Datasheet FAN2513S285X, FAN2513S27X, FAN2513S26X, FAN2513S25X, FAN2512SX Datasheet (Fairchild Semiconductor)

www.fairchildsemi.com

FAN2512, FAN2513

150 mA CMOS LDO Regulators with Fast Start Enable

Features

• Ultra Low Power Consumption

• Enable optimized for CDMA time phases

• 150 mV dropout voltage at 150 mA

• 25 µA ground current at 150 mA

• Enable/Shutdown Control

• SOT23-5 package

• Thermal limiting

• 300 mA peak current

Applications

• Cellular Phones and accessories

•PDAs

• Portable cameras and video recorders

• Laptop, notebook and palmtop computers

Description

The F AN2512/13 family of micropower lo w-dropout v oltage
regulators utilize CMOS technology to offer a new level of
cost-effective performance in GSM, TDMA, and CDMA
cellular handsets, Laptop and Notebook portable computers,
and other portable devices. Features include extremely low
power consumption and low shutdown current, low dropout
voltage, exceptional loop stability able to accommodate a

Block Diagrams

EN

V

IN

Bandgap

Error
Amplifier

p

V

OUT

ADJ

wide variety of external capacitors, and the compact SOT23-5
surface-mount package. In addition, the F AN2512/13 f amily
offer the fast power-cycle time required in CDMA handset
applications. These products offer significant improvements
over older BiCMOS designs and are pin-compatible with
many popular devices. The output is thermally protected
against overload.

The FAN2512 and FAN2513 devices are distinguished by
the assignment of pin 4:

FAN2512: pin 4 – ADJ, allowing the user to adjust the

output voltage over a wide range using an external voltage
divider.

FAN2512-XX: pin 4 – BYP, to which a bypass capacitor

may be connected for optimal noise performance. Output
voltage is fixed, indicated by the suffix XX.

FAN2513-XX: pin 4 – ERR

, a flag which indicates that the
output voltage has dropped below the specified minimum
due to a fault condition.

The standard fixed output voltages available are 2.5V, 2.6V,

2.7V, 2.8V , 2.85V, 3.0V , and 3.3V. Custom output voltage are
also available: please contact your local Fairchild Sales
Office for information.

EN

V

IN

Bandgap

Error
Amplifier

p

BYP

V

OUT

FAN2512

Thermal

Sense

GND

V

IN

Bandgap

FAN2513-XX

FAN2512-XX

EN

Error
Amplifier

Thermal

Sense

Thermal

Sense

ERR

p

V

OUT

GND

GND

REV. 1.1.7 2/14/03

0:

1:

0:

. 1:

PRODUCT SPECIFICATION FAN2512/FAN2513

Pin Assignments

15

V

IN

V

OUT

EN

2

3

4

ADJ/BYP/ERR

GND

Pin No. FAN2512 FAN2512-XX FAN2513-XX

1. V

IN

V

IN

2. GND GND GND

3. EN EN EN

4. ADJ BYP ERR

5. V

OUT

V

OUT

Pin Descriptions

Pin Name Pin No. Type Pin Function Description

ADJ 4 Input

BYP 4 Passive

ERR 4 Open drain FAN2513-XX Error. Error flag output.

EN 3 Digital Input Enable.

V

V

IN

OUT

1 Power in
5 Power out

GND 2 Power

FAN2512 Adjust. Ratio of potential divider from VOUT to ADJ

determines output voltage.

FAN2512-XX Bypass. Connect 470 pF capacitor for noise reduction.

Output voltage < 95% of nominal.
Output voltage > 95% of nominal.

Shutdown V
Enable V

OUT

OUT

.

Voltage Input. Supply voltage input.
Voltage Output. Regulated output voltage.
Ground.

V

V

OUT

IN

Functional Description

Designed utilizing CMOS process technology, the
FAN2512/13 family of products are carefully optimized for
use in compact battery-powered devices, offering a unique
combination of low power consumption, extremely low
dropout voltages, high tolerance for a variety of output
capacitors, and the ability to disable the output to less than
1µA under user control. In the circuit, a difference amplifier
controls the current through a series-pass P-Channel
MOSFET, comparing the load voltage at the output with an
onboard low-drift bandgap reference. The series resistance
of the pass P-Channel MOSFET is approximately 1 Ω , result­ing in an unusually low dropout voltage under load when
compared to older bipolar pass-transistor designs.

2

Protection circuitry is provided onboard for overload condi­tions. In conditions where the device reaches temperatures
exceeding the specified maximums, an onboard circuit shuts
down the output, where it remains suspended until it has
cooled before re-enabling. The user is also free to shut down
the device using the Enable control pin at any time.

Careful design of the output regulator amplifier assures loop
stability over a wide range of ESR values in the external
output capacitor. A wide range of values and types can be
accommodated, allowing the user to select a capacitor
meeting his space, cost, and performance requirements,
and enjoy reliable operation over temperature, load, and
tolerance variations.

REV. 1.1.7 2/14/03

3

FAN2512/FAN2513 PRODUCT SPECIFICATION

An Enable pin, available on all devices, allows the user to
shut down the regulator output to conserve power, reducing
supply current to less than 1µA. The output can then be
re-Enabled within 500µSec, fulfilling the fast power-c ycling
needs of CDMA applications. Depending on the model
selected, other control and status functions are available at
pin 4 to enhance the operation of the device. The adjustable­voltage versions utilize pin 4 to connect to an external
voltage divider which feeds back to the regulator error
amplifier, thereby setting the voltage as desired. Two other
functions are available in the fixed-voltage versions: in
noise-sensitive applications, an external Bypass capacitor
connection is provided that allows the user to achieve opti­mal noise performance at the output, while the Error output
functions as a diagnostic flag to indicate that the output
voltage has dropped more than 5% below the nominal fixed
voltage.

Applications Information

External Capacitors – Selection

The FAN2512/13 allows the user to utilize a wide variety of
capacitors compared to other LDO products. An innovative
design approach offers significantly reduced sensitivity to
ESR (Effective Series Resistance), which de grades re gulator
loop stability in older designs. While the improvements fea­tured in the FAN2512/13 family greatly simplify the design
task, capacitor quality still must be considered if the designer
is to achieve optimal circuit performance. In general,
ceramic capacitors offer superior ESR performance, at a
lower cost and a smaller case size than tantalums. Those with
X7R or Y5Vdielectric offer the best temperature coefficient
characteristics. The combination of tolerance and variation
over temperature in some capacitor types can result in signif­icant variations, resulting in unstable performance over rated
conditions.

Input Capacitor

An input capacitor of 2.2µF (nominal value) or greater,
connected between the Input pin and Ground, located in
close proximity to the device, will improve transient
response and noise rejection. Higher values will offer supe­rior input ripple rejection and transient response. An input
capacitor is recommended when the input source, either a
battery or a regulated AC voltage, is located far from the
device. Any good quality ceramic, tantalum, or metal film
capacitor will give acceptable performance, however tanta­lum capacitors with a surge current rating appropriate to the
application must be selected to avoid catastrophic failure.

Output Capacitor

An output capacitor is required to maintain regulator loop
stability. Unlik e many other LDO regulators, the FAN2512/13
family of products are nearly insensitive to output capacitor
ESR. Stable operation will be achieved with a wide variety
of capacitors with ESR values ranging from 10m Ω to 10 Ω or

more. Tantalum or aluminum electrolytic, or multilayer
ceramic types can all be used. A nominal value of at least
1µF is recommended.

Bypass Capacitor (FAN2512 Only)

In the fixed-voltage configuration, connecting a capacitor
between the bypass pin and ground can significantly reduce
noise on the output. Values ranging from 470pF to 10nF can
be used, depending on the sensitivity to output noise in the
application.

At the high-impedance Bypass pin, care must be taken in the
circuit layout to minimize noise pickup, and capacitors must
be selected to minimize current loading (leakage). Noise
pickup from external sources can be considerable. Leakage
currents into the Bypass pin will directly affect regulator
accuracy and should be kept as low as possible; thus, high­quality ceramic and film types are recommended for their
low leakage characteristics. Cost-sensitive applications not
concerned with noise can omit this capacitor.

Control Functions

Enable Pin

Applying a voltage of 0.4V or less at the Enable pin will dis­able the output, reducing the quiescent output current to less
than 1µA, while a voltage of 2.0V or greater will enable the
device. If this shutdown function is not needed, the pin can
simply be connected to the V
will cause erratic operation.

Error Flag (FAN2513 Only)

To indicate conditions such as input voltage dropout
(low V

), overheating, or overloading (excessive output

IN

current), the ERR pin indicates a fault condition. It is an
open-drain output which is HIGH when the voltage at V
is greater than 95% of the nominal rated output voltage and
LOW when V

is less than 95% or the rated output volt-

OUT

age, as specified in the error trip level characteristics.

A logic pullup resistor of 100K Ω is recommended at this
output. The pin can be left disconnected if unused.

Thermal Protection

The FAN2512/13 is designed to supply high peak output
currents of up to 1A for brief periods, however this output
load will cause the device temperature to increase and
exceed maximum ratings due to power dissipation. During
output overload conditions, when the die temperature
exceeds the shutdown limit temperature of 150°C, onboard
thermal protection will disable the output until the tempera­ture drops below this limit, at which point the output is then
re-enabled. During a thermal shutdown situation the user
may assert the power-down function at the Enable pin,
reducing power consumption to the minimum level I

pin. Allo wing this pin to float

IN

GND

OUT

.

REV. 1.1.7 2/14/03

PRODUCT SPECIFICATION FAN2512/FAN2513

Thermal Characteristics

The FAN2512/13 is designed to supply 150mA at the speci­fied output voltage with an operating die (junction) tempera­ture of up to 125°C. Once the power dissipation and thermal
resistance is known, the maximum junction temperature of
the device can be calculated. While the power dissipation is
calculated from known electrical parameters, the thermal
resistance is a result of the thermal characteristics of the
compact SOT23-5 surface-mount package and the surround­ing PC Board copper to which it is mounted.

The power dissipation is equal to the product of the input-to­output voltage differential and the output current plus the
ground current multiplied by the input voltage, or:

P

VINV

D

The ground pin current I

–()I

OUT

OUTVIN

can be found in the charts

GND

provided in the Electrical Characteristics section.

The relationship describing the thermal behavior of the
package is:

T



J max()TA

-------------------------------

P

=

D max()



θ



JA

I

+=

GND

–

device to enter a thermal cycling loop, in which the circuit
enters a shutdown condition, cools, re-enables, and then
again overheats and shuts down repeatedly due to an
unmanaged fault condition.

Operation of Adjustable Version

The adjustable version of the FAN2512/13 includes an input
pin ADJ which allows the user to select an output voltage
ranging from 1.32V to near V
divider . The voltage V

ADJ

the onboard error amplifier which adjusts the output voltage
until V

is equal to the onboard bandgap reference voltage

ADJ

of 1.32V(typ). The equation is:

V

OUT

1.32V 1

The total value of the resistor chain should not exceed
250K Ω total to keep the error amplifier biased during
no-load conditions. Programming output voltages very near
V

need to allow for the magnitude and variation of the

IN

dropout voltage V

over load, supply, and temperature

DO

variations. Note that the low-leakage FET input to the
CMOS Error Amplifier induces no bias current error to the
calculation.

, using an external resistor

IN

presented to the ADJ pin is fed to

R

upper

--------------- -+×=
R

lower

where T
ture of the die, which is 125°C, and T
ing temperature. θ
board layout and can be empirically obtained. While the θ

is the maximum allowable junction tempera-

J(max)

is dependent on the surrounding PC

JA

is the ambient operat-

A

JC

(junction-to-case) of the SOT23-5 package is specified at
130°C /W, the θ

of the minimum PWB footprint will be at

JA

least 235°C /W. This can be improved upon by providing a
heat sink of surrounding copper ground on the PWB.
Depending on the size of the copper area, the resulting θ

JA

can range from approximately 180°C /W for one square inch
to nearly 130°C /W for 4 square inches. The addition of
backside copper with through-holes, stiffeners, and other
enhancements can also aid in reducing this value. The heat
contributed by the dissipation of other devices located
nearby must be included in design considerations.

Once the limiting parameters in these two relationships have
been determined, the design can be modified to ensure that
the device remains within specified operating conditions. If
overload conditions are not considered, it is possible for the

General PWB Layout Considerations

T o achieve the full performance of the device, careful circuit
layout and grounding technique must be observed. Establish­ing a small local ground, to which the GND pin, the output
and bypass capacitors are connected, is recommended, while
the input capacitor should be grounded to the main ground
plane. The quiet local ground is then routed back to the main
ground plane using feedthrough vias. In general, the high­frequency compensation components (input, bypass, and
output capacitors) should be located as close to the device as
possible. The proximity of the output capacitor is especially
important to achieve optimal noise compensation from the
onboard error amplifier, especially during high load condi­tions. A lar ge copper area in the local ground will provide the
heat sinking discussed above when high power dissipation
significantly increases the temperature of the device.
Component-side copper provides significantly better thermal
performance for this surface-mount device, compared to that
obtained when using only copper planes on the underside.

4

REV. 1.1.7 2/14/03

FAN2512/FAN2513 PRODUCT SPECIFICATION

Absolute Maximum Ratings

(beyond which the device may be damaged)

1

Parameter Min Typ Max Unit
Power Supply Voltages

V

(Measured to GND) 0 7 V

IN

Enable Input (EN)

Applied voltage (Measured to GND)

2

07V

ERR Output

Applied voltage (Measured to GND)

2

07V

Power

Dissipation

3

Internally limited

Temperature

Junction -65 150 °C
Lead Soldering (5 seconds) 260 °C
Storage -65 150 °C
Electrostatic Discharge

Notes:

1. Functional operation under any of these conditions is NOT implied. Performance and reliability are guaranteed only
if Operating Conditions are not exceeded.

2. Applied voltage must be current limited to specified range.

3. Based upon thermally limited junction temperature:

4

4kV

T

–

J max()TA

P

-------------------------------=

D

4. Human Body Model is 4kV minimum using Mil Std. 883E, method 3015.7. Machine Model is 400V minimum using JEDEC
method A115-A.

Θ

JA

Recommended Operating Conditions

Parameter Min Nom Max Units

V

V
V

V

θ

θ

IN

EN

ERR

T

JA
JC

Input Voltage Range 2.7 6.5 V
Output Voltage Range, Adjustable Vref V

O

Enable Input Voltage 0 V
ERR

Flag Voltage V

Junction Temperature -40 +125 °C

J

–V

IN

DO
IN
IN

Thermal resistance 220 °C/W
Thermal resistance 130 °C/W

V
V
V

REV. 1.1.7 2/14/03

5

PRODUCT SPECIFICATION FAN2512/FAN2513

Electrical Characteristics (Notes 1, 2)

Symbol Parameter Conditions Min. Typ. Max. Units

Regulator

V

DO

∆V

O

V

DO

3

∆V

O

I

GND

Protection

I

GSD

T

SH

E

TL

Enable Input

V

IL

V

IH

I

IH

I

I

Drop Out Voltage I

= 100 µA 2.5 4 mV

OUT

I

= 50 mA 50 75 mV

OUT

I

= 100 mA 100 140 mV

OUT

I

= 150 mA 150 180 mV

OUT

Output Voltage Accuracy -2 2 %
Reference Voltage Accuracy, Adjustable Mode 1.24 1.32 1.40 V
Output Voltage Accuracy, Adjustable Mode -6 6 %
Ground Pin Current I

= 150 mA 50 µA

OUT

Current Limit Thermally Protected
Shut-Down Current EN = 0V 1 µA
Thermal Protection Shutdown Temperature 150 °C
ERR Trip Level FAN2513 only 90 95 99 %

Logic Low Voltage 1.2 0.4 V
Logic High Voltage 2.0 1.4 V
Input Current High 1 µA
Input Current Low 1 µA

Switching Characteristics (Notes 1, 2)

Parameter Conditions Min. Typ. Max. Unit

Enable Input

4

Response time 500 µsec

Error Flag (FAN2513-XX)

Response time 3 msec

Performance Characteristics (Notes 1, 2)

Symbol Parameter Conditions Min. Typ. Max. Units

∆V

/∆V

OUT

∆V

OUT/VOUT

e

N

IN

PSRR Power Supply Rejection 120 Hz,

Notes:

1. Unless otherwise stated, T

2. Bold values indicate -40 ≤ T

3. The adjustable version, has a bandgap voltage range of 1.24V to 1.40V with a nominal value of 1.32V.

4. When using repeated cycling.

Line regulation VIN = (V
Load regulation I

OUT

OUT

= 0.1 to 150mA 1.0 2.0 %

Output noise 10Hz–1KHz

C

= 10µF,

OUT

= 0.01µF

C

BYP

>10KHz,
C

= 10µF,

OUT

C

= 0.01µF

BYP

= 10µF,

C

OUT

C

= 0.01µF

BYP

= 25°C, VIN = V

A

≤ 125°C.

J

OUT

+ 1V, I

= 100µA, VIH > 2.0 V.

OUT

+ 1) to 6.5V 0.3 % / V

<7

µV/

<0.01

43 dB

Hz

6 REV. 1.1.7 2/14/03

FAN2512/FAN2513 PRODUCT SPECIFICATION

Typical Performance Characteristics

100

I

OUT

C

80

60

40

PSRR (dB)

20

0

10

100

I

OUT

C

80

60

40

PSRR (dB)

20

0

10

Power Supply Power Supply Power Supply

Rejection Ratio

= 100µA

= 1.0µF Cer.

OUT

100

PSRR (dB)

VIN = 4.0V
V

= 3.0V

OUT

1k

100

10k

100k

1M

10M

I

OUT

C

80

60

40

20

0

10

Rejection Ratio

= 10mA

= 1.0µF Cer.

OUT

VIN = 4.0V
V

OUT

1k

100

10k

= 3.0V

100k

1M

10M

100

I

OUT

C

80

OUT

60

40

PSRR (dB)

20

0

10

Rejection Ratio

= 100mA

= 1.0µF Cer.

VIN = 4.0V
V

1k

100

Frequency (Hz) Frequency (Hz) Frequency (Hz)

I

OUT

C

OUT

80

C

BYP

60

40

20

0

10

Power Supply

Rejection Ratio

= 10mA

= 10µF Cer.
= 0.01µF

1k

100

Frequency (Hz)

Power Supply Power Supply

Rejection Ratio

= 150mA

= 1.0µF Cer.

OUT

VIN = 4.0V
V

OUT

100

= 3.0V

PSRR (dB)

I

OUT

C

80

C

60

40

Rejection Ratio

= 100µA

= 10µF Cer.

OUT

= 0.01µF

BYP

20

100

1k

10k

100k

1M

10M

0

10

100

1k

Frequency (Hz) Frequency (Hz)

10k

VIN = 4.0V
V

= 3.0V

OUT

1M

100k

100

PSRR (dB)

10M

OUT

= 3.0V

10k

10k

100k

VIN = 4.0V

= 3.0V

V

OUT

100k

1M

1M

10M

10M

Power Supply

I

OUT

C

80

C

60

40

Rejection Ratio

= 100mA

= 10µF Cer.

OUT

= 0.01µF

BYP

VIN = 4.0V
V

= 3.0V

OUT

100

PSRR (dB)

20

0

10

100

1k

10k

100k

1M

10M

Frequency (Hz)

Rejection Ratio vs. Voltage Drop

Power Supply

70
60

I

= 10mA

OUT

50
40
30

PSRR (dB)

20
10

0

100µA

100mA

C

= 10µF Cer.

150mA

OUT

3.0 3.6 4.1

Voltage (V)

100

80

60

40

PSRR (dB)

20

10

0.1

0.01

Noise (µV/ Hz)

0.001

0.0001

Power Supply

Rejection Ratio

I

= 150mA

OUT

= 10µF Cer.

C

OUT

C

= 0.01µF

BYP

0

10

100

1k

Frequency (Hz)

Noise Performance

1

C

= 1.0µF

OUT

= 0.01µF

C

BYP

I

= 10µA

L

100

1k

Frequency (Hz)

10

10k

VIN = 4.0V
V

OUT

100k

VIN = 4V
V

OUT

10k

= 3.0V

= 3V

100k

1M

10M

1M

Power Supply

Rejection Ratio vs. Voltage Drop

70
60

I

= 100µA

OUT

50

10mA

40
30

PSRR (dB)

20
10

0

3.0 3.6 4.1

100mA

150mA

C

OUT

= 1.0µF Cer.

Voltage (V)

Ground Pin Current

30.00

VIN = 4V
V

= 3V

OUT

10

1

Load Current (mA)

Quiescent Current (µA)

28.00

26.00

24.00

22.00

20.00

0.1

100

REV. 1.1.7 2/14/03 7

PRODUCT SPECIFICATION FAN2512/FAN2513

Typical Performance Characteristics (continued)

Quiescent Current (µA)

Ground Pin Current

35.00

30.00

25.00

20.00

15.00

10.00

5.00

0.00

3.0

Ground Pin Current

75

V

IN

V

OUT

I

= 150mA

L

50

25

Quiescent Current (µA)

0

-40

4.0

5.0

Input Voltage (V)

= 4V

= 3V

0

40

Temperature (°C)

V
I

OUT

OUT

= 3V

= 100µA

6.0

80

7.0

125

Ground Pin Current

35.00

30.00

25.00

20.00

15.00

10.00

Quiescent Current (µA)

5.00

0.00

3.0

4.0

Input Voltage (V)

150.00

Dropout Voltage

120.00

90.00

60.00

Dropout Voltage (mV)

30.00

0.00
25

0.1

Output Current (mA)

Ground Pin Current

75

V

= 4V

IN

V

= 3V

OUT

I

= 100µA

L

50

25

V

= 3V

5.0

I

OUT

OUT

= 150mA

6.0

7.0

Quiescent Current (µA)

0

0

-40

40

125

80

Temperature (°C)

Dropout Characteristics

3.5

3.0
V

= 3V

OUT

2.5

R

= 30KΩ

OUT

2.0

1.5

R

= 20Ω

OUT

1.0

Output Voltage (V)

0.5

50

100 125 150

75

0.0

0.0 1.0

2.0

3.0

4.0

5.0

Input Voltage (V)

Dropout Voltage

8

6

4

I

= 100µA

2

Dropout Voltage (mV)

0

-40

L

0

40

125

80

Temperature (°C)

Functional Characteristics

Enable Pin Delay

Enable

(1V/div)

Enable Voltage

(1V/div)

Output Voltage

V

OUT

Time (20µs/div)

Dropout Voltage

200

150

100

50

Dropout Voltage (mV)

0

0

-40

Temperature (°C)

I

= 150mA

L

40

125

80

(1V/div)

Disable Voltage

(1V/div)

Output Voltage

Disable

V

OUT

Output Voltage

2.95

2.9

2.85

3

-40

vs. Temperature

0

Temperature (°C)

3.05

Output Voltage (V)

Shutdown Delay

Time (20µs/div)

V

= 4V

IN

Typical 3V device
I

= 100µA

L

40

80

125

8 REV. 1.1.7 2/14/03

FAN2512/FAN2513 PRODUCT SPECIFICATION

Mechanical Dimensions

5-Lead SOT-23-5 (S) Package

Symbol

A .035 .057
A1 .000 .006
B .008
c .003 .010
D .106 .122
E .059 .071
e
e1
H .087 .126
L

α

B

Inches

Min. Max. Min. Max.

.020

.037 BSC
.075 BSC

.004 .024 .10 .60

0° 10°

e

Millimeters

.90 1.45
.00 .15
.20
.08 .25

2.70 3.10

1.50 1.80

2.20 3.20

0° 10°

E

.50

.95 BSC

1.90 BSC

H

Notes

Notes:

1.

Package outline exclusive of mold flash & metal burr.

2.

Package outline exclusive of solder plating.

3.

EIAJ Ref Number SC-74A.

L

e1

D

A

A1

c

REV. 1.1.7 2/14/03 9

PRODUCT SPECIFICATION FAN2512/FAN2513

Ordering Information

Product Number V

OUT

Pin 4 Function Package Marking

FAN2512SX Adj. Adjust AJA
FAN2512S25X 2.5 Bypass AJE
FAN2512S26X 2.6 Bypass AJG
FAN2512S27X 2.7 Bypass AJJ
FAN2512S28X 2.8 Bypass AJM
FAN2512S285X 2.85 Bypass AJN
FAN2512S30X 3.0 Bypass AJW
FAN2512S33X 3.3 Bypass AJ3
FAN2513S25X 2.5 Error output AKE
FAN2513S26X 2.6 Error output AKG
FAN2513S27X 2.7 Error output AKJ
FAN2513S28X 2.8 Error output AKM
FAN2513S285X 2.85 Error output AKN
FAN2513S30X 3.0 Error output AKW
FAN2513S33X 3.3 Error output AK3

Tape and Reel Information

Quantity Reel Size Width

3000 7" 8mm

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:

1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.

2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.

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2/14/03 0.0m 005

 2000 Fairchild Semiconductor Corporation

Stock#DS30002512