Datasheet HV312NG, HV302NG Datasheet (Supertex)

Page 1
HV302
__________________________________________________________________________________________________________________
HV312

Initial Release

Sequencing Hotswap Controllers

(Negative Supply Rail)
Features
-10V to 90V or +10V to +90V Operation Four PWRGD Flags with Programmable Delays Integrated “normally-on” Gate Clamp eliminates components UV/OV Lock Out & Power-On-Reset (POR) for Debouncing Sense resistor programmed Circuit Breaker & Servo Limit Programmable Circuit Breaker Delay Inrush control using either: Servo or Feedback Capacitor Feedback to RAMP pin saves gate protection components 100ms Start Up Timeout Protection for Output Overload Programmable Inrush Current di/dt Control Programmable Auto-Retry (tens of seconds if desired) Auto-Retry or Latched Operation Application solution for input voltage step (diode “ORing”) Enable through Open Drain interface to UV or OV Low Power, 0.6mA Active Mode, 0.4mA Sleep Mode Small SOIC-14 Package
Applications
-48V Telecom and Networking -24V Cellular and Fixed Wireless Systems -24V PBX Systems Power Over LAN (IEEE802.3) Distributed Power Systems Power Supply Control +48V Servers and SANs Hotswap Control of Diode ORed Multiple Power Sources Cooling Fan Systems
Typical Application Circuit and Waveforms
GND
-48V
14
VDD
R1
487k
6
UV
R2
6.81k 5
OV
R3
9.76k
TB TC TD
11
RTB RTC RTD
NOTES: 1. Under Voltage Shutdown (UV) set to 35V.
2. Over Voltage Shutdown (OV) set to 65V.
3. Current Limit set to -1A.
4. Circuit Breaker set to 8A.
HV302 / HV312
12 13
10nF
C1
PWRGD-D / PWRGD-D
PWRGD-C /PWRGD-C
PWRGD-B / PWRGD-B
PWRGD-A / PWRGD-A
VEE SENSE GATERAMP
810 97
R4
0.0125
________
1
________
2
________
3
________
4
Cload
100uF
C2
0.75nF ___
Q1
IRF530
___ EN / EN
DC/DC PWM CONVERTER
___ EN / EN
DC/DC PWM CONVERTER
___ EN / EN
DC/DC PWM CONVERTER
EN / EN
DC/DC PWM CONVERTER
-12V
COM
+12V
COM
+5V
COM
+3.3V
COM
General Description
The HV302 and HV312 Hotswap Controllers perform current limiting, circuit breaker protection, over and under voltage detection power management functions during insertion of cards or modules into live backplanes and connectors. They may be used in systems where active control is implemented in the negative lead of supplies ranging from -10V to -90V or +10V to +90V.
During initial power application the external pass device is held off by a “normally-on” circuit that clamps its gate low. Thereafter UV/OV and power-on-reset work together to suppress gate turn on due to contact bounce. When stable connection has been established for the duration of a programmed time delay, the inrush current is controlled and limited to a programmed level using one of two possible methods; servo mode or drain to ramp feedback capacitor mode. When charging of the load capacitor is completed, the open drain PWRGD-A flag is asserted. Open drain PWRGD-B, PWRGD-C and PWRGD-D flags are asserted sequentially after the expiration of their respective programmed time delays. Thereafter it transitions to a low power sleep mode and continues to monitor current and input voltage. If full charging of the load capacitor is not achieved within 100ms or the circuit breaker is tripped at any time, the external pass device is turned off and all four PWRGD flags are reset to the inactive state. Thereafter a programmable auto-retry timer will hold the pass device off to allow it to cool before resetting and initiating auto­retry. The auto-retry can be disabled using a single resistor if desired.
1 Rev. D 04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
Page 2
HV302 / HV312
Absolute Maximum Ratings Ordering Information
reference to VDD pin +0.3V to -100V
V
EE
V
referenced to VEE Voltage -0.3V to +100V
PWRGD
and VOV referenced to VEE Voltage -0.3V to +12V
V
UV
Operating Ambient Temperature -40°C to +85°C Operating Junction Temperature -40°C to +125°C Storage Temperature Range -65°C to +150°C
Good Flags
HIGH HV302NG
LOW HV312NG
Package Options Active State of Power
14 Pin SOIC
Electrical Characteristics
Symbol Parameter Min Typ Max Units Conditions
Supply (Referenced to V
V
Supply Voltage -90 -10 V
EE
IEE Supply Current 600 700 IEE Sleep Mode Supply Current 400 450
OV and UV Control (Referenced to V
UV High Threshold 1.26 V Low to High Transition
V
UVH
V
UV Low Threshold 1.16 V High to Low Transition
UVL
V
UV Hysteresis 100 mV
UVHY
IUV UV Input Current 1.0 nA VUV = VEE + 1.9V V
OV High Threshold 1.26 V Low to High Transition
OVH
V
OV Low Threshold 1.16 V High to Low Transition
OVL
V
OV Hysteresis 100 mV
OVHY
IOV OV Input Current 1.0 nA VOV = VEE + 0.5V
Current Limit (Referenced to V
V V
Current Limit Threshold Voltage 40 50 60 mV VUV = VEE + 1.9V, VOV = VEE + 0.5V
SENSE-CL
Circuit Breaker Current Limit Threshold Voltage 80 100 120 mV VUV = VEE + 1.9V, VOV = VEE + 0.5V
SENSE-CB
Gate Drive Output (Referenced to V
V
Maximum Gate Drive Voltage 8.5 10 12 V VUV = VEE + 1.9V, VOV = VEE + 0.5V
GATE
Gate Drive Pull-Up Current 500
GATEUP
Gate Drive Pull-Down Current 40 mA VUV = VEE, VOV = VEE + 0.5V
GATEDOWN
Ramp Timing Control - Test Conditions: C
Ramp Pin Output Current 10
RAMP
Time from UV to Gate Turn On 2.0 ms (See Note 1)
POR
Time from Gate Turn On to V
RISE
Duration of Current Limit Mode 5.0 ms
LIMIT
Time from Current Limit to PWRGD-A 5.0 ms
PWRGD-A
Maximum Time from PWRGD-A to PWRGD-B 150 200 250 ms
PWRGD-B
Minimum Time from PWRGD-A to PWRGD-B 3.0 5.0 8.0 ms
PWRGD-B
Maximum Time from PWRGD-B to PWRGD-C 150 200 250 ms
PWRGD-C
Minimum Time from PWRGD-B to PWRGD-C 3.0 5.0 8.0 ms
PWRGD-C
Maximum Time from PWRGD-C to PWRGD-D 150 200 250 ms
PWRGD-D
Minimum Time from PWRGD-C to PWRGD-D 3.0 5.0 8.0 ms
PWRGD-D
V
Voltage on Ramp Pin in Current Limit Mode 3.6 V (See Note 2)
RAMP
Start up Time Limit 80 100 120 ms
STARTLIMIT
Circuit Breaker Delay Time 2.0 5.0
CBTRIP
Automatic Retry Delay 16 s
AUTO
DD
pin)
(-10V VIN -90V, -40°C TA +85°C unless otherwise noted)
µA µA
pin)
EE
pin)
EE
pin)
EE
µA
=100µF, C
LOAD
=10nF, VUV = VEE + 1.9V, VOV = VEE + 0.5V, External MOSFET is IRF530*
RAMP
µA
Limit 400
SENSE
µs
µs
VEE = -48V, Mode = Limiting VEE = -48V, Mode = Sleep
VUV = VEE + 1.9V, VOV = VEE + 0.5V
V
= 0V
SENSE
= 120k
R
TB
= 3k
R
TB
R
= 120k
TC
= 3k
R
TC
= 120k
R
TD
= 3k
R
TD
May be extended by external RC circuit
2 Rev. D 04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
Page 3
Power Good Outputs (Referenced to V
V
PWRGD-x(hi)
V
PWRGD-x(lo)
PWRGD-x(lk)
Power Good Pin Breakdown Voltage 90 V PWRGD-x = HI Z Power Good Pin Output Low Voltage 0.5 0.8 V I
Maximum Leakage Current <1.0 10

Dynamic Characteristics

OV Comparator Transition 500 ns
GATEHLOV
UV Comparator Transition 500 ns
GATEHLUV
Note 1: This timing depends on the threshold voltage of the external N-Channel MOSFET. The higher its threshold is, the longer this timing. Note 2: This voltage depends on the characteristics of the external N-Channel MOSFET. V *IRF530 is a registered trademark of International Rectifier.

Pinout

PWRGD-D (HV302)
________
PWRGD-D (HV312)
PWRGD-C (HV302)
________
PWRGD-C (HV312)
PWRGD-B (HV302)
________
PWRGD-B (HV312)
PWRGD-A (HV302)
________
PWRGD-A (HV312)
OV
UV
VEE
1
2
3
4
5
6
7
PWRGD Logic
Model Condition PWRGD-A/B/C/D
HV302
HV312
3 Rev. D 04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
INACTIVE (Not Ready) 0 VEE
ACTIVE (Ready) 1 HI Z
INACTIVE (Not Ready) 1 HI Z
ACTIVE (Ready) 0 V
EE
pin)
= 1mA, PWRGD-x = LOW
PWRGD
V
µA
= 3V for an IRF530.
to
= 90V, PWRGD-x = HI Z
PWRGD
Pin Description
PWRGD-D – This Power Good Output Pin is held inactive on initial
power application and goes active a programmed time delay after
14
VDD
13
TD
12
TC
11
TB
10
RAMP
9
GATE
8
SENSE
EE
PWRGD-C goes active.
PWRGD-C – This Power Good Output Pin is held inactive on initial power application and goes active a programmed time delay after PWRGD-B goes active.
PWRGD-B – This Power Good Output Pin is held inactive on initial power application and goes active a programmed time delay after PWRGD-A goes active.
PWRGD-A – This Power Good Output Pin is held inactive on initial power application and goes active when the external MOSFET is fully turned on.
OV – This Over Voltage (OV) sense pin, when raised above its high threshold will immediately cause the GATE pin to be pulled low. The GATE pin will remain low until the voltage on this pin falls below the low threshold limit, initiating a new start-up cycle.
UV – This Under Voltage (UV) sense pin, when below its low threshold limit will immediately cause the GATE pin to be pulled low. The GATE pin will remain low until the voltage on this pin rises above the high threshold limit, initiating a new start-up cycle.
– This pin is the negative terminal of the power supply input to
V
EE
the circuit.
This pin is the positive terminal of the power supply input to
V
DD
the circuit.
TD – The resistor connected from this pin to V
pin sets the time
EE
delay from PWRGD-C going active to PWRGD-D going active.
TC – The resistor connected from this pin to V
pin sets the time
EE
delay from PWRGD-B going active to PWRGD-C going active.
TB – The resistor connected from this pin to V
pin sets the time
EE
delay from PWRGD-A going active to PWRGD-B going active.
RAMP – This pin provides a current output so that a timing ramp voltage is generated when a capacitor is connected.
GATE – This is the Gate Driver Output for the external N-Channel MOSFET.
SENSE – The current sense resistor connected from this pin to V Pin programs the servo control current limit and the circuit breaker trip limit.
EE
Page 4
Functional Block Diagram
Vint
Internal Supply Regulator
UVLO and POR
HV302 / HV312
PWRGD-D VDD
UV
OV
VEE
Band Gap Reference
Vbg
Vbg
Programmable
Selector Switch
Timer
Buffer
Selector Switch
TB TC TD SENSE RAMP GATE
LOGIC
C
555 type Auto-Retry
C
Timer
Latch High & Sleep
C
100mV
Vint-1.2V
Transconductor
gm
Vint
10uA
Transconductor
gm
2Vbg
5k 5k
Clamp Mechanism
1 : 2 Mirror
C
Circuit Breaker
PWRGD-C
PWRGD-B
PWRGD-A
Functional Description
Insertion into Hot Backplanes
Telecom, Networking, SAN and Server applications require the ability to insert and remove circuit cards from systems without powering down the entire system. All circuit cards have some filter capacitance on the power rails, which is especially true in circuit cards or network terminal equipment utilizing distributed power systems. The insertion can result in high inrush currents that can cause damage to connector and circuit cards and may result in unacceptable disturbances on the system backplane power rails.
The HV302 and HV312 are designed to facilitate the insertion of these circuit cards or connection of terminal equipment by eliminating these inrush currents and powering up these circuits in a controlled manner after full connector insertion has been achieved
Description of Operation
During initial power application, a “normally-on” circuit holds off the external MOSFET, preventing an input glitch while an integrated regulator establishes an internal operating voltage of approximately 10V. Until the proper internal voltage is achieved all circuits are held reset, the PWRGD flags are inactive and the gate to source voltage of the external MOSFET is clamped low.
Once the internal under voltage lock out (UVLO) has been satisfied, the circuit checks the input supply under voltage (UV) and over voltage (OV) sense circuits to ensure that the input voltage is within programmed limits. These limits are determined by the selected values of resistors R1, R2 and R3, which form a voltage divider.
4 Rev. D 04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
In Servo Mode operation, assuming the UV and OV limits are satisfied and while continuing to hold the PWRGD flags inactive and the external MOSFET GATE voltage low, the current source feeding the RAMP pin is turned on. The external ramp capacitor connected to it begins to charge, thus starting an initial time delay determined by the value of the capacitor and the 2Vbg threshold voltage of the RAMP pin. During this time if the OV or UV limits are exceeded, an immediate reset occurs and the capacitor connected to the RAMP pin is discharged.
When the voltage on the RAMP pin exceeds the 2Vbg threshold voltage, the gate drive circuit begins to apply voltage to the gate of the external MOSFET, which begins to turn on when its gate threshold voltage is reached. The resulting output current generates a voltage drop on the sense resistor connected between the SENSE and V
pins, causing a decrease in the available
EE
current charging the capacitor on the RAMP pin. This continuous feedback mechanism allows the output current to rise inverse exponentially over a period of a few hundred microseconds to the sense resistor programmed current limit set point.
When the voltage drop on the sense resistor reaches 50mV the RAMP pin current is reduced to zero and the voltage on the RAMP pin will be fixed, indicating that the circuit is in current limit mode. Depending on the value of the load capacitor and the programmed current limit, charging may continue for some time, but may not exceed a nominal 100ms preset time limit. Once the load capacitor has been charged, the output current will drop, reducing the voltage on the SENSE pin, which in turn will increase the RAMP pin current, thus causing the voltage on the capacitor connected to the RAMP pin to continue rising, thereby providing yet another programmed delay.
Page 5
Functional Description - continued
In Feedback Capacitor Mode operation, assuming the UV and OV limits are satisfied and while continuing to hold the PWRGD flags inactive and the external MOSFET GATE voltage low, the current source feeding the RAMP pin is turned on. The external ramp capacitor (C capacitor (C
) begins to discharge, thus starting an initial time
FB
delay determined by the equivalent value of the capacitors and the 2Vbg threshold voltage of the RAMP pin. During this time if the OV or UV limits are exceeded, an immediate reset occurs, the ramp capacitor is discharged and the feedback capacitor is recharged.
When the voltage on the RAMP pin exceeds the 2Vbg threshold voltage, the gate drive circuit begins to apply voltage to the gate of the external MOSFET, which begins to turn on when its gate threshold voltage is reached. However, the source current from the RAMP pin limits the dv/dt of the feedback capacitor (C which, in turn, programs the inrush current limit (I with the relationship I load capacitor. At this point essentially all available current from the RAMP pin flows into the feedback capacitor, thus the voltage on the ramp capacitor and the RAMP pin remains essentially constant, thereby limiting and controlling the gate voltage of the external MOSFET (See Programming Current Limit and Circuit Breaker in Design Information section). When the load capacitor is fully charged the current flowing into the feedback capacitor is reduced and the voltage drop across the MOSFET essentially drops to zero, effectively connecting the feedback capacitor in parallel with the ramp capacitor. Now the current from the RAMP pin flows into the parallel-connected capacitors and the voltage on the RAMP pin begins to rise, thereby providing yet another programmed delay.
) begins to charge and the feedback
RAMP
) in accordance
= I
RAMP
x C
LOAD/CFB
CL
CL
and thus the dv/dt of the
)
FB
HV302 / HV312
Whether operating in Servo Mode or Feedback Capacitor Mode, when the ramp voltage is within 1.2V of the regulated internal supply voltage, the controller will force the GATE terminal to a nominal 10V, the PWRGD-A pin will change to an active state and the Circuit Breaker is enabled. PWRGD-B will change to an active state a programmed delay time after PWRGD-A went active, PWRGD-C will change to an active state a programmed delay time after PWRGD-B went active, PWRGD-D will change to an active state a programmed delay time after PWRGD-C went active and the circuit transitions to a low power sleep mode. While in sleep mode the circuit continues to monitor the current and the OV and UV status.
When the voltage on the SENSE pin rises to 100mV, indicating an
over current condition, the circuit breaker will trip in less than 5µs.
This time may be extended by the addition of external components.
If due to output overload conditions during startup full charging of the load is not achieved within 100ms or a load fault occurs at any time the circuit breaker is tripped, the MOSFET is turned off by pulling down the GATE to V Thereafter an auto-retry timer, programmed by the capacitor connected to the RAMP pin, will hold the pass device off to allow it to cool before resetting and restarting. The auto-retry can be disabled using a single resistor if desired (See Auto-Retry and Auto-Retry Disable in Design Information section).
At any time during the start up cycle or thereafter, crossing the UV and OV limits (including hysteresis) will cause an immediate reset of all internal circuitry. When the input supply voltage returns to a value within the programmed UV and OV limits a new start up sequence will be immediately initiated.
and all four PWRGD flags are reset.
EE
5 Rev. D 04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
Page 6
Design Information
Programming Under and Over Voltage Shut Down
The UV and OV pins are connected to comparators with nominal
1.21V thresholds and 100mV of hysteresis (1.21V ± 50mV). They
are used to detect under voltage and over voltage conditions at the input to the circuit. Whenever the OV pin rises above its high threshold (1.26V) or the UV pin falls below its low threshold (1.16V) the GATE voltage is immediately pulled low, the PWRGD pin changes to its inactive state and the external capacitor connected to the RAMP pin is discharged.
Calculations can be based on either the desired input voltage operating limits or the input voltage shutdown limits. In the following equations the shutdown limits are assumed.
The under voltage and over voltage shut down thresholds can be programmed by means of the three resistor divider formed by R1, R2 and R3. Since the input currents on the UV and OV pins are negligible the resistor values may be calculated as follows:
V1.16VUV
×===
EEUV(off)UVLOFF
×===
V1.26VOV
EEOV(off)OVHOFF
Where V
EEUV(off)
and V
are Under & Over Voltage Shut
EEOV(off)
Down Threshold points.
If we select a divider current of 100µA at a nominal operating input
voltage of 50 Volts then
50V
R3R2R1 ==++
100uA
500k
From the second equation for an OV shut down threshold of 65V the value of R3 may be calculated.
×
R365
OFF
==
1.26OV 500k
500K1.26
R3 =
×
=
65
9.69k
The closest 1% value is 9.76k
From the first equation for a UV shut down threshold of 35V the value of R2 can be calculated.
()
R3R235
+×
OFF
1.16UV
==
500K
500k1.16
R2 =
×
=
35
6.81k9.76k
The closest 1% value is 6.81k
Then
483kR3R2500KR1 ==
The closest 1% value is 487k
R3R2
+
R3R2R1
++
R3
R3R2R1
++
HV302 / HV312
From the calculated resistor values the OV and UV start up threshold voltages can be calculated as follows:
Where V
Up Threshold points.
Then
And
Therefore, the circuit will start when the input supply voltage is in the range of 38.29V to 59.85V.
Under Voltage/Over Voltage Operation
V1.26VUV
EEUV(on)UVHON
V1.16VOV
EEOV(on)OVLON
EEUV(on)
EEUV(on)
EEUV(on)
EEOV(on)
EEOV(on)
and V
1.26V
×=
1.26V
×=
×=
1.16V
×=
1.16V
are Under & Over Voltage Start
EEOV(on)
R3R2R1
++
R3R2
+
+
++
R3R2R1
R3
9.76k
R3R2
+
R3
R3R2R1
++
R3R2R1
++
×===
×===
9.76k6.81k487k
++
9.76k6.81k
38.29V
=
++
9.76k6.81k487k
59.85V
=
6 Rev. D 04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
Page 7
Design Information- continued

Programming Current Limit and Circuit Breaker

Feedback Capacitor Mode Operation
In this operating mode the circuit breaker trip current and the inrush current limit can be independently programmed. In fact the circuit breaker can be completely disabled by setting R
The circuit breaker will trip in less than 5µs when the voltage on
the SENSE pin is raised 100mV above the V
pin and the value of
EE
the sense resistor may be calculated from the following equation:
R ==
SENSE
V
CB-SENSE
I
100mV
I
CBCB
For an 8A circuit breaker:
R
SENSE
100mV
8A
==
12.5m
The power rating of the sense resistor must be greater than or equal to I
x V
CB
SENSE-CB
.
The following diagrams depict the equivalent circuitry to clarify the feedback capacitor operation for programming the inrush current limit.
The inrush current limit may be programmed as follows:
Choose inrush current limit, for example I
= 1A
CL
Calculate
I
SINK
×
SENSECL
=
=
k5
m5.12A1
×
k5
RI
If the Circuit Breaker function is disabled by setting R then I
= 0A. However, in this example we assume that the
SINK
Circuit Breaker function is enabled and therefore use I
A5.2
µ=
SENSE
SENSE
= 2.5µA.
SINK
= 0Ω.
= 0Ω,
HV302 / HV312
Calculate C2 (feedback capacitor) discharge current
SINK2C
If Auto-Retry is disabled an adjustment must be made to I
V
R
DISABLE
t
I
AUTO
V4
==
M5.2
A6.1
µ=
Where Vt is the maximum threshold voltage of the MOSFET.
Therefore, the adjusted value of I
is:
C2
A9.5A6.1A5.2A10I
2C
IIA10I µ=
AUTOSINK2C
µ=µµµ=
In this example we assume that Auto-Retry is enabled and therefore use I
= 7.5µA.
C2
Note that
Since V
dv
across C
dt
is fixed and V
IN
2C
LOAD
=
×=I and
dt
is constant during limiting, then
RAMP
dv
across C2 as they share a common node
dt
C
LOADCL
dv
2C
and their other terminals are at fixed voltages during inrush current
I
I
limiting. Therefore,
CL2C
= or
C
2C
LOAD
2
=C .
As previously calculated and by conservation of charge on RAMP node I
=7.5µA based on the chosen inrush current limit of I
C2
Given that C
=100µF the required value for C2 can be
LOAD
calculated.
CI
×
Therefore
2
LOAD2C
=C
=
I
CL
µ×µ
A1
Note that during initial power application the RAMP pin is voltage protected by the capacitive AC voltage divider consisting of C C2 and C
and the GATE pin is internally clamped.
RAMP
Servo Control Mode Operation
The circuit breaker will trip in less than 5µs when the voltage on
the SENSE pin is raised 100mV above the V the sense resistor may be calculated from the following equation:
V
R ==
SENSE
CB-SENSE
I
100mV
I
CBCB
For a 2A circuit breaker:
R
SENSE
100mV
2A
50m
==
The power rating of the sense resistor must be greater than or equal to I
x V
CB
SENSE-CB
.
A5.7A5.2A10IA10I
µ=µµ=µ=
C2
dv
×=I
dt
CI
×
LOAD2C
I
CL
F100A5.7
nF75.0
=
pin and the value of
EE
=1A.
CL
LOAD
,
7 Rev. D 04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
Page 8
Design Information-
continued
The inrush current limit can be calculated as follows:
I ==
CL
V
CL-SENSE
R
50mV
R
SENSESENSE
Thus the inrush current limit for a 2A circuit breaker:
50mV
I
CL
50m
1A
==
Compensation components from gate to source of the external MOSFET may be required to reduce peaking of the inrush current.
Compensation can be accomplished as follows:
1. Start with a 2nF capacitor from gate to source.
2. Increase capacitor value up to 10nF if needed.
3. If needed, add a 1k resistor in series with the above
capacitor.
Servo Mode Timing
HV302 / HV312
The timing functions are defined by the following equations:
C
START
t
RISE
These equations assume that the load is purely capacitive and the following definitions apply.
C
is the external capacitor connected to the RAMP pin.
RAMP
I
is the output current from the RAMP pin, nominally
RAMP
10µA, when the voltage drop on R
V
is the internally regulated supply voltage and can range
INT
from 9V to 11V.
V
is the gate threshold voltage of the external pass
GS(th)
transistor and may be obtained from its datasheet.
V
is the external pass transistor gate-source voltage
GS(limit)
required to obtain the limit current. It is dependent on the pass transistor’s characteristics and may be obtained from the transfer characteristics on the transistor datasheet.
g
is the transconductance of the external pass transistor and
fs
may be obtained from its datasheet.
is the internal feedback resistor and is nominally 5KΩ.
R
FB
I
is the load current when the voltage drop on R
LIMIT
resistor is 50mV.
These equations may be used to calculate the minimum value of C
for the most critical system performance characteristics.
RAMP
For maximum contact bounce duration protection choose a value for t
and use the following equation:
POR
C
RAMP
If control of PWRGD active delay is the critical system parameter, then choose a value for t
C
RAMP
RAMP
4.2t =
I
RAMP
C
RAMP
Vt =
)th(GSTH
I
RAMP
ttt +=
THSTARTPOR
C
RAMP
I
RAMP
g
fs
 
C
Vt
INLIMIT
()
=
=
LOAD
I
LIMIT
+
I9.0
LIMIT
It
×
RAMPPOR
V4.2
PWRGD-A
×
R
SENSE
 
R
FB
C
RAMP
2.1VVt =
)LIMIT(GSINTAPWRGD
SENSE
)it(limGS
I
RAMP
resistor is zero.
and use the following equation:
It
RAMPAPWRGD
2.1VV
)it(limGSINT
SENSE
8 Rev. D 04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
Page 9
HV302 / HV312
Design Information - continued
Start up Overload Protection
Start up must be achieved within a nominal 100ms as indicated by the PWRGD-A pin transition to the active state or the circuit will reset and an Auto-Retry will initiate. If there is an output overload or short circuit during start up, the circuit will be in current limit mode for the 100ms time limit (in servo mode). In feedback capacitor mode the circuit breaker will shutdown the MOSFET before 100ms.
Circuit Breaker Delay
The circuit breaker will trip in less than 5µs when the voltage on
the SENSE pin reaches a nominal 100mV. A resistor in series with the SENSE pin and a capacitor connected between the SENSE and VEE pins may be added to delay the rate of voltage rise on the SENSE pin, thus permitting a current overshoot and delaying Circuit Breaker activation. This method is particularly useful when operating in Feedback Capacitor Mode. However, in Servo Mode operation it will result in a current limit leading edge overshoot.
Auto-Retry and Auto-Retry Disable
The Auto-Retry delay time is directly proportional to the capacitance at the RAMP pin. Auto-Retry sequence is activated whenever the 100ms timeout is reached during start up or the Circuit Breaker is tripped.
Auto-Retry can be approximated as a 555-timer with 2.5µA charge
up and charge down currents through 8V, to a count of 256.
Therefore,
25682
For C
t ×
= 10nF
RAMP
t
tryReAuto
××
=
=
C
RAMPtryReAuto
A5.2
µ
25682
××
A5.2
µ
s4.16nF10
=×
Due to the 2.5µA maximum charge current a resistor which draws more than 2.5µA below 8V will disable Auto-Retry. Try to keep this resistor as big as possible, e.g. 2.5M. For most MOSFETs with maximum Vt of 4V, this will vary the 10µA RAMP current source by
only
V4 M5.2
A6.1
µ=
PWRGD Flag Delay Programming
Shortly after current limiting ends, PWRGD-A becomes active indicating successful completion of the Hotswap operation. PWRGD-B will change to an active state a programmed delay time after PWRGD-A went active, PWRGD-C will change to an active state a programmed delay time after PWRGD-B went active and PWRGD-D will change to an active state a programmed delay time after PWRGD-C went active. Resistors connected from the respective TB, TC and TD pins to V
pin are used to program the
EE
delay times between the PWRGD flags sequentially going active.
9 Rev. D 04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
The following waveforms demonstrate the sequencing of the PWRGD flags. These results were obtained with R
= 60k and R
= 3k
TD
= 120kΩ, R
TB
The value of the resistors determines the capacitor charging and discharging current of a triangle wave oscillator. The oscillator output is fed to an 8-bit counter to generate the desired time delay.
The respective delay time is defined by the following equation:
VC2255
×××
t
=
TX
I
CD
PPOSC
and
V
bg
I =
CD
R4
TX
Where t C V I
= Delay Time between respective PWRGD flags
TX
= 120pF (Internal oscillator capacitor)
OSC
= 8.2V (Peak-to-Peak voltage swing of oscillator)
PP
= Charge and Discharge current of oscillator
CD
Vbg = 1.2V (Internal Band Gap Reference) R
= Programming resistor at TB, TC or TD pin
TX
Combining the above two equations and solving for R
yields:
TX
tB
×
R
=
TX
TXbg
=
VC2040
××
PPPP
tV2.1
×
TX
V2.8pF1202040
××
6
TX
t106.0R ××=
TX
For a delay time of 200ms we get:
()( )
TX
36
=×××=
k12010200106.0R
For a delay time of 5ms we get:
()()
TX
36
=×××=
k3105106.0R
TC
Page 10
Design Information - continued
Supported External Pass Devices
The HV302 and HV312 are designed to support N-Channel MOSFETs and IGBTs.
Selection of External Pass Devices
The R allowable voltage drop at maximum load (I Hotswap action has been completed. Thus the required continuous power dissipation rating (P determined from the following equation:
The peak power rating (P current level, which is always the circuit breaker trip set point (I and on the assumption that a output is shorted. The peak power rating may be calculated from the following equation:
Given these values an external pass transistor may be selected from the manufacturers data sheet.

Paralleling External Pass Transistors

Due to variations in threshold voltages and transconductance characteristics between samples of MOSFETs, reliable 50% current sharing is not achievable. Some measure of paralleling may be accomplished by adding resistors in series with the source of each device; however, it will cause increased voltage drop and power dissipation.
Paralleling of external Pass devices is not recommended!
If a sufficiently high current rated external pass transistor cannot be found then increased current capability may be achieved by connecting independent Hotswap circuits in parallel, since they act as current sources during the load capacitor charging time when the circuits are in current limit. For this application the HV302 with active high PWRGD is recommended where the PWRGD pins of multiple Hotswap circuits can be connected in a wired OR configuration.
Kelvin Connection to Sense Resistor
Physical layout of the printed circuit board is critical for correct current sensing. Ideally trace routing between the current sense resistor and the V as possible with zero current in the sense traces. The use of Kelvin connection from SENSE pin and V ends of the current sense resistor is recommended.
of the device is likely to be selected based on
DS(ON)
) of the device can be
CONT
2
IRP ×=
)ON(DSCONT
PEAK
IVP ×=
CBINPEAK
and SENSE pins should be direct and as short
EE
To Negative Terminal of Power Source
)MAX(LOAD
) should be based on the highest
pin to the respective
EE
To
To
SENSE
VEE
Pin
Pin
Sense Resistor
LOAD(MAX)
To Source of MOSFET
) after the
),
CB
HV302 / HV312
10 Rev. D 04/17/02
Supertex, Inc. 1235 Bordeaux Drive, Sunnyvale, CA 94089 TEL: (408) 744-0100 Fax: (408) 222-4895 www.supertex.com
Loading...