ZTE ME3631 User Manual

HARDWARE DEVELOPMENT GUIDE

Version: V1.1

Date: 2017-02-23

LTE Module Series

ME3631

Website: www.ztewelink.com

E-mail: ztewelink@zte.com.cn

ME3631

Hardware Development Guide

Version

Date

Description

1.0

2017-01-18

1st released version

LEGAL INFORMATION

By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as ZTEWelink), you are deemed

to have agreed to the following terms. If you don’t agree to the following terms, please stop using the document.

proprietary information. Without the prior written permission of ZTEWelink, no entity or individual is allowed to reproduce, transfer,

distribute, use and disclose this document or any image, table, data or other information contained in this document.

ZTEWelink is a holding subsidiary of ZTE Corporation, dedicate to cellular M2M communication modules and M2M solutions.

is the registered trademark of ZTE Corporation and ZTEWelink is granted to use ZTE Corporation’s registered trademarks.

The name and logo of ZTEWelink are ZTEWElink’s trademark or registered trademarks. The other products or company names

mentioned in this document are the trademark or registered trademark of their respective owner. Without the prior written

permission of ZTEWelink or the third-party oblige, no entity or individual is allowed to use any company name, trademark, logo, label

or other information contained in this document.

The product meets the design requirements of environmental protection and personal security. The storage, use or disposal of

products should abide by the product manual, relevant contract or the laws and regulations of relevant country.

ZTEWelink reserves the right to make modifications on the product described in this document without prior notice, and keeps

the right to revise or retrieve the document any time.

If you have any question about the manual, please consult the company or its distributors promptly.

REVISION HISTORY

ME3631

Hardware Development Guide

Abbreviations

Full Name

3GPP

Third Generation Partnership Project

Another name of DTE

CHAP

Challenge Handshake Authentication Protocol

European Conformity

CMOS

Complementary Metal Oxide Semiconductor

DCE

Data Communication Equipment

Downlink

DTE

Data Terminal Equipment

EIA

Electronic Industries Association

EMC

Electromagnetic Compatibility

ESD

Electro-Static discharge

ESR

Equivalent Series Resistance

FDD

Frequency Division Duplex

GPIO

General-purpose I/O

LCC

Leadless Chip Carrier

ABOUT THIS DOCUMENT

A. Application Range

This document is the Product Technical Specification for the ME3631 GSM/WCDMA/LTE-FDD module. It defines the high level

product features and illustrates the interface for these features. This document is intended to cover the hardware aspects of the

product, including electrical and mechanical.

B. Reading Note

The symbols below are the reading notes you should pay attention on:

: WARNING or ATTENTION : NOTE or REMARK

C. Purpose

This document provides the hardware solutions and development fundamentals for a product with the module. By reading this

document, the user can have an overall knowledge of the module and a clear understanding of the technical parameters. With this

document, the user can successfully fulfill the application and development of wireless Internet product or equipment.

Besides the product features and technical parameters, this document also provides the product reliability tests and related

testing standards, RF performance indexes and a guide on the design of user circuits, to provide the user with a complete design

reference.

NOTE:

To ensure the module manufacturing and welding quality, do as the chapter 7 of Manufacturing Guide in

this document. The force on the squeegee should be adjusted so as to produce a clean stencil surface on a

single pass and ensure the module soldering quality.

D. Abbreviations

Table below is a list of abbreviations involved in this document, as well as the English full names.

ME3631

Hardware Development Guide

LDO

Low-Dropout

LED

Light Emitting Diode

LTE

Long Term Evolution

Mobile Equipment

Mobile Origination Call

Mobile Termination Call

MSB

Most Significant Bit

Personal Computer

PCB

Printed Circuit Board

PDA

Personal Digital Assistant

PDU

Protocol Data Unit

PAP

Password Authentication Protocol

PPP

Point to Point Protocol

RTC

Real Time Clock

SMS

Short Messaging Service

SMT

Surface Mount Technology

SPI

Serial Peripheral Interface

TBD

To Be Determined

TCP

Transmission Control Protocol

TIS

Total Isotropic Sensitivity

TRP

Total Radiated Power

TVS

Transient Voltage Suppressor

UART

Universal Asynchronous Receiver-Transmitter

UDP

User Datagram Protocol

Up Link

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

URC

Unsolicited result code

VIH

Logic High level of input voltage

VIL

Logic Low level of input voltage

VOH

Logic High level of output voltage

VOL

Logic Low level of output voltage

ME3631

Hardware Development Guide

Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a

mobile while driving (even with a hands free kit) cause distraction and can lead to an accident. You must

comply with laws and regulations restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The

operation of wireless appliances in an aircraft is forbidden to prevent interference with communication

systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device

offers a Airplane Mode which must be enabled prior to boarding an aircraft.

Switch off your wireless device when in hospitals or clinics or other health care facilities. These

requests are designed to prevent possible interference with sensitive medical equipment.

GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and

cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While

you are in this condition and need emergent help, please remember using emergency call. In order to make

or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate

cellular signal strength.

Your cellular terminal or mobile contains a transmitter and receiver. When it is on, it receives and

transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or

other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices

such as your phone or other cellular terminals. Areas with potentially explosive atmospheres including

fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air

contains chemicals or particles such as grain, dust or metal powders.

SAFETY INFORMATION

The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any

cellular terminal or mobile incorporating ME3610 module. Manufacturers of the cellular terminal should send the following safety

information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not

so, ZTEWelink does not take on any liability for customer failure to comply with these precautions.

ME3631

Hardware Development Guide

CONTENTS

LEGAL INFORMATION ........................................................................................................................................................................... I

REVISION HISTORY ........................................................................................................................................................................... I

ABOUT THIS DOCUMENT.......................................................................................................................................................................... II

SAFETY INFORMATION ......................................................................................................................................................................... IV

CONTENTS .......................................................................................................................................................................... V

TABLES ........................................................................................................................................................................ VII

FIGURES ......................................................................................................................................................................... IX

1. Product Overview ....................................................................................................................................................................... 11

1.1. General Description ........................................................................................................................................................................... 11

1.2. Key Features ................................................................................................................................................................................. 11

1.3. Function Diagram............................................................................................................................................................................... 12

1.4. Evaluation Board ................................................................................................................................................................................ 13

2. Application Interface ................................................................................................................................................................... 14

2.1. General Description ........................................................................................................................................................................... 14

2.2. Pin Assignment ................................................................................................................................................................................. 14

2.3. Pin Description ................................................................................................................................................................................. 15

2.4. Power Supply ................................................................................................................................................................................. 21

2.4.1. Power Supply Pins ................................................................................................................................................................... 21

2.4.2. Decrease Voltage Drop ............................................................................................................................................................ 21

2.4.3. Reference Circuit of Power Supply .......................................................................................................................................... 21

2.5. Turn on Scenarios .............................................................................................................................................................................. 22

2.6. Turn off Scenarios .............................................................................................................................................................................. 24

2.7. Reset Scenarios ................................................................................................................................................................................. 24

2.8. USIM Card Interface........................................................................................................................................................................... 25

2.8.1. Description of PINs .................................................................................................................................................................. 25

2.8.2. Design Considerations for USIM Card Holder .......................................................................................................................... 27

2.9. USB Interface ................................................................................................................................................................................. 29

2.10. UART Interface ................................................................................................................................................................................. 30

2.11. Network Status Indication ............................................................................................................................................................... 32

2.12. ADC Interface ................................................................................................................................................................................. 33

2.13. WAKEUP_IN Signal ........................................................................................................................................................................... 34

2.14. WAKEUP_OUT Signal ....................................................................................................................................................................... 35

2.15. GPIO Interface(not support yet) ...................................................................................................................................................... 36

ME3631

Hardware Development Guide

3. Antenna Interface ....................................................................................................................................................................... 37

3.1. Pin Definition ................................................................................................................................................................................. 37

3.2. Reference Design ............................................................................................................................................................................... 37

3.3. Reference PCB Layout of Antenna ..................................................................................................................................................... 38

3.4. Suggestions for EMC & ESD Design .................................................................................................................................................... 38

3.4.1. EMC Design Requirements ...................................................................................................................................................... 38

3.4.2. ESD Design Requirements ....................................................................................................................................................... 39

3.5. Test Methods for Whole-Set Antenna OTA ....................................................................................................................................... 39

4. Electrical, Reliability and Radio Characteristics ............................................................................................................................ 40

4.1. Absolute Maximum Ratings ............................................................................................................................................................... 40

4.2. Operating Temperature ..................................................................................................................................................................... 40

4.3. Current Consumption ........................................................................................................................................................................ 40

4.4. RF Output Power ............................................................................................................................................................................... 41

4.5. RF Receiving Sensitivity ...................................................................................................................................................................... 41

4.6. GNSS Technical Parameters ............................................................................................................................................................... 42

5. Mechanical Dimensions .............................................................................................................................................................. 42

5.1. Mechanical Dimensions of the Module ............................................................................................................................................. 42

5.2. Footprint of Recommendation .......................................................................................................................................................... 44

5.3. Top View of the Module .................................................................................................................................................................... 44

6. Related Test & Test Standard ...................................................................................................................................................... 46

6.1. Testing Reference .............................................................................................................................................................................. 46

6.2. Description of Testing Environment .................................................................................................................................................. 47

6.3. Reliability Testing Environment ......................................................................................................................................................... 48

7. SMT Process and Baking Guide .................................................................................................................................................... 49

7.1. Storage Requirements ....................................................................................................................................................................... 49

7.2. Module Plainness Standard ............................................................................................................................................................... 49

7.3. Process Routing Selection .................................................................................................................................................................. 49

7.3.1. Solder Paste Selection ............................................................................................................................................................. 49

7.3.2. Design of module PAD’s steel mesh opening on main board .................................................................................................. 49

7.3.3. Module Board’s SMT process .................................................................................................................................................. 50

7.3.4. Module Soldering Reflow Curve .............................................................................................................................................. 51

7.3.5. Reflow method ........................................................................................................................................................................ 52

7.3.6. Maintenance of defects .......................................................................................................................................................... 52

7.4. Module’s Baking Requirements ......................................................................................................................................................... 52

7.4.1. Module’s Baking Environment ................................................................................................................................................ 52

7.4.2. Baking device and operation procedure ................................................................................................................................. 53

7.4.3. Module Baking Conditions ...................................................................................................................................................... 53

ME3631

Hardware Development Guide

TABLES

Table 1-1 ME3631 Supported Band ................................................................................................ 11

Table 1-2 ME3631 Key Features .................................................................................................. 11

Table 2-1 IO Parameters Definition .............................................................................................. 15

Table 2-2 Logic levels Description ................................................................................................ 16

Table 2-3 Pin Description ............................................................................................................. 16

Table 2-4 Power Supply ............................................................................................................... 21

Table 2-5 POWER_ON/OFF Pin Description ............................................................................... 23

Table 2-6 Power-on Time ............................................................................................................. 23

Table 2-7 Pin Definition of the USIM Interface .............................................................................. 25

Table 2-8 Pin Description of Molex USIM Card Holder ................................................................. 28

Table 2-9 Pin Description of Amphenol USIM Card Holder........................................................... 29

Table 2-10 USB Pin Description ................................................................................................... 30

Table 2-11 Pin Definition of the Main UART Interface .................................................................. 31

Table 2-12 Pin Definition of the Debug UART Interface ................................................................ 31

Table 2-13 Pin Definition of Network Indicator .............................................................................. 33

Table 2-14 Working State of the Network Indicator ...................................................................... 33

Table 2-15 Pin Definition of the ADC ............................................................................................ 33

Table 2-16 Characteristic of the ADC ........................................................................................... 33

Table 2-17 Pin Definition of WAKEUP_IN .................................................................................... 34

Table 2-18 Pin Definition of WAKEUP_OUT ................................................................................ 35

Table 2-19 Pin Definition of GPIO ................................................................................................ 36

Table 3-1 Pin Definition of GPIO .................................................................................................. 37

Table 4-1 Absolute Maximum Ratings .......................................................................................... 40

Table 4-2 Operating Temperature ................................................................................................ 40

Table 4-3 ESD characteristic ........................................................................................................ 40

Table 4-4 Averaged standby DC power consumption [1] .............................................................. 40

Table 4-5 Averaged standby DC power consumption [2] .............................................................. 40

Table 4-6 Averaged standby DC power consumption [3] .............................................................. 41

Table 4-7 Conducted RF Output Power........................................................................................ 41

ME3631

Hardware Development Guide

Table 4-8 Conducted RF Receiving Sensitivity Typical Value [1] .................................................. 41

Table 4-9 Conducted RF Receiving Sensitivity Typical Value [2] .................................................. 41

Table 4-10 GNSS Technical Parameters ...................................................................................... 42

Table 6-1 Testing Standard .......................................................................................................... 46

Table 6-2 Testing Environment .................................................................................................... 47

Table 6-3 Testing Instrument & Device......................................................................................... 47

Table 6-4 Reliability Features ....................................................................................................... 48

Table 7-1 Baking parameters ....................................................................................................... 49

Table 7-2 LCC module PAD’s steel mesh opening ................................................................................ 49

ME3631

Hardware Development Guide

FIGURES

Figure 1–1 System Connection Structure ..................................................................................... 13

Figure 2–1 Pin Assignment .......................................................................................................... 15

Figure 2–2 Reference circuit of AAT2138 ..................................................................................... 22

Figure 2–3 Reference circuit of LDO ............................................................................................ 22

Figure 2–4 reference circuit to turn-on/off module(1) .................................................................... 23

Figure 2–5 Timing of Turning on Mode ......................................................................................... 23

Figure 2–6 Timing of Turning off Mode ......................................................................................... 24

Figure 2–7 reference circuit to reset module(1) ............................................................................ 25

Figure 2–8 Timing of Reset Mode ................................................................................................ 25

Figure 2–9 Reference Circuit of the 8 Pin USIM Card .................................................................. 26

Figure 2–10 Reference Circuit of the 6 Pin USIM Card ................................................................ 26

Figure 2–11 Molex 91228 USIM Card Holder ............................................................................... 28

Figure 2–12 Amphenol C707 10M006 512 2 USIM Card Holder .................................................. 29

Figure 2–13 Reference Circuit of USB Application ....................................................................... 30

Figure 2–14 Reference Circuit of USB Communication between module and AP ......................... 30

Figure 2–15 Reference Circuit of Logic Level Translator .............................................................. 31

Figure 2–16 RS232 Level Match Circuit ....................................................................................... 32

Figure 2–17 Reference Circuit of Main UART with 4 Line Level Translator .................................. 32

Figure 2–18 Reference Circuit of UART with 2 Line Level Translator ........................................... 32

Figure 2–19 Reference Circuit of the Network Indicator ............................................................... 33

Figure 2–20 WAKEUP_IN input sequence ................................................................................. 34

Figure 2–21 Connections of the WAKEUP_IN pin ........................................................................ 34

Figure 2–22 The output signal of WAKEUP_OUT ........................................................................ 35

Figure 2–23 Connections of the WAKEUP_OUT pin .................................................................... 35

Figure 3–1 Reference Circuit of Antenna Interface ....................................................................... 37

Figure 3–2 Reference Circuit of GNSS Antenna ........................................................................... 38

Figure 3–3 The OTA test system of CTIA ..................................................................................... 39

Figure 5–1 ME3631 Top and Side Dimensions ............................................................................ 42

Figure 5–2 ME3631 Bottom Dimensions (Bottom view) ................................................................ 43

Figure 5–3 Recommended Footprint (Top view) ........................................................................... 44

ME3631

Hardware Development Guide

Figure 7–1 Module Board’s Steel Mesh Diagram ......................................................................... 50

Figure 7–2 Material Module Pallet ................................................................................................ 50

Figure 7–3 Tape Reel Dimension ................................................................................................. 51

Figure 7–4 Module Furnace Temperature Curve Reference Diagram .......................................... 52

Hardware Development Guide

PID

RF support

RF Band

Transmit Frequency (TX)

Receive Frequency (RX)

ME3631

LTE FDD

WCDMA

GSM

B12

B17

GSM850

PCS1900

1850 to 1910 MHz

1710 to 1755 MHz

824 to 849 MHz

698 to 716 MHz

704 to 716 MHz

1850 to 1910 MHz

824 to 849 MHz

825 to849 MHz

1850 to 1910 MHz

1930 to 1990 MHz

2110 to 2155 MHz

869 to 894 MHz

728 to 746 MHz

734 to 746 MHz

1930 to 1990 MHz

869 to 894 MHz

1930 to 1990 MHz

Feature

Description

Physical

Small form factor-30 mm × 30 mm × 2.3mm

LCC with 80 pins Power Supply

The range of voltage supply is 3.4V-4.2V, typical value is 3.8V

Frequency Bands

ME3631

LTE FDD:B2,B4,B5,B12,B17

WCDMA:B2,B5

GSM: GSM 850, PCS 1900

Transmission Date

LTE FDD: Max 150Mbps(DL)/Max 50Mbps(UL)

Network Protocols

Support TCP/PPP/UDP protocols

Support PAP, CHAP protocols used for PPP connection.

USIM Interface

1.8V/3 V support

SIM extraction/hot plug detection

Support SIM and USIM

UART Interface

Support two UART interface: main UART interface and debug UART interface

Main UART interface:

Eight lines on main UART interface

1. PRODUCT OVERVIEW

1.1. GENERAL DESCRIPTION

ME3631 is a WCDMA /LTE FDD wireless communication module with LCC interface. It is widely applied to but not limited to the

various products and equipment such as laptops, vehicle-mounted terminals, and electric devices, by providing data services.

Customer can choose the dedicated type based on the wireless network configuration and using area. The following table

shows the entire radio band configuration of ME3631 series.

Table 1-1 ME3631 Supported Band

1.2. KEY FE ATURES

The table below describes the detailed features of the ME3631 module.

Table 1-2 ME3631 Key Features

Hardware Development Guide

Support RTS and CTS hardware flow control

Baud rate can reach up to 921600 bps,115200 bps by default

Used for AT command, data transmission or firmware upgrade

Debug UART interface:

Two lines on debug UART interface, can be used for software debug, firmware upgrade

USB Interface

Compliant with USB 2.0 specification (slave only)

Used for AT command communication, data transmission, software debug and firmware upgrade.

USB Driver

Support Windows XP, Windows Vista, Windows 7, Windows 8, Windows 10,

Windows CE5.0/6.0 and later,

Linux 2.6.20 and later,

Android 2.3 / 4.X/ 5.X

SDIO interface

1.8V support (full speed) 4bits,SDIO compatible to WLAN (802.11)

Antenna Interface

Include main antenna ,diversity antenna and GNSS antenna

Rx-diversity

Support WCDMA/LTE Rx-diversity

AT commands

Compliant with 3GPP TS 27.007,27.005 and ZTEWelink enhanced AT commands

Network Indication

Use LED_MODE to indicate network connectivity status

SMS

Text and PDU mode

Point to point MO and MT

SMS saving/reading to SIM card or module storage

SMS cell broadcast

Temperature Range

Normal operation: -30°C to +75°C

Restricted operation1): -40°C~ -30°C and +75°C~ +85°C1)

Storage temperature: -40°C to +85°C

Firmware Upgrade

USB interface or UART interface or OTA(WEFOTA)

1.3. FUNCTI ON DIAG RA M

The figure below shows a block diagram of the ME3631 and illustrates the major functional parts.

 Power management  Baseband  Memory  RF send-receive  Peripheral interface

--UART interface

--USIM card interface

--USB interface

--SDIO interface

--SPI interface

--I2C interface

--ADC interface

Hardware Development Guide

Baseband

USB

USIM

UART

I2C

SDIO

SPI

LED

ADC

GPIO

FLASH

LPDDR2

Data

Control

Rx&Tx

Transceiver

RF PA

Duplexer

MAIN_ANT

80PIN LCC Connector Interface

GNSS

DIV_ANT

--Status interface (LED)

Figure 1–1 System Connection Structure

1.4. EVALUATION BOARD

In order to help you to develop applications with ME3631, ZTEWelink supplies an evaluation board (G2000/GE2015), RS-232 to

USB cable, USB data cable, power adapter, antenna and other peripherals to control or test the module. For details, please refer to the related document [ZTEWelink G2000 Dev Board User Guide] or [ZTEWelink GE2015 Dev Board User Guide].

Hardware Development Guide

2. APPLICATION INTERFACE

2.1. GENERAL DESCRIPTION

ME3631 is equipped with an 80-pin 0.72mm pitch SMT pads plus 16-pin ground pads and reserved pads that connect to

customer’s cellular application platform. Sub-interface included in these pads is described in detail in the following chapters:

 Pin assignment  Pin description  Power supply  Turn on/off scenarios  USIM interface  USB interface  UART interface  Network status indication  ADC interface  WAKEUP_IN signal  WAKEUP_OUT signal  GPIO interface

2.2. PIN ASSIGNMENT

The following figure shows the pin assignment of the ME3631 module.

Hardware Development Guide

Type

Description

Bidirectional input/output

Digital input

Digital output

Keep all NC pins unconnected.

2.3. PIN DESCR IPTION

The following table shows the IO Parameters Definition.

Figure 2–1 Pin Assignment

NOTE:

Table 2-1 IO Parameters Definition

Hardware Development Guide

Power input

Power output

Analog input

Analog output

Open drain

Parameter

Min

Max

Unit

VIH

0.65*VDD_IO

VDD_IO+0.3

VIL

-0.3

0.35* VDD_IO

VOH

VDD_IO-0.45

VDD_IO

VOL 0 0.45

Power Supply Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

V_BAT

50.51

Power supply for

module

Vmax = 4.2V

Vmin = 3.4V

Vnorm = 3.8V

It must be able to provide

sufficient current in a

transmitting burst which

typically rises to 2.0A

VREF_1V8

Provide 1.8V for

external circuit

Vnorm = 1.8V

Imax = 300mA

Power supply for external

GPIO’S pull up circuits

GND

3,9,11,20,21,31,36,

46,49,52, 61,63,78,

80,

Ground

Turn On/Off Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

POWER_ON

Turn on/off module

VIH max = 2.1V

VIH min = 1.17V

VIL max = 0.63V

Pull-up to 1.8V through 200K

resistance internally, active low

RESET_N

Reset module

VIH max = 2.1V

VIH min = 1.17V

VIL max = 0.63V

Active low

Status Indication

Pin Name

Pin NO.

I/O

Description

DC Characteristics

Comment

LED_MODE

Indicate the module

network registration

VOH min = 1.35V

VOL max = 0.45V

1.8V power domain

The logic levels are described in the following table.

NOTE:

VDD_IO is the voltage level of pins.

Table 2-2 Logic levels Description

The following tables show the ME3631’s pin definition.

Table 2-3 Pin Description

+ 38 hidden pages

ZTE ME3631 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual