Datasheet 3SK295 Datasheet (HIT)

Page 1
Silicon N-Channel Dual Gate MOS FET
Application
UHF RF amplifier
Features
Low noise figure.
Capable of low voltage operation
Outline
3SK295
ADE-208-387
1st. Edition
MPAK-4
2
3
1
4
1. Source
2. Gate1
3. Gate2
4. Drain
Page 2
3SK295
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate 1 to source voltage V Gate 2 to source voltage V Drain current I
DS
G1S
G2S
D
Channel power dissipation Pch 150 mW Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Attention: This device is very sensitive to electro static discharge.
It is recommended to adopt appropriate cautions when handling this transistor.
12 V
±8V ±8V
25 mA
2
Page 3
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source breakdown
V
(BR)DSX
voltage Gate 1 to source breakdown
V
(BR)G1SS
voltage Gate 2 to source breakdown
V
(BR) G2SS
voltage Gate 1 cutoff current I Gate 2 cutoff current I Drain current I
Gate 1 to source cutoff voltage V
Gate 2 to source cutoff voltage V
G1SS
G2SS
DS(on)
G1S(off)
G2S(off)
Forward transfer admittance |yfs| 16 20.8 mS V
Input capacitance Ciss 1.2 1.5 2.2 pF V
Output capacitance Coss 0.6 0.9 1.2 pF Reverse transfer capacitance Crss 0.01 0.03 pF Power gain PG 16 19.5 dB V
Noise figure NF 2.0 3 dB Note: Marking is “ZQ–”
12 V ID = 200 µA , V
V
= –3 V
G2S
±8— —V IG1 = ±10 µA, V
±8— —V IG2 = ±10 µA, V
——±100 nA V ——±100 nA V
0.5 10 mA V
–0.5 +0.5 V V
0 +1.0 V V
= ±6 V, V
G1S
= ±6 V, V
G2S
= 6 V, V
DS
V
= 3 V
G2S
= 10 V, V
DS
I
= 100 µA
D
= 10 V, V
DS
I
= 100 µA
D
= 6 V, V
DS
I
= 10 mA, f = 1 kHz
D
= 6 V, V
DS
I
= 10 mA, f = 1 MHz
D
= 4 V, V
DS
I
= 10 mA, f = 900 MHz
D
G1S
G2S
G1S
G2S
G2S
G2S
G2S
G1S
= 0.5V,
= 3V,
= 3V,
= 3V,
3SK295
= –3 V,
G1S
= VDS = 0
G2S
= VDS = 0
G1S
= VDS = 0 = VDS = 0
= 3V,
= 3V,
3
Page 4
3SK295
Maximum Channel Power
Dissipation Curve
200
150
100
50
Channel Power Dissipation Pch (mW)
0 50 100 150 200
Ambient Temperature Ta (°C)
Drain Current vs. Gate1 to Source Voltage
20
16
3.0 V
2.5 V
2.0 V
V = 6 V
DS
Pulse test
Typical Output Characteristics
20
V = 3 V
G2S
1.2 V
Pulse test
16
1.0 V
D
12
0.8 V
8
0.6 V
4
Drain current I (mA)
V = 0.4 V
G1S
0246810
Drain to source voltage V (V)
DS
Drain Current vs. Gate2 to Source Voltage
20
16
2.0 V
1.5 V
V = 6 V
DS
Pulse test
1.5 V
D
12
8
1.0 V
4
Drain current I (mA)
V = 0.5 V
G2S
0
12345
Gate1 to source voltage V (V)
G1S
D
12
8
V = 0.5 V
4
Drain current I (mA)
0
12345
G1S
Gate2 to source voltage V (V)
1.0 V
G2S
4
Page 5
3SK295
Forward Transfer Admittance vs.
Gate1 to Source Voltage
30
V = 6 V
DS
f = 1 kHz
fs
24
|y | (mS)
V = 3.0 V
18
12
6
1.0 V
0.5 V
Forward transfer admittance
0
0.4 0.8 1.2 1.6
Gate1 to source voltage V (V)
Noise Figure vs. Drain Current
5
4
G2S
2.0 V
1.5 V
V = 4 V
DS
V = 3 V
G2S
f = 900 MHz
G1S
2.5 V
2.0
Power Gain vs. Drain Current
25
20
15
10
Power gain PG (dB)
5
V = 4 V
DS
V = 3 V
G2S
f = 900 MHz
0
12 510
Drain current I (mA)
D
Power Gain vs. Drain to Source Voltage
25
20
20
3
2
Noise figure NF (dB)
1
0
12 510
Drain current I (mA)
D
20
15
10
Power gain PG (dB)
5
0
2468
Drain to source voltage V (V)
V = 3 V
G2S
I = 10 mA
D
f = 900 MHz
DS
10
5
Page 6
3SK295
Noise Figure vs. Drain to Source Voltage
5
4
3
2
Noise figure NF (dB)
V = 3 V
1
0
2468
Drain to source voltage V (V)
G2S
I = 10 mA
D
f = 900 MHz
10
DS
6
Page 7
3SK295
S11 Parameter vs. Frequency
1
.8
.6
.4
.2
0
–.2
.2
–.4
Condition:
.6
.4
–.6
1.0
.8
–.8
–1
V = 4 V , V = 3 V
DS
I = 10 mA , Zo = 50
D
100 to 1000 MHz (50 MHz step)
S12 Parameter vs. Frequency
120°
150°
180°
–150°
–120°
Condition:
100 to 1000 MHz (50 MHz step)
V = 4 V , V = 3 V I = 10 mA , Zo = 50
–90° DS
D
90°
1.5
1.5
234
–1.5
G2S
2
3
4
5
10
10
5
–10
–5
–4
–3
–2
Scale: 0.002/ div.
60°
30°
–30°
–60°
G2S
S21 Parameter vs. Frequency
Scale: 0.5 / div.
180°
150°
–150°
120°
–120°
Condition:
90°
–90°
V = 4 V , V = 3 V
DS
I = 10 mA , Zo = 50
D
60°
30°
0°
–30°
–60°
G2S
100 to 1000 MHz (50 MHz step)
S22 Parameter vs. Frequency
1
.8
.6
.4
.2
0°
0
–.2
.2
–.4
Condition:
.6
.4
.8
–.6
–.8
–1
V = 4 V , V = 3 V
DS
I = 10 mA , Zo = 50
D
100 to 1000 MHz (50 MHz step)
1.0
1.5
1.5
234
–1.5
G2S
2
3
4
5
10
10
5
–10
–5
–4
–3
–2
7
Page 8
3SK295
S Parameter (VDS = 4 V, V
Freq. S11 S21 S12 S22 (MHz) MAG. ANG. MAG. ANG. MAG. ANG. MAG. ANG.
100 0.999 –6.1 1.98 172.2 0.00094 79.2 0.989 –4.2 150 0.998 –9.1 1.97 168.4 0.00189 80.4 0.987 –6.1 200 0.992 –11.9 1.96 165.0 0.00230 79.5 0.986 –7.9 250 0.988 –14.8 1.96 161.0 0.00286 79.9 0.984 –9.8 300 0.985 –17.9 1.94 157.1 0.00364 75.2 0.981 –11.5 350 0.976 –20.6 1.92 153.7 0.00353 71.8 0.978 –13.4 400 0.971 –23.2 1.91 149.9 0.00419 70.7 0.975 –15.2 450 0.964 –26.3 1.88 146.8 0.00495 65.5 0.972 –17.2 500 0.961 –29.1 1.87 142.8 0.00509 62.7 0.968 –19.1 550 0.951 –32.2 1.86 139.4 0.00530 66.6 0.963 –20.8 600 0.949 –35.0 1.86 136.1 0.00550 63.8 0.960 –22.8 650 0.935 –37.6 1.81 132.9 0.00601 58.2 0.956 –24.5 700 0.933 –40.5 1.78 129.4 0.00582 60.6 0.950 –26.3 750 0.923 –42.9 1.77 125.7 0.00572 58.5 0.945 –28.0 800 0.916 –45.8 1.75 122.6 0.00553 56.3 0.941 –29.9 850 0.908 –49.0 1.72 119.1 0.00514 56.3 0.936 –31.7 900 0.900 –51.2 1.70 115.8 0.00543 52.9 0.930 –33.4 950 0.890 –54.0 1.67 112.6 0.00506 52.4 0.924 –35.2 1000 0.876 –56.4 1.65 109.3 0.00469 51.9 0.919 –37.0
= 3 V, ID = 10 mA, ZO = 50 )
G2S
8
Page 9
0.4
+ 0.1 – 0.05
2.95 ± 0.2
1.9 ± 0.2
0.95 0.95
0.4
+ 0.1
– 0.05
0.65
0.16
+ 0.1 – 0.06
Unit: mm
0.4
+ 0.1 – 0.05
0.95
1.8 ± 0.2
0.85
0.6
+ 0.1 – 0.05
0.3
+ 0.2
1.1
1.5 ± 0.15
0.65
– 0.1
+ 0.2
– 0.6
2.8
Hitachi Code JEDEC EIAJ Weight
0 – 0.1
(reference value)
MPAK-4 — Conforms
0.013 g
Page 10
Cautions
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4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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