Bosch DVA-16K User Manual
RAID Subsystem DVA-16K
DVA-16K SCSI Premium Series
en Installation Manual
RAID Subsystem DVA-16K | Installation Manual Table of Contents | en 3
Table of Contents
1 Warnings and Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 Warning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.2 Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.3 Certifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 Best Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3.1 Avoiding Points of Failure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3.2 Dual-Redundant Data Paths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3.3 ID Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4 Enclosure Chassis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4.1 Chassis Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4.2 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.4.3 Front Panel Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.4.4 Hard Drive Numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4.5 Rear Panel Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4.6 Backplane Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.5 Subsystem Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.5.1 LCD Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.5.2 Drive Trays. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.5.3 The RAID Controller Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5.4 Controller Module Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5.5 DIMM Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.5.6 Battery Backup Unit (BBU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.5.7 Power Supply Units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.5.8 Cooling Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.6 Subsystem Monitoring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.6.1 I
2.6.2 LED Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.6.3 Firmware (FW) and Bosch RAIDWatch GUI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.6.4 Audible Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.7 Hot-swappable Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.7.1 Hot-swap Capabilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.7.2 Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.7.3 Normalized Airflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2
C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3 Hardware Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.2 Installation Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3 Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.3.1 Precautions and Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.3.2 Static-free Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.4 General Installation Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.4.1 Installation Procedure Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.5 Unpacking the Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.6 Rack/Cabinet Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.7 Drive Tray Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Bosch Security System F.01U.027.799 | V2 | 2008.08
4 en | Table of Contents RAID Subsystem DVA-16K | Installation Manual
4 Subsystem Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.1 Subsystem Monitoring Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.2 Status Indicating LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.2.1 Brief Overview of the LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.2.2 LCD Panel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.2.3 Drive Tray LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.2.4 Controller Module LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.2.5 LAN Port LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.2.6 BBU Module LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.2.7 PSU LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.2.8 Cooling Module LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.3 Audible Alarm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.3.1 Default Threshold Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.3.2 Failed Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.4 Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5 Subsystem Connection and Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.1 SCSI Connection Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.1.1 SCSI Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.1.2 SCSI Port on the Controller Rear Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.1.3 SCSI Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.2 Host Connection Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.2.1 Single Host . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.2.2 Dual Hosts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.3 Daisy Chain. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.3.1 Daisy Chain Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.3.2 Daisy Chain Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.4 Power On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.4.1 Check List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.4.2 Power On Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.4.3 Power On Status Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.4.4 LCD Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.5 Power Off Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
6 Subsystem Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
6.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
6.1.1 About Subsystem Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
6.1.2 General Notes on Component Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
6.2 Replacing Controller Module Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.2.1 Controller Module Maintenance Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.2.2 Removing the Controller Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.2.3 Replacing the Controller Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.3 DIMM Module Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
6.3.1 DIMM Module Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
6.3.2 DIMM Module Replacement Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
6.4 Replacing a Faulty BBU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.4.1 BBU Warnings and Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.4.2 Procedure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.5 Replacing a Faulty PSU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.5.1 PSU Module Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.5.2 Replacing the PSU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.6 Cooling Module Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.6.1 Cooling Module Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.6.2 Replacing a Cooling Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.7 Replacing a Failed Hard Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6.7.1 Hard Drive Maintenance Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6.7.2 Replacing a Hard Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
F.01U.027.799 | V2 | 2008.08 Bosch Security System
RAID Subsystem DVA-16K | Installation Manual Table of Contents | en 5
7 Appendix: Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
7.1 Technical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
7.2 Controller Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
7.3 Drive Tray Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
7.4 Power Supply Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
7.5 Cooling Module Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
7.6 RAID Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
7.7 Fault Tolerance Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
8 Appendix: Spare Parts and Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
8.1 Spare Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
8.2 Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
9 Appendix: Pin Outs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
9.1 VHDCI SCSI Port Pin Outs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
9.2 DB9 Audio Jack Pin Outs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
9.3 DB9 Audio Jack UPS Cable Pin Outs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
9.4 Null Modem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
9.5 Ethernet Port Pin Outs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
9.6 Main Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
10 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Bosch Security System F.01U.027.799 | V2 | 2008.08
6 en | Warnings and Certifications RAID Subsystem DVA-16K | Installation Manual
1 Warnings and Certifications
1.1 Warning
• A shielded power cord is required in order to meet FCC emission limits and also to pre-
vent interference with nearby radio and television reception.
• Use only shielded cables to connect I/O devices to this equipment. You are cautioned
that changes or modifications not expressly approved by the party responsible for compliance could void your authority to operate the equipment.
1.2 Safety Precautions
Precautions and Instructions
• Prior to powering on the subsystem, ensure that the correct power range is being used.
• The subsystem comes with 16 drive bays. Leaving any of these drive bays empty will
greatly affect the efficiency of the airflow within the enclosure, and will consequently
lead to the system overheating, which can cause irreparable damage.
• If a module fails, leave it in place until you have a replacement unit and you are ready to
replace it.
• Airflow Consideration: The subsystem requires an airflow clearance, especially at the
front and rear.
• Handle subsystem modules using the retention screws, eject levers, and the metal
frames/face plates. Avoid touching PCB boards and connector pins.
• To comply with safety, emission, or thermal requirements, none of the covers or replace-
able modules should be removed. Make sure that all enclosure modules and covers are
securely in place during operation.
• Be sure that the rack cabinet into which the subsystem chassis will be installed provides
sufficient ventilation channels and airflow circulation around the subsystem.
• Provide a soft, clean surface to place your subsystem on before working on it. Servicing
on a rough surface may damage the exterior of the chassis.
• If it is necessary to transport the subsystem, repackage all drives and replaceable mod-
ules separately.
• Dual redundant controller models come with two controller modules that must be
installed into the subsystem. Single controller modules come with a single controller
module and a metal sheet is placed over the lower controller bay at the rear of the subsystem. Since single controller modules cannot be upgraded, this metal sheet should
NEVER be removed.
ESD Precautions
Observe all conventional anti-ESD methods while handling system modules. The use of a
grounded wrist strap and an anti-static work pad are recommended. Avoid dust and debris in
your work area.
F.01U.027.799 | V2 | 2008.08 Bosch Security System
RAID Subsystem DVA-16K | Installation Manual Warnings and Certifications | en 7
1.3 Certifications
FCC (applies in the U.S. and Canada)
FCC Class B Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules (47 CFR, Part 2, Part 15 and CISPR PUB. 22
Class B). These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with
this user’s manual, may cause harmful interference to radio communications. However, there
is no guarantee that interference will not occur in a particular installation. If this equipment
does cause harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, you are encouraged to try to correct the interference by one
or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of FCC Rules. Operation is subject to the following two conditions: 1) this device may not cause harmful interference, and 2) this device must accept any
interference received, including interference that may cause undesired operation.
This device is in conformity with the EMC.
CB (Certified Worldwide)
This device meets the requirements of the CB standard for electrical equipment with regard to
establishing a satisfactory level of safety for persons using the device and for the area surrounding the apparatus. This standard covers only safety aspects of the above apparatus; it
does not cover other matters, such as style or performance.
Bosch Security System F.01U.027.799 | V2 | 2008.08
8 en | Introduction RAID Subsystem DVA-16K | Installation Manual
2 Introduction
This manual covers the DVA-16K series of RAID subsystems.
The 3U profile, SCSI-320 to SATA-II, RAID subsystem is capable of a high-performance storage
operation that has been specifically designed to meet the rapidly changing demands and
needs of today’s storage networks. The RAID subsystem is rigorous and durable that can be
easily configured and operated.
Fully featured RAID redundancy provides advanced data protection and ensures that the complete range of RAID levels 0, 1(0+1), 3, 5, 10, 30, 50 and JBOD are supported. Complete system redundancy, through fully redundant data paths and hot-swappable devices ensures the
overall protection of data. A long list of sophisticated firmware functions (multi-subsystem
configuration, dedicated/ global hot-spares, battery protected disk cache, automatic background rebuild, online drive expansion, intelligent drive handling, media scan, task-scheduler,
remote and real-time subsystem monitoring, and more). Further the system guarantees the
overall availability of valuable data.
System integrators, using the RAID series, will be able to rapidly develop SCSI-320 solutions.
This will help save both development time and the associated R&D costs, providing a competitive edge in the marketplace. For users, the modular nature of the series minimizes the total
management cost of building a large storage network with a RAID subsystem.
The enhanced 3U RAID storage subsystem chassis is a 3U metal chassis divided into front and
rear sections, which are respectively accessed through front and rear panels. Pre-drilled
mounting holes in the sides of the 3U RAID subsystem enclosure allow you to attach separately purchased slide rails so that you can install the enclosure into a rack or cabinet. The
modular design of the active components facilitates their easy installation and removal. Hotswap mechanisms are incorporated to eliminate power surges and signal glitches that might
happen while removing or installing these modules.
2.1 Product Overview
This manual introduces the SCSI-320 to SATA-II RAID subsystem shown in Figure 2.1.
Fig. 2.1 RAID Subsystem
The RAID subsystem comes with two (2) 320MB/second SCSI (SCSI-320) host channels. This
high-density subsystem supports up to sixteen (16) hot swappable, SATA-II hard drives in a 3U
profile. The core of the subsystem is the RAID controller board with the ASIC266 and a preinstalled 256MB DDR RAM DIMM module with support for capacities up to 1GB. The new
SCSI-320 host channel features packet protocol, and its reduction in command overhead provide increased speed without bandwidth issues.
The metal container in which the controller board is pre-installed is referred to as the “controller module.” The controller module is comprised of a PCB board, a rear faceplate, and a
metal canister. The controller module is accessed through the rear of the RAID subsystem. A
battery backup unit (BBU) is installed in the upper left side of the controller module when
viewed from the rear of the subsystem. The BBU is also accessible and hot swappable through
the rear panel of the RAID subsystem.
F.01U.027.799 | V2 | 2008.08 Bosch Security System
RAID Subsystem DVA-16K | Installation Manual Introduction | en 9
i
Two (2) dual-stacked VHDCI SCSI connectors connect the RAID controller to single or dual
hosts and cascade external devices. Two (2) hot-swappable cooling modules protect the subsystem from overheating, and two (2) hot-swappable power supply unit (PSU) modules provide constant power to the subsystem. The modular nature of the subsystem and the easy
accessibility to all major components ensure the ease of the subsystem maintenance.
NOTICE!
On receiving and unpacking your subsystem, please check the package contents against the
included Unpacking Checklist. If any modules are missing, please contact your subsystem vendor immediately.
2.2 Management
The RAID subsystem can be managed using either the firmware or the Bosch RAIDWatch webbased GUI. The firmware can be accessed by using either the LCD panel (see Figure 2.2)
located at the front of the subsystem or a terminal emulation program installed on an external
computer and connected to the COM1 on the controller module’s rear panel (see Figure 2.2)
with the provided serial cable.
Fig. 2.2 Controller Module Rear Panel
If web-based management is desired, connecting the subsystem to the world wide web
through the Ethernet port on the controller module’s rear panel, (See Figure 2.2) allows you to
manage the RAID subsystem by Bosch RAIDWatch management software.
Bosch Security System F.01U.027.799 | V2 | 2008.08
10 en | Introduction RAID Subsystem DVA-16K | Installation Manual
i
2.3 Best Practices
2.3.1 Avoiding Points of Failure
To achieve maximum uptime when connecting a RAID subsystem into a storage environment,
it is imperative that points-of-failure are avoided. The best way to avoid them is through the
use of redundant components. As stated above, the cooling modules and PSU modules on the
subsystem are fully redundant. Using dual-redundant data paths will further minimize the possibility of system downtime.
2.3.2 Dual-Redundant Data Paths
When connecting the RAID subsystem to a server, dual-redundant data paths are recommended. If one (1) data path fails, a second data path can be used to transmit data. Dualredundant data paths are supported by both the host and drive channels.
2.3.3 ID Mapping
Host ID mapping is flexible, in the sense that the same array can be associated with different
host ID/LUNs, allowing the host clustering configurations. Drives on different channels can
then be grouped into an array, and the array has its unique volume size, stripe size, and optimization mode. Arrays of different RAID levels can be striped together into logical volumes,
making management of huge volume size an easier task.
2.4 Enclosure Chassis
2.4.1 Chassis Overview
The RAID storage subsystem chassis is an enhanced 3U metal chassis divided into front and
rear sections, which are respectively accessed through front (see Figure 2.4) and rear (see
Figure 2.6) panels. Pre-drilled mounting holes in the sides of the 3U RAID subsystem enclosure
allow you to attach separately purchased slide rails so that you can install the enclosure into a
rack or cabinet.
NOTICE!
Components accessed through the front panel are referred to as “Front Panel Components”
and components accessed through the rear panel are referred to as “Rear Panel Components.”
F.01U.027.799 | V2 | 2008.08 Bosch Security System
RAID Subsystem DVA-16K | Installation Manual Introduction | en 11
Fig. 2.3 RAID subsystem Overview
2.4.2 Physical Dimensions
The RAID subsystem comes in an enhanced 3U chassis with the following dimensions:
• With handles: 482.6mm x 131mm x 504.3mm (width x height x depth)
• Without handles: 445mm x 130mm x 488.2mm (width x height x depth)
2.4.3 Front Panel Overview
The front section of the subsystem features a 4 x 4 layout for sixteen (16) 3.5-inch drives. The
two (2) handles on the front of the subsystem enable you to easily insert/extract the chassis
into/from a rack or cabinet. The LCD panel on the left handle provides an easy way for you to
monitor and configure your subsystem.
The front panel of the RAID subsystem described in this manual is shown in Figure 2.4. A
description of each front panel component is given below:
Fig. 2.4 RAID subsystem Front View
The front panel shown in Figure 2.4 accommodates the following components:
• Drive bays with drive tray canisters: The drive bays house the hard drives.
• Right handle and left handle with LCD panel: The subsystem has right and left handles for
easier rackmounting and handling. The LCD panel shows system information and can be
used to configure and monitor the RAID subsystem. (Please refer to Section 2.5.1 LCD
Panel)
Bosch Security System F.01U.027.799 | V2 | 2008.08
12 en | Introduction RAID Subsystem DVA-16K | Installation Manual
2.4.4 Hard Drive Numbering
The front panel of the RAID subsystem enclosure houses sixteen (16) hard drives in a 4x4 configuration as shown in Figure 2.5. When viewed from the front, the drive bays (slots) are numbered 1 to 16 from left to right, from top to bottom.
Fig. 2.5 Hard Drive Numbering
2.4.5 Rear Panel Overview
The rear section of RAID subsystem is accessed through the rear panel and is reserved for a
single RAID controller module, one (1) BBU, two (2) power supply units (PSUs) and two (2)
cooling modules.
The rear panel of the RAID subsystem described in this manual is shown in Figure 2.6. A
description of each rear panel component is given below:
Fig. 2.6 RAID subsystem Rear View
The rear panel shown in Figure 2.6 accommodates the following components:
• RAID controller module: A controller board and a DDR RAM DIMM module are housed in
the controller module to provide the system RAID functionalities. (See Section 2.5.3 The
RAID Controller Module)
• BBU: A BBU sustains cache memory during a power shortage to prevent data loss. (See
Section 2.5.6 Battery Backup Unit (BBU))
• PSUs: The hot-swappable PSUs provide power to the subsystem. A power switch is
located on the right of each PSU to turn the system on and off. (See Section 2.5.7 Power
Supply Units)
• Cooling modules: The redundant cooling modules ventilate the subsystem to reduce the
temperature within the subsystem. (See Section 2.5.8 Cooling Modules)
• Dummy plate: This device is a single controller subsystem. The only controller module is
installed in the upper controller bay. A dummy plate covers the lower controller bay at
the rear of the subsystem.
2.4.6 Backplane Board
Internal backplane boards separate the front and rear sections of the RAID subsystem. The
PCB board provide logic level signals and low voltage power paths. They contain no user-serviceable components.
F.01U.027.799 | V2 | 2008.08 Bosch Security System
RAID Subsystem DVA-16K | Installation Manual Introduction | en 13
2.5 Subsystem Components
The RAID subsystem houses many active components and most of them can be accessed
through either the front or rear panel. The modular design of the active components facilitates
their easy installation and removal. Hot-swap mechanisms are incorporated to eliminate
power surges and signal glitches that might occur while removing or installing these modules.
2.5.1 LCD Panel
Fig. 2.7 LCD Panel
The LCD panel shown in Figure 2.7 consists of a 16x2-character LCD screen with push buttons
and LED status indicators. The LCD front panel provides full access to all RAID configuration
settings and monitoring functions. After powering up the subsystem, the initial screen will
show the subsystem model name. A different name may be assigned for the system or different arrays. This will enable easier identification in a topology with numerous arrays.
2.5.2 Drive Trays
Fig. 2.8 Drive Tray Front View
The RAID subsystem comes with sixteen (16) drive trays (See Figure 2.8) designed to accommodate separately purchased standard 1-inch pitch, 3.5-inch disk drives. The drive bays are
easily accessible from the front of the enclosure. Two (2) LEDs on the front of the tray indicate the drive status. A key-lock on each drive tray secures the hard drive in place, while an
easily accessible button ensures fast and efficient drive hot-swapping.
CAUTION!
Be careful not to warp, twist, or contort the drive tray in any way (e.g., by dropping it or resting heavy objects on it). The drive tray has been customized to fit into the drive bays in the
RAID subsystem. If the drive bay superstructure is deformed or altered, the drive trays may
not fit into the drive bay.
Bosch Security System F.01U.027.799 | V2 | 2008.08
14 en | Introduction RAID Subsystem DVA-16K | Installation Manual
2.5.3 The RAID Controller Module
The RAID controller module contains a main circuit board, a preinstalled 256MB capacity or
above DDR RAM DIMM module and the controller module interfaces. The controller module
contains no user-serviceable components. Except when installing/upgrading the cache memory inside, the controller module should never be removed or opened.
CAUTION!
Although the RAID controller can be removed, the only time you should touch the controller
itself is to install the memory modules. The RAID controller is built of sensitive components
and unnecessary tampering can damage the controller.
The heart of the RAID controller subsystem is the 320MB per second SCSI-to-SATA controller
board. The controller comes with two (2) pre-set SCSI-320 host channels, CH0 and CH1. The
subsystem connects to the host through a VHDCI SCSI input connector, while the output connector is ready to connect external devices. (See Figure 2.9)
The docking connector at the rear of the controller board is used to connect the controller
module to the backplane board. A DDR RAM DIMM socket is strategically placed in an easily
accessible location on the controller board for easy insertion of the DDR RAM DIMM module.
2.5.4 Controller Module Interfaces
All external interfaces that connect to external devices are located on the controller module
rear panel shown in Figure 2.9. The interfaces are listed below.
Fig. 2.9 Controller Module Interfaces
• Host Ports: Two (2) SCSI-320 host channels (CH0 and CH1 in Figure 2.9) connect the
subsystem to the host through two (2) dual-stacked VHDCI SCSI connectors.
• Ethernet Ports: A single 10/100BaseT Ethernet port (located next to COM2) is used for
remote management through the network.
• COM ports: The controller module comes with two (2) COM ports. One port is used to
access the controller-embedded configuration utility through the network, and the other
connects to a UPS connection. .
• Levers: Two (2) levers located in the sides of the controller board rear panel provide easy
controller module installation and secure the controller module in place.
F.01U.027.799 | V2 | 2008.08 Bosch Security System
RAID Subsystem DVA-16K | Installation Manual Introduction | en 15
2.5.5 DIMM Module
The controller module comes with a pre-installed 256MB capacity or above DDR RAM DIMM
module and can support capacities up to 1GB. The DIMM module is placed in an easily
accessed location on the controller board. However, when the DIMM module is being
changed, the controller module must be removed from the subsystem chassis.
2.5.6 Battery Backup Unit (BBU)
The Li-ION battery backup unit (BBU) (see Figure 2.11) sustains cache memory after a power
failure. It is installed on the upper left side of the controller module in the rear subsystem
chassis.
Fig. 2.10 BBU Module
In accordance with international transportation regulations, the BBU is only charged to
between 35% and 45% of its total capacity when shipped. Therefore, after powering on the
subsystem (see Section 5.4 Power On) the BBU must be charged to its full capacity. It normally
requires approximately twelve (12) hours for the battery to be fully charged. If the battery is
not fully charged after twelve (12) hours, there is a problem with the BBU and you should contact your subsystem vendor immediately. While the battery is being charged, the LED on the
BBU rear panel and the fifth LED on the rear panel of the controller module will flash slowly.
(See Section 4.2.6 BBU Module LED for details on the LED indicators.) You can check the status of the battery’s charge via Bosch RAIDWatch or the firmware.
2.5.7 Power Supply Units
The RAID subsystem is equipped with two (2) redundant, hot-swappable, 460W PSUs, which
are located at the rear of the enclosure. (See Figure 2.6) The PSU is permanently mounted
into a 2U (dual-level) bracket especially designed to house both the PSU and a cooling module, which is mounted in the lower part of the 2U bracket. Hot-swapping the PSU requires the
removal of the cooling module.
As shown in Figure 2.11, each PSU comes with a single power socket for power cord plug-in,
and a power switch on the right to turn the subsystem on and off. Two (2) embedded cooling
fans provide sufficient airflow to keep the PSU cool. A single LED indicates the PSU status.
When any power supply failure occurs, such as over-voltage or fan failure, the LED shines red.
A handle at the back of the PSU has been especially designed to enable you to remove the
PSU from the subsystem while the subsystem is online. This should only be done if the PSU
has failed and needs to be replaced.
A retention screw at the top of the PSU module secures the PSU to the enclosure. To remove
the PSU, the retention screw must be removed first. When installing a new PSU module, make
sure that the retention screw has been firmly secured.
Bosch Security System F.01U.027.799 | V2 | 2008.08
16 en | Introduction RAID Subsystem DVA-16K | Installation Manual
Fig. 2.11 PSU Module
For the PSU specifications, please refer to Section 7 Appendix: Specifications.
2.5.8 Cooling Modules
The RAID subsystem is equipped with two (2) 1U, dual-fan, redundant, hot-swappable cooling
modules. They are installed in the cooling module slots located in the lower section of the
PSU modules (see Figure 2.12.) The two (2) 9.7cm fans housed in each cooling module provide two (2) fan speeds. When the subsystem is running in normal ambient temperature, the
fans operate at the lower speed. When the temperature reaches the temperature threshold,
the fans automatically change to high speed to generate more cooling air from the front to the
rear of the subsystem to extract the heat generated by the hard drives.
Cooling module specifications are listed in Section 7 Appendix: Specifications.
Fig. 2.12 Cooling Module
F.01U.027.799 | V2 | 2008.08 Bosch Security System
RAID Subsystem DVA-16K | Installation Manual Introduction | en 17
2.6 Subsystem Monitoring
The RAID subsystem comes with a number of different monitoring methods that provide you
with continual updates on the status of the system and individual components. The following
monitoring features are included in the subsystem.
2.6.1 I2C bus
The following elements are interfaced to the RAID controller over a non-user-serviceable I2C
bus:
• PSU modules
• Cooling modules
• Temperature sensors (for the temperature of the backplane board and controller board)
2.6.2 LED Indicators
The following active components come with LEDs to indicate the status of the individual component:
• RAID controller (5 LEDs)
• LCD panel (3 LEDs)
• BBU (2 LEDs)
• Cooling modules (2 LEDs)
• PSU modules (1 LED)
• Drive trays (2 LEDs)
2.6.3 Firmware (FW) and Bosch RAIDWatch GUI
Firmware: The firmware is pre-installed software used to configure the subsystem. The latest
firmware functionalities include Task Scheduler, Intelligent Drive Handling, and Media Scan.
Media Scan handles low quality drives in both the degraded mode and during the rebuild process. Maintenance tasks will then be performed on an entire array or specific hard drives. Various options are user-configurable such as priority, start time, and execution internals.
Bosch RAIDWatch: Bosch RAIDWatch is a premier web-based graphics user interface (GUI)
that can be installed on a remote computer and accessed via the web. The manager communicates with the array via the connection of the existing host interface or Ethernet link to the
array’s LAN port.
2.6.4 Audible Alarms
The RAID subsystem comes with audible alarms that are triggered when certain active components fail or when certain (controller or subsystem) thresholds are exceeded. Whenever you
hear an audible alarm from the RAID subsystem, it is imperative that you determine the cause
and rectify the problem immediately.
Event notification messages indicate the completion or status of array configuration tasks and
are always accompanied by two (2) or three (3) successive and prolonged beeps.
CAUTION!
Failing to respond when an audible alarm is heard can lead to permanent damage of the RAID
subsystem. When an audible alarm is heard, rectify the problem as soon as possible.
Bosch Security System F.01U.027.799 | V2 | 2008.08
18 en | Introduction RAID Subsystem DVA-16K | Installation Manual
2.7 Hot-swappable Components
2.7.1 Hot-swap Capabilities
The RAID subsystem comes with a number of hot-swappable components. A hot-swap component is one that can be exchanged while the subsystem is still online without affecting the
operational integrity of the subsystem. These components should only be removed from the
subsystem when they are being replaced. At no other time should these components be
removed from the subsystem.
2.7.2 Components
The following components are hot-swappable:
• Power supply units (PSUs)
• Cooling modules
• BBU
• Hard drives
2.7.3 Normalized Airflow
Proper subsystem cooling is referred to as “normalized” airflow. Normalized airflow ensures
the sufficient cooling of the subsystem and is only attained when all components are properly
installed. Therefore, a failed component should only be hot-swapped when a replacement is
available. If a failed component is removed but not replaced, permanent damage to the subsystem can result.
F.01U.027.799 | V2 | 2008.08 Bosch Security System
RAID Subsystem DVA-16K | Installation Manual Hardware Installation | en 19
3 Hardware Installation
3.1 Introduction
This chapter gives detailed instructions on how to install the subsystem. When installing the
subsystem, it is necessary to install the controller module, hard drives, and drive trays. Installation into a rack or cabinet should occur before the hard drives or drive trays are installed
into the subsystem. Please confirm that you received all of the components listed on the
Unpacking List that came with the subsystem before proceeding with the installation process.
CAUTION!
Please note that the installation instructions described in this manual should be carefully followed to prevent any difficulties and damages to your system.
3.2 Installation Prerequisites
1. Static-free installation environment: The RAID subsystem must be installed in a static-free
environment to minimize the possibility of electrostatic discharge (ESD) damage. (See
Section 3.3.2 Static-free Installation)
2. Component check: Before installing the RAID subsystem, you should first check to see
that you have received all the required components. (See Section 3.5 Unpacking the Sub-
system) If any items appear damaged, contact your vendor for a replacement.
3. Hard drives: Up to sixteen (16) SATA-I or SATA-II hard drives must be purchased separately prior to the RAID subsystem installation.
4. Cabling: The RAID subsystem requires an external VHDCI to VHDCI SCSI round cable to
connect the subsystem to a host computer. Please see Section 5 Subsystem Connection
and Operation for sample topologies and configuration options.
5. Memory module: If you wish to change the pre-installed memory module, a separately
purchased module must be installed. (See Section 6.3 DIMM Module Replacement)
6. Rack installation: The enclosure chassis can be installed into rack cabinet using separately purchased mounting rails, rear-attached brackets, or Bosch’s slide rails. (See
Section 3.6 Rack/Cabinet Installation)
Bosch Security System F.01U.027.799 | V2 | 2008.08
20 en | Hardware Installation RAID Subsystem DVA-16K | Installation Manual
3.3 Safety Precautions
3.3.1 Precautions and Instructions
1. Be sure the correct power range (100-120 or 200-230VAC) is supplied by your rack cabinet or power outlet.
2. Thermal notice: All drive trays (even if they do not contain a hard drive) must be installed
into the enclosure. Leaving a drive bay or module slot open will greatly affect the airflow
efficiency within the enclosure, and will consequently lead to system overheating. Keep a
faulty module in place until you have a replacement unit and you are ready to replace it.
3. An enclosure without disk drives can weigh over 24 kilograms. Two (2) people are
required to install or relocate the subsystem. Drives should be removed from the enclosure before moving the subsystem.
4. Airflow considerations: The subsystem requires an airflow clearance especially on the
front and rear. For proper ventilation, a minimum of 2.5cm is required between the front
of the enclosure and rack cover; a minimum of 5cm is required between the enclosure
and end of the rack.
5. Handle the system modules by the retention screws, eject levers, or the module’s metal
frame/face plate only. Avoid touching the PCB boards and connector pins.
6. None of the covers or replaceable modules should be removed in order to maintain compliance with safety, emission, or thermal requirements.
7. Always secure every enclosure module by its retaining screws or make sure it is held in
place by its latches.
8. Always make sure the subsystem has a safe electrical earth connection via power cords
or chassis ground by the rack cabinet.
9. Be sure that the rack cabinet in which the subsystem chassis is to be installed provides
sufficient ventilation channels and airflow circulation around the subsystem.
10. Provide a soft, clean surface to place your enclosure on before working on it. Servicing
the enclosure on a rough surface may damage the finish of the chassis.
11. If it is necessary to transport the subsystem, repackage all drives and replaceable modules separately.
3.3.2 Static-free Installation
Static electricity can damage the system’s electronic components. To prevent ESD damage to
any of the components, follow these precautions before touching or handling them:
• Discharge the static electricity accumulated in your body by wearing an anti-static wrist-
band.
• Avoid carpets, plastic, vinyl, and Styrofoam in your work area.
• Handle all components by holding their edges or metal frames. Avoid touching the
exposed circuitry on PCB boards and connector pins.
F.01U.027.799 | V2 | 2008.08 Bosch Security System
RAID Subsystem DVA-16K | Installation Manual Hardware Installation | en 21
i
3.4 General Installation Procedure
Following all the instructions provided below can save subsystem installation time. Detailed,
illustrated instructions for each component are given in the following sections.
CAUTION!
To ensure that your system is correctly installed, please follow the steps outlined below. If you
follow these steps, installation will be fast and efficient. If you do not follow these steps, you
may accidentally install the hardware incorrectly.
1. Unpack: Unpack the subsystem and confirm that all the components on the packing list
have been included. (See Section 3.5 Unpacking the Subsystem)
2. Rack/Cabinet installation: If the subsystem is going to be installed in a rack or cabinet, it
should be installed prior to installing the hard drives. Installing the subsystem into a rack
or cabinet requires at least two (2) people. (See Section 3.6 Rack/Cabinet Installation)
3. Install drive trays: After the hard drives have been installed into the drive trays, the drive
trays must be installed into the enclosure itself. (See Section 3.7 Drive Tray Installation)
4. Cable connection: Use the power cables to connect the subsystem to the main power
source. Use the SCSI cable to connect a host port to the host computer or an external
device.
5. Power up: Once the components have been properly installed and all cables are properly
connected, you can power up the subsystem and configure the RAID array. (See
Section 5.4 Power On)
3.4.1 Installation Procedure Flowchart
Table 3.1 shows a flowchart of the installation procedure. As you complete each step, check
the “Done” box on the right. Please use this flowchart in conjunction with the instructions
that follow.
Step Installation Procedure Done
1 Unpack See Section 3.5 Unpacking the Subsystem
3 Rack/Cabinet Installation See Section 3.6 Rack/Cabinet Installation
5 Drive Tray Installation See Section 3.7 Drive Tray Installation
6 Cable Connection
7 Power On See Section 5.4 Power On
Table 3.1 Installation Procedure Flowchart
3.5 Unpacking the Subsystem
Use the Unpacking Checklist in your package to verify package contents. Carefully check the
items contained in each box before proceeding with installation.
NOTICE!
A detailed packing list can be found in your product shipping package or product CD.
Bosch Security System F.01U.027.799 | V2 | 2008.08
22 en | Hardware Installation RAID Subsystem DVA-16K | Installation Manual
3.6 Rack/Cabinet Installation
The RAID subsystem has been designed to fit into a standard cabinet or rack. Two (2) slide
rails are available for installing the subsystem into a rack or cabinet. Please contact your system vendor for further details. The subsystem should be installed in the rack or cabinet before
the hard drives and the drive trays are installed. If the drive trays with the associated hard
drives are installed, the subsystem will be too heavy to mount into a rack or cabinet. When
installing the subsystem into a rack or cabinet it is advisable that three people assist in the
mounting process.
To install the subsystem into a rack or cabinet please refer to the installation instructions that
came with the slide rails.
3.7 Drive Tray Installation
Once the hard drives have been installed in the drive trays, the drive trays can be installed into
the RAID subsystem.
CAUTION!
All drive trays must be installed into the enclosure even if they do not contain a hard drive. If
the trays are not installed into the enclosure, the ventilation required for cooling will not be
normalized and the subsystem will overheat.
1. Make sure the key-lock is in the unlocked position, i.e., the groove on its face is in a horizontal orientation. If the groove is in a vertical position, as shown in Figure 3.1, then the
key-lock is locked and the front flap on the drive tray cannot be opened.
Fig. 3.1 Front View of an Individual Drive Tray
2. Open the front flap on the drive tray. (See Figure 3.2) Push the button on the front of the
drive tray. The front flap will open in an upward direction.
Fig. 3.2 Drive Tray Front Flap
3. Align the drive tray with the slot in which you wish to insert it. Make sure that it is resting
on the rails inside the enclosure. Once the drive tray is lined up with the slot, gently slide
it in. This should be done smoothly and gently. (See Figure 3.3)
F.01U.027.799 | V2 | 2008.08 Bosch Security System
Loading...