8-bit Microcontroller with 16/32K bytes of ISP Flash and
USB Controller
DATASHEET SUMMARY
Features
• High Performance, Low Power AVR
®
8-Bit Microcontroller
• Advanced RISC Architecture
– 135 Powerful Instructions – Most Single Clock Cycle Execution
– 32 x 8 General Purpose Worki ng Re gisters
– Fully Static Operation
– Up to 16 MIPS Throughput at 16MHz
– On-Chip 2-cycle Multiplier
• Non-volatile Program and Data Memories
– 16/32KB of In-System Self-Programmable Flash
– 1.25/2.5KB Internal SRAM
– 512Bytes/1KB Internal EEPROM
– Write/Erase Cycles: 10,000 Flash/100,000 EEPROM
– Data retention: 20 years at 85C/ 100 years at 25C
– Optional Boot Code Section with Independent Lo ck Bits
In-System Programming by On-chip Boot Program
True Read-While-Write Operation
Parts using external XTAL clock are pre -programed with a default USB bootloader
– Programming Lock for Software Security
• JTAG (IEEE
– Boundary-scan Capabilities According to the JTAG Standard
– Extensive On-chip Debug Support
– Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface
®
std. 1149.1 compliant) Interface
(1)
• USB 2.0 Full-speed/Low Speed Device Module with Interrupt on Transfer Completion
– Complies fully with Universal Serial Bus Specification Rev 2.0
– Supports data transfer rates up to 12Mbit/s and 1.5Mbit/s
– Endpoint 0 for Control Transfers: up to 64-bytes
– Six Programmable Endpoints with IN or Out Directions and with Bulk, Interrupt or
Isochronous Transfers
– Configurable Endpoints size up to 256 bytes in double bank mode
– Fully independent 832 bytes USB DPRAM for endpoint memory allocation
– Suspend/Resume Interrupts
– CPU Reset possible on USB Bus Reset detection
– 48MHz from PLL for Full-speed Bus Operation
– USB Bus Connection/Disconnection on Microcontroller Request
– Crystal-less operation for Low Speed mode
• Peripheral Features
– On-chip PLL for USB and High Speed Timer: 32 up to 96MHz operation
– One 8-bit Timer/Counter with Separate Prescaler and Compare Mode
– Two 16-bit Timer/Counter with Separate Prescaler, Compare- and Capture Mode
– One 10-bit High-Speed Timer/Counter with PLL (64MHz) and Compare Mode
– Four 8-bit PWM Channels
– Four PWM Channels with Programmable Resolution from 2 to 16 Bits
– Six PWM Channels for High Speed Operation, with Programmable Resolution from 2 to 11 Bits
– Output Compare Modulator
– 12-channels, 10-bit ADC (features Differential Channels with Programmable Gain)
– Programmable Serial USART with Hardware Flow Control
– Master/Slave SPI Serial Interface
– Byte Oriented 2-wire Serial Interface
– Programmable Watchdog Timer with Separate On-chip Oscillator
– On-chip Analog Comparator
– Interrupt and Wa ke -u p on Pin Change
– On-chip Temperature Sensor
• Special Microcontroller Features
– Power-on Reset and Programmable Brown-out Detection
– Internal 8MHz Calibrated Oscillator
– Internal clock prescaler and On-the-fly Clock Switching (Int RC / Ext Osc)
– External and Internal Interrupt Sources
– Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby, and Extended Standby
P F 5 (AD C 5/TMS)P F 6 (AD C 6/TDO)P F 7 (AD C 7/TD
38
37
36
GND
ARE F
P F 0 (AD C 0)
P F 1 (AD C 1)
43
42
41
40
INDEX CORNER
AT mega 32U4
AT mega 16U4
44-pin QFN/TQFP
PD6 (T1/OC4D/ADC9)
26
PD4 (ICP1/ADC8)
25
AVCC
22
(X C K1/CT S) P D5
24
23
GND
(PDI/PCINT2/MOSI) PB2
PDO/PCINT3/MISO) PB3
10
11
12
PCI NT7/OC0 A/OC1C/RT S) PB7
13
RESET
14
VCC
15
GND
16
XT AL2
17
XT AL1
18
(OC 0B /S C L/INT0) P D0
19
(S D A/INT1) P D 1
20
(R X D1/INT 2) P D2
21
(T X D 1 /INT3) PD3
2.Overview
The ATmega16U4/ATmega32U4 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC
architecture. By executing powerful instructions in a single clock cycle, the device achieves throughputs
approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing
speed.
The AVR core combines a rich instruction set with 32 general purpose working registers. All the 32 registers are
directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one
single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving
throughputs up to ten times faster than conventional CISC microcontrollers.
The device provides the following features: 16/32K bytes of In-System Programmable Flash with Read-WhileWrite capabilities, 512Bytes/1K bytes EEPROM, 1.25/2.5K bytes SRAM, 26 general purpose I/O lines (CMOS
outputs and LVTTL inputs), 32 general purpose working registers, four flexible Timer/Counters with compare
modes and PWM, one more high-speed Timer/Counter with compare modes and PLL adjustable source, one
USART (including CTS/RTS flow control signals), a byte oriented 2-wire Serial Interface, a 12-channels 10-bit
ADC with optional differential input stage with programmable gain, an on-chip calibrated temperature sensor, a
programmable Watchdog Timer with Internal Oscillator, an SPI serial port, IEEE std. 1149.1 compliant JTAG
test interface, also used for accessing the On-chip Debug system and programming and six softwa re selectable
power saving modes. The Idle mode stops the CPU while allowing the SRAM, Timer/Counters, SPI port, and
interrupt system to continue functioning. The Power-down mode saves the register contents but freezes the
Oscillator, disabling all other chip functions until the next interrupt or Hardware Reset. The ADC Noise
Reduction mode stops the CPU and all I/O modules except ADC, to minimize switching noise during ADC
conversions. In Standby mode, the Crystal/Resonator Oscillator is running while the rest of the device is
sleeping. This allows very fast start-up combined with low power consumption.
The device is manufactured using the Atmel
Flash allows the program memory to be reprogrammed in-system thr ough an SPI serial interface, by a
conventional nonvolatile memory programmer, or by an On-chip Boot program running on the AVR core. The
boot program can use any interface to download the application program in the applica tion Flash memory.
Software in the Boot Flash section will continue to run while the Application Flash section is updated, providing
true Read-While-Write operation. By combining an 8-bit RISC CPU with In-System Self-Programmable Flash on
a monolithic chip, the device is a powerful microcontroller that provides a highly flexible and cost effective
solution to many embedded control applications.
The ATmega16U4/ATmega32U4 AVR is supported with a full suite of program and system development tools
including: C compilers, macro assemblers, program debugger/simulators, in-circuit emulators, and evaluation
kits.
2.2Pin Descriptions
2.2.1VCC
Digital supply voltage.
®
high-density nonvolatile memory technology. The On-chip ISP
2.2.2GND
Ground.
2.2.3Port B (PB7..PB0)
Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output
buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port B pins
that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tristated when a reset condition becomes active, even if the cloc k is not ru nn in g.
Port B has better driving capabilities than the other ports.
Port B also serves the functions of various special feat ur es of the device as listed on page 74.
2.2.4Port C (PC7,PC6)
Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port C output
buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port C pins
that are externally pulled low will source current if the pull-up resistors are activated. The Port C pins are tristated when a reset condition becomes active, even if the cloc k is not ru nn in g.
Only bits 6 and 7 are present on the product pinout.
Port C also serves the functions of special features of the device as listed on page 77.
2.2.5Port D (PD7..PD0)
Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port D output
buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port D pins
that are externally pulled low will source current if the pull-up resistors are activated. The Port D pins are tristated when a reset condition becomes active, even if the cloc k is not ru nn in g.
Port D also serves the functions of various special features of the ATmega16U4/ATmega32U4 as listed on
page 78.
2.2.6Port E (PE6,PE2)
Port E is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port E output
buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port E pins
that are externally pulled low will source current if the pull-up resistors are activated. The Port E pins are tristated when a reset condition becomes active, even if the cloc k is not ru nn in g.
Only bits 2 and 6 are present on the product pinout.
Port E also serves the functions of various special feat ur es of the ATmega16U4/ATmega32U4 as listed on
page 81.
2.2.7Port F (PF7..PF4, PF1,PF0)
Port F serves as analog inputs to the A/D Converter.
Port F also serves as an 8-bit bi-directional I/O port, if the A/D Converter channels ar e not used. Port pins can
provide internal pull-up resistors (selected for each bit). The Port F output buffers have symmetrical drive
characteristics with both high sink and source capability. As inputs, Port F pins that are externally pulled low will
source current if the pull-up resistors are activated. The Port F pins are tri-stated when a reset condition
becomes active, even if the clock is not running.
Bits 2 and 3 are not present on the product pinout .
Port F also serves the functions of the JTAG interface. If the JTAG interface is enabled, the pull-up resistors on
pins PF7(TDI), PF5(TMS), and PF4(TCK) will be activated even if a reset occurs.
2.2.8D-
USB Full speed / Low Speed Negative Data Upstream Port. Should be connected to the USB D- connector pin
with a serial 22 resistor.
2.2.9D+
USB Full speed / Low Speed Positive Data Upstream Port. Should be connected to the USB D+ connector pin
with a serial 22 resistor.
2.2.10 UGND
USB Pads Ground.
2.2.11 UVCC
USB Pads Internal Regulator Input supply voltage.
2.2.12 UCAP
USB Pads Internal Regulator Output supply voltage. Should be connected to an external capacitor (1µF).
Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the
clock is not running. The minimum pulse length is given in Table 8-2 on page 53. Sho rter pulses are not
guaranteed to generate a reset.
2.2.15 XTAL1
Input to the inverting Oscillator amplifier and input to the internal clock operating circuit.
2.2.16 XTAL2
Output from the inverting Oscillator amplifier.
2.2.17 AVCC
AVCC is the supply voltage pin (input) for all the A/D Converter channels. If the ADC is not used, it should be
externally connected to V
2.2.18 AREF
This is the analog reference pin (input) for the A/D Converter.
. If the ADC is used, it should be connected to VCC through a low-pass filter.
Typical values contained in this datasheet are based on simulations and characterization of other AVR
microcontrollers manufactured on the same process technology. Min. and Max. values will be available after the
device is characterized.
3.2Resources
A comprehensive set of development tools, application notes and datasheets are available for download on
http://www.atmel.com/avr.
3.3Code Examples
This documentation contains simple code examples that briefly show how to use various parts of the device. Be
aware that not all C compiler vendors include bit defini ti ons in the header files and interrupt handling in C is
compiler dependent. Confirm with the C compiler documentation for more details.
These code examples assume that the part specific header file is included before compilation. For I/O registers
located in extended I/O map, "IN", "OUT", "SBIS", "SBIC", "CBI", and "SBI" instructions must be replaced with
instructions that allow access to extended I/O. Typically "LDS" and "STS" combined with "SBRS", "SBRC",
"SBR", and "CBR".
3.4Data Retention
Reliability Qualification results show that the projected data retention failure rate is much less than 1PPM over
20 years at 85°C or 100 years at 25°C.
Note:1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory
addresses should never be written.
2. I/O registers within the address range $00 - $1F are directly bit-acce ssible using the SBI and CBI instructions. In these
registers, the value of single bits can be checked by using the SBIS and SBIC instructions.
3. Some of the status flags are cleared by writing a logical one to them. Note that the C BI and SBI instructions will operate
on all bits in the I/O register, writing a one back into any flag read as set, thus clearing the flag. The CBI and SBI instructions work with registers 0x00 to 0x1F only.
4. When using the I/O specific commands IN and OUT, the I/O addresses $00 - $3F must be used. When addressing I/O
registers as data space using LD and ST instructions, $20 must be added to these addresses. The
ATmega16U4/ATmega32U4 is a complex microcontroller with more peripheral units than can be supported within the 64
location reserved in Opcode for the IN and OUT instructions. For the Extended I/O space from $60 - $1FF in SRAM, only
the ST/STS/STD and LD/LDS/LDD instructions can be used.
ADDRd, RrAdd two RegistersRd Rd + RrZ,C,N,V,H1
ADCRd, RrAdd with Carry two RegistersRd Rd + Rr + CZ,C,N,V,H1
ADIWRdl,KAdd Immediate to WordRdh:Rdl Rdh:Rdl + KZ,C,N,V,S2
SUBRd, RrSubtract two RegistersRd Rd - RrZ,C,N,V,H1
SUBIRd, KSubtract Constant from Register Rd Rd - KZ,C,N,V,H1
SBCRd, RrSubtract with Carry two RegistersRd Rd - Rr - CZ,C,N,V,H1
SBCIRd, KSubtract with Carry Constant from Reg.Rd Rd - K - CZ,C,N,V,H1
SBIWRdl,KSubtract Immediate from WordRdh:Rdl Rdh:Rdl - KZ,C,N,V,S2
ANDRd, RrLogical AND RegistersRd Rd RrZ,N,V1
ANDIRd, KLogical AND Register and ConstantRd Rd KZ,N,V1
ORRd, RrLogical OR RegistersRd Rd v RrZ,N,V1
ORIRd, KLogical OR Register and ConstantRd Rd v KZ,N,V1
EORRd, RrExclusive OR RegistersRd Rd RrZ,N,V1
COMRdOne’s ComplementRd 0xFF RdZ,C,N,V1
NEGRdTwo’s ComplementRd 0x00 RdZ,C,N,V,H1
SBRRd,KSet Bit(s) in RegisterRd Rd v KZ,N,V1
CBRRd,KClear Bit(s) in RegisterRd Rd (0xFF - K)Z,N,V1
INCRdIncrementRd Rd + 1Z,N,V1
DECRdDecrementRd Rd 1 Z,N,V1
TSTRdTest for Zero or MinusRd Rd Rd Z,N,V1
CLRRdClear RegisterRd Rd RdZ,N,V1
SERRdSet RegisterRd 0xFFNone1
MULRd, RrMultiply UnsignedR1:R0 Rd x RrZ,C2
MULSRd, RrMultiply SignedR1:R0 Rd x RrZ,C2
MULSURd, RrMultiply Signed with UnsignedR1:R0 Rd x RrZ,C2
FMULRd, RrFractional Multiply UnsignedR1:R0 (Rd x Rr) << 1Z,C2
FMULSRd, RrFractional Multiply SignedR1:R0 (Rd x Rr) << 1Z,C2
FMULSURd, RrFractional Multiply Signed with UnsignedR1:R0 (Rd x Rr) << 1Z,C2
RJMPkRelative JumpPC PC + k + 1None2
IJMPIndirect Jump to (Z)PC Z None2
EIJMPExtended Indirect Jump to (Z)
JMPkDirect JumpPC kNone3
RCALLkRelative Subroutine Call PC PC + k + 1None4
ICALLIndirect Call to (Z)PC ZNone4
EICALLExtended Indirect Call to (Z)
CALLkDirect Subroutine Call PC kNone5
RETSubroutine ReturnPC STACKNone5
RETIInterrupt ReturnPC STACKI5
CPSERd,RrCompare, Skip if Equalif (Rd = Rr) PC PC + 2 or 3N one1/2/3
CPRd,RrCompareRd RrZ, N,V,C,H1
CPCRd,RrCompare with CarryRd Rr CZ, N,V,C,H1
CPIRd,KCompare Regist er with ImmediateRd KZ, N,V,C,H1
SBRCRr, bSkip if Bit in Register Clearedif (Rr(b)=0) PC PC + 2 or 3 None1/2/3
SBRSRr, bSkip if Bit in Register is Setif (Rr(b)=1) PC PC + 2 or 3None1/2/3
SBICP, bSkip if Bit in I/O Register Clearedif (P(b)=0) PC PC + 2 or 3 None1/2/3
SBISP, bSkip if Bit in I/O Register is Setif (P(b)=1) PC PC + 2 or 3None1/2 /3
BRBSs, kBranch if Status Flag Setif (SREG(s) = 1) then PCPC+k + 1None1/2
BRBCs, kBranch if Status Flag Clearedif (SREG(s) = 0) then PCPC+k + 1None1/2
BREQ kBranch if Equal if (Z = 1) then PC PC + k + 1N one1/2
BRNE kBranch if Not Equalif (Z = 0) then PC PC + k + 1None1/2
BRCS kBranch if Carry Setif (C = 1) then PC PC + k + 1None1/2
BRCC kBranch if Carry Clearedif (C = 0) then PC PC + k + 1None1/2
BRSH kBranch if Same or Higher if (C = 0) then PC PC + k + 1None1/2
BRLO kBranch if Lowerif (C = 1) then PC PC + k + 1None1/2
BRMI kBranch if Minusif (N = 1) then PC PC + k + 1None1/2
BRPL kBranch if Plus if (N = 0) then PC PC + k + 1None1/2
BRGE kBranch if Greater or Equal, Signedif (N V= 0) then PC PC + k + 1None1/2
BRLT kBranch if Less Than Zero, Signedif (N V= 1) then PC PC + k + 1None1/2
BRHS kBranch if Half Carry Flag Setif (H = 1) then PC PC + k + 1None1/2
BRHC kBranch if Half Carry Flag Clearedif (H = 0) then PC PC + k + 1None1/2
BRTS kBranch if T Flag Setif (T = 1) then PC PC + k + 1None1/2
BRTC kBranch if T Flag Clearedif (T = 0) then PC PC + k + 1None1/2
BRVS kBranch if Overflow Flag is Setif (V = 1) then PC PC + k + 1None1/2
CLIGlobal Interrupt DisableI 0 I1
SESS et Signed Test FlagS 1S1
CLSClear Signed Test FlagS 0 S1
SEVSet Twos Complement Overflow.V 1V1
CLVClear Twos Complement OverflowV 0 V1
SETSet T in SREGT 1T1
CLTCle ar T in SREGT
SEHSet Half Carry Flag in SREGH 1H1
CLHClear Half Carry Flag in SREGH 0 H1
MOVRd, RrMove Between RegistersRd RrNone1
MOVWRd, RrCopy Register Word
LDIRd, KLoad ImmediateRd KNone1
LDRd, XLoad IndirectRd (X)None2
LDRd, X+Load Indirect and Post-Inc.Rd (X), X X + 1None2
LDRd, - XLoad Indirect and Pre-Dec.X X - 1, Rd (X)None2
LDRd, YLoad IndirectRd (Y)None2
LDRd, Y+Load Indirect and Post-Inc.Rd (Y), Y Y + 1None2
LDRd, - YLoad Indirect and Pre-Dec.Y Y - 1, Rd (Y)None2
LDDRd,Y+qLoad Indirect with DisplacementRd (Y + q)None2
LDRd, ZLoad Indirect Rd (Z)None2
LDRd, Z+Load Indirect and Post-Inc.Rd (Z), Z Z+1None2
LDRd, -ZLoad Indirect and Pre-Dec.Z Z - 1, Rd (Z)None2
LDDRd, Z+qLoad Indirect with DisplacementRd (Z + q)None2
LDSRd, kLoad Direct from SRAMRd (k)None2
STX, RrStore Indirect(X) RrNone2
STX+, RrStore Indirect and Post-Inc.(X) Rr, X X + 1None2
ST- X, RrStore Indirect and Pre-Dec.X X - 1, (X) RrNone2
STY, RrStore Indirect(Y) RrNone2
STY+, RrStore Indirect and Post-Inc.(Y) Rr, Y Y + 1None2
ST- Y, RrStore Indirect and Pre-Dec.Y Y - 1, (Y) RrNone2
STDY+q,RrStore Indirect with Displacement(Y + q) RrNone2
STZ, RrStore Indirect(Z) RrNone2
STZ+, RrStore Indirect and Post-Inc.(Z) Rr, Z Z + 1None2
ST-Z, RrStore Indirect and Pre-Dec.Z Z - 1, (Z) RrNone2
STDZ+q,RrStore Indirect with Displacement(Z + q) RrNone2
STSk, RrStore Direct to SRAM(k) RrNone2
LPMLoad Program MemoryR0 (Z)None3
LPMRd, ZLoad Program MemoryRd (Z)None3
LPMRd, Z+Load Program Memory and P os t-IncRd (Z), Z Z+1None3
ELPMExtended Load Program MemoryR0 (RAMPZ:Z)None3
ELPMRd, ZExtended Load Program MemoryRd (Z)None3
ELPMRd, Z+Extended Load Program MemoryRd (RAMPZ:Z), RAMPZ:Z RAMPZ:Z+1None3
Speed [MHz]Power Supply Ordering CodeDefault OscillatorPackageOperation Ran ge
ATmega16U4-AUExternal XTAL
44ML
ATmega16U4RC-AUInternal Calib. RC
16
Notes:1. For more information on running the USB from internal RC oscillator consult application note AVR291: 8MHz Internal Oscillator Calibration for USB Low
Speed on Atmel ATmega32U4RC.
2. USB operation from internal RC oscillator is only guaranteed for 0°C to 40°C.
3. These parts are shipped with no USB bootloader pre-programmed.
2.7 - 5.5V
ATmega16U4-MU
(1)(2)(3)
ATmega16U4RC-MU
(1)(2)(3)
External XTAL
44PW
Internal Calib. RC
Industrial (-40° to +85°C)
44ML
44PW
Package Type
ML, 44 - Lead, 10 x 10mm Body Size, 1.0mm Body Thickness
0.8mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
PW, 44 - Lead 7.0 x 7.0mm Body, 0.50mm Pitch
Speed [MHz]Power Supply Ordering CodeDefault OscillatorPackageOperation Range
ATmega32U4-AUExternal XTAL
44ML
ATmega32U4RC-AU Internal Calib. RC
16
Notes:1. For more information on running the USB from internal RC oscillator consult application note AVR291: 8MHz Internal Oscillator Calibration for USB Low
Speed on Atmel ATmega32U4RC.
2. USB operation from internal RC oscillator is only guaranteed for 0°C to 40°C.
3. These parts are shipped with no USB bootloader pre-programmed.
2.7 - 5.5V
ATmega32U4-MU
(1)(2)(3)
ATmega32U4RC-MU
(2) (3)
External XTAL
(1)
Internal Calib. RC
44PW
Industrial (-40° to +85°C)
44ML
44PW
Package Type
ML, 44 - Lead, 10 x 10mm Body Size, 1.0mm Body Thickness
0.8mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
PW, 44 - Lead 7.0 x 7.0mm Body, 0.50mm Pitch
The revision letter in this section refers to the revision of the ATmega16U4/ATmega32U4 device.
8.1ATmega16U4/ATmega32U4 Rev E
• Spike on TWI pins when TWI is enabled
• High current consumption in sleep mode
• MSB of OCR4A/B/D is write only in 11-bits enhanced PWM mode
1. Spike on TWI pins when TWI is enabled
100 ns negative spike occurs on SDA and SCL pins when TWI is enabled.
Problem Fix/work around
Enable ATmega16U4/ATmega32U4 TWI before the other nodes of the TWI network.
2. High current consumption in sleep mode
If a pending interrupt cannot wake the part up from the selected mode, the current consumption will
increase during sleep when executing the SLEEP instruction directly after a SEI instruction.
Problem Fix/work around
Before entering sleep, interrupts not used to wake up the part from the sleep mode should be disabled.
3. MSB of OCR4A/B/D is write only in 11-bits enhanced PWM mode
In the 11-bits enhanced PWM mode the MSB of OCR4A/B/D is write only. A read of OCR4A/B/D will
always return zero in the MSB position.
Problem Fix/work around
None.
8.2ATmega16U4/ATmega32U4 Rev D
• Spike on TWI pins when TWI is enabled
• High current consumption in sleep mode
• Timer 4 11-bits enhanced PWM mode
1. Spike on TWI pins when TWI is enabled
100 ns negative spike occurs on SDA and SCL pins when TWI is enabled.
Problem Fix/work around
Enable ATmega16U4/ATmega32U4 TWI before the other nodes of the TWI network.
2. High current consumption in sleep mode
If a pending interrupt cannot wake the part up from the selected mode, the current consumption will
increase during sleep when executing the SLEEP instruction directly after a SEI instruction.
Problem Fix/work around
Before entering sleep, interrupts not used to wake up the part from the sleep mode should be disabled.
100 ns negative spike occurs on SDA and SCL pins when TWI is enabled.
Problem Fix/work around
Enable ATmega16U4/ATmega32U4 TWI before the other nodes of the TWI network.
2. High current consumption in sleep mode
If a pending interrupt cannot wake the part up from the selected mode, the current consumption will
increase during sleep when executing the SLEEP instruction directly after a SEI instruction.
Problem Fix/work around
Before entering sleep, interrupts not used to wake up the part from the sleep mode should be disabled.
3. Incorrect execution of VBUSTI interrupt
The CPU may incorrectly execute the interrupt vector related to the VBUSTI interrupt flag.
Problem fix/work around
Do not enable this interrupt. Firmware must process this USB event by polling VBUSTI.
4.
Timer 4 11-bits enhanced PWM mode
Timer 4 11-bits enhanced mode is not functional.
Problem Fix/work around
None.
8.5ATmega16U4/ATmega32U4 Rev A
• Spike on TWI pins when TWI is enabled
• High current consumption in sleep mode
• Increased power consumption in power-down mode
• Internal RC oscillator start up may fail
• Internal RC oscillator calibration
• Incorrect execution of VBUSTI interrupt
• Timer 4 enhanced mode issue
1. Spike on TWI pins when TWI is enabled
100 ns negative spike occurs on SDA and SCL pins when TWI is enabled.
Problem Fix/work around
Enable ATmega16U4/ATmega32U4 TWI before the other nodes of the TWI network.
If a pending interrupt cannot wake the part up from the selected mode, the current consumption will
increase during sleep when executing the SLEEP instruction directly after a SEI instruction.
Problem Fix/work around
Before entering sleep, interrupts not used to wake up the part from the sleep mode should be disabled.
3. Increased power consumption in power-down mode
The typical power consumption is increased by about 30 µA in power-down mode.
Problem Fix/work around
None.
4. Internal RC oscillator start up may fail
When the part is configured to start on internal RC oscillator, the oscillator may not start properly after
power-on.
Problem Fix/work around
Do not configure the part to start on internal RC oscillator.
5. Internal RC oscillator calibration
8 MHz frequency can be impossible to reach with internal RC even when using maximal OSCAL value.
Problem Fix/work around
None.
6. Incorrect execution of VBUSTI interrupt
The CPU may incorrectly execute the interrupt vector related to the VBUSTI interrupt flag.
Problem fix/work around
Do not enable this interrupt. Firmware must process this USB event by polling VBUSTI.
9.Datasheet Revision History for ATmega16U4/ATmega32U4
Note that the referring page numbers in this section are referred to this document. The referring revision in this
section are referring to the document revision.
9.1Rev. 7766J – 04/2016
“Memory Programming” on page 353: Updated number of words in a page and number of
1.
9.2Rev. 7766I – 07/2015
1.Applied Atmel brands throughout the contents and reorganized the contents.
2.Updated “Power Management and Sleep Modes” on page 43. Part of contents was missing.
pages in the Flash and EEPROM for ATmega16U4 and ATmega32U4. Refer to Tabl e 28 -1 1
and Table 28-12 on page 359.
9.3Rev. 7766H – 06/2014
1.
2.Several corrections are made according to the new template.
3.Trademarks are added to the last page.
4Removed preliminary on the front page
5Updated with new datasheet template from 05-2014
6.
7.
8.Removed footnote on Frequency range in Table 6-3 on page 30 and Table 6-7 on page 32.
9.Updated values and removed footnote in Table 8-3 on page 55.
10.Removed column VCC=1.5 - 5.5V in Table 29-2 on page 385.
11.Changed footnote for Table 29-2 on page 385.
12. Added max value for Rise/Fall time in Table 29-4 on page 387.
The first section in “Phase and Frequency Correct PWM Mode” on page 154 has been
corrected.
Updated description of parts pre-programed with a default USB bootloader in Features on
page 2.
Added three footnotes for the RC part numbers in Section 6., “Ordering Information” on page
4.MUX bit in “ADC Control and Status Register B – ADCSRB” on page 294 changed to R/W.
5.
6.
7.Updated “Register Summary” on page 9. Added UCSRnD at the address CBh.
8.Replaced the “TQFP44” on page 18 and “QFN44” on page 19 by updated package drawings.
9.Updated the last page according to Atmel new Brand Style Guide (new logo).
Updated the “Description” on page 177 of the “Output Compare Modulator (OCM1C0A)” .
Specified when the logical AND and the logical OR will be performed based on the PORTB7.
Updated “USART Control and Status Register n D– UCSRnD” on page 213. “Bits 7:2 Reserved” are Read only.
Updated “Crystal-less Operation” on page 259. The temperature range changed to “within the
0C and +40C.
Updated Table 24-6 on page 318. Trigger Source: Timer/Counter0 Compare Match updated
to Timer/Counter0 Compare Match A.
Updated “DC Characteristics” on page 383. Added Active 16MHz, VCC = 5V, max. 27mA, in
“Icc / Power supply current”.
9.5Rev. 7766F – 11/10
1.Replaced the “QFN44” on page 19 by an updated drawing.
2.
3.Updated the last page according to Atmel new Brand Style Guide.
Updated “ADC Control and Status Register B – ADCSRB” on page 294. Defined the
ADCSRB register as in “ADC Control and Status Register B – ADCSRB” on page 317.
9.6Rev. 7766E – 04/10
1.Updated “Features” on page 1.
2.Updated “Features” on page 256.
3.Updated Figure 21-9 on page 261.
4.Updated Section 21.8 on page 263.
5.Updated “Features” on page 297.
6.Updated “Boundary-scan Order” on page 332.
7.Updated “Program And Data Memory Lock Bits” on page 353.
8.Updated Table 28-5 on page 355.
9.Updated “Electrical Characteristics” on page 383.
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