Datasheet LZ2513 Datasheet (Sharp)

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1

DESCRIPTION

The LZ2513 is a 1/5-type (3.6 mm) solid-state
image sensor that consists of PN photo-diodes
and CCDs (charge-coupled devices). With
approximately 270 000 pixels (542 horizontal x 492
vertical), the sensor provides a stable high-resolution
color image.

FEATURES

• Number of effective pixels : 512 (H) x 492 (V)

• Number of optical black pixels
– Horizontal : 2 front and 28 rear

• Pixel pitch : 5.8 µm (H) x 4.5 µm (V)

• Mg, G, Cy, and Ye complementary color filters

• Low fixed-pattern noise and lag

• No burn-in and no image distortion

• Blooming suppression structure

• Built-in output amplifier

• Built-in overflow drain voltage circuit and reset
gate voltage circuit

• Horizontal shift register clock voltage : 3.6 V (TYP.)

• Variable electronic shutter (1/60 to 1/10 000 s)

• Compatible with NTSC standard

• Package :
14-pin half-pitch WDIP [Plastic]
(WDIP014-P-0400A)
Row space : 10.16 mm

PIN CONNECTIONS

PRECAUTIONS

• The exit pupil position of lens should be more
than 25 mm from the top surface of the CCD.

• Refer to "PRECAUTIONS FOR CCD AREA

SENSORS" for details.

LZ2513

1/5-type Color CCD Area Sensor

with 270 k Pixels

LZ2513

1OD

2Ø

RS

3NC1

4OS

5NC

2

6ØH2

7ØH1

14

13

12

11

10

9

8

GND

Ø

V4

ØV3

ØV2

ØV1

PW

OFD

14-PIN HALF-PITCH WDIP

TOP VIEW

(WDIP014-P-0400A)

LZ2513

2

PIN DESCRIPTION

ABSOLUTE MAXIMUM RATINGS

(TA = +25 ˚C)

SYMBOL PIN NAME

OD Output transistor drain
OS Output signals
ØRS Reset transistor clock
Ø

V1, ØV2, ØV3, ØV4 Vertical shift register clock

ØH1, ØH2 Horizontal shift register clock

PW P-well
GND Ground
NC

1, NC2 No connection

PARAMETER SYMBOL RATING UNIT

Output transistor drain voltage V

OD 0 to +18 V

Reset gate clock voltage V

ØRS Internal output V

Vertical shift register clock voltage V

ØV –11.5 to +17.5 V

Horizontal shift register clock voltage V

ØH –0.3 to +12 V

Voltage difference between P-well and vertical clock VPW-VØV –29 to 0 V

Storage temperature T

STG –40 to +85 ˚C

Ambient operating temperature T

OPR –20 to +70 ˚C

2

NOTE

NOTES :

1. Do not connect to DC voltage directly. When OFD is connected to GND, connect VOD to GND. Overflow drain clock is
applied below 27 Vp-p.

2. Do not connect to DC voltage directly. When Ø

RS is connected to GND, connect VOD to GND. Reset gate clock is

applied below 8 Vp-p.

3. When clock width is below 10 µs, and clock duty factor is below 0.1%, voltage difference between vertical clocks will be
below 28 V.

Overflow drainOFD

1VInternal outputV

OFDOverflow drain voltage

3V0 to +15VØV-VØVVoltage difference between vertical clocks

3

LZ2513

RECOMMENDED OPERATING CONDITIONS

PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTE

Ambient operating temperature T

OPR 25.0 ˚C

Output transistor drain voltage V

OD 14.55 15.0 15.45 V

1V24.522.5VØOFD

Overflow drain clock

P-well voltage VPW –10.0 VØVL V2

Ground GND 0.0 V

V–8.5–9.0–9.5

V

ØV1L, VØV2L

VØV3L, VØV4L

Vertical shift
register clock

LOW level

INTERMEDIATE level

HIGH level

V

ØV1I, VØV2I

VØV3I, VØV4I

VØV1H, VØV3H 14.55

0.0

15.0 15.45VV

LOW levelHorizontal shift

register clock

V

ØH1L, VØH2L –0.05 0.0 0.05 V

HIGH level VØH1H, VØH2H 3.3 3.6 5.5 V

1V5.55.04.5V

ØRSReset gate clock p-p level

Reset gate clock frequency f

ØRS 9.53 MHz

Horizontal shift register clock frequency fØH1, fØH2 9.53 MHz

Vertical shift register clock frequency

f

ØV1, fØV2

fØV3, fØV4

15.73 kHz

p-p level

NOTES :

• Connect NC1 and NC2 to GND directly or through a capacitor larger than 0.047 µF.

1. Use the circuit parameter indicated in "SYSTEM CONFIGURATION EXAMPLE", and do not connect to DC voltage directly.

2. V

PW is set below VØVL that is low level of vertical shift register clock, or is used with the same power supply that is connected

to V

L of V driver IC.

* To apply power, first connect GND and then turn on V

OD. After turning on VOD, turn on PW first and then turn on other powers

and pulses. Do not connect the device to or disconnect it from the plug socket while power is being applied.

LZ2513

4

CHARACTERISTICS (Drive method : Field accumulation)

(T

A = +25 ˚C, Operating conditions : The typical values specified in "

RECOMMENDED OPERATING CONDITIONS

".

Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.)

PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTE

Standard output voltage V

O 150 mV 2

Photo response non-uniformity PRNU 15 % 3
Saturation output voltage V

SAT 550 700 mV 4

Dark output voltage V

DARK 0.5 3.0 mV 1, 5

Dark signal non-uniformity DSNU 0.5 2.0 mV 1, 6
Sensitivity R 160 220 mV 7
Smear ratio SMR –80 –70 dB 8
Image lag AI 1.0 % 9
Blooming suppression ratio ABL 1 000 10
Output transistor drain current I

OD 4.0 8.0 mA

Output impedance RO 350 $
Vector breakup 7.0 ˚, % 11
Line crawling 3.0 % 12
Luminance flicker 2.0 % 13

NOTES :

• Within the recommended operating conditions of VOD,
V

OFD of the internal output satisfies with ABL larger than

1 000 times exposure of the standard exposure conditions,
and V

SAT larger than 550 mV.

1. T

A = +60 ˚C

2. The average output voltage under uniform illumination.
The standard exposure conditions are defined as when
Vo is 150 mV.

3. The image area is divided into 10 x 10 segments under
the standard exposure conditions. Each segment's
voltage is the average output voltage of all pixels within
the segment. PRNU is defined by (Vmax – Vmin)/Vo,
where Vmax and Vmin are the maximum and minimum
values of each segment's voltage respectively.

4. The image area is divided into 10 x 10 segments. Each
segment's voltage is the average output voltage of all
pixels within the segment. V

SAT is the minimum

segment's voltage under 10 times exposure of the
standard exposure conditions.

5. The average output voltage under non-exposure
conditions.

6. The image area is divided into 10 x 10 segments under
non-exposure conditions. DSNU is defined by (Vdmax –
Vdmin), where Vdmax and Vdmin are the maximum and
minimum values of each segment's voltage respectively.

7. The average output voltage when a 1 000 lux light
source with a 90% reflector is imaged by a lens of F4,
f50 mm.

8. The sensor is exposed only in the central area of V/10
square with a lens at F4, where V is the vertical image
size. SMR is defined by the ratio of the output voltage
detected during the vertical blanking period to the
maximum output voltage in the V/10 square.

9. The sensor is exposed at the exposure level
corresponding to the standard conditions. AI is defined
by the ratio of the output voltage measured at the 1st
field during the non-exposure period to the standard
output voltage.

10. The sensor is exposed only in the central area of V/10
square, where V is the vertical image size. ABL is
defined by the ratio of the exposure at the standard
conditions to the exposure at a point where blooming is
observed.

11. Observed with a vector scope when the color bar chart
is imaged under the standard exposure conditions.

12. The difference between the average output voltage of the
(Mg + Ye), (G + Cy) line and that of the (Mg + Cy), (G +
Ye) line under the standard exposure conditions.

13. The difference between the average output voltage of
the odd field and that of the even field under the
standard exposure conditions.

LZ2513

5

PIXEL STRUCTURE

,

,

,

,

y

y

y

y

,

,

,

y

y

y

512 (H) x 492 (V)

1 pin

OPTICAL BLACK

(2 PIXELS)

OPTICAL BLACK

(28 PIXELS)

COLOR FILTER ARRAY

MgGMgGMg

Cy Ye Cy Ye Cy

GMgGMgG

Cy Ye Cy Ye Cy

MgGMgGMg

Cy Ye Cy Ye Cy

Mg G Mg G Mg

Ye Cy Ye Cy Ye

G Mg G Mg G

Ye Cy Ye Cy Ye

Mg G Mg G Mg

Ye Cy Ye Cy Ye

G Mg G Mg G

Ye Cy Ye Cy Ye

Mg G Mg G Mg

Ye Cy Ye Cy Ye

G Mg G Mg G

Ye Cy Ye Cy Ye

GMgGMgG

Cy Ye Cy Ye Cy

MgGMgGMg

Cy Ye Cy Ye Cy

GMgGMgG

Cy Ye Cy Ye Cy

(1, 492) (512, 492)

(1, 1) (512, 1)

EVEN
field

ODD
field

,

y

,

y

,

y

LZ2513

6

TIMING CHART

484

+



485

486

+



487

488

+



489

490

+



491

492



11

+



12

9
+



10

7
+



8

5
+



6

3
+



4

1
+



2

OS

Ø

OFD

ØV4

ØV3

ØV2

ØV1

VD

HD

(ODD FIELD)

Shutter speed

1/2 000 s

VERTICAL TRANSFER TIMING

483

+



484

485

+



486

487

+



488

491

+



492

489

+

490



10

+



11

8
+



9

6
+



7

4
+



5

2
+



3




1

OS

Ø

OFD

ØV4

ØV3

ØV2

ØV1

VD

HD

(EVEN FIELD)

525 1 10 17 19

263 272 279 282

OS

ØRS

ØH2

ØH1

HD

…

512 OB (28)

OB (2)

ØOFD

ØV4

ØV3

ØV2

ØV1

HORIZONTAL TRANSFER TIMING

29

606, 1 60

24 54

34 64

62 72

49

39

59

OUTPUT (512) 1

πππππππ

LZ2513

7

ØV4

ØV3

ØV2

ØV1

HD

(ODD FIELD)

(EVEN FIELD)

READOUT TIMING

ØV4

ØV3

ØV2

ØV1

HD

1

29

39

24

34 64

54

59 161

180

290 338

242 290

449

606, 1 60

29

39

54

6434

59

4949

60

1

29

39

24

34 64

54

59 161

180

290 338

242 290

606, 1 60

54

64450

59

49

60

LZ2513

8

SYSTEM CONFIGURATION EXAMPLE

OD

OS

NC

1

OFD

PW

Ø

RS

ØH2
ØH1

GND
Ø

V4

ØV3
ØV2
ØV1NC2

V3B
V3A
V1B
V1A

VMa

VH

V4

V2

VL

VMb

POFD

NC

VH

VOD

V4X

VL (VPW)

V3X

V2X

V1X

VH3AX

VH1AX

+5 V

OFDX

ØH1

ØH2

ØRS

CCD

OUT

0.01 µF

1 M$

VOFDH
VH3BX
OFDX
V

2X

V1X

V3X
VDD
GND

V

4X

VH3AX

VH1BX

VH1AX

+

+

1234567812

242322212019181713

11

14

10

15

9

16

1234567

141312111098

LR36685 LZ2513

100 $

270 pF

1 M$

0.1 µF

(*1)

(*1)

+

+

(*1) ØRS, OFD :

Use the circuit parameter indicated in

this circuit example, and do not connect

to DC voltage directly.

PACKAGES FOR CCD AND CMOS DEVICES

9

¬

(◊ : Lid's size)

10.00

±0.10

0.50

±0.50

0.50

±0.50

10.00

±0.10

0.25

±0.10

9.00

±0.10

(◊)

10.16

5.00

±0.075

5.00

±0.075

CCD

17

814

0.03

0.03

1.39

±0.05

1.96

±0.05

9.00

±0.10

(◊)

Package

Glass Lid

CCD

Rotation error of die : ¬= 1.0˚

MAX.

Center of effective imaging area
and center of package

Cross section A-A'

3.50

±0.30

1.27

±0.25

2.55

±0.10

0.30

TYP.

0.46

TYP.

P-1.27

TYP.

5.02

MAX.

3.35

±0.10

A'

A

0.80

±0.05

(◊)

M0.25

+0.5
–0

PACKAGE (Unit : mm)

14 WDIP (WDIP014-P-0400A)

PRECAUTIONS FOR CCD AREA SENSORS

1. Package Breakage

In order to prevent the package from being broken,
observe the following instructions :

1) The CCD is a precise optical component and
the package material is ceramic or plastic.
Therefore,
ø Take care not to drop the device when

mounting, handling, or transporting.

ø Avoid giving a shock to the package.

Especially when leads are fixed to the socket
or the circuit board, small shock could break
the package more easily than when the
package isn’t fixed.

2) When applying force for mounting the device or
any other purposes, fix the leads between a
joint and a stand-off, so that no stress will be
given to the jointed part of the lead. In addition,
when applying force, do it at a point below the
stand-off part.

(In the case of ceramic packages)

– The leads of the package are fixed with low

melting point glass, so stress added to a
lead could cause a crack in the low melting
point glass in the jointed part of the lead.

(In the case of plastic packages)

– The leads of the package are fixed with

package body (plastic), so stress added to a
lead could cause a crack in the package
body (plastic) in the jointed part of the lead.

3) When mounting the package on the housing,
be sure that the package is not bent.

– If a bent package is forced into place

between a hard plate or the like, the pack­age may be broken.

4) If any damage or breakage occurs on the sur­face of the glass cap, its characteristics could
deteriorate.

Therefore,

ø Do not hit the glass cap.
ø Do not give a shock large enough to cause

distortion.

ø Do not scrub or scratch the glass surface.

– Even a soft cloth or applicator, if dry, could

cause dust to scratch the glass.

2. Electrostatic Damage

As compared with general MOS-LSI, CCD has
lower ESD. Therefore, take the following anti-static
measures when handling the CCD :

1) Always discharge static electricity by grounding
the human body and the instrument to be used.
To ground the human body, provide resistance
of about 1 M$ between the human body and
the ground to be on the safe side.

2) When directly handling the device with the
fingers, hold the part without leads and do not
touch any lead.

Glass cap

Package
Lead

Fixed

Stand-off

Fixed

Lead

Stand-off

Low melting point glass

10

PRECAUTIONS FOR CCD AREA SENSORS

3) To avoid generating static electricity,
a. do not scrub the glass surface with cloth or

plastic.

b. do not attach any tape or labels.

c. do not clean the glass surface with dust-

cleaning tape.

4) When storing or transporting the device, put it in
a container of conductive material.

3. Dust and Contamination

Dust or contamination on the glass surface could
deteriorate the output characteristics or cause a
scar. In order to minimize dust or contamination on
the glass surface, take the following precautions :

1) Handle the CCD in a clean environment such
as a cleaned booth. (The cleanliness level
should be, if possible, class 1 000 at least.)

2) Do not touch the glass surface with the fingers.
If dust or contamination gets on the glass
surface, the following cleaning method is
recommended :
ø Dust from static electricity should be blown

off with an ionized air blower. For anti­electrostatic measures, however, ground all
the leads on the device before blowing off
the dust.

ø The contamination on the glass surface

should be wiped off with a clean applicator
soaked in Isopropyl alcohol. Wipe slowly and
gently in one direction only.

– Frequently replace the applicator and do not

use the same applicator to clean more than
one device.

◊ Note : In most cases, dust and contamination

are unavoidable, even before the device
is first used. It is, therefore, recommended
that the above procedures should be
taken to wipe out dust and contamination
before using the device.

4. Other

1) Soldering should be manually performed within
5 seconds at 350 °C maximum at soldering iron.

2) Avoid using or storing the CCD at high tem­perature or high humidity as it is a precise
optical component. Do not give a mechanical
shock to the CCD.

3) Do not expose the device to strong light. For
the color device, long exposure to strong light
will fade the color of the color filters.

11

PRECAUTIONS FOR CCD AREA SENSORS