Page 1
LOW-NOISE TV VERTICALDEFLECTIONSYSTEM
.
COMPLETE VERTICAL DEFLECTION SYSTEM
.
LOW NOISE
.
SUITABLE FOR HIGH DEFINITION MONITORS
DESCRIPTION
The TDA1170Dis a monolithicintegratedcircuitin
a 16-leaddualin-line plasticpackage.Itis intended
for use in black and whiteandcolourTV receivers.
Low-noise makes this deviceparticularly suitable for use in monitors. The functions incorpo-
rated are : synchronization circuit, oscillator and
ramp generator,highpower gain amplifier,flyback
generator,voltageregulator.
TDA1170D
DIP16
(Plastic Package)
ORDER CODE : TDA1170D
PIN CONNECTIONS
POWER AMPLIFIER OUTPUT
REGULATED VOLTAGE
December 1992
RAMP OUTPUT
SUPPLY VOLTAGE
FLYBACK
GROUND
GROUND
POWER AMPLIFIER
SUPPLY VOLTAGE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
RAMP GENERATOR
COMPENSATION
AMPLIFIER INPUT
GROUND
GROUND
OSCILLATOR
SYNC. INPUT
HEIGHT ADJUST
9
1170D-01.EPS
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TDA1170D
BLOCK DIAGRAM
+V
S
FREQ
SYNC
TDA1170D
OSCILLATOR
11
10
4 5 12 13
SYNC
CIRCUIT
87
VOLTAGE
REGULATOR
RAMP
GENERATOR
916 14
HEIGHT
2
LINEARITY
3
FLYBACK
GENERATOR
BUFFER
STAGE
1
POWER
AMPLIFLIER
PREAMPLIFLIER
6
15
ABSOLUTEMAXIMUM RATINGS
Symbol Parameter Value Unit
V
V
6,V7
V
I
I
I
I
I
I
10
P
T
stg,Tj
S
14
o
o
o
3
3
tot
Supply Voltage at Pin 2 35 V
Flyback Peak Voltage 60 V
Power Amplifier Input Voltage + 10
– 0.5
Output Peak Current (non repetitive) at t = 2msec 2 A
Output Peak Current at f = 50Hz t ≤ 10µsec 2.5 A
Output Prak Current at f = 50Hz t > 10µsec 1.5 A
Pin 3 DC Current at V6<V
2
Pin 3 Peak to Peak Flyback Current for f = 50Hz, t
≤ 1.5msec 1.8 A
fly
100 mA
Pin 10 Current ± 20 mA
Power Dissipation : at T
at T
=90°C
tab
=70°C (free air)
amb
4.3
1
Storage and JunctionTemperature – 40 to 150 °C
YOKE
1170D-02.EPS
V
V
W
W
1170D-01.TBL
THERMALDATA
Symbol Parameter Value Unit
R
th j–case
R
th j–amb
* Obtained with pins 4, 5,12, 13 soldered to printed circuit with minimized copper area.
Thermal Resistance Junction–pins
Thermal Resistance Junction-ambient
2/8
Max
Max
14
80
°C/W
°C/W*
1170D-02.TBL
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TDA1170D
ELECTRICAL CHARACTERISTICS
(refer to the testcircuits, V
=35V, T
S
DC CHARACTERISTICS
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.
I
2
I
7
–I
11
–I
14
–I
16
–I
16
∆I
16
I
16
V
S
V
1
V
3
V
6
V
6L
V
6H
V
8
V
9
∆V
8
,
∆V
S
V
14
R10 Pin 10 Input Resistance V
Pin 2 Quiescent Current I3=0 7 14 mA 1b
Pin 7 Quiescent Current I6=0 8 17 mA 1b
Oscillator Bias Current V11= 1V 0.1 1 µA1a
Amplifier Input Bias Current V14=1V 1 10 µA1b
Ramp GeneratorBias Current V16= 0 0.02 0.3 µA1a
Ramp GeneratorCurrent I9=20µA, V16= 0 18.5 20 21.5 µA1b
Ramp GeneratorNon-linearity ∆V16= 0to 12V, I9=20µA 0.2 1 % 1b
Supply Voltage Range 10 35 V –
Pin 1 Saturation Voltage to Ground I1= 1mA 1 1.4 V –
Pin 3 Saturation Voltage to Ground I3= 10mA 300 450 mV 1a
Quiescent Output Voltage Vs= 10V
Output Saturation Voltage to Ground – I6= 0.1A
Output Saturation Voltage to Supply I6= 0.1A
Regulated Voltage at Pin 8 6.1 6.5 6.9 V 1b
Regulated Voltage at Pin 9 I9=20µA 6.2 6.6 7 V 1b
∆V
9
Regulated Voltage Drift with Supply
Voltage
∆V
S
Amplifier Input Reference Voltage 2.07 2.2 2.3 V –
=25oC, unless otherwisespecified)
amb
R1 = 1kΩ,R2=1kΩ
V
= 35V
s
R1 = 3kΩ,R2=1kΩ
= 0.8A
–I
6
= 0.8A
I
6
= 10 to 35V 1 mV/V 1b
∆V
S
≤ 0.4V 1 MΩ 1a
10
4.1 4.4 4.75 V 1a
8.3 8.8 9.45 V 1a
0.9
1.2
1.9
2.3VV
1.4
2.1
2.8
3.2VV
1c
1c
1d
1d
1170D-03.TBL
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TDA1170D
Figure 1 : DC TestCircuit
Figure1a
I10
1kΩ
1V 1V 8V
Figure1c
V3 I3
327
10
TDA1170D
11
916 144 5 12 13
- I11
27
- I16
+Vs
+Vs
Figure1b
I2
27
6
R1
V6
R2
1170D-03.EPS
11
8
- I16
V8
TDA1170D
16
9
100kΩ
+Vs
I7
4 5 12 13
V9
14
- I14
1V
1170D-04.EPS
Figure1d
+Vs
I6
27
V6H
11
TDA1170D
14 4 5 12 13
4V
6
V6L
1170D-05.EPS
11
TDA1170D
14 4 5 12 13
6
I61V
1170D-06.EPS
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TDA1170D
ELECTRICALCHARACTERISTICS
(refer to the AC test circuit, V
= 22V ; f = 50Hz ; T
S
AC CHARACTERISTICS
Symbol Parameter Test Conditions Min. Typ. Max. Unit
Supply Current Iy= 1App 140 mA
I
s
Sync. Input Current(positive or negative) 500 µA
I
10
V6 Flyback Voltage I
Flyback Time Iy= App 0.7 ms
t
fly
V
Peak to Peak Output Noise Pin 11 Connected to GND 40 mV
ON
f
Free Running Frequency (P1 = R1) = 260kΩ, C2 = 0.1µF
o
∆f Synchronization Range I
∆f
∆V
∆T
Frequency Drift withSupply Voltage Vs= 10 to 35V 0.005 Hz/V
S
∆f
Frequency Drift vs. Pins 4, 5, 12 and 13
Temp.
pins
Figure 2 : AC Test Circuit
1N4001
=25oC, unlessotherwisespecified)
amb
= 1App 45 V
y
48.5
(P1 = R1) = 300kΩ, C2 = 0.1µF
= 0.5mA 14 Hz
8
= 40 to 120°C 0.01 Hz/°C
T
pins
V = 22V
470µF
42.2
S
PP
Hz
Hz
1170D-04.TBL
Sync.
Input
7
100µF0.1µF
10
11
P1
0.1µF 120kΩ 910kΩ
C2
4 5 12 13
3
R1
220kΩ
2
6
T
D
A
15
1
1
7
14
0
220kΩ
470pF
22k
Ω
3.3
Ω
100pF
5.6kΩ
D
1
98
16
100kΩ
47kΩ 1.8kΩ
0.1µF
0.1µF
0.1mF
5.6k
10µF
V
D
YOKE
Ω
Ry = 10Ω
Ly =20mH
1000µF
V
Rf
Rf
1W
1170D-07.EPS
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TDA1170D
Figure 3 : TypicalApplication Circuit for Smal Screen B/WTV SET(Ry = 2.9Ω, Ly= 6mH, Iy= 1.1App)
V = 12V
D1
1N4001
C5
470µF
S
R11
1.8kΩ
R10
2.2kΩ
R9
1.8k
Ω
C10
0.1µF
R13
270Ω
C11
100µF 2200µF
C1 C4
0.1µF 100µF
f sync=
50Hz
C3
C2
4.7kΩ
0.1µF
R1
P1
0.1µF
7
3
10
11
100kΩ
R2
150kΩ
220k
220kΩ 910kΩ
4 5 12 13
T
D
A
1
1
7
0
D
98
P2
Ω
R3
2
6
15
14
1
P3
C7
0.1µF
C8
0.1µF
100k
16
R4
Ω
R5
150kΩ
C6
470pF
R6
22kΩ
3.3Ω
R7
82kΩ
R8
C9
100pF
Figure4 : P.C.Board and ComponentsLayout of the Circuit of Fig. 3 (1 : 1 scale)
YOKE
Ry =2.9Ω
Ly =6mH
C12
R12
1Ω
1170D-08.EPS
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1170D-09.TIF
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TDA1170D
MOUNTINGINSTRUCTION
The R
th j-amb
of the TDA1170Dcanbe reduced by
soldering the GND pins to a suitable copper area
of theprintedcircuitboard (fig.5) or to anexternal
heatsink(fig.6).
The diagram of figure7showsthemaximum dissipable power P
and the R
tot
th j-amb
as a function of
Figure 5 : Exampleof P.C. Board Copper Area
which is Used as Heatsink
the side ”l” oftwoequalsquarecopperareashaving
a thicknessof 35 µ (1.4 mils).
During soldering the pins temperature must not
exceed260 °Cand the solderingtime must not be
longer than 12 seconds.
Theexternalheatsinkorprintedcircuit copperarea
must be connectedto electricalground.
Figure6 : ExternalHeatsinkMounting Example
Figure 7 : MaximumDissipable Power and
Junction-AmbientThermal
ResistanceversusSide ”l”
1170D-10.EPS
Figure8 : Maximum Allowable Power
Dissipationversus Ambient
Temperature
1170D-12.EPS
1170D-11.EPS
1170D-13.EPS
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TDA1170D
PACKAGE MECHANICAL DATA
16 PINS - PLASTIC PACKAGE
I
L
b1
E
Dimensions
a1
Z
b
16
18
Be
e3
D
9
F
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
a1 0.51 0.020
B 0.77 1.65 0.030 0.065
b 0.5 0.020
b1 0.25 0.010
D 20 0.787
E 8.5 0.335
e 2.54 0.100
e3 17.78 0.700
F 7.1 0.280
i 5.1 0.201
L 3.3 0.130
Z 1.27 0.050
PM-DIP16.EPS
DIP16.TBL
Information furnished is believed to be accurateand reliable.However, SGS-THOMSON Microelectronicsassumes no responsibility
for the consequencesof use ofsuch information norfor any infringement of patents orother rights ofthird parties whichmay result
from itsuse. Nolicence is granted byimplication orotherwise underany patent or patent rights ofSGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previouslysupplied. SGS-THOMSON Microelectronics products arenot authorized for use as critical components inlife
support devices or systemswithout express written approval of SGS-THOMSON Microelectronics.
1994 SGS-THOMSON Microelectronics - All RightsReserved
Purchase of I
2
I
C Patent. Rights to use these components in a I2C system, is granted provided that the systemconformsto
Australia - Brazil - China- France - Germany - Hong Kong - Italy- Japan - Korea - Malaysia -Malta - Morocco
The Netherlands - Singapore - Spain -Sweden - Switzerland - Taiwan - Thailand - UnitedKingdom - U.S.A.
2
C Components of SGS-THOMSON Microelectronics, conveys a licenseunder the Philips
2
the I
C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
8/8
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