FEATURES
Pin-Compatible 12- and 14-Bit DACs
Serial Input, Voltage Output
Maximum Output Voltage Range of ⴞ10 V
Data Readback
3-Wire Serial Interface
Clear Function to a User-Defined Voltage
Power-Down Function
Serial Data Output for Daisy-Chaining
16-Lead TSSOP Packages
APPLICATIONS
Industrial Automation
Automatic Test Equipment
Process Control
General-Purpose Instrumentation
12-/14-Bit DACs
AD5530/AD5531
GENERAL DESCRIPTION
The AD5530 and AD5531 are single 12-/14-bit serial input,
voltage output DACs, respectively.
They utilize a versatile 3-wire interface that is compatible with
™
SPI
, QSPI™, MICROWIRE™, and DSP interface standards.
Data is presented to the part in the format of a 16-bit serial word.
Serial data is available on the SDO pin for daisy-chaining purposes. Data readback allows the user to read the contents of the
DAC register via the SDO pin.
The DAC output is buffered by a gain of 2 amplifier and referenced to the potential at DUTGND. LDAC may be used to update
the output of the DAC asynchronously. A power-down (PD) pin
allows the DAC to be put into a low power state, and a CLR pin
allows the output to be cleared to a user-defined voltage, the
potential at DUTGND.
The AD5530 and AD5531 are available in 16-lead TSSOP
packages.
REFIN
REFAGND
LDAC
RBEN
SDIN
FUNCTIONAL BLOCK DIAGRAM
VSSV
DD
AD5530/AD5531
GND
R
–
+
DAC REGISTER
SHIFT REGISTER
SCLK
R
SYNC
12-/14-BIT DAC
SDO
POWER-DOWN
CONTROL LOGIC
+
–
R
R
V
OUT
DUTGND
CLR
PD
SPI and QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corporation.
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
(VDD = +15 V ±10%; VSS = –15 V ±10%; GND = 0 V; RL = 5 kΩ and
1
AD5530/AD5531–SPECIFICATIONS
CL = 220 pF to GND. All specifications T
MIN
to T
, unless otherwise noted.)
MAX
ParameterAD5530AD5531UnitTest Conditions/Comments
ACCURACY
Resolution1214Bits
Relative Accuracy±1±2LSB max
Differential Nonlinearity±1±1LSB maxGuaranteed Monotonic Over Temperature
Zero-Scale Error±2± 8LSB maxTypically within ±1 LSB
Full-Scale Error±2± 8LSB maxTypically within ±1 LSB
Gain Error±1± 4LSB typ
Gain Temperature Coefficient
2
0.50.5ppm FSR/°C typ
1010ppm FSR/°C max
REFERENCE INPUTS
2
Reference Input Range0/50/5V min/V maxMax Output Range ±10 V
DC Input Resistance100100MΩ typ
Input Current±1± 1µA maxPer Input. Typically ±20 nA.
DUTGND INPUT
2
DC Input Impedance6060kΩ typ
Max Input Current±0.3±0.3mA typ
Input Range–4/+4–4/+4V min/V maxMax Output Range ±10 V
O/P CHARACTERISTICS
2
Output Voltage Swing±10±10V max
Short Circuit Current1515mA max
Resistive Load55kΩ minTo 0 V
Capacitive Load12001200pF maxTo 0 V
DC Output Impedance0.50.5Ω max
DIGITAL I/O
V
, Input High Voltage2.42.4V min
INH
V
, Input Low Voltage0.80.8V max
INL
I
, Input Current±10± 10µA maxTotal for All Pins
INH
, Input Capacitance
C
IN
SDO VOL Output Low Voltage0.40.4V maxI
2
1010pF max3 pF Typ
= 1 mA
SINK
POWER REQUIREMENTS
VDD/V
SS
+15/–15+15/–15V nom±10% For Specified Performance
Power Supply Sensitivity
∆Full Scale/∆V
∆Full Scale/∆V
I
DD
I
SS
DD
SS
110110dB typ
100100dB typ
22mA maxOutputs Unloaded
22mA maxOutputs Unloaded
IDD in Power-Down150150µA maxTypically 50 µA
NOTES
1
Temperature range for B Version: –40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
REV. 0–2–
SPECIFICATIONS
1
(VDD = +12 V ±10%; VSS = –12 V ±10%; GND = 0 V;
RL = 5 kΩ and CL = 220 pF to GND; TA = T
MIN
to T
, unless otherwise noted.)
MAX
AD5530/AD5531
ParameterAD5530AD5531UnitTest Conditions/Comments
ACCURACY
Resolution1214Bits
Relative Accuracy±1± 2LSB max
Differential Nonlinearity±1± 1LSB maxGuaranteed Monotonic Over Temperature
Zero-Scale Error±2± 8LSB maxTypically within ±1 LSB
Full-Scale Error±2± 8LSB maxTypically within ±1 LSB
Gain Error±1± 4LSB typ
Gain Temperature Coefficient
2
0.50.5ppm FSR/°C typ
1010ppm FSR/°C max
REFERENCE INPUTS
2
Reference Input Range0/4.0960/4.096V min/V maxMax Output Range ±8.192 V
DC Input Resistance100100MΩ typ
Input Current±1± 1µA maxPer Input. Typically ±20 nA.
DUTGND INPUT
2
DC Input Impedance6060kΩ typ
Max Input Current±0.3±0.3mA typ
Input Range–3/+3–3/+3V min/V maxMax Output Range ±8.192 V
O/P CHARACTERISTICS
2
Output Voltage Swing±8.192±8.192V max
Short Circuit Current1515mA max
Resistive Load55kΩ minTo 0 V
Capacitive Load12001200pF maxTo 0 V
DC Output Impedance0.50.5Ω max
DIGITAL I/O
V
, Input High Voltage2.42.4V min
INH
, Input Low Voltage0.80.8V max
V
INL
I
, Input Current±10± 10µA maxTotal for All Pins
INH
C
, Input Capacitance
IN
SDO VOL Output Low Voltage0.40.4V maxI
2
1010pF max3 pF Typ
= 1 mA
SINK
POWER REQUIREMENTS
VDD/V
SS
+12/–12+12/–12V nom±10% For Specified Performance
Power Supply Sensitivity
∆Full Scale/∆V
∆Full Scale/∆V
I
DD
I
SS
DD
SS
110110dB typ
100100dB typ
22mA maxOutputs Unloaded
22mA maxOutputs Unloaded
IDD in Power-Down150150µA maxTypically 50 µA
NOTES
1
Temperature range for B Version: –40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
(VDD = 10.8 V to 16.5 V, VSS = –10.8 V to –16.5 V; GND = 0 V; RL = 5 kΩ and
AC PERFORMANCE CHARACTERISTICS
CL = 220 pF to GND. All specifications T
MIN
to T
, unless otherwise noted.)
MAX
ParameterAUnitTest Conditions/Comments
DYNAMIC PERFORMANCE
Output Voltage Settling Time20µs typFull-Scale Change to ±1/2 LSB. DAC Latch Contents
alternately loaded with all 0s and all 1s.
Slew Rate1.3V/µs typ
Digital-to-Analog Glitch Impulse120nV-s typDAC Latch alternately loaded with 0FFF Hex and
1000 Hex. Not dependent on load conditions.
Digital Feedthrough0.5nV-s typEffect of Input Bus Activity on DAC Output Under Test
Output Noise Spectral Density
@ 1 kHz100nV/(Hz)
Specifications subject to change without notice. Guaranteed by design, not subject to production test.
REV. 0
1/2
typAll 1s Loaded to DAC
–3–
AD5530/AD5531
L
STANDALONE TIMING CHARACTERISTICS
RL = 5 kΩ and CL = 220 pF to GND. All specifications T
ParameterLimit at T
f
MAX
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
9
t
10
t
11
t
12
1
Guaranteed by design. Not production tested.
2
Sample tested during initial release and after any redesign or process change that may affect this parameter. All input signals are measured with tr = tf = 5 ns
(10% to 90% of VDD) and timed from a voltage level of (VIL +VIH)/2.
Specifications subject to change without notice.
SCLK
SYNC
SDIN
DAC*
CLR
*LDAC MAY BE TIED PERMANENTLY LOW IF REQUIRED
7MHz maxSCLK Frequency
140ns minSCLK Cycle Time
60ns minSCLK Low Time
60ns minSCLK High Time
50ns minSYNC to SCLK Falling Edge Setup Time
40ns minSCLK Falling Edge to SYNC Rising Edge
50ns minMin SYNC High Time
40ns minData Setup Time
15ns minData Hold Time
5ns minSYNC High to LDAC Low
50ns minLDAC Pulsewidth
5ns minLDAC High to SYNC Low
50ns minCLR Pulsewidth
t
4
t
6
MSBLSB
DB15DB14DB11DB0
MIN
, T
MAX
t7t
MIN
t
1
8
1, 2
(VDD = 10.8 V to 16.5 V, VSS = –10.8 V to –16.5 V; GND = 0 V;
to T
, unless otherwise noted.)
MAX
UnitDescription
t
5
t
3
t
2
t
9
t
11
t
10
t
12
Figure 1. Timing Diagram for Standalone Mode
REV. 0–4–
AD5530/AD5531
DAISY-CHAINING AND READBACK TIMING CHARACTERISTICS
to –16.5 V; VSS = –15 V ±10%; GND = 0 V; RL = 5 kΩ and CL = 220 pF to GND. All specifications T
ParameterLimit at T
f
MAX
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
12
t
13
t
14
t
15
t
16
t
17
1
Guaranteed by design. Not production tested.
2
Sample tested during initial release and after any redesign or process change that may affect this parameter. All input signals are measured with tr = tf = 5 ns
(10% to 90% of VDD) and timed from a voltage level of (VIL +VIH)/2.
3
SDO; R
Specifications subject to change without notice.
= 5 kΩ, CL = 15 pF.
PULLUP
2MHz maxSCLK Frequency
500ns minSCLK Cycle Time
200ns minSCLK Low Time
200ns minSCLK High Time
50ns minSYNC to SCLK Falling Edge Setup Time
40ns minSCLK Falling Edge to SYNC Rising Edge
50ns minMin SYNC High Time
40ns minData Setup Time
15ns minData Hold Time
50ns minCLR Pulsewidth
130ns minSCLK Falling Edge to SDO Valid
50ns maxSCLK Falling Edge to SDO Invalid
50ns minRBEN to SCLK Falling Edge Setup Time
50ns minRBEN Hold Time
100ns minRBEN Falling Edge to SDO Valid
MIN
, T
MAX
UnitDescription
1, 2, 3
to T
MIN
(VDD = 10.8 V to 16.5 V, VSS = –10.8 V
, unless otherwise noted.)
MAX
SCLK
SYNC
SDIN
SDO
(DAISY
CHAINING)
RBEN
SDO
(READBACK)
t
1
t
4
t
6
MSB
DB15DB14DB11
t7t
8
t
3
t
2
t
MSBLSB
DB15
14
DB11DB0
t
15
t
17
MSBLSB
LSB
DB0
t
5
t
13
t
16
t
13
0
RB13RB0
0
t
14
Figure 2. Timing Diagram for Daisy-Chaining and READBACK Mode
REV. 0
–5–
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