Datasheet 3SK186 Datasheet (HIT)

Page 1
Silicon N-Channel Dual Gate MOS FET
Application
UHF TV tuner RF amplifier
Outline
3SK186
2
3
1
4
1. Source
2. Gate1
3. Gate2
4. Drain
Page 2
3SK186
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate 1 to source voltage V Gate 2 to source voltage V Drain current I
DS
G1S
G2S
D
Channel power dissipation Pch 150 mW Channel temperature Tch 125 °C Storage temperature Tstg –55 to +125 °C
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test conditions
Drain to source breakdown
V
(BR)DSX
voltage Gate 1 to source breakdown
V
(BR)G1SS
voltage Gate 2 to source breakdown
V
(BR) G2SS
voltage Gate 1 cutoff current I Gate 2 cutoff current I Gate 1 to source cutoff voltage V
Gate 2 to source cutoff voltage V
Drain current I
G1SS
G2SS
G1S(off)
G2S(off)
DSS
Forward transfer admittance |yfs|15——mSV
Input capacitance Ciss — 1.7 2.2 pF V
Output capacitance Coss — 1.0 1.4 pF Reverse transfer capacitance Crss — 0.017 0.03 pF Power gain PG 16 19 — dB V
Noise figure NF — 3.0 4.5 dB Note: Marking is “FI–”.
12 — — V V
±10 — — V IG1 = ±10 µA, V
±10 — — V IG2 = ±10 µA, V
——±100 nA V ——±100 nA V +0.5 — –0.8 V V
+0.5 — –0.8 V V
0—4mAV
12 V
±10 V ±10 V
35 mA
= V
G2S
= ±8 V, V = ±8 V, V
= 6 V, V
= 6 V, V
= 6 V, V = 6 V, V
= 6 V, V
= 4 V, V
= –5 V,
G2S
G1S
G2S
G2S
G2S
G2S
G1S
I
= 200 µA
D
G1S
G2S
DS
I
= 100 µA
D
DS
I
= 100 µA
D
DS
DS
I
= 10 mA, f = 1 kHz
D
DS
I
= 10 mA, f = 1 MHz
D
DS
I
= 10 mA, f = 900 MHz
D
G2S
G1S
= 3V,
= 3V,
= 3V, V = 3V,
= 3V,
= 3V,
= VDS = 0
G2S
= VDS = 0
G1S
= VDS = 0 = VDS = 0
G1S
= 0
2
Page 3
3SK186
Maximum Channel Power
Dissipation Curve
300
(mW)
ch
200
100
Channel Power Dissipation P
0
50 100 150
Ambient Temperature Ta (°C)
Drain Current vs. Gate 1
to Source Voltage
20
16
(mA)
D
12
VDS = 4 V
3
2
8
2.5
1.0
1.5
Typical Output Characteristics
20
1.6
1.4
1.2
16
(mA)
D
12
8
Drain Current I
4
02 6 10
48
Drain to Source Voltage V
1.0
V
0.8
0.6
0.4
0.2
P
ch
= 150 mW
= 3 V
G2S
V
= 0 V
G1S
(V)
DS
Drain Current vs. Gate 2
to Source Voltage
20
16
(mA)
D
12
1.75
VDS = 4 V
1.5
1.25
1.0
0.75
8
Drain Current I
4
0
0–0.8 1.6 3.20.8 2.4
Gate 1 to Source Voltage V
V
G2S
= 0.5 V
G1S
(V)
Drain Current I
4
0.5
0.25
0 0.8 2.4 4.01.6 3.2
Gate 2 to Source Voltage V
V
G1S
G2S
= 0
(V)
3
Page 4
3SK186
20
(mS)
fs
16
Forward Transfer Admittance vs.
Gate 1 to Source Voltage
VDS = 6 V
3
2.5
2.0
Power Gain vs. Drain Current
20
16
12
8
4
Forward Transfer Admittance y
0
0 0.8 1.60.4–0.4 1.2
Gate 1 to Source Voltage V
1.5
1.0
V
= 0.5 V
G2S
(V)
G1S
Noise Figure vs. Drain Current
10
8
6
4
Noise Figure NF (dB)
2
12
8
V
= 4 V
Power Gain PG (dB)
4
DS
V
= 3 V
G2S
f = 900 MHz
02 6 1048
V
= 4 V
DS
V
= 3 V
G2S
f = 900 MHz
Drain Current I
(mA)
D
02 6 1048
Drain Current I
(mA)
D
4
Page 5
0.4
+ 0.1 – 0.05
2.95 ± 0.2
1.9 ± 0.2
0.95 0.95
0.4
+ 0.1
– 0.05
0.65
0.16
+ 0.1 – 0.06
Unit: mm
0.4
+ 0.1 – 0.05
0.95
1.8 ± 0.2
0.85
0.6
+ 0.1 – 0.05
0.3
+ 0.2
1.1
1.5 ± 0.15
0.65
– 0.1
+ 0.2
2.8
– 0.6
Hitachi Code JEDEC EIAJ Weight
(reference value)
0 – 0.1
MPAK-4 — Conforms
0.013 g
Page 6
Cautions
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2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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