Datasheet TDA1308T, TDA1308 Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA1308
Class AB stereo headphone driver
Product specification File under Integrated Circuits, IC01
Philips Semiconductors
August 1994
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
FEATURES
Wide temperature range
No switch ON/OFF clicks
Excellent power supply ripple rejection
Low power consumption
GENERAL DESCRIPTION
The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications.
Short-circuit resistant
High performance
– high signal-to-noise ratio – high slew rate – low distortion
Large output voltage swing.
QUICK REFERENCE DATA
=5V; VSS=0V; T
V
DD
=25°C; fi= 1 kHz; RL=32Ω; unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
DD
supply voltage
single 3.0 5.0 7.0 V dual 1.5 2.5 3.5 V
V
SS
I
DD
P
tot
P
o
(THD + N)/S total harmonic distortion plus
negative supply voltage 1.5 2.5 3.5 V supply current no load 35mA total power dissipation no load 15 25 mW maximum output power THD < 0.1%; note 1 60 mW
note 1
noise-to-signal ratio
0.03 0.06 %
−−70 −65 dB
R
=5kΩ−101 dB
L
S/N signal-to-noise ratio 100 110 dB
α
cs
PSRR power supply ripple rejection f T
amb
channel separation 70 dB
R
= 5 kΩ−105 dB
L
operating ambient
= 100 Hz; V
i
ripple(p-p)
= 100 mV 90 dB
40 +85 °C
temperature
Note
1. V
= 5 V; V
DD
= 3.5 V (at 0 dB).
O(p-p)
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
TDA1308 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
TDA1308T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
BLOCK DIAGRAM
PINNING
SYMBOL PIN DESCRIPTION
OUTA 1 output A INA(neg) 2 inverting input A INA(pos) 3 non-inverting input A V
SS
INB(pos) 5 non-inverting input B INB(neg) 6 inverting input B OUTB 7 output B V
DD
4 negative supply
8 positive supply
Fig.1 Block diagram.
Fig.2 Pin configuration.
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
August 1994 4
Fig.3 Equivalent schematic diagram.
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DD
t
SC(O)
T
stg
T
amb
V
esd
Notes
1. Human body model: C = 100 pF; R = 1500 ; 3 pulses positive plus 3 pulses negative.
2. Machine model: C = 200 pF: L = 0.5 mH: R = 0 ; 3 pulses positive plus 3 pulses negative.
THERMAL CHARACTERISTICS
supply voltage 0 8.0 V output short-circuit duration T
=25°C; P
amb
=1W 20 s
tot
storage temperature 65 +150 °C operating ambient temperature 40 +85 °C electrostatic discharge note 1 2000 +2000 V
note 2 200 +200 V
SYMBOL PARAMETER VALUE UNIT
R
th j-a
thermal resistance from junction to ambient in free air
DIP8 109 K/W
SO8 210 K/W
QUALITY SPECIFICATION
In accordance with
Handbook”
. The handbook can be ordered using the code 9398 510 63011.
“UZW-BO/FQ-0601”
. The numbers of the quality specification can be found in the
“Quality Reference
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
CHARACTERISTICS
=5V; VSS=0V; T
V
DD
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
V
DD
supply voltage
single 3.0 5.0 7.0 V dual 1.5 2.5 3.5 V
V
SS
I
DD
P
tot
negative supply voltage 1.5 2.5 3.5 V supply current no load 35mA total power dissipation no load 15 25 mW
DC characteristics
V
I(os)
I
bias
V
CM
G
v
I
O
R
O
V
O
input offset voltage 10 mV input bias current 10 pA common mode voltage 0 3.5 V open-loop voltage gain RL=5kΩ−70 dB maximum output current (THD + N)/S < 0.1% 60 mA output resistance 0.25 −Ω output voltage swing note 1 0.75 4.25 V
PSRR power supply rejection ratio f
α
cs
C
L
channel separation 70 dB
load capacitance −−200 pF
AC characteristics
(THD + N)/S total harmonic distortion plus
noise-to-signal ratio
S/N signal-to-noise ratio 100 110 dB f
G
P
o
C
i
unity gain frequency open-loop; RL=5kΩ− 5.5 MHz maximum output power (THD + N)/S < 0.1% 60 mW
input capacitance 3 pF SR slew rate unity gain inverting 5 V/µs B power bandwidth unity gain inverting 20 kHz
=25°C; fi= 1 kHz; RL=32Ω; unless otherwise specified.
amb
R
=16Ω; note 1 1.5 3.5 V
L
R
=5kΩ; note 1 0.1 4.9 V
L
= 100 Hz;
i
V
ripple(p-p)
R
L
= 100 mV
=5kΩ−105 dB
90 dB
note 2 −−70 65 dB
0.03 0.06 %
note 2; R
=5kΩ−−101 dB
L
0.0009 %
Notes
1. Values are proportional to V
2. VDD= 5.0 V; V
= 3.5 V (at 0 dB).
O(p-p)
; (THD + N)/S < 0.1%.
DD
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
TEST AND APPLICATION INFORMATION
Fig.4 Measurement circuit for inverting application.
Fig.5 Example of application with TDA1545A (stereo continuous calibration DAC).
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
Fig.6 Open-loop gain as a function of input
frequency.
Fig.7 Crosstalk as a function of input
frequency.
Fig.8 Output power as a function of supply
voltage.
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
Fig.9 Total harmonic distortion plus noise-to-signal ratio as a function of input frequency.
Fig.10 Total harmonic distortion plus noise-to-signal ratio as a function of output voltage level.
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
PACKAGE OUTLINES
handbook, full pagewidth
seating plane
3.60
3.05
1.15 max
9.8
9.2
3.2
4.2
max
max
0.51 min
2.54 (3x)
1.73 max
8
0.53 max
5
41
0.254 M
6.48
6.20
0.38 max
8.25
7.80
7.62
10.0
8.3
MSA252 - 1
Dimensions in mm.
Fig.11 Plastic dual in-line package; 8 leads (300 mil); DIP8; SOT97-1.
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
handbook, full pagewidth
pin 1
index
0.7
0.3
8
1
1.27
5.0
4.8
0.49
0.36
4.0
3.8
0.1 SS
5
1.45
1.25
4
0.25 M (8x)
6.2
5.8
0.25
0.10
detail A
1.0
0.5
0.7
0.6
A
0.25
0.19
0 to 8
MBC180 - 1
1.75
1.35
o
Dimensions in mm.
Fig.12 Plastic small outline package; 8 leads; body width 3.9 mm. (SO8; SOT96-1).
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
SOLDERING Plastic dual in-line packages
Y DIP OR WAVE
B The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 °C, it must not be in contact for more than 10 s; if between 300 and 400 °C, for not more than 5 s.
Plastic small outline packages
YWAVE
B During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing.
Y SOLDER PASTE REFLOW
B Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 °C.
R
EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE
-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 °C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 °C. (Pulse-heated soldering is not recommended for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 °C within 6 s. Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications.
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
August 1994 13
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
NOTES
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Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
NOTES
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