Datasheet LZ2463A Datasheet (Sharp)

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

1

DESCRIPTION

The LZ2463A is a 1/4-type (4.5 mm) solid-state
image sensor that consists of PN photo-diodes
and CCDs (charge-coupled devices). With
approximately 470 000 pixels (795 horizontal x 595
vertical), the sensor provides a stable high-resolution
color image.

FEATURES

• Number of effective pixels : 752 (H) x 582 (V)

• Number of optical black pixels
– Horizontal : 3 front and 40 rear
– Vertical : 11 front and 2 rear

• Pixel pitch : 5.0 µm (H) x 4.7 µm (V)

• Mg, G, Cy, and Ye complementary color filters

• Low fixed-pattern noise and lag

• No burn-in and no image distortion

• Blooming suppression structure

• Built-in output amplifier

• Built-in overflow drain voltage circuit

• Horizontal shift register clock voltage : 3.6 V (TYP.)

• Variable electronic shutter (1/50 to 1/10 000 s)

• Compatible with PAL standard

• Package :
14-pin half-pitch WDIP [Plastic]
(WDIP014-P-0400A)
Row space : 10.16 mm

PIN CONNECTIONS

PRECAUTIONS

• The exit pupil position of lens should be more
than 25 mm from the top surface of the CCD.

• Refer to "PRECAUTIONS FOR CCD AREA

SENSORS" for details.

LZ2463A

1/4-type Color CCD Area Sensor

with 470 k Pixels

LZ2463A

1OD

2GND

3OFD

4PW

5Ø

RS

6ØH1

7ØH2

14

13

12

11

10

9

8

OS

GND

NC

Ø

V1

ØV2

ØV3

ØV4

14-PIN HALF-PITCH WDIP

TOP VIEW

(WDIP014-P-0400A)

LZ2463A

2

PIN DESCRIPTION

ABSOLUTE MAXIMUM RATINGS

(TA = +25 ˚C)

SYMBOL PIN NAME

OD Output transistor drain
OS Output signals
ØRS Reset transistor clock
Ø

V1, ØV2, ØV3, ØV4 Vertical shift register clock

ØH1, ØH2 Horizontal shift register clock

PW P-well
GND Ground
NC No connection

PARAMETER SYMBOL RATING UNIT

Output transistor drain voltage V

OD 0 to +18 V

Reset gate clock voltage V

ØRS –0.3 to +12 V

Vertical shift register clock voltage V

ØV –11.5 to +17.5 V

Horizontal shift register clock voltage VØH –0.3 to +12 V
Voltage difference between P-well and vertical clock V

PW-VØV –29 to 0 V

Storage temperature T

STG –40 to +85 ˚C

Ambient operating temperature T

OPR –20 to +70 ˚C

NOTE

NOTES :

1. Do not connect to DC voltage directly. When OFD is connected to GND, connect VOD to GND. Overflow drain clock is
applied below 27 Vp-p.

2. When clock width is below 10 µs, and clock duty factor is below 0.1%, voltage difference between vertical clocks will be
below 28 V.

Overflow drainOFD

1VInternal outputV

OFDOverflow drain voltage

2V0 to +15VØV-VØVVoltage difference between vertical clocks

3

LZ2463A

RECOMMENDED OPERATING CONDITIONS

PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTE

Ambient operating temperature T

OPR 25.0 ˚C

Output transistor drain voltage V

OD 14.55 15.0 15.45 V

1V24.522.5VØOFD

Overflow drain clock

P-well voltage VPW –10.0 VØVL V2

Ground GND 0.0 V

V–8.5–9.0–9.5

V

ØV1L, VØV2L

VØV3L, VØV4L

Vertical shift
register clock

LOW level

INTERMEDIATE level

HIGH level

V

ØV1I, VØV2I

VØV3I, VØV4I

VØV1H, VØV3H 14.55

0.0

15.0 15.45VV

LOW levelHorizontal shift

register clock

V

ØH1L, VØH2L –0.05 0.0 0.05 V

HIGH level VØH1H, VØH2H 3.3 3.6 5.5 V

V

VOD– 14.2

0.0VØRSL

Reset gate clock

LOW level

Reset gate clock frequency f

ØRS 14.18 MHz

Horizontal shift register clock frequency f

ØH1, fØH2 14.18 MHz

Vertical shift register clock frequency

f

ØV1, fØV2

fØV3, fØV4

15.63 kHz

HIGH level V

ØRSH

VOD– 9.7

10.0 V

p-p level

NOTES :

• Connect NC to GND directly or through a capacitor larger than 0.047 µF.

1. Use the circuit parameter indicated in "SYSTEM CONFIGURATION EXAMPLE", and do not connect to DC voltage directly.

2. V

PW is set below VØVL that is low level of vertical shift register clock, or is used with the same power supply that is connected

to V

L of V driver IC.

* To apply power, first connect GND and then turn on V

OD. After turning on VOD, turn on PW first and then turn on other powers

and pulses. Do not connect the device to or disconnect it from the plug socket while power is being applied.

LZ2463A

4

CHARACTERISTICS (Drive method : Field accumulation)

(T

A = +25 ˚C, Operating conditions : The typical values specified in "

RECOMMENDED OPERATING CONDITIONS

".

Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.)

PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTE

Standard output voltage V

O 150 mV 2

Photo response non-uniformity PRNU 15 % 3
Saturation output voltage V

SAT 550 700 mV 4

Dark output voltage V

DARK 0.5 3.0 mV 1, 5

Dark signal non-uniformity DSNU 0.5 2.0 mV 1, 6
Sensitivity R 150 210 mV 7
Smear ratio SMR –80 –70 dB 8
Image lag AI 1.0 % 9
Blooming suppression ratio ABL 1 000 10
Output transistor drain current I

OD 4.0 8.0 mA

Output impedance RO 350 $
Vector breakup 7.0 ˚, % 11
Line crawling 3.0 % 12
Luminance flicker 2.0 % 13

NOTES :

• Within the recommended operating conditions of VOD,
V

OFD of the internal output satisfies with ABL larger than

1 000 times exposure of the standard exposure conditions,
and V

SAT larger than 550 mV.

1. T

A = +60 ˚C

2. The average output voltage under uniform illumination.
The standard exposure conditions are defined as when
Vo is 150 mV.

3. The image area is divided into 10 x 10 segments under
the standard exposure conditions. Each segment's
voltage is the average output voltage of all pixels within
the segment. PRNU is defined by (Vmax – Vmin)/Vo,
where Vmax and Vmin are the maximum and minimum
values of each segment's voltage respectively.

4. The image area is divided into 10 x 10 segments. Each
segment's voltage is the average output voltage of all
pixels within the segment. V

SAT is the minimum

segment's voltage under 10 times exposure of the
standard exposure conditions.

5. The average output voltage under non-exposure
conditions.

6. The image area is divided into 10 x 10 segments under
non-exposure conditions. DSNU is defined by (Vdmax –
Vdmin), where Vdmax and Vdmin are the maximum and
minimum values of each segment's voltage respectively.

7. The average output voltage when a 1 000 lux light
source with a 90% reflector is imaged by a lens of F4,
f50 mm.

8. The sensor is exposed only in the central area of V/10
square with a lens at F4, where V is the vertical image
size. SMR is defined by the ratio of the output voltage
detected during the vertical blanking period to the
maximum output voltage in the V/10 square.

9. The sensor is exposed at the exposure level
corresponding to the standard conditions. AI is defined
by the ratio of the output voltage measured at the 1st
field during the non-exposure period to the standard
output voltage.

10. The sensor is exposed only in the central area of V/10
square, where V is the vertical image size. ABL is
defined by the ratio of the exposure at the standard
conditions to the exposure at a point where blooming is
observed.

11. Observed with a vector scope when the color bar chart
is imaged under the standard exposure conditions.

12. The difference between the average output voltage of the
(Mg + Ye), (G + Cy) line and that of the (Mg + Cy), (G +
Ye) line under the standard exposure conditions.

13. The difference between the average output voltage of
the odd field and that of the even field under the
standard exposure conditions.

LZ2463A

5

PIXEL STRUCTURE

1 pin

,

,

,

,

,

y

y

y

y

y

752 (H) x 582 (V)

OPTICAL BLACK

(2 PIXELS)

OPTICAL BLACK

(11 PIXELS)

OPTICAL BLACK

(3 PIXELS)

OPTICAL BLACK

(40 PIXELS)

COLOR FILTER ARRAY

Cy Ye Cy Ye Cy

MgGMgGMg

Cy Ye Cy Ye Cy

GMgGMgG

Cy Ye Cy Ye Cy

MgGMgGMg

Ye Cy Ye Cy Ye

G Mg G Mg G

Ye Cy Ye Cy Ye

Mg G Mg G Mg

Ye Cy Ye Cy Ye

G Mg G Mg G

Ye Cy Ye Cy Ye

G Mg G Mg G

Ye Cy Ye Cy Ye

Mg G Mg G Mg

Ye Cy Ye Cy Ye

G Mg G Mg G

Cy Ye Cy Ye Cy

MgGMgGMg

Cy Ye Cy Ye Cy

GMgGMgG

Cy Ye Cy Ye Cy

MgGMgGMg

(1, 582) (752, 582)

(1, 1) (752, 1)

1st, 3rd

field

2nd, 4th
field

,,,,,,,

yyyyyyy

,,,,,,,

yyyyyyy

,,,,,,,

yyyyyyy

,,,,,,,

yyyyyyy

,,,,,,,

yyyyyyy

LZ2463A

6

TIMING CHART

579

+



580

581

+



582

OB1

+



OB2

6
+



7

4
+



5

2
+



3

OB11

+



1

OB9

+



OB10

OB7

+



OB8

OB5

+



OB6

OB3

+



OB4

OB1

+



OB2

OS

Ø

OFD

ØV4

ØV3

ØV2

ØV1

VD

HD

(1st, 3rd FIELD)

Shutter speed

1/2 000 s

VERTICAL TRANSFER TIMING

578

+



579

580

+



581

582

+



OB1

OB2



5
+



6

3
+



4

1
+



2

OB10

+



OB11

OB8

+



OB9

OB6

+



OB7

OB4

+



OB5

OB2

+



OB3




OB1

OS

Ø

OFD

ØV4

ØV3

ØV2

ØV1

VD

HD

(2nd, 4th FIELD)

623 625 1 6 13

311 318 325

OS

Ø

RS

ØH2

ØH1

HD

..

752 OB (40)

OUTPUT (752) 1

ππ

ØOFD

ØV4

ØV3

ØV2

ØV1

HORIZONTAL TRANSFER TIMING

908, 1 91

42

74

58 90

8234

50 98

8666

PRE SCAN (22)

OB (3)

LZ2463A

7

ØV4

ØV3

ØV2

ØV1

HD

Ø

V4

ØV3

ØV2

ØV1

HD

(1st, 3rd FIELD)

(2nd, 4th FIELD)

READOUT TIMING

1

42

58

34

50 98

82

90 208

240

404 472

336 404

644

908, 1 91

42

58

82

9850

90

7474

91

1

42

58

34

50 98

82

90 208

240

404 472

336

404

908, 1 91

82

98644

90

74

91

LZ2463A

8

SYSTEM CONFIGURATION EXAMPLE

OD

PW

OFD

Ø

V4

ØV3

GND

ØH1
ØH2

OS
GND
NC
Ø

V1

ØV2

ØRS

V3B
V3A
V1B
V1A

VMa

VH

V4

V2

VL

VMb

POFD

NC

VH

ØH2

V4X

V3X

V2X

V1X

VH3AX

VH1AX

+5 V

OFDX

ØH1

ØRS

VL (VPW)

CCD

OUT

VOFDH
VH3BX
OFDX
V

2X

V1X

V3X
VDD
GND

V

4X

VH3AX

VH1BX

VH1AX

+

+

1234567812

242322212019181713

11

14

10

15

9

16

1234567

141312111098

LR36685 LZ2463A

(*1)

VOD

270

pF

100 $

1 M$

1 M$

0.1 µF

1 000 pF

+

+

(*1) OFD :

Use the circuit parameter indicated in

this circuit example, and do not connect

to DC voltage directly.

PACKAGES FOR CCD AND CMOS DEVICES

9

¬

(◊ : Lid's size)

10.00

±0.10

0.50

±0.50

0.50

±0.50

10.00

±0.10

0.25

±0.10

9.00

±0.10

(◊)

10.16

5.00

±0.075

5.00

±0.075

CCD

17

814

0.03

0.03

1.39

±0.05

1.96

±0.05

9.00

±0.10

(◊)

Package

Glass Lid

CCD

Rotation error of die : ¬= 1.0˚

MAX.

Center of effective imaging area
and center of package

Cross section A-A'

3.50

±0.30

1.27

±0.25

2.55

±0.10

0.30

TYP.

0.46

TYP.

P-1.27

TYP.

5.02

MAX.

3.35

±0.10

A'

A

0.80

±0.05

(◊)

M0.25

+0.5
–0

PACKAGE (Unit : mm)

14 WDIP (WDIP014-P-0400A)

PRECAUTIONS FOR CCD AREA SENSORS

1. Package Breakage

In order to prevent the package from being broken,
observe the following instructions :

1) The CCD is a precise optical component and
the package material is ceramic or plastic.
Therefore,
ø Take care not to drop the device when

mounting, handling, or transporting.

ø Avoid giving a shock to the package.

Especially when leads are fixed to the socket
or the circuit board, small shock could break
the package more easily than when the
package isn’t fixed.

2) When applying force for mounting the device or
any other purposes, fix the leads between a
joint and a stand-off, so that no stress will be
given to the jointed part of the lead. In addition,
when applying force, do it at a point below the
stand-off part.

(In the case of ceramic packages)

– The leads of the package are fixed with low

melting point glass, so stress added to a
lead could cause a crack in the low melting
point glass in the jointed part of the lead.

(In the case of plastic packages)

– The leads of the package are fixed with

package body (plastic), so stress added to a
lead could cause a crack in the package
body (plastic) in the jointed part of the lead.

3) When mounting the package on the housing,
be sure that the package is not bent.

– If a bent package is forced into place

between a hard plate or the like, the pack­age may be broken.

4) If any damage or breakage occurs on the sur­face of the glass cap, its characteristics could
deteriorate.

Therefore,

ø Do not hit the glass cap.
ø Do not give a shock large enough to cause

distortion.

ø Do not scrub or scratch the glass surface.

– Even a soft cloth or applicator, if dry, could

cause dust to scratch the glass.

2. Electrostatic Damage

As compared with general MOS-LSI, CCD has
lower ESD. Therefore, take the following anti-static
measures when handling the CCD :

1) Always discharge static electricity by grounding
the human body and the instrument to be used.
To ground the human body, provide resistance
of about 1 M$ between the human body and
the ground to be on the safe side.

2) When directly handling the device with the
fingers, hold the part without leads and do not
touch any lead.

Glass cap

Package
Lead

Fixed

Stand-off

Fixed

Lead

Stand-off

Low melting point glass

10

PRECAUTIONS FOR CCD AREA SENSORS

3) To avoid generating static electricity,
a. do not scrub the glass surface with cloth or

plastic.

b. do not attach any tape or labels.

c. do not clean the glass surface with dust-

cleaning tape.

4) When storing or transporting the device, put it in
a container of conductive material.

3. Dust and Contamination

Dust or contamination on the glass surface could
deteriorate the output characteristics or cause a
scar. In order to minimize dust or contamination on
the glass surface, take the following precautions :

1) Handle the CCD in a clean environment such
as a cleaned booth. (The cleanliness level
should be, if possible, class 1 000 at least.)

2) Do not touch the glass surface with the fingers.
If dust or contamination gets on the glass
surface, the following cleaning method is
recommended :
ø Dust from static electricity should be blown

off with an ionized air blower. For anti­electrostatic measures, however, ground all
the leads on the device before blowing off
the dust.

ø The contamination on the glass surface

should be wiped off with a clean applicator
soaked in Isopropyl alcohol. Wipe slowly and
gently in one direction only.

– Frequently replace the applicator and do not

use the same applicator to clean more than
one device.

◊ Note : In most cases, dust and contamination

are unavoidable, even before the device
is first used. It is, therefore, recommended
that the above procedures should be
taken to wipe out dust and contamination
before using the device.

4. Other

1) Soldering should be manually performed within
5 seconds at 350 °C maximum at soldering iron.

2) Avoid using or storing the CCD at high tem­perature or high humidity as it is a precise
optical component. Do not give a mechanical
shock to the CCD.

3) Do not expose the device to strong light. For
the color device, long exposure to strong light
will fade the color of the color filters.

11

PRECAUTIONS FOR CCD AREA SENSORS