V.
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Fig.13 Typical FM audio voltage (VAF; signal), noise, THD (at ∆f = 22.5 kHz and ∆f = 75 kHz) and indicator
current (level) as a function of RF input voltage (V
mute (mono) and with mute (mono and stereo). Channel separation at ∆f = 75 kHz. Measured in
test circuit Fig.7 with VP= 3.0 V.
Fig.15 Plastic small outline package; 32 leads; body width 7.5 mm (SO32; SOT287-1).
September 199424
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Philips SemiconductorsProduct specification
AM/FM stereo radio circuitTEA5711; TEA5711T
SOLDERING
Plastic dual in-line packages
Y DIP OR WAVE
B
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not
more than 2 mm above it). If its temperature is below
300 °C, it must not be in contact for more than 10 s; if
between 300 and 400 °C, for not more than 5 s.
Plastic small-outline packages
BYWAVE
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Y SOLDER PASTE REFLOW
B
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min. at 45 °C.
R
EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE
-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
September 199425
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Philips SemiconductorsProduct specification
AM/FM stereo radio circuitTEA5711; TEA5711T
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
September 199426
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Philips SemiconductorsProduct specification
AM/FM stereo radio circuitTEA5711; TEA5711T
NOTES
September 199427
Page 28
Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. (02)805 4455, Fax. (02)805 4466
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,
Tel. (01)60 101-1236, Fax. (01)60 101-1211
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,
CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-724825
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Printed in The Netherlands
Philips Semiconductors
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