No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer
Law. You are entitled to a replacement or refund for a major failure and compensation for
any other reasonably foreseeable loss or damage caused by our goods. You are also entitled
to have the goods repaired or replaced if the goods fail to be of acceptable quality and the
failure does not amount to a major failure. If you require assistance please call ASRock Tel
: +886-2-28965588 ext.123 (Standard International call charges apply)
e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
INTEL END USER SOFTWARE LICENSE AGREEMENT
IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
LICENSE. Licensee has a license under Intel’s copyrights to reproduce Intel’s Soware
only in its unmodied and binary form, (with the accompanying documentation, the
“Soware”) for Licensee’s personal use only, and not commercial use, in connection with
Intel-based products for which the Soware has been provided, subject to the following
conditions:
(a) Licensee may not disclose, distribute or transfer any part of the Soware, and You agree
to prevent unauthorized copying of the Soware.
(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.
(c) Licensee may not sublicense the Soware.
(d) e Soware may contain the soware and other intellectual property of third party
suppliers, some of which may be identied in, and licensed in accordance with, an enclosed
license.txt le or other text or le.
(e) Intel has no obligation to provide any support, technical assistance or updates for the
Soware.
OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware
remains with Intel or its licensors or suppliers. e Soware is copyrighted and protected
by the laws of the United States and other countries, and international treaty provisions.
Licensee may not remove any copyright notices from the Soware. Except as otherwise
expressly provided above, Intel grants no express or implied right under Intel patents,
copyrights, trademarks, or other intellectual property rights. Transfer of the license terminates Licensee’s right to use the Soware.
DISCLAIMER OF WARRANTY. e Soware is provided “AS IS” without warranty of
any kind, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION,
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.
LIMITATION OF LIABILITY. NEITHER INTEL NOR ITS LICENSORS OR SUPPLIERS
WILL BE LIABLE FOR ANY LOSS OF PROFITS, LOSS OF USE, INTERRUPTION OF
BUSINESS, OR INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAG
ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN
IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
LICENSE TO USE COMMENTS AND SUGGESTIONS. is Agreement does NOT
obligate Licensee to provide Intel with comments or suggestions regarding the Soware.
However, if Licensee provides Intel with comments or suggestions for the modication,
correction, improvement or enhancement of (a) the Soware or (b) Intel products or
processes that work with the Soware, Licensee grants to Intel a non-exclusive, worldwide,
perpetual, irrevocable, transferable, royalty-free license, with the right to sublicense, under
Licensee’s intellectual property rights, to incorporate or otherwise utilize those comments
and suggestions.
TERMINATION OF THIS LICENSE. Intel or the sublicensor may terminate this license
at any time if Licensee is in breach of any of its terms or conditions. Upon termination,
Licensee will immediately destroy or return to Intel all copies of the Soware.
THIRD PARTY BENEFICIARY. Intel is an intended beneciary of the End User License
Agreement and has the right to enforce all of its terms.
U.S. GOVERNMENT RESTRICTED RIGHTS. e Soware is a commercial item (as
dened in 48 C.F.R. 2.101) consisting of commercial computer soware and commercial
computer soware documentation (as those terms are used in 48 C.F.R. 12.212), consistent
with 48 C.F.R. 12.212 and 48 C.F.R 227.7202-1 through 227.7202-4. You will not provide
the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation,
2200 Mission College Blvd., Santa Clara, CA 95054.
EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will
export/re-export the Soware, directly or indirectly, to any country for which the U.S.
Department of Commerce or any other agency or department of the U.S. Government
or the foreign government from where it is shipping requires an export license, or other
governmental approval, without rst obtaining any such required license or approval. In
the event the Soware is exported from the U.S.A. or re-exported from a foreign destination by Licensee, Licensee will ensure that the distribution and export/re-export or import
of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S.
Export Administration Regulations and the appropriate foreign government.
APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will
be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws
principles. e Parties to this Agreement exclude the application of the United Nations
Convention on Contracts for the International Sale of Goods (1980). e state and federal
courts sitting in Delaware, U.S.A. will have exclusive jurisdiction over any dispute arising
out of or relating to this Agreement. e Parties consent to personal jurisdiction and venue
in those courts. A Party that obtains a judgment against the other Party in the courts identied in this section may enforce that judgment in any court that has jurisdiction over the
Parties.
Licensee’s specic rights may vary from country to country.
CE Warning
is device complies with directive 2014/53/EU issued by the Commision of the European
Community.
is equipment complies with EU radiation exposure limits set forth for an uncontrolled
environment.
is equipment should be installed and operated with minimum distance 20cm between
the radiator & your body.
Operations in the 5.15-5.35GHz band are restricted to indoor usage only.
Radio transmit power per transceiver type
FunctionFrequencyMaximum Output Power (EIRP)
2400-2483.5 MHz18.5 + / -1.5 dbm
5150-5250 MHz21.5 + / -1.5 dbm
WiFi
Bluetooth2400-2483.5 MHz8.5 + / -1.5 dbm
5250-5350 MHz
5470-5725 MHz
18.5 + / -1.5 dbm (no TPC)
21.5 + / -1.5 dbm (TPC)
25.5 + / -1.5 dbm (no TPC)
28.5 + / -1.5 dbm (TPC)
Motherboard Layout
PCIE1
DDR4_ A1 (64 bi t, 288- pi n mod ul e)
DDR4_ B1 (64 bi t, 288- pi n mod ul e)
CPU_FAN1
CHA_FAN1/WP
7
RoHS
H670M-ITX/ax
2
8
10
15
9
19
16
6
1
HD_AUDIO1
SPEAK ER1
Intel
H670
ATXPWR1
USB3_ 12
1
4
3
PANEL1
HDLED RESET
PLED PWRBTN
1
Top:
LIN E IN
Cen ter:
FRO NT
Bot tom:
MIC I N
SATA3_3
SATA3_2
1
CLRMOS1
SATA3_1
SATA3_0
1
USB_56
M2_ 2
RJ-45:
2.5G LAN
1
11
12
13
14
M2_WIFI1
DP_ 1
CHA_FAN2
USB 3.2 Gen2x2:
USB32_TC_1
HDM I1
USB 2.0
T: USB_1
B: USB_2
RGB_LED1
1
M2_ 1
USB 3.2 Gen2:
USB31_TA_1
RJ-45:
LAN
USB 2.0:
USB_3
USB 3.2 Gen2:
USB_4
F_USB3_TC_1
ADDR_ LED1
1
5
17
18
BIOS_FB1_PH1
USB 2.0:
BIOS_FB1_USB1
1
H670M-ITX/ax
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1
No. Description
1Chassis/Waterpump Fan Connector (CHA_FAN1/WP)
2ATX 12V Power Connector (ATX12V1)
3CPU Fan Connector (CPU_FAN1)
42 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
5RGB LED Header (RGB_LED1)
6ATX Power Connector (ATXPWR1)
7USB 2.0 Header (USB_56)
8USB 3.2 Gen1 Header (USB3_12)
9SATA3 Connector (SATA3_1)
10 SATA3 Connector (SATA3_0)
11 SATA3 Connector (SATA3_3)
12 SATA3 Connector (SATA3_2)
13 Front Panel Type C USB 3.2 Gen1 Header (F_USB3_TC_1)
14 System Panel Header (PANEL1)
15 Addressable LED Header (ADDR_LED1)
16 Clear CMOS Jumper (CLRMOS1)
17 Chassis Fan Connector (CHA_FAN2)
18 Chassis Speaker Header (SPEAKER1)
19 Front Panel Audio Header (HD_AUDIO1)
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I/O Panel
H670M-ITX/ax
5
1
2
34
6
15
14
13
911
8
7
1210
No. DescriptionNo. Description
1DisplayPort 1.49USB 3.2 Gen2 Type-A Port (USB31_TA_1)
2BIOS Flashback Button10USB 3.2 Gen2x2 Type-C Port (USB32_TC_1)
3LAN RJ-45 Port (Intel® I219V)*11USB 2.0 Port (USB_3)
42.5G LAN RJ-45 Port (Dragon RTL8125BG)** 12USB 3.2 Gen2 Port (USB_4)
5Line In (Light Blue)***13USB 2.0 Ports (USB_12)
6Front Speaker (Lime)***14USB 2.0 Port (BIOS_FB1_USB1)
7Antenna Ports15HDMI Port
8Microphone (Pink)***
* ere are two LEDs on ea ch LAN port. Please refer to the table below for the LA N port LED indications .
*** Function of the Audio Ports in 7.1-channel Conguration:
PortFunction
Light Blue (Rear panel)Rear Speaker Out
Lime (Rear panel)Front Speaker Out
Pink (Rear panel)Central /Subwoofer Speaker Out
Lime (Front panel)Side Speaker Out
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H670M-ITX/ax
802.11ax Wi-Fi 6E Module and ASRock WiFi 2.4/5/6 GHz
Antennas
802.11ax Wi-Fi 6E + BT Module
is motherboard comes with an exclusive 802.11 a/b/g/n/ax Wi-Fi 6E + BT module
(pre-installed on the rear I/O panel) that oers support for 802.11 a/b/g/n/ax WiFi 6E connectivity standards and Bluetooth. Wi-Fi 6E + BT module is an easyto-use wireless local area network (WLAN) adapter to support Wi-Fi 6E + BT.
Bluetooth standard features Smart Ready technology that adds a whole new class of
functionality into the mobile devices. BT also includes Low Energy Technology and
ensures extraordinary low power consumption for PCs.
* e transmission speed may vary according to the environment.
* Wi-Fi 6E (6GHz band) is not currently enabled by default due to the dierent
regulation status of each country. It will be activated (for supported countries)
through Windows Update and soware update once available. e update is
expected to be in the middle of 2021.
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5
WiFi Antennas Installation Guide
Step 1
Prepare the WiFi 2.4/5/6 GHz Antennas that
come with the package.
Step 2
Connect the two WiFi 2.4/5/6 GHz Antennas
to the antenna connectors. Turn the antenna
clockwise until it is securely connected.
Step 3
Set the WiFi 2.4/5/6 GHz Antenna as shown in
the illustration.
*You may need to adjust the direction of
the antenna for a stronger signal.
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6
Chapter 1 Introduction
ank you for purchasing ASRock H670M-ITX/ax motherboard, a reliable
motherboard produced under ASRock ’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
Becau se the motherboard specication s and the BIOS soware might be updated, the
content of this doc umentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version w ill be available on
ASRock’s website without further notice. If you require technical support related to
this motherboard, please visit our website for specic infor mation about the model
you are using. You may nd the latest VGA cards and CPU support li st on ASRock’s
website a s well. ASRock website http://www.asrock.com.
1.1 Package Contents
ASRock H670M-ITX/ax Motherboard (Mini-ITX Form Factor)
•
ASRock H670M-ITX/ax Quick Installation Guide
•
ASRock H670M-ITX/ax Support CD
•
2 x Serial ATA (SATA) Data Cables (Optional)
•
1 x I/O Panel Shield
•
2 x ASRock WiFi 2.4/5/6 GHz Antennas (Optional)
•
2 x Screws for M.2 Sockets (Optiona l)
•
H670M-ITX/ax
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1.2 Specications
Platform
CPU
Chipset
Memory
•
•
•
•
•
•
•
•
•
•
•
* Supports DDR4 3200 natively.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
•
•
Mini-ITX Form Factor
8 Layer PCB
Supports 12th Gen Intel® CoreTM Processors (LGA1700)
Digi Power design
8 Power Phase design
Supports Intel® Hybrid Technology
Supports Intel® Turbo Boost Max 3.0 Technology
Intel® H670
Dual Channel DDR4 Memory Technology
2 x DDR4 DIMM Slots
Supports DDR4 non-ECC, un-buered memory up to
5000+(OC)*
Supports ECC UDIMM memory modules (operate in nonECC mo de)
Max. capacity of system memory: 64GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
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Expansion
Slot
Graphics
1 x PCIe Gen5x16 Slot*
•
* Supports PCIe riser cards to extend one x16 slot to two x8 slots
* Supports NVMe SSD as boot disks
1 x Vertical M.2 Socket (Key E), supports type 2230 WiFi/BT
•
PCIe WiFi module and Intel® CNVi (Integrated WiFi/BT)
* Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
Intel® Xe Graphics Architecture (Gen 12)
•
Dual graphics output: support HDMI and DisplayPort 1.4
•
ports by independent display controllers
Supports HDMI 2.1 TMDS Compatible with max. resolution
•
up to 4K x 2K (4096x2160) @ 60Hz
Audio
Supports DisplayPort 1.4 with DSC (compressed) max.
•
resolution up to 8K (7680x4320) @ 60Hz / 5K (5120x3200) @
120Hz
Supports HDCP 2.3 with HDMI 2.1 TMDS Compatible and
•
DisplayPort 1.4 Ports
7.1 CH HD Audio (Realtek ALC897 Audio Codec)
•
Supports Surge Protection
•
Nahimic Audio
•
H670M-ITX/ax
LAN
Wireless
LAN
1 x 2.5 Gigabit LAN 10/100/1000/2500 Mb/s (Dragon RTL-
8125BG)
Supports Dragon 2.5G LAN Soware
•
- Smart Auto Adjust Bandwidth Control
- Visual User Friendly UI
- Visual Network Usage Statistics
- Optimized Default Setting for Game, Browser, and
Streaming Modes
- User Customized Priority Control
Supports Wake-On-LAN
•
Supports Lightning/ESD Protection
•
Supports Energy Ecient Ethernet 802.3az
•
Supports PXE
•
1 x Gigabit LAN 10/100/1000 Mb/s (Intel® I219V)
Supports Wake-On-LAN
•
Supports Lightning/ESD Protection
•
Supports Energy Ecient Ethernet 802.3az
•
Supports UEFI PXE
•
802.11ax Wi-Fi 6E Module
•
Supports IEEE 802.11a/b/g/n/ax
•
Supports Dual-Band 2x2 160MHz with extended 6GHz
•
band* support
* Wi-Fi 6E (6GHz band) will be supported by Microso®
Windows® 11. e availability will depend on the dierent
regulation status of each country and region.
It will be activated (for supported countries) through Windows
Update and soware updates once available.
* A 6GHz compatible router is required for 6E functionality.
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9
Rear Panel
I/O
Storage
2 antennas to support 2 (Transmit) x 2 (Receive) diversity
•
technology
Supports Bluetooth + High speed class II
•
Supports MU-MIMO
•
2 x Antenna Ports
•
1 x HDMI Port
•
1 x DisplayPort 1.4
•
2 x USB 3.2 Gen2 Ports (10 Gb/s) (Supports ESD Protection)
•
1 x USB 3.2 Gen2x2 Type-C Port (20 Gb/s) (Supports ESD
•
Protection)
4 x USB 2.0 Ports (Supports ESD Protection)
•
2 x RJ-45 LAN Ports with LED (ACT/LINK LED and SPEED
•
LED)
1 x BIOS Flashback Button
•
HD Audio Jacks: Line in / Front Speaker / Microphone
•
4 x SATA3 6.0 Gb/s Connectors
•
1 x Hyper M.2 Socket (M2_1, Key M), supports type 2280
•
PCIe Gen4x4 (64 Gb/s) mode*
1 x Hyper M.2 Socket (M2_2, Key M), supports type 2280
Supports RAID 0, RAID 1, RAID 5 and RAID 10 for SATA
•
storage devices
Supports RAID 0, RAID 1 and RAID 5 for M.2 NVMe
•
storage devices*
* Requires additional M.2 NVMe expansion cards to support
RAID 5
1 x RGB LED Header
•
* Supports in total up to 12V/3A, 36W LED Strip
1 x Addressable LED Header
•
* Supports in total up to 5V/3A, 15W LED Strip
1 x CPU Fan Connector (4-pin)
•
* e CPU Fan Connector supports the CPU fan of maximum
1A (12W) fan power.
BIOS
Feature
H670M-ITX/ax
1 x Chassis Fan Connector (4-pin)
•
* e Chassis Fan Connector supports the chassis fan of maximum 1A (12W) fan power.
1 x Chassis/Water Pump Fan Connector (4-pin) (Smart Fan
•
Speed Control)
* e Chassis/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
* CHA_FAN1/WP can auto detect if 3-pin or 4-pin fan is in use.
1 x 24 pin ATX Power Connector
•
1 x 8 pin 12V Power Connector (Hi-Density Power Connec-
•
tor)
1 x Front Panel Audio Connector
•
1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports
•
ESD Protection)
1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)
•
(Supports ESD Protection)
1 x Front Panel Type C USB 3.2 Gen1 Header (Supports ESD
•
Protection)
AMI UEFI Legal BIOS with multilingual GUI support
•
ACPI 6.0 Compliant wake up events
•
SMBIOS 2.7 Support
•
CPU Core/Cache, CPU GT, DRAM, VCCIN AUX, +1.05V
•
PROC, +1.8V PROC, +0.82V PCH, +1.05V PCH Voltage
Multi-adjustment
Fan Tachometer: CPU, Chassis, Chassis/Water Pump Fans
Quiet Fan (Auto adjust chassis fan speed by CPU tempera-
•
ture): CPU, Chassis, Chassis/Water Pump Fans
Fan Multi-Speed Control: CPU, Chassis, Chassis/Water
•
Pump Fans
Voltage monitoring: CPU Vcore, +12V, +5V, +3.3V
•
Microso® Windows® 10 64-bit / 11 64-bit
•
FCC, CE
•
ErP/EuP ready (ErP/EuP ready power supply is required)
•
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11
Please realize that there is a certain risk involved with overclocking, including
adjusting the setting in the BIOS, applying Untied Overclocking Technology, or using
third-party overclocking tools. Overclocking may aect your system’s stability, or
even cause damage to the components and devices of your system . It should be done
at your own risk and expen se. We are not responsible for possible damage caused by
overclocking.
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12
H670M-ITX/ax
Chapter 2 Installation
is is a Mini-ITX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
13
English
2.1 Installing the CPU
1. Before you insert the 1700-Pin CPU into the socket, please check if the PnP cap
is on the socket, if the CPU surface is unclean, or if there are any bent pins in the
socket. Do not force to insert the CPU into the socket if above situation i s found.
Other wise, the CPU will be seriously damaged.
2. Unplug all power cables before installing the CPU.
1
A
B
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14
23
H670M-ITX/ax
4
76
5
15
English
Please save and replace the cover if the processor is removed. e cover must be
placed if you wish to return the motherboard for aer service.
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16
2.2 Installing the CPU Fan and Heatsink
12
H670M-ITX/ax
CPU_FAN
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17
2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identical (the same
brand, speed, size and chip-ty pe) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memory Technology with only one memory
module installed.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwi se, this motherboard and DIMM may be damaged .
e DIMM only ts in one correct orientation. It will cause permanent damage to
the mothe rboard and the DIMM if you force the DIMM into the slot at incorrect
orientation.
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18
H670M-ITX/ax
1
2
3
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19
2.4 Expansion Slot (PCI Express Slot)
ere is 1 PCI Express slot on the motherboard.
Before installing an expansion card, ple ase make sure that the power supply is
switched o or the power cord is unplug ged. Please read the documentation of the
expan sion card and make necessary hardware settings for the card before you start
the installation.
PCIe slot:
PCIE1 (PCIe 5.0 x16 slot) is used for PCIe x16 lane width graphics cards.
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20
H670M-ITX/ax
2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“Open”.
Clear CMOS Jumper
(CLR MOS1)
(see p.1, No. 16)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short the pins on CLRMOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed. Please remember toremove the jumper cap aer clearing the CMOS.
2-pin Jumper
21
English
2.6 Onboard Headers and Connectors
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over
these headers and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.
System Panel Header
(9-p in PA NEL1)
(see p.1, No. 14)
PWRBTN (Power Swi tch):
Connec t to the power switch on the chassis f ront panel. You may congure the way to
turn o your system using the power switch.
RESET (Reset Sw itch):
Connec t to the reset switch on the cha ssis front panel. Press the reset switch to restar t
the computer if the computer f reezes and fails to per form a normal restart.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassi s front panel. e LED is on when
the system is operating. e LED keeps blinking when the system is in S1/S3 sleep
state. e LED is o when the system is in S4 sleep state or powe red o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive activity LED on the chassis f ront panel. e LED is on
when the hard drive is reading or writing data.
e front panel design may dier by chassis . A front panel module mainly consists
of power switch, reset switch, power LED, hard drive activity LED, speaker and etc.
When connecting your cha ssis front panel module to this header, make sure the wire
assig nments and the pin assignments are matched correctly.
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
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22
H670M-ITX/ax
Serial ATA3 Connectors
(SATA3_0:
see p.1, No. 10)
(SATA3_1:
see p.1, No. 9)
(SATA3_2:
see p.1, No. 12)
(SATA3_3:
see p.1, No. 11)
USB 2.0 Header
(9-pin USB_56)
(see p.1, No. 7)
USB 3.2 Gen1 Header
(19-pin USB3_12)
(see p.1, No. 8)
SATA3_1
SATA3_3
Vbus
IntA_PA_SSRX-
IntA_PA_SSRX+
GND
IntA_PA_SSTX-
IntA_PA_SSTX+
GND
IntA_PA_D-
IntA_PA_D+
VbusVbus
IntA_PB_SSRX-
IntA_PB_SSRX+
GND
IntA_PB_SSTX-
IntA_PB_SSTX+
GND
IntA_PB_D-
IntA_PB_D+
Dummy
1
ese four SATA3
connectors support SATA
data cables for internal
SATA3_0
storage devices with up to
6.0 Gb/s data transfer rate.
SATA3_2
ere is one USB2.0
header on this
motherboard. is USB
2.0 header can support
two ports.
ere is one header on
this motherboard. is
USB 3.2 Gen1 header can
support two ports.
Front Panel Type C USB
3.2 Gen1 Header
(20-pin F_USB3_TC_1)
(see p.1, No. 13)
Front Panel Audio Header
(9-pin HD_AUDIO1)
(see p.1, No. 19)
USB Type-C Cable
GND
PRESENCE#
MIC_RET
1
OUT2_R
MIC2_R
MIC2_L
OUT_RET
OUT2_L
J_SENSE
ere is one Front
Panel Type C USB 3.2
Gen1 Header on this
motherboard. is header
is used for connecting a
USB 3.2 Gen1 module for
additional USB 3.2 Gen1
ports.
is header is for
connecting audio devices
to the front audio panel.
English
23
4 3 2 1
1. High Denition Audio supports Jack Sensing, but the panel wire on the chassis
must support HDA to function correctly. Plea se follow the instructions in our
manual and chassis manual to install your system.
2. If you use an AC’97 audio panel, please in stall it to the front panel audio header by
the steps below:
A. Connect Mic_ IN (MIC) to MIC2_L.
B. Conne ct Audio_R (RIN) to OUT2 _R and Audio_ L (LIN) to OUT2_ L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to
connect them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel
and adjust “Recording Volume”.