Asus P7P55D User Manual

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P7P55D

Motherboard

Page 2

E4977

Second Edition August 2009

No part of this manual, including the products and software described in it, may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means, except documentation kept by the purchaser for backup purposes, without the express written permission of ASUSTeK COMPUTER INC. (“ASUS”).

Product warranty or service will not be extended if: (1) the product is repaired, modied or altered, unless such repair, modication of alteration is authorized in writing by ASUS; or (2) the serial number of the

product is defaced or missing.

ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFITS, LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSINESS AND THE LIKE), EVEN IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY DEFECT OR ERROR IN THIS MANUAL OR PRODUCT.

SPECIFICATIONS AND INFORMATION CONTAINED IN THIS MANUAL ARE FURNISHED FOR INFORMATIONAL USE ONLY, AND ARE SUBJECT TO CHANGE AT ANY TIME WITHOUT NOTICE, AND SHOULD NOT BE CONSTRUED AS A COMMITMENT BY ASUS. ASUS ASSUMES NO RESPONSIBILITY OR LIABILITY FOR ANY ERRORS OR INACCURACIES THAT MAY APPEAR IN THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT.

Products and corporate names appearing in this manual may or may not be registered trademarks or

copyrights of their respective companies, and are used only for identication or explanation and to the owners’ benet, without intent to infringe.

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Contents ...................................................................................................................... iii

Notices ......................................................................................................................vii

Safety information .................................................................................................... viii

About this guide ......................................................................................................... ix

P7P55D specications summary .............................................................................. xi

Chapter 1: Product introduction

1.1 Welcome! ....................................................................................................1-1

1.2 Package contents.......................................................................................1-1

1.3 Special features..........................................................................................1-2

1.3.1 Product highlights........................................................................1-2

1.3.2 ASUS Xtreme Design—Hybrid Processor ..................................1-3

1.3.3 ASUS Xtreme Design—Hybrid Phase ........................................1-3

1.3.4 ASUS Xtreme Design—Hybrid OS .............................................1-3

1.3.5 ASUS Exclusive Features ........................................................... 1-4

Chapter 2: Hardware information

2.1 Before you proceed ...................................................................................2-1

2.2 Motherboard overview ............................................................................... 2-2

2.2.1 Motherboard layout ..................................................................... 2-2

2.2.2 Layout contents ...........................................................................2-3

2.2.3 Placement direction.....................................................................2-4

2.2.4 Screw holes.................................................................................2-4

2.3 Central Processing Unit (CPU) .................................................................2-5

2.3.1 Installing the CPU .......................................................................2-5

2.3.2 Installing the CPU heatsink and fan ............................................ 2-8

2.3.3 Uninstalling the CPU heatsink and fan........................................2-9

2.4 System memory .......................................................................................2-10

2.4.1 Overview ................................................................................... 2-10

2.4.2 Memory congurations .............................................................. 2-11

2.4.3 Installing a DIMM ......................................................................2-19

2.4.4 Removing a DIMM ....................................................................2-19

2.5 Expansion slots........................................................................................2-20

2.5.1 Installing an expansion card......................................................2-20

2.5.2 Conguring an expansion card .................................................2-20

2.5.3 Interrupt assignments................................................................2-21

2.5.4 PCI slots ....................................................................................2-22

2.5.5 PCI Express x1 slots ................................................................. 2-22

2.5.6 PCI Express 2.0 x16 slots ......................................................... 2-22

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Contents

2.6 Onboard switch ........................................................................................ 2-24

2.7 Jumpers ....................................................................................................2-25

2.8 Connectors ...............................................................................................2-27

2.8.1 Rear panel connectors .............................................................. 2-27

2.8.2 Audio I/O connections ............................................................... 2-28

2.8.3 Internal connectors....................................................................2-31

2.8.4. ASUS Q-Connector (system panel) ..........................................2-40

2.9 Onboard LEDs .......................................................................................... 2-41

2.10 Starting up for the rst time .................................................................... 2-42

2.11 Turning off the computer ......................................................................... 2-42

Chapter 3: BIOS setup

3.1 Knowing BIOS ............................................................................................3-1

3.2 Updating BIOS ............................................................................................ 3-1

3.2.1 ASUS Update utility.....................................................................3-1

3.2.2 ASUS EZ Flash 2 utility ............................................................... 3-5

3.2.3 ASUS CrashFree BIOS 3 utility...................................................3-6

3.3 BIOS setup program ..................................................................................3-6

Entering BIOS Setup at startup .................................................................... 3-6

Entering BIOS Setup after POST ................................................................. 3-6

3.3.1 BIOS menu screen ...................................................................... 3-7

3.3.2 Menu bar ..................................................................................... 3-7

3.3.3 Navigation keys ........................................................................... 3-8

3.3.4 Menu items..................................................................................3-8

3.3.5 Submenu items ........................................................................... 3-8

3.3.6 Conguration elds .....................................................................3-8

3.3.7 Pop-up window............................................................................3-8

3.3.8 Scroll bar ..................................................................................... 3-8

3.3.9 General help................................................................................3-8

3.4 Main menu ..................................................................................................3-9

3.4.1 SATA 1-6 .....................................................................................3-9

3.4.2 Storage Conguration ............................................................... 3-11

3.4.3 AHCI Conguration ................................................................... 3-11

3.4.4 System Information ................................................................... 3-12

3.5 Ai Tweaker menu ...................................................................................... 3-13

3.5.1 OC Tuner Utility ......................................................................... 3-13

3.5.2 OC Tuner limit Value ................................................................ 3-13

3.5.3 Ai Overclock Tuner ................................................................... 3-14

3.5.4 CPU Ratio Setting .................................................................... 3-14

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Contents

3.5.5 Intel(R) SpeedStep(TM) Tech .................................................. 3-15

3.5.6 Intel(R) TurboMode Tech .......................................................... 3-15

3.5.7 Xtreme Phase Full Power Mode ..............................................3-15

3.5.8 DRAM Frequency .....................................................................3-15

3.5.9. DRAM Timing Control ..............................................................3-15

3.5.10 CPU Differential Amplitude ....................................................... 3-17

3.5.11 CPU Clock Skew ...................................................................... 3-17

3.5.12 CPU Voltage Mode [Offset] ...................................................... 3-17

3.5.13 IMC Voltage .............................................................................3-18

3.5.14 DRAM Voltage .........................................................................3-18

3.5.15 CPU PLL Voltage .....................................................................3-18

3.5.16 PCH Voltage .............................................................................3-18

3.5.17 DRAM DATA REF Voltage on CHA/B ......................................3-19

3.5.18 DRAM CTRL REF Voltage on CHA/B ...................................... 3-19

3.5.19 Load-Line Calibration ............................................................... 3-19

3.5.20 CPU Spread Spectrum .............................................................3-19

3.5.21 PCIE Spread Spectrum ............................................................ 3-19

3.6 Advanced menu .......................................................................................3-20

3.6.1 CPU Conguration .................................................................... 3-20

3.6.2 North Bridge Conguration........................................................3-22

3.6.3 Onboard Device Conguration .................................................. 3-23

3.6.4 USB Conguration ....................................................................3-24

3.6.5 PCIPnP .....................................................................................3-25

3.6.6 Intel VT-d Conguration ...........................................................3-25

3.6.7 T.Probe ..................................................................................... 3-25

3.7 Power menu .............................................................................................. 3-25

3.7.1 Suspend Mode ......................................................................... 3-26

3.7.2 Repost Video on S3 Resume ................................................... 3-26

3.7.3 ACPI 2.0 Support ..................................................................... 3-26

3.7.4 ACPI APIC Support .................................................................. 3-26

3.7.5 EuP Ready ............................................................................... 3-26

3.7.6 APM Conguration .................................................................... 3-27

3.7.7 Hardware Monitor......................................................................3-28

3.8 Boot menu ................................................................................................3-29

3.8.1 Boot Device Priority...................................................................3-29

3.8.2 Boot Settings Conguration ......................................................3-30

3.8.3 Security ..................................................................................... 3-31

3.9 Tools menu ............................................................................................... 3-33

3.9.1 ASUS O.C. Prole ..................................................................... 3-33

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Contents

3.9.2 AI NET 2 .................................................................................... 3-34

3.9.3 ASUS EZ Flash 2 ...................................................................... 3-34

3.9.4 Express Gate ...........................................................................3-35

3.10 Exit menu .................................................................................................. 3-36

Chapter 4: Software support

4.1 Installing an operating system .................................................................4-1

4.2 Support DVD information .......................................................................... 4-1

4.2.1 Running the support DVD ........................................................... 4-1

4.2.2 Obtaining the software manuals..................................................4-2

4.3 Software information .................................................................................4-3

4.3.1 ASUS PC Probe II ....................................................................... 4-3

4.3.2 ASUS AI Suite ............................................................................. 4-4

4.3.3 ASUS Fan Xpert..........................................................................4-5

4.3.4 ASUS EPU-6 Engine...................................................................4-6

4.3.5 ASUS Express Gate....................................................................4-7

4.3.6 VIA® High Denition Audio utility ................................................. 4-8

4.4 ASUS Unique Overclocking Utility—TurboV EVO ................................... 4-9

4.4.1 Using ASUS TurboV .................................................................... 4-9

4.4.2 Using ASUS TurboV Auto Tuning Mode .................................... 4-10

4.4.3 Using ASUS Turbo Key ............................................................. 4-11

4.5 RAID congurations ................................................................................4-12

4.5.1 RAID denitions ........................................................................4-12

4.5.2 Installing Serial ATA hard disks .................................................4-13

4.5.3 Setting the RAID item in BIOS .................................................. 4-13

4.5.4 Intel® Matrix Storage Manager option ROM utility ..................... 4-13

4.6 Creating a RAID driver disk.....................................................................4-17

4.6.1 Creating a RAID driver disk without entering the OS ................ 4-17

4.6.2 Creating a RAID driver disk in Windows® .................................. 4-17

4.6.3 Installing the RAID driver during Windows® OS installation ...... 4-18

4.6.4 Using a USB oppy disk drive ................................................... 4-18

Chapter 5: Multiple GPU technology support

5.1 ATI® CrossFireX™ technology ..................................................................5-1

5.1.1 Requirements .............................................................................. 5-1

5.1.2 Before you begin ......................................................................... 5-1

5.1.3 Installing two CrossFireX™ graphics cards ................................5-2

5.1.4 Installing the device drivers ......................................................... 5-3

5.1.5 Enabling the ATI® CrossFireX™ technology ...............................5-3

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Notices

Federal Communications Commission Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

• This device may not cause harmful interference, and

• This device must accept any interference received including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed

and used in accordance with manufacturer’s instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment to an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

The use of shielded cables for connection of the monitor to the graphics card is required

to assure compliance with FCC regulations. Changes or modications to this unit not expressly approved by the party responsible for compliance could void the user’s authority

to operate this equipment.

Canadian Department of Communications Statement

This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications.

This class B digital apparatus complies with Canadian ICES-003.

REACH

Complying with the REACH (Registration, Evaluation, Authorisation, and Restriction of Chemicals) regulatory framework, we published the chemical substances in our products at ASUS REACH website at http://green.asus.com/english/REACH.htm.

DO NOT throw the motherboard in municipal waste. This product has been designed to enable proper reuse of parts and recycling. This symbol of the crossed out wheeled bin indicates that the product (electrical and electronic equipment) should not be placed in municipal waste. Check local regulations for disposal of electronic products.

DO NOT throw the mercury-containing button cell battery in municipal waste. This symbol of the crossed out wheeled bin indicates that the battery should not be placed in municipal waste.

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Safety information

Electrical safety

• To prevent electrical shock hazard, disconnect the power cable from the electrical outlet

before relocating the system.

• When adding or removing devices to or from the system, ensure that the power cables for the devices are unplugged before the signal cables are connected. If possible, disconnect all power cables from the existing system before you add a device.

• Before connecting or removing signal cables from the motherboard, ensure that all power cables are unplugged.

• Seek professional assistance before using an adapter or extension cord. These devices could interrupt the grounding circuit.

• Ensure that your power supply is set to the correct voltage in your area. If you are not sure about the voltage of the electrical outlet you are using, contact your local power company.

• If the power supply is broken, do not try to x it by yourself. Contact a qualied service

technician or your retailer.

• The optical S/PDIF is an optional component (may or may not be included in your

motherboard) and is dened as a CLASS 1 LASER PRODUCT.

INVISIBLE LASER RADIATION, AVOID EXPOSURE TO BEAM.

• Never dispose of the battery in re. It could explode and release harmful substances into

the environment.

• Never dispose of the battery with your regular household waste. Take it to a hazardous

material collection point.

• Never replace the battery with an incorrect battery type.

• RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE.

• DISPOSE OF USED BATTERIES ACCORDING TO THE ABOVE BATTERYRELATED INSTRUCTIONS.

Operation safety

• Before installing the motherboard and adding devices on it, carefully read all the manuals that came with the package.

• Before using the product, ensure all cables are correctly connected and the power cables are not damaged. If you detect any damage, contact your dealer immediately.

• To avoid short circuits, keep paper clips, screws, and staples away from connectors, slots, sockets and circuitry.

• Avoid dust, humidity, and temperature extremes. Do not place the product in any area where it may become wet.

This motherboard should only be used in environments with ambient temperatures between 5°C (41°F) and 40°C (104°F).

• Place the product on a stable surface.

• If you encounter technical problems with the product, contact a qualied service

technician or your retailer.

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About this guide

This user guide contains the information you need when installing and conguring the motherboard.

How this guide is organized

This guide contains the following parts:

• Chapter 1: Product introduction

This chapter describes the features of the motherboard and the new technology it supports.

• Chapter 2: Hardware information

This chapter lists the hardware setup procedures that you have to perform when installing system components. It includes description of the switches, jumpers, and connectors on the motherboard.

• Chapter 3: BIOS setup

This chapter tells how to change system settings through the BIOS Setup menus. Detailed descriptions of the BIOS parameters are also provided.

• Chapter 4: Software support

This chapter describes the contents of the support DVD that comes with the motherboard package and the software.

• Chapter 5: Multiple GPU technology support

This chapter describes how to install and congure multiple ATI® CrossFireX™

graphics cards.

Where to nd more information

Refer to the following sources for additional information and for product and software updates.

1. ASUS websites

The ASUS website provides updated information on ASUS hardware and software products. Refer to the ASUS contact information.

2. Optional documentation

Your product package may include optional documentation, such as warranty yers,

that may have been added by your dealer. These documents are not part of the standard package.

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Conventions used in this guide

To ensure that you perform certain tasks properly, take note of the following symbols used throughout this manual.

DANGER/WARNING: Information to prevent injury to yourself when trying to

complete a task.

CAUTION: Information to prevent damage to the components when trying to

complete a task.

IMPORTANT: Instructions that you MUST follow to complete a task.

NOTE: Tips and additional information to help you complete a task.

Typography

Bold text Indicates a menu or an item to select.

Italic

s Used to emphasize a word or a phrase.

<Key> Keys enclosed in the less-than and greater-than sign means

that you must press the enclosed key.that you must press the enclosed key.

Example: <Enter> means that you must press the Enter or Return key.Return key.

<Key1> + <Key2> + <Key3> If you must press two or more keys simultaneously, the key

names are linked with a plus sign (+).

Example: <Ctrl> + <Alt> + <Del>

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P7P55D specications summary

CPU

Chipset Intel® P55 Express Chipset

Memory

Expansion Slots

Multi-GPU Support

Storage Intel® P55 Express Chipset:

LAN

USB

IEEE 1394

Audio

ASUS Q-Design ASUS Q-Design:

LGA1156 socket for Intel® Core™ i7 Processors/ Core™ i5 processors Supports Intel® Turbo Boost Technology * Refer to www.asus.com for Intel CPU support list

Dual channel memory architecture

- 4 x 240-pin DIMM sockets support unbuffered non-ECC

DDR3 2133(O.C.)* / 1600 / 1333 / 1066 MHz

memeory modules

- Supports up to 16GB system memory

Supports Intel® Extreme Memory Prole (XMP) * Hyper DIMM support is subject to the physical characteristics of individual CPUs. Some hyper DIMMs only support one DIMM per channel. ** Refer to www.asus.com or this user manual for the

Memory QVL (Qualied Vendors Lists)

2 x PCI Express 2.0 x 16 slots

- One slot at x16 mode (single, blue)

- One slot at x4 mode, 2.5GT/s (black) 2 x PCI Express 2.0 x1 slots (2.5GT/s) 3 x PCI slots

Supports ATI® Quad-GPU CrossFireX™ Technology

- 6 x SATA 3.0 Gb/s ports

- Intel® Matrix Storage Technology supporting SATA RAID 0,1, 5, and 10

JMicron® JMB363 SATA & PATA controller

- 1 x Ultra DMA 133/100/66 for up to 2 PATA devices

- 1 x SATA 3.0 Gb/s port (black)

- 1 x eSATA 3.0 Gb/s port (SATA on-the-go)

Realtek® 8112L Gigabit LAN controller featuring AI NET2

14 x USB 2.0 ports (6 ports at mid-board, 8 ports at rear panel)

VIA® VT6308P controller supports 2 x IEEE 1394a ports (one at mid-board, one at rear panel)

VIA® VT1828S 8-channel High Denition Audio CODEC

- Absolute Pitch BD192/24

- DTS Surround Sensation UltraPC

- BD audio layer Content Protection

- Supports Jack-Detection, Multi-streaming, and Front Panel Jack-Retasking

- Optical S/PDIF out port at back I/O

- ASUS Q-LED (CPU, DRAM, VGA, Boot Device LED)

- ASUS Q-Slot

- ASUS Q-DIMM

(continued on the next page)

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P7P55D specications summary

ASUS Unique Features ASUS Hybrid Processor – ASUS TurboV EVO

ASUS Exclusive Overclocking Features

Back Panel I/O Ports 1 x PS/2 Keyboard port (Purple)

- Auto Tuning, TurboV, and Turbo Key

ASUS Hybrid Phase

- T.Probe Technology for Active Cooling

- 12+2 Phase Power Design

ASUS Hybrid OS – Express Gate

ASUS Xtreme Design

ASUS Exclusive Features

- MemOK!

- ASUS EPU

ASUS Quiet Thermal Solution:

- ASUS Fanless Design: Stylish Heat-sink solution

- ASUS Fanless Design: Stack Cool 3

- ASUS Fan Xpert

ASUS Crystal Sound

- ASUS Noise Filter

ASUS EZ DIY:

- ASUS Q-Shield

- ASUS Q-Connector

- ASUS O.C. Prole

- ASUS CrashFree BIOS 3

- ASUS EZ Flash 2

- ASUS My Logo 2

- Multi-language BIOS

Precision Tweaker 2:

- vCore: Adjustable CPU voltage at 0.00625V increment

- vIMC: 49-step IMC voltage control

- vDRAM Bus: 81-step DRAM voltage control

- vPCH: 2-step chipset voltage control

- vCPU PLL: 4-step reference voltage control

SFS (Stepless Frequency Selection):

- Internal Base Clock tuning from 80MHz up to 500 MHz at 1MHz increment

- PCI Express frequency tuning from 100MHz up to 200MHz at 1MHz increment

Overclocking Protection:

- ASUS C.P.R.(CPU Parameter Recall)

1 x PS/2 Mouse port (Green) 1 x Optical S/PDIF Out 1 x IEEE1394a 1 x eSATA 3.0 Gb/s port (SATA on-the-go) 1 x RJ45 port 8 x USB 2.0/1.1 8-channel Audio I/O

(continued on the next page)

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P7P55D specications summary

Internal I/O Connectors

BIOS Features

Manageability WfM 2.0, DMI 2.0, WOL by PME, WOR by PME, PXE

Support DVD Contents Drivers

Form Factor ATX Form Factor, 12”x 9.6” (30.5cm x 24.4cm)

*Specications are subject to change without notice.

3 x USB connectors support additional 6 USB ports 1 x IDE connector 7 x SATA connectors 1 x CPU Fan connector 2 x Chassis Fan connectors (1 x 4-pin, 1 x 3-pin) 1 x Power Fan connector 1 x IEEE1394a connector 1 x COM port connector Front panel audio connector 1 x S/PDIF Out Header CD audio in 24-pin ATX Power connector 1 x 8-pin ATX 12V Power connectors System Panel (Q-Connector) 1 x MemOK! button

16 Mb Flash ROM, AMI BIOS, PnP, DMI 2.0, WfM 2.0, SM BIOS

2.5, ACPI 2.0a, Multi-language BIOS, ASUS EZ Flash 2, ASUS CrashFree BIOS 3

ASUS Utilities ASUS Update Anti-virus software (OEM version)

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User Manual

Chapter 1

Chapter 1: Product introduction

1.1 Welcome!

Thank you for buying an ASUS® P7P55D motherboard!

The motherboard delivers a host of new features and latest technologies, making it another standout in the long line of ASUS quality motherboards!

Before you start installing the motherboard, and hardware devices on it, check the items in your package with the list below.

1.2 Package contents

Check your motherboard package for the following items.

ASUS P7P55D motherboard User guide Support DVD

4 x Serial ATA 3.0Gb/s cables

ASUS P7P55D

1 x Ultra DMA 133/

100/66 cable

1 x 2-in-1 ASUS Q-Connector kit

• If any of the above items is damaged or missing, contact your retailer.

• The illustrated items above are for your reference only. Actual product specications

may vary with different models.

1 x ASUS Q-Shield

1-1

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1.3 Special features

1.3.1 Product highlights

Chapter 1

Green ASUS

This motherboard and its packaging comply with the European Union’s Restriction on the use of Hazardous Substances (RoHS). This is in line with the ASUS vision of creating environment-friendly and recyclable products/packagings to safeguard consumers’ health while minimizing the impact on the environment.

Intel® LGA1156 Lynneld Processor Ready

This motherboard supports the latest Intel® Lynneld processors in LGA1156 package, which has memory and PCI Express controller integrated to support 2-channel (4 DIMMs) DDR3 memory and 16 PCI Express 2.0 lanes, providing great graphics performance. Intel® Lynneld

processor is one of the most powerful and energy efcient CPU in the world. Refer to page

2-5 for details.

Intel® P55

The Intel® P55 Express Chipset is the latest one-chipset design to support the latest 1156 socket Intel® Core™ i7 / Core™ i5 processors. Intel P55 provides improved performance by

utilizing serial point-to-point links, allowing increased bandwidth and stability.

PCIe 2.0 support

Double Speed; Double Bandwidth

This motherboard supports the latest PCIe 2.0 devices for double speed and bandwidth that enhances system performance. Refer to page 2-22 for details.

Quad-GPU CrossFireX™ support!

Flexible Multi-GPU solution, Your Weapon of Choice!

P7P55D brings you the multi-GPU choice of CrossFireX™. The motherboard features the most powerful Intel® P55 platform to optimize PCIe allocation in multiple GPU congurations.

Expect a brand-new gaming style you’ve never experienced before! Refer to Chapter 5 for

details.

Dual-Channel DDR3 DDR3 2133 (O.C.)/1600/1333/1066 support

The motherboard supports DDR3 memory that features data transfer rates of 2133(O.C.) /

1600 / 1333 / 1066 MHz to meet the higher bandwidth requirements of the latest 3D graphics,

multimedia, and Internet applications. The dual-channel DDR3 architecture enlarges the bandwidth of your system memory to boost system performance. Refer to page 2-10 for details.

1-2 Chapter 1: Product Introduction

Page 17

1.3.2 ASUS Xtreme Design—Hybrid Processor

TurboV EVO

Ultimate O.C. Processor

The ultimate O.C. processor satises every level of overclockers—from die-hard enthusiasts

to beginners. Auto tuning intelligently pushes the system to the fastest clock speeds while

maintaining stability. Turbo Key boosts performance with just one touch; while TurboV offers

more options to advanced overclockers to achieve world O.C. record. Refer to page 4-9 for details.

Auto Tuning

Auto System Level Up

Auto Tuning is an intelligent tool that automates overclocking to achieve a total system level up. This tool also provides stability testing. Even O.C. beginners can achieve extreme yet stable overclocking results with Auto Tuning! Refer to page 4-10 for details.

1.3.3 ASUS Xtreme Design—Hybrid Phase

T.Probe

Leading Active Cooling Technology

The T.Probe microchip detects and balances power phase loading and temperature in real-

time. This feature optimizes the power phase functions, allowing components to run at lower

temperatures and extending their lifespan.

ASUS 12+2 Phase Power Design

Unprecedented Innovation with the Best Quality Component for Best Performance

The groundbreaking 12+2 phase VRM design is brought to the ASUS motherboards. 12+2 phase power design, 12-phase for vCore and extra 2-phase for Memory controller inside

CPU can provide the highest power efciency, and hence generates less heat to effectively

enhance the overclocking capability. With the high quality power components such as low RDS (on) MOSFETs, Ferrite core chokes with lower hysteresis loss and 100% Japan-made high quality conductive polymer capacitors, ASUS 12+2 phase VRM design also ensure longer component life and minimum power loss.

Chapter 1

1.3.4 ASUS Xtreme Design—Hybrid OS

ASUS Express Gate

Instant Online! Instant Fun!

Express Gate is an ASUS exclusive OS that provides you with quick access to the Internet and key applications without entering the Windows® OS. Refer to page 3-36 and 4-7 for details.

The actual boot time is subject to hardware congurations and product models.

ASUS P7P55D

1-3

Page 18

1.3.5 ASUS Exclusive Features

MemOK!

Chapter 1

Any Memory is A-OK!

Memory compatibility is among the top concerns during computer upgrades. Worry no more. MemOK! is the fastest memory booting solution today. This remarkable memory rescue tool requires nothing but a push of a button to patch memory issues and get your system up and running in no time. The technology is able to determine failsafe settings that can dramatically improve your system booting success. Refer to page 2-24 for details.

ASUS EPU

System Level Energy Saving

The new ASUS EPU—the world’s rst power saving engine, has been upgraded to a new 6

engine version, which provides total system power savings by detecting current PC loadings and intelligently moderating power in real-time. With auto phase switching for components (which includes the CPU, VGA card, memory, chipset, hard drives and CPU cooler / system fans), the EPU automatically provides the most appropriate power usage via intelligent acceleration and overclocking—helping save power and money. Refer to page 4-6 for details.

ASUS Quiet Thermal Solutions

ASUS Quiet Thermal solutions make the system more stable and enhances the overclocking capability.

ASUS Fanless Design—Heat-sink solution

The heat sink design effectively directs the chipsets’ generated heat to the heatsink

near the back I/O ports, where the generated heat is carried away by the existing

airow from the CPU fan. This innovative and groundbreaking design effectively lowers the system temperature by 10˚C, prevents any problems that are typical to standard chipsets, and allows you to install a side-ow fan or passive cooler. The heat sink

design provides you with the most reliable fanless thermal solution.

Up to 20ºC (36ºF) Cooler—Stack Cool 3

Effective Fanless Heat Dissipation at 0dB

Stack Cool 3 is a fanless cooling solution offered exclusively by ASUS. It effectively and noiselessly transfers heat generated by the critical components to the other side of the specially designed PCB (printed circuit board) for effective heat dissipation—

making temperatures cooler by up to 20˚C.

Fan Xpert

Active Quiet & Cool

ASUS Fan Xpert intelligently allows users to adjust both the CPU and chassis fan speed according to different ambient temperature, which is caused by different climate conditions in different geographic regions and system loading. Built-in variety of useful

proles offer exible controls of fan speed to achieve a quiet and cool environment.

Refer to page 4-5 for details.

1-4 Chapter 1: Product Introduction

Page 19

ASUS Crystal Sound

This feature can enhance speech-centric applications like Skype, online game, video conference and recording.

ASUS Noise Filter

Eliminate background noise while recording

This feature detects repetitive and stationary noises like computer fans, air conditioners, and other background noises then eliminates it in the incoming audio stream while recording.

ASUS EZ DIY

ASUS EZ DIY feature collection provides you with easy ways to install computer components, update the BIOS or back up your favorite settings.

ASUS Q-Design

DIY quickly, DIY easily!

ASUS Q-Design enhances your DIY experience. All of Q-LED, Q-Slot and Q-DIMM design speed up and simplify the DIY process!

ASUS Q-Shield

Easy and Comfortable Installations

The specially designed ASUS Q-Shield does without the usual “ngers”—making

it convenient and easy to install. With better electric conductivity, it ideally protects your motherboard against static electricity and shields it against Electronic Magnetic Interference (EMI).

ASUS Q-Connector

Make connection quick and accurate!

The ASUS Q-Connector allows you to connect or disconnect chassis front panel cables in one easy step with one complete module. This unique module eliminates the trouble of plugging in one cable at a time, making connection quick and accurate. Refer to page 2-40 for details.

ASUS EZ-Flash 2

Simply update BIOS from a USB ash drive before entering the OS

EZ Flash 2 is a user-friendly BIOS update utility. Simply launch this tool and update

BIOS from a USB ash drive before entering the OS. You can update your BIOS only in a few clicks without preparing an additional oppy diskette or using an OS-based ash

utility. Refer to page 3-5 for details.

ASUS O.C. Prole

Conveniently restore or load multiple BIOS settings

Freely share and distribute favorite overclocking settings. The motherboard features

the ASUS O.C. Prole that allows users to conveniently store or load multiple BIOS settings. The BIOS settings can be stored in the CMOS or a separate le, giving users

freedom to share and distribute their favorite overclocking settings. Refer to page 3-34 for details.

Chapter 1

ASUS P7P55D

1-5

Page 20

ASUS MyLogo2™

This feature allows you to convert your favorite photo into a 256-color boot logo for a more

Chapter 1

colorful and vivid image on your screen.

ASUS Multi-language BIOS

The multi-language BIOS allows you to select the language of your choice from the available

options. The localized BIOS setup menu helps you congure your system easier and faster.

1-6 Chapter 1: Product Introduction

Page 21

Chapter 2

Chapter 2: Hardware information

2.1 Before you proceed

Take note of the following precautions before you install motherboard components or change any motherboard settings.

• Unplug the power cord from the wall socket before touching any component.

• Before handling components, use a grounded wrist strap or touch a safely grounded object or a metal object, such as the power supply case, to avoid damaging them due to static electricity.

• Hold components by the edges to avoid touching the ICs on them.

• Whenever you uninstall any component, place it on a grounded antistatic pad or in the bag that came with the component.

• Before you install or remove any component, ensure that the ATX power supply is switched off or the power cord is detached from the power supply. Failure to do so may cause severe damage to the motherboard, peripherals, or components.

ASUS P7P55D 2-1

Page 22

2.2 Motherboard overview

2.2.1 Motherboard layout

Chapter 2

Refer to

2.8 Connectors

connectors.

2-2 Chapter 2: Hardware information

for more information about rear panel connectors and internal

Page 23

2.2.2 Layout contents

Connectors/Jumpers/Slots Page

1. ATX power connectors (24-pin EATXPWR, 8-pin EATX12V) 2-38

2. LGA1156 CPU Socket 2-5

3. DDR3 DIMM slots 2-10

4. DRAM overvoltage jumper (3-pin OV_DRAM) 2-26

5. CPU, chassis, and power fan connectors (4-pin CPU_FAN, 4-pin CHA_FAN1, 3-pin CHA_FAN2, 3-pin PWR_FAN)

6. Serial port connector (9-pin COM1) 2-36

7. MemOK! switch 2-24

8. IDE connector (40-1 pin PRI_EIDE) 2-32

9. JMicron JMB363 Serial ATA connector (7-pin SATA_E1) 2-34

10. P55 Serial ATA connectors (7-pin SATA1-6) 2-33

11. System panel connector (20-8 pin PANEL) 2-39

12. Clear RTC RAM (3-pin CLRTC) 2-25

13. USB connectors (10-1 pin USB910, USB1112, USB1314) 2-35

14. Standby power LED 2-41

15. IEEE 1394a port connector (10-1 pin IE1394_2) 2-36

16. Optical drive audio connector (4-pin CD) 2-35

17. Front panel audio connector (10-1 pin AAFP) 2-31

18. Digital audio connector (4-1 pin SPDIF_OUT) 2-31

2-37

Chapter 2

ASUS P7P55D 2-3

Page 24

2.2.3 Placement direction

When installing the motherboard, ensure that you place it into the chassis in the correct orientation. The edge with external ports goes to the rear part of the chassis as indicated in the image below.

2.2.4 Screw holes

Place nine screws into the holes indicated by circles to secure the motherboard to the chassis.

Chapter 2

DO NOT overtighten the screws! Doing so can damage the motherboard.

Place this side towards

the rear of the chassis

2-4 Chapter 2: Hardware information

Page 25

2.3 Central Processing Unit (CPU)

The motherboard comes with a surface mount LGA1156 socket designed for the Intel® Core™ i7 / Core™ i5 Processor.

Ensure that all power cables are unplugged before installing the CPU.

• Upon purchase of the motherboard, ensure that the PnP cap is on the socket and the socket contacts are not bent. Contact your retailer immediately if the PnP cap is missing, or if you see any damage to the PnP cap/socket contacts/motherboard components. ASUS will shoulder the cost of repair only if the damage is shipment/ transit-related.

• Keep the cap after installing the motherboard. ASUS will process Return Merchandise

Authorization (RMA) requests only if the motherboard comes with the cap on the

LGA1156 socket.

• The product warranty does not cover damage to the socket contacts resulting from incorrect CPU installation/removal, or misplacement/loss/incorrect removal of the PnP cap.

2.3.1 Installing the CPU

To install a CPU:

1. Locate the CPU socket on the motherboard.

Chapter 2

2. Press the load lever with your thumb (A), and then move it to the right (B) until it is

Load lever

released from the retention tab.

To prevent damage to the socket pins, do not remove the PnP cap unless you are installing a CPU.

Retention tab

ASUS P7P55D 2-5

Page 26

3. Lift the load lever in the direction of the arrow until the load plate is completely lifted.

Chapter 2

4. Remove the PnP cap from the CPU socket.

Load plate

PnP cap

5. Position the CPU over the socket, ensuring that the gold triangle is on the bottom-left corner of the socket, and then

t the socket alignment keys into the CPU

CPU notches

notches.

The CPU ts in only one correct

orientation. DO NOT force the CPU into the socket to prevent bending the connectors on the socket and damaging the CPU!

2-6 Chapter 2: Hardware information

Gold

triangle

mark

Alignment keys

Page 27

6. Apply some Thermal Interface Material

to the exposed area of the CPU that the heatsink will be in contact with, ensuring that it is spread in an even thin layer.

Some heatsinks come with preapplied thermal paste. If so, skip this step.

The Thermal Interface Material is toxic and inedible. DO NOT eat it. If it gets into your eyes or touches your skin, wash it off immediately, and seek professional medical help.

7. Close the load plate (A), and then push down the load lever (B), ensuring that the front edge of the load plate slides under the retention knob (C).

Chapter 2

8. Insert the load lever under the retention tab.

ASUS P7P55D 2-7

Page 28

2.3.2 Installing the CPU heatsink and fan

The Intel® LGA1156 processor requires a specially designed heatsink and fan assembly to ensure optimum thermal condition and performance.

Chapter 2

To install the CPU heatsink and fan:

• When you buy a boxed Intel® processor, the package includes the CPU fan and heatsink assembly. If you buy a CPU separately, ensure that you use only Intel®-certied multi-directional heatsink and fan.

• Your Intel® LGA1156 heatsink and fan assembly comes in a push-pin design and requires no tool to install.

• Use an LGA1156-compatible CPU heatsink and fan assembly only. The LGA1156

socket is incompatible with the LGA775 and LGA1366 sockets in size and dimension.

If you purchased a separate CPU heatsink and fan assembly, ensure that the Thermal Interface Material is properly applied to the CPU heatsink or CPU before you install the heatsink and fan assembly.

Ensure that you have installed the motherboard to the chassis before you install the CPU fan and heatsink assembly.

1. Place the heatsink on top of the installed

CPU, making sure that the four fasteners match the holes on the motherboard.

2. Push down two fasteners at a time in

a diagonal sequence to secure the heatsink and fan assembly in place.

2-8 Chapter 2: Hardware information

Orient the heatsink and fan assembly such that the CPU fan cable is closest to the CPU fan connector.

Page 29

3. Connect the CPU fan cable to the connector on the motherboard labeled CPU_FAN.

DO NOT forget to connect the CPU fan connector! Hardware monitoring errors can occur if you fail to plug this connector.

2.3.3 Uninstalling the CPU heatsink and fan

To uninstall the CPU heatsink and fan:

Chapter 2

1. Disconnect the CPU fan cable from the connector on the motherboard.

2. Rotate each fastener counterclockwise.

3. Pull up two fasteners at a time in a

diagonal sequence to disengage the heatsink and fan assembly from the motherboard.

4. Carefully remove the heatsink and fan assembly from the motherboard.

ASUS P7P55D 2-9

Page 30

2.4 System memory

2.4.1 Overview

The motherboard comes with four Double Data Rate 3 (DDR3) Dual Inline Memory Modules (DIMM) sockets.

A DDR3 module has the same physical dimensions as a DDR2 DIMM but is notched differently to prevent installation on a DDR2 DIMM socket. DDR3 modules are developed for better performance with less power consumption.

The gure illustrates the location of the DDR3 DIMM sockets:

Chapter 2

Recommended memory congurations

One DIMM:

Install one memory module in slot A1 or B1 rst as a single-channel operation.

Two DIMMs (dual-channel operation):

Four DIMMs (dual-channel operation):

2-10 Chapter 2: Hardware information

Page 31

2.4.2 Memory congurations

You may install 1GB, 2GB and 4GB unbuffered and non-ECC DDR3 DIMMs into the DIMM sockets.

• You may install varying memory sizes in Channel A and Channel B. The system maps the total size of the lower-sized channel for the dual-channel conguration. Any excess memory from the higher-sized channel is then mapped for single-channel operation.

• Due to Intel spec denition, X.M.P. DIMMs are supported for one DIMM per channel

only.

• According to Intel CPU spec, DIMM voltage below 1.65V is recommended to protect the CPU.

• According to Intel CPU spec, CPUs with a core frequency of 2.66G support the maximum DIMM frequency of up to DDR3-1333. To use DIMMs of a higher frequency with a 2.66G CPU, enable the

3.5.3 Ai Overclock Tuner

• Always install DIMMs with the same CAS latency. For optimum compatibility, we recommend that you obtain memory modules from the same vendor.

• Due to the memory address limitation on 32-bit Windows OS, when you install 4GB or more memory on the motherboard, the actual usable memory for the OS can be about 3GB or less. For effective use of memory, we recommend that you do any of the following:

- Use a maximum of 3GB system memory if you are using a 32-bit Windows OS.

- Install a 64-bit Windows OS when you want to install 4GB or more on the

motherboard. For more details, refer to the Microsoft® support site at http://support.microsoft.com/kb/929605/en-us.

• This motherboard does not support DIMMs made up of 512Mb (64MB) chips or less (Memory chip capacity counts in Megabit, 8 Megabit/Mb = 1 Megabyte/MB).

DRAM O.C. Prole

for details.

feature in BIOS. Refer to section

Chapter 2

• The default memory operation frequency is dependent on its Serial Presence Detect (SPD), which is the standard way of accessing information from a memory module. Under the default state, some memory modules for overclocking may operate at a lower frequency than the vendor-marked value. To operate at the vendor-marked or at a higher frequency, refer to section 3.5 Ai Tweaker menu for manual memory frequency adjustment.

• For system stability, use a more efcient memory cooling system to support a full

memory load (4 DIMMs) or overclocking condition.

ASUS P7P55D 2-11

Page 32

P7P55D Motherboard Qualied Vendors Lists (QVL) DDR3-1067MHz

capability for CPU at 2.66, 2.8 and 2.93GHz

1024MB SS

2048MB DS

SS/DSChip

Chip NO.

Brand

MICRON D9KPT

ELPIDA J1108BABG-DJ-E

HYNIX H5TQ1G83AFPG7C

Vendor Part No. Size

CORSAIR CM3X1024-1066C7 1024MB DS N/A Heat-Sink Package 7 1.1 • • •

CT12864BA1067.8FF

Crucial

Crucial CT12864BA1067.8SFD 1024MB SS MICRON D9JNL 7 • • •

Crucial CT12872BA1067.9FF 1024MB SS MICRON D9KPT(ECC) 7(1066-9-9-9-25) • • •

Crucial CT25664BA1067.16FF 2048MB DS MICRON D9KPT 7(1066-7-7-7-20) • • •

Crucial CT25664BA1067.16SFD 2048MB DS MICRON D9JNL 7 • • •

Crucial CT25672BA1067.18FF 2048MB DS MICRON D9KPT(ECC) 7(1066-7-7-7-20) • • •

EBJ10UE8BAW0-AE-E

ELPIDA

ELPIDA EBJ11RD8BAFA-AE-E 1024MB DS ELPIDA J5308BASE-AC-E(ECC) 7 • • •

ELPIDA EBJ11UD8BAFA-AG-E 1024MB DS ELPIDA J5308BASE-AC-E 8 • • •

ELPIDA EBJ21UE8BAW0-AE-E 2048MB DS ELPIDA J1108BABG-DJ-E 7(1066-7-7-7-20) • • •

Hynix HMT112U6AFP8C-G7N0 1024MB SS HYNIX H5TQ1G83AFPG7C 7 • • •

Hynix HYMT112U64ZNF8-G7 1024MB SS HYNIX HY5TQ1G831ZNFP-G7 7 • •

HMT125U6AFP8C-G7N0

Hynix

HYMT125U64ZNF8-G7 2048MB DS HYNIX HY5TQ1G831ZNFP-G7 7 • •

Hynix

Chapter 2

KINGSTON KVR1066D3N7/1G 1024MB SS ELPIDA J1108BABG-DJ-E 1066-7-7-7-20 1.5 • • •

KINGSTON KVR1066D3N7/2G 2048MB DS ELPIDA J1108BABG-DJ-E 1066-7-7-7-20 1.5 • • •

KINGSTON KVR1066D3N7/4G 4096MB DS SAMSUNG K4B2G0846B-HCF8 1066-7-7-7-20 1.5 • • •

MICRON MT8JTF12864AY-1G1D1 1024MB SS MICRON 7VD22 7 • • •

MICRON MT8JTF12864AZ-1G1F1 1024MB SS MICRON 8ZF22 D9KPV 7(1066-7-7-7-20) • • •

MICRON MT8JTF12864AZ-1G1F1 1024MB SS MICRON D9KPT 7(1066-7-7-7-20) • • •

MICRON MT9JSF12872AZ-1G1F1 1024MB SS MICRON D9KPT(ECC) 7(1066-9-9-9-25) • •

MICRON MT16JTF25664AY-1G1D1 2048MB DS MICRON 7VD22 7 • • •

MICRON MT16JTF25664AZ-1G1F1 2048MB DS MICRON 8ZF22 D9KPV 7(1066-7-7-7-20) • • •

MICRON MT16JTF25664AZ-1G1F1 2048MB DS MICRON D9KPT 7(1066-7-7-7-20) • • •

MICRON MT18JSF25672AZ-1G1F1 2048MB DS MICRON D9KPT(ECC) 7(1066-7-7-7-20) • •

SAMSUNG M378B5273BH1-CF8 4096MB DS SAMSUNG K4B2G0846B-HCF8 8(7-7-7-20) 1.5 • • •

Transcend TS256MLK64V1U 2048MB DS ELPIDA J1108BABG-AE-E 7(1066-7-7-7-20) • • •

Asint SLY3128M8-EAE 1024MB SS Asint DDRIII1208-AE (7-7-7-20) • • •

Asint SLZ3128M8-EAE 2048MB DS Asint DDRIII1208-AE (7-7-7-20) • • •

WINTEC 3DU3191A-10 1024MB DS Qimonda IDSH51-03A1F1C-10F 7 • • •

Timing Lable(Bios)

7(1066-7-7-7-20)

Voltage

DIMM socket support (Optional)

A* B* C*

• •

•

• •

•

• •

•

P7P55D Motherboard Qualied Vendors Lists (QVL) DDR3-1333MHz

capability for CPU at 2.66, 2.8 and 2.93GHz

Vendor Part No. Size

A-DATA AD133301GOU 1024MB SS A-DATA AD30908C8D-15IG 1333-9-9-9-24 • • •

A-DATA AD1333002GOU 2048MB DS A-DATA AD30908C8D-15IG 1333-9-9-9-24 • • •

A-DATA AD31333E002G0U 6144MB(Kit of 3) DS N/A Heat-Sink Package 7-7-7-20(1333-9-9-9-24) 1.65-1.85 • • •

Apacer 78.01GC6.420 1024MB SS ELPIDA J1108BABG-DJ-E (1333-9-9-9-24) • • •

Apacer 78.01GC6.9L0 1024MB SS Apacer AM5D5808AEWSBG 9(1333-9-9-9-24) • • •

Apacer 78.01GC8.422 1024MB SS ELPIDA J1108BABG-DJ-E(ECC) (1333-9-9-9-24) • •

Apacer 78.A1GC6.421 2048MB DS ELPIDA J1108BABG-DJ-E (1333-9-9-9-24) • • •

Apacer 78.A1GC6.9L1 2048MB DS Apacer AM5D5808AEWSBG 9(1333-9-9-9-24) • • •

Apacer 78.A1GC8.423 2048MB DS ELPIDA J1108BABG-DJ-E(ECC) (1333-9-9-9-24) • • •

CORSAIR TR3X3G1333C9 (Ver2.1) 3072MB(Kit of 3) SS N/A Heat-Sink Package 9-9-9-24(1333-9-9-9-24) 1.5 • • •

CORSAIR CM3X1024-1333C9DHX 1024MB DS N/A Heat-Sink Package (1333-9-9-9-24) 1.1 • •

BoxP/N:TWIN3X2048-1333C9

CORSAIR

(CM3X1024-1333C9)Ver1.1

BoxP/N:TW3X4G1333C9DHX

CORSAIR

(CM3X2048-1333C9DHX)Ver3.2

CORSAIR TR3X6G1333C9 (Ver2.1) 6144MB(Kit of 3) DS N/A Heat-Sink Package 9-9-9-24(1333-9-9-9-24) 1.5 • • •

Crucial CT12864BA1339.8FF 1024MB SS MICRON D9KPT 9(1333-9-9-9-24) • • •

Crucial CT12864BA1339.8SFD 1024MB SS MICRON MT8JF12864AY-1G4D1 (1333-9-9-9-24) • • •

Crucial CT12872BA1339.9FF 1024MB SS MICRON D9KPT(ECC) 9(1333-9-9-9-24) • • •

Crucial CT25664BA1339.16FF 2048MB DS MICRON D9KPT 9(1333-9-9-9-24) • • •

2048MB(Kit of 2) DS N/A Heat-Sink Package 9-9-9-24(1066-7-7-7-20) 1.70 • • •

4096MB(Kit of 2) DS N/A Heat-Sink Package 9-9-9-24(1066-7-7-7-20) 1.70 • •

SS/DSChip

Brand

Chip NO.

Timing Dimm(Bios)

2-12 Chapter 2: Hardware information

Voltage

DIMM socket support (Optional)

A* B* C*

Page 33

P7P55D Motherboard Qualied Vendors Lists (QVL) DDR3-1333MHz

capability for CPU at 2.66, 2.8 and 2.93GHz (continued)

Vendor Part No. Size

Crucial CT25672BA1339.18FF 2048MB DS MICRON D9KPT(ECC) 9(1333-9-9-9-24) • • •

Crucial BL25664BA1336.16SFB1

ELPIDA EBJ10UE8BAW0-DJ-E 1024MB SS ELPIDA J1108BABG-DJ-E 9(1333-9-9-9-24) • • •

ELPIDA EBJ21UE8BAW0-DJ-E 2048MB DS ELPIDA J1108BABG-DJ-E 9(1333-9-9-9-24) • • •

G.SKILL F3-10600CL7D-2GBPI 2048MB(Kit of 2) SS N/A Heat-Sink Package (1337-7-7-7-18) 1.65 • •

G.SKILL F3-10600CL8D-2GBHK 2048MB(Kit of 2) SS N/A Heat-Sink Package (1337-8-8-8-22) 1.65 • • •

G.SKILL F3-10666CL7T-6GBPK(XMP) 2048MB DS N/A Heat-Sink Package 7-7-7-18(1333-7-7-7-18) 1.5-1.6 • • •

G.SKILL F3-10666CL8D-4GBHK(XMP)

G.SKILL F3-10666CL9T-6GBNQ 6144MB(Kit of 3) DS N/A Heat-Sink Package 9-9-9-24(1333-9-9-9-24) 1.5 • • •

GEIL GV34GB1333C7DC 4096MB(Kit of 2) DS N/A Heat-Sink Package 7-7-7-24(1333-8-8-8-28) 1.5 • • •

Hynix HMT112U6BFR8C-H9 1024MB SS Hynix H5TQ1G83BFR 9(1333-9-9-9-24) • • •

Hynix HMT125U6BFR8C-H9 2048MB DS Hynix H5TQ1G83BFR 9(1333-9-9-9-24) • • •

Hynix HMT125U6BFR8C-H9 2048MB DS Hynix H5TQ1G83BFRH9C 9(1333-9-9-9-24) • • •

KINGMAX FLFD45F-B8EE9

KINGSTON KVR1333D3N9/1G 1024MB SS ELPIDA J1108BABG-DJ-E 9(1066-8-7-7-20) 1.5 • • •

KINGSTON KVR1333D3N9/2G 2048MB DS ELPIDA J1108BABG-DJ-E 1333-9-9-9-24 1.5 • • •

KINGSTON KVR1333D3N9/2G 2048MB DS ELPIDA J1108BABG-DJ-E 9(1066-8-7-7-20) 1.5 • • •

MICRON MT8JTF12864AY-1G4BYES 1024MB SS MICRON Z9HWR (1333-9-9-9-24) • •

MICRON MT8JTF12864AZ-1G4F1 1024MB SS MICRON 9FF22 D9KPT 9(1066-8-8-8-20) • • •

MICRON MT8JTF12864AZ-1G4F1 1024MB SS MICRON D9KPT 9(1333-9-9-9-24) • • •

MICRON MT9JSF12872AZ-1G4F1 1024MB SS MICRON D9KPT(ECC) 9(1333-9-9-9-24) • • •

MICRON MT16JF25664AZ-1G4F1 2048MB DS MICRON D9KPT 9(1333-9-9-9-24) • • •

MICRON MT16JTF25664AZ-1G4F1 2048MB DS MICRON 9FF22 D9KPT 9(1066-8-8-8-20) • • •

MICRON MT18JSF25672AZ-1G4F1 2048MB DS MICRON D9KPT(ECC) 9(1333-9-9-9-24) • • •

OCZ OCZ3RPX1333EB2GK 1024MB SS N/A Heat-Sink Package (1066-6-5-5-20) • •

OCZ OCZ3G1333LV3GK 3072MB(Kit of 3) SS N/A Heat-Sink Package 9-9-9(1066-7-7-7-20) 1.65 • •

OCZ OCZ3P1333LV3GK 3072MB(Kit of 3) SS N/A Heat-Sink Package 7-7-7(1066-7-7-7-16) 1.65 • • •

OCZ OCZ3P13332GK 1024MB DS N/A Heat-Sink Package 7-7-7-20(1333-9-9-9-24) • •

OCZ OCZ3P13334GK 4096MB(Kit of 2) DS N/A Heat-Sink Package 7(1333-7-7-7-20) 1.8 • • •

OCZ OCZ3G1333LV6GK 6144MB(Kit of 3) DS N/A Heat-Sink Package 9-9-9(1066-7-7-7-20) 1.65 • • •

OCZ OCZ3P1333LV6GK 6144MB(Kit of 3) DS N/A Heat-Sink Package 7-7-7(1066-7-7-7-20) 1.65 • • •

OCZ OCZX1333LV6GK(XMP) 6144MB(Kit of 3) DS NA Heat-Sink Package 8-8-8(1066-7-7-7-16) 1.6 • • •

SAMSUNG M378B2873DZ1-CH9 1024MB SS SAMSUNG K4B1G0846D 9(1333-9-9-9-24) • • •

SAMSUNG M378B2873EH1-CH9 1024MB SS SAMSUNG K4B1G0846E 1066-8-7-7-20 • • •

SAMSUNG M391B2873DZ1-CH9 1024MB SS SAMSUNG K4B1G0846D(ECC) 9(1333-9-9-9-24) • • •

SAMSUNG M378B5673DZ1-CH9 2048MB DS SAMSUNG K4B1G0846D 9(1333-9-9-9-24) • • •

SAMSUNG M378B5673EH1-CH9 2048MB DS SAMSUNG K4B1G0846E 1066-8-7-7-20 • • •

SAMSUNG M391B5673DZ1-CH9 2048MB DS SAMSUNG K4B1G0846D(ECC) 9(1333-9-9-9-24) • • •

SAMSUNG M378B5273BH1-CH9 4096MB DS SAMSUNG K4B2G0846B-HCH9 9(1333-9-9-9-24) • • •

Super Talent W1333UX2GB(XMP) 2048MB(Kit of 2) SS N/A Heat-Sink Package 8(1333-8-8-8-24) 1.8 • • •

Transcend TS128MLK64V3U 1024MB SS SAMSUNG K4B1G0846D 9(1333-9-9-9-24) • • •

Transcend TS256MLK64V3U 2048MB DS SAMSUNG K4B1G0846D 9(1333-9-9-9-24) • • •

Asint SLY3128M8-EDJ 1024MB SS Asint DDRIII1208-DJ (9-9-9-24) • • •

Asint SLY3128M8-EDJE 1024MB SS ELPIDA J1108BASE-DJ-E 1066-8-8-8-20 • • •

Asint SLZ3128M8-EDJ 2048MB DS Asint DDRIII1208-DJ (9-9-9-24) • • •

Asint SLZ3128M8-EDJE 2048MB DS ELPIDA J1108BASE-DJ-E 1066-8-8-8-20 • • •

ASUS N/A 1024MB DS N/A Heat-Sink Package (1333-9-9-9-24) • • •

BUFFALO FSX1333D3G-1G 1024MB SS N/A Heat-Sink Package (1066-7-7-7-20) • •

BUFFALO FSH1333D3G-T3G(XMP) 3072MB(Kit of 3) SS N/A Heat-Sink Package 7-7-7-20(1066-8-7-7-20) • • •

BUFFALO FSX1333D3G-2G 2048MB DS N/A Heat-Sink Package (1066-7-7-7-20) • •

Patriot PDC32G1333LLK 1024MB SS PATRIOT Heat-Sink Package 7(1337-7-7-7-20) 1.7 • •

Patriot PVT33G1333ELK 3072MB(Kit of 3) SS N/A Heat-Sink Package 9-9-9-24(1066-7-7-7-20) 1.65 • • •

Patriot PVS34G1333ELK 4096MB(Kit of 2) DS N/A Heat-Sink Package 9-9-9-24(1066-7-7-7-20) 1.5 • • •

Patriot PVS34G1333LLK 4096MB(Kit of 2) DS N/A Heat-Sink Package 7-7-7-20(1066-7-7-7-20) 1.7 • •

Patriot PVT36G1333ELK 6144MB(Kit of 3) DS N/A Heat-Sink Package 9-9-9-24(1066-7-7-7-20) 1.65 • • •

Silicon

SP001GBLTU133S02 1024MB SS S-POWER I0YT3E0 9(1333-9-9-9-24) • • •

Power

Silicon

SP002GBLTU133S02 2048MB DS S-POWER I0YT3E0 9(1333-9-9-9-24) • • •

Power

4096MB(Kit of 2)

4096MB(Kit of 2) DS

1024MB SS

SS/DSChip

Brand

DS NA

N/A

ELPIDA

Chip NO.

Heat-Sink Package 6-6-6-20(1333-9-9-9-24)

Heat-Sink Package 8-8-8-21(1333-7-7-7-20)

J1108BASE-DJ-E (1333-9-9-9-24)

Timing Dimm(Bios)

Voltage

1.8

1.5-1.6

DIMM socket support (Optional)

A* B* C*

• •

•

Chapter 2

ASUS P7P55D 2-13

Page 34

P7P55D Motherboard Qualied Vendors Lists (QVL) DDR3-1600MHz

capability for CPU at 2.66GHz

Vendor Part No. Size

A-DATA AD31600E001GMU 3072MB(Kit of 3) SS N/A Heat-Sink Package 8-8-8-24(1333-9-9-9-24) 1.65-1.85 • • •

A-DATA

CORSAIR TR3X3G1600C8D(XMP)Ver2.1 3072MB(Kit of 3) SS N/A Heat-Sink Package 8-8-8-24(1601-8-8-8-24) 1.65 • •

CORSAIR TR3X3G1600C8D 3072MB(Kit of 3) SS N/A Heat-Sink Package 8-8-8-24(1600-8-8-8-24) 1.65 • •

CORSAIR TR3X3G1600C9(XMP)Ver1.1 3072MB(Kit of 3) SS N/A Heat-Sink Package 9-9-9-24(1601-9-9-9-24) 1.65 • •

CORSAIR

CORSAIR TR3X6G1600C8D(XMP)Ver2.1 6144MB(Kit of 3) DS N/A Heat-Sink Package 8-8-8-24(1601-8-8-8-24) 1.65 • • •

CORSAIR

CORSAIR TR3X6G1600C9(XMP)Ver2.1 6144MB(Kit of 3) DS N/A Heat-Sink Package 9-9-9-24(1333-9-9-9-24) 1.65 • • •

Crucial BL12864BA1608.8SFB(XMP) 1024MB SS N/A Heat-Sink Package (1601-8-8-8-24) 1.8 • • •

G.SKILL F3-12800CL9D-2GBNQ 2048MB(Kit of 2) SS N/A Heat-Sink Package (1333-9-9-9-24) 1.6 • • •

G.SKILL F3-12800CL8T-6GBHK(XMP) 6144MB(Kit of 3) DS N/A Heat-Sink Package 8-8-8-21(1333-8-8-8-21) 1.6-1.65 • • •

G.SKILL F3-12800CL8T-6GBPI(XMP) 6144MB(Kit of 3) DS N/A Heat-Sink Package 8-8-8-21(1066-8-8-8-20) 1.6~1.65 • • •

Chapter 2

G.SKILL F3-12800CL9T-6GBNQ 6144MB(Kit of 3) DS N/A Heat-Sink Package 9-9-9-24(1601-9-9-9-24) 1.5-1.6 • • •

GEIL GV34GB1600C8DC 4096MB(Kit of 2) DS N/A Heat-Sink Package 8-8-8-28(1600-8-8-8-28) 1.6 • • •

KINGMAX FLGD45F-B8KG9-NAES 1024MB SS KINGMAX KFB8FNGXF-ANX-12A 9(1600-9-8-9-28) 1.5 • • •

KINGMAX FLGE85F-B8KG9-NEES 2048MB DS KINGMAX KFB8FNGXF-ANX-12A 9(1600-9-8-9-28) 1.5 • • •

KINGSTON KHX12800D3LLK3/3GX(XMP) 3072MB(Kit of 3) SS N/A Heat-Sink Package 1600-8-8-8-20 1.65 • • •

KINGSTON KHX12800D3K2/4G 4096MB(Kit of 2) DS N/A Heat-Sink Package 9(1333-9-9-9-24) 1.9 • • •

KINGSTON KHX12800D3LLK3/6GX(XMP) 6144MB(Kit of 3) DS N/A Heat-Sink Package (1066-8-8-8-20) 1.65 • • •

OCZ OCZ3P1600EB1G 1024MB SS N/A Heat-Sink Package 7-6-6-24(1333-7-7-7-20) • •

OCZ OCZ3G1600LV3GK 3072MB(Kit of 3) SS N/A Heat-Sink Package 8-8-8(1066-7-7-7-20) 1.65 • • •

OCZ OCZ3P1600LV3GK 3072MB(Kit of 3) SS N/A Heat-Sink Package 7-7-7(1066-7-7-7-20) 1.65 • • •

OCZ OCZ3P16004GK 4096MB(Kit of 2) DS N/A Heat-Sink Package 7-7-7(1333-7-7-7-20) 1.9 • •

OCZ OCZ3P1600EB4GK 4096MB(Kit of 2) DS N/A Heat-Sink Package 7-7-6(1333-7-7-7-20) 1.8 • • •

OCZ OCZ3G1600LV6GK 6144MB(Kit of 3) DS N/A Heat-Sink Package 8-8-8(1066-7-7-7-16) 1.65 • •

OCZ OCZ3X1600LV6GK(XMP) 6144MB(Kit of 3) DS N/A Heat-Sink Package 8-8-8(1066-7-7-7-16) 1.65 • • •

Cell Shock CS322271 2048MB(Kit of 2) DS N/A Heat-Sink Package 7-7-7-14(1066-7-7-7-20) 1.7-1.9 • • •

Mushkin 996657 4096MB(Kit of 2) DS N/A Heat-Sink Package 7-7-7-20 • • •

Mushkin 998659(XMP) 6144MB(Kit of 3) DS N/A Heat-Sink Package 9-9-9-24(1333-9-9-9-24) 1.5-1.6 • • •

Patriot PVT33G1600ELK 3072MB(Kit of 3) SS N/A Heat-Sink Package 9-9-9-24(1066-7-7-7-20) 1.65 • • •

Patriot PVS34G1600ELK 4096MB(Kit of 2) DS N/A Heat-Sink Package 9-9-9-24(1066-7-7-7-20) 1.8 • •

Patriot PVS34G1600LLK(XMP) 4096MB(Kit of 2) DS N/A Heat-Sink Package 7-7-7-20(1066-7-7-7-20) 1.9 • • •

Patriot PVS34G1600LLKN 4096MB(Kit of 2) DS N/A Heat-Sink Package 7-7-7-20(1066-7-7-7-20) 2.0 • •

Patriot PVT36G1600ELK 6144MB(Kit of 3) DS N/A Heat-Sink Package 9-9-9-24(1066-7-7-7-20) 1.65 • • •

Patriot PVT36G1600ELK 6144MB(Kit of 3)144MB(Kit of 3) DS N/A Heat-Sink Package 9-9-9-24(1600-7-7-7-20) 1.65 • • •

PQI MFADR401PA0102(XMP) 2048MB DS SAMSUNG K4B1G08460 1066-8-8-8-20 • • •

AD31600F002GMU(XMP)

BoxP/N:TW3X4G1600C9DHXNV (CM3X2G1600C9DHXNV)Ver4.1

TR3X6G1600C8D

SS/DSChip

6144MB(Kit of 3) DS

4096MB(Kit of 2) DS N/A Heat-Sink Package (1333-9-9--9-24) 1.80 • • •

6144MB(Kit of 3) DS

Chip NO.

Brand

N/A Heat-Sink Package

Timing Dimm(Bios)

7-7-7-20(1333-9-9-9-24)

8-8-8-24(1600-8-8-8-24)

Voltage

1.75-1.85 •

1.65 •

DIMM socket support (Optional)

A* B* C*

• •

2-14 Chapter 2: Hardware information

Page 35

P7P55D Motherboard Qualied Vendors Lists (QVL) DDR3-1600MHz

capability for CPU at 2.8 and 2.93GHz

Vendor Part No. Size

A-DATA AD31600E001GMU 3072MB(Kit of 3) SS N/A Heat-Sink Package 8-8-8-24(1333-9-9-9-24) 1.65-1.85 • • •

AD31600F002GMU(XMP)

A-DATA

CORSAIR TR3X3G1600C8D(XMP)Ver2.1 3072MB(Kit of 3) SS N/A Heat-Sink Package 8-8-8-24(1601-8-8-8-24) 1.65 • •

CORSAIR TR3X3G1600C8D 3072MB(Kit of 3) SS N/A Heat-Sink Package 8-8-8-24(1600-8-8-8-24) 1.65 • •

CORSAIR TR3X3G1600C9(XMP)Ver1.1 3072MB(Kit of 3) SS N/A Heat-Sink Package 9-9-9-24(1601-9-9-9-24) 1.65 • •

CORSAIR BoxP/N:TW3X4G1600C9DHXNV

(CM3X2G1600C9DHXNV)Ver4.1