ZTE ME3631 User Manual

HARDWARE DEVELOPMENT GUIDE
Version: V1.1
Date: 2017-02-23
LTE Module Series
ME3631
Website: www.ztewelink.com
E-mail: ztewelink@zte.com.cn
ME3631
Hardware Development Guide
Version
Date
Description
1.0
2017-01-18
1st released version
LEGAL INFORMATION
By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as ZTEWelink), you are deemed
to have agreed to the following terms. If you don’t agree to the following terms, please stop using the document.
Copyright © 2017 Shenzhen ZTEWelink Technology Co., Ltd. All rights reserved. The document contains ZTEWelink’s
proprietary information. Without the prior written permission of ZTEWelink, no entity or individual is allowed to reproduce, transfer,
distribute, use and disclose this document or any image, table, data or other information contained in this document.
ZTEWelink is a holding subsidiary of ZTE Corporation, dedicate to cellular M2M communication modules and M2M solutions.
is the registered trademark of ZTE Corporation and ZTEWelink is granted to use ZTE Corporation’s registered trademarks.
The name and logo of ZTEWelink are ZTEWElink’s trademark or registered trademarks. The other products or company names
mentioned in this document are the trademark or registered trademark of their respective owner. Without the prior written
permission of ZTEWelink or the third-party oblige, no entity or individual is allowed to use any company name, trademark, logo, label
or other information contained in this document.
The product meets the design requirements of environmental protection and personal security. The storage, use or disposal of
products should abide by the product manual, relevant contract or the laws and regulations of relevant country.
ZTEWelink reserves the right to make modifications on the product described in this document without prior notice, and keeps
the right to revise or retrieve the document any time.
If you have any question about the manual, please consult the company or its distributors promptly.
Copyright © ZTEWeLink Technology Co., LTD, All rights reserved.
REVISION HISTORY
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ME3631
Hardware Development Guide
Abbreviations
Full Name
3GPP
Third Generation Partnership Project
AP
Another name of DTE
CHAP
Challenge Handshake Authentication Protocol
CE
European Conformity
CMOS
Complementary Metal Oxide Semiconductor
DCE
Data Communication Equipment
DL
Downlink
DTE
Data Terminal Equipment
EIA
Electronic Industries Association
EMC
Electromagnetic Compatibility
ESD
Electro-Static discharge
ESR
Equivalent Series Resistance
FDD
Frequency Division Duplex
GPIO
General-purpose I/O
LCC
Leadless Chip Carrier
ABOUT THIS DOCUMENT
A. Application Range
This document is the Product Technical Specification for the ME3631 GSM/WCDMA/LTE-FDD module. It defines the high level
product features and illustrates the interface for these features. This document is intended to cover the hardware aspects of the
product, including electrical and mechanical.
B. Reading Note
The symbols below are the reading notes you should pay attention on:
: WARNING or ATTENTION : NOTE or REMARK
C. Purpose
This document provides the hardware solutions and development fundamentals for a product with the module. By reading this
document, the user can have an overall knowledge of the module and a clear understanding of the technical parameters. With this
document, the user can successfully fulfill the application and development of wireless Internet product or equipment.
Besides the product features and technical parameters, this document also provides the product reliability tests and related
testing standards, RF performance indexes and a guide on the design of user circuits, to provide the user with a complete design
reference.
NOTE:
To ensure the module manufacturing and welding quality, do as the chapter 7 of Manufacturing Guide in
this document. The force on the squeegee should be adjusted so as to produce a clean stencil surface on a
single pass and ensure the module soldering quality.
D. Abbreviations
Table below is a list of abbreviations involved in this document, as well as the English full names.
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ME3631
Hardware Development Guide
LDO
Low-Dropout
LED
Light Emitting Diode
LTE
Long Term Evolution
ME
Mobile Equipment
MO
Mobile Origination Call
MT
Mobile Termination Call
MSB
Most Significant Bit
PC
Personal Computer
PCB
Printed Circuit Board
PDA
Personal Digital Assistant
PDU
Protocol Data Unit
PAP
Password Authentication Protocol
PPP
Point to Point Protocol
RTC
Real Time Clock
SMS
Short Messaging Service
SMT
Surface Mount Technology
SPI
Serial Peripheral Interface
TBD
To Be Determined
TCP
Transmission Control Protocol
TIS
Total Isotropic Sensitivity
TRP
Total Radiated Power
TVS
Transient Voltage Suppressor
UART
Universal Asynchronous Receiver-Transmitter
UDP
User Datagram Protocol
UL
Up Link
USB
Universal Serial Bus
USIM
Universal Subscriber Identity Module
URC
Unsolicited result code
VIH
Logic High level of input voltage
VIL
Logic Low level of input voltage
VOH
Logic High level of output voltage
VOL
Logic Low level of output voltage
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ME3631
Hardware Development Guide
Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a
mobile while driving (even with a hands free kit) cause distraction and can lead to an accident. You must
comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The
operation of wireless appliances in an aircraft is forbidden to prevent interference with communication
systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device
offers a Airplane Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals or clinics or other health care facilities. These
requests are designed to prevent possible interference with sensitive medical equipment.
GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and
cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While
you are in this condition and need emergent help, please remember using emergency call. In order to make
or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is on, it receives and
transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or
other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices
such as your phone or other cellular terminals. Areas with potentially explosive atmospheres including
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air
contains chemicals or particles such as grain, dust or metal powders.
SAFETY INFORMATION
The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any
cellular terminal or mobile incorporating ME3610 module. Manufacturers of the cellular terminal should send the following safety
information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not
so, ZTEWelink does not take on any liability for customer failure to comply with these precautions.
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ME3631
Hardware Development Guide
CONTENTS
LEGAL INFORMATION ........................................................................................................................................................................... I
REVISION HISTORY ........................................................................................................................................................................... I
ABOUT THIS DOCUMENT.......................................................................................................................................................................... II
SAFETY INFORMATION ......................................................................................................................................................................... IV
CONTENTS .......................................................................................................................................................................... V
TABLES ........................................................................................................................................................................ VII
FIGURES ......................................................................................................................................................................... IX
1. Product Overview ....................................................................................................................................................................... 11
1.1. General Description ........................................................................................................................................................................... 11
1.2. Key Features ................................................................................................................................................................................. 11
1.3. Function Diagram............................................................................................................................................................................... 12
1.4. Evaluation Board ................................................................................................................................................................................ 13
2. Application Interface ................................................................................................................................................................... 14
2.1. General Description ........................................................................................................................................................................... 14
2.2. Pin Assignment ................................................................................................................................................................................. 14
2.3. Pin Description ................................................................................................................................................................................. 15
2.4. Power Supply ................................................................................................................................................................................. 21
2.4.1. Power Supply Pins ................................................................................................................................................................... 21
2.4.2. Decrease Voltage Drop ............................................................................................................................................................ 21
2.4.3. Reference Circuit of Power Supply .......................................................................................................................................... 21
2.5. Turn on Scenarios .............................................................................................................................................................................. 22
2.6. Turn off Scenarios .............................................................................................................................................................................. 24
2.7. Reset Scenarios ................................................................................................................................................................................. 24
2.8. USIM Card Interface........................................................................................................................................................................... 25
2.8.1. Description of PINs .................................................................................................................................................................. 25
2.8.2. Design Considerations for USIM Card Holder .......................................................................................................................... 27
2.9. USB Interface ................................................................................................................................................................................. 29
2.10. UART Interface ................................................................................................................................................................................. 30
2.11. Network Status Indication ............................................................................................................................................................... 32
2.12. ADC Interface ................................................................................................................................................................................. 33
2.13. WAKEUP_IN Signal ........................................................................................................................................................................... 34
2.14. WAKEUP_OUT Signal ....................................................................................................................................................................... 35
2.15. GPIO Interface(not support yet) ...................................................................................................................................................... 36
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Hardware Development Guide
3. Antenna Interface ....................................................................................................................................................................... 37
3.1. Pin Definition ................................................................................................................................................................................. 37
3.2. Reference Design ............................................................................................................................................................................... 37
3.3. Reference PCB Layout of Antenna ..................................................................................................................................................... 38
3.4. Suggestions for EMC & ESD Design .................................................................................................................................................... 38
3.4.1. EMC Design Requirements ...................................................................................................................................................... 38
3.4.2. ESD Design Requirements ....................................................................................................................................................... 39
3.5. Test Methods for Whole-Set Antenna OTA ....................................................................................................................................... 39
4. Electrical, Reliability and Radio Characteristics ............................................................................................................................ 40
4.1. Absolute Maximum Ratings ............................................................................................................................................................... 40
4.2. Operating Temperature ..................................................................................................................................................................... 40
4.3. Current Consumption ........................................................................................................................................................................ 40
4.4. RF Output Power ............................................................................................................................................................................... 41
4.5. RF Receiving Sensitivity ...................................................................................................................................................................... 41
4.6. GNSS Technical Parameters ............................................................................................................................................................... 42
5. Mechanical Dimensions .............................................................................................................................................................. 42
5.1. Mechanical Dimensions of the Module ............................................................................................................................................. 42
5.2. Footprint of Recommendation .......................................................................................................................................................... 44
5.3. Top View of the Module .................................................................................................................................................................... 44
6. Related Test & Test Standard ...................................................................................................................................................... 46
6.1. Testing Reference .............................................................................................................................................................................. 46
6.2. Description of Testing Environment .................................................................................................................................................. 47
6.3. Reliability Testing Environment ......................................................................................................................................................... 48
7. SMT Process and Baking Guide .................................................................................................................................................... 49
7.1. Storage Requirements ....................................................................................................................................................................... 49
7.2. Module Plainness Standard ............................................................................................................................................................... 49
7.3. Process Routing Selection .................................................................................................................................................................. 49
7.3.1. Solder Paste Selection ............................................................................................................................................................. 49
7.3.2. Design of module PAD’s steel mesh opening on main board .................................................................................................. 49
7.3.3. Module Board’s SMT process .................................................................................................................................................. 50
7.3.4. Module Soldering Reflow Curve .............................................................................................................................................. 51
7.3.5. Reflow method ........................................................................................................................................................................ 52
7.3.6. Maintenance of defects .......................................................................................................................................................... 52
7.4. Module’s Baking Requirements ......................................................................................................................................................... 52
7.4.1. Module’s Baking Environment ................................................................................................................................................ 52
7.4.2. Baking device and operation procedure ................................................................................................................................. 53
7.4.3. Module Baking Conditions ...................................................................................................................................................... 53
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ME3631
Hardware Development Guide
TABLES
Table 1-1 ME3631 Supported Band ................................................................................................ 11
Table 1-2 ME3631 Key Features .................................................................................................. 11
Table 2-1 IO Parameters Definition .............................................................................................. 15
Table 2-2 Logic levels Description ................................................................................................ 16
Table 2-3 Pin Description ............................................................................................................. 16
Table 2-4 Power Supply ............................................................................................................... 21
Table 2-5 POWER_ON/OFF Pin Description ............................................................................... 23
Table 2-6 Power-on Time ............................................................................................................. 23
Table 2-7 Pin Definition of the USIM Interface .............................................................................. 25
Table 2-8 Pin Description of Molex USIM Card Holder ................................................................. 28
Table 2-9 Pin Description of Amphenol USIM Card Holder........................................................... 29
Table 2-10 USB Pin Description ................................................................................................... 30
Table 2-11 Pin Definition of the Main UART Interface .................................................................. 31
Table 2-12 Pin Definition of the Debug UART Interface ................................................................ 31
Table 2-13 Pin Definition of Network Indicator .............................................................................. 33
Table 2-14 Working State of the Network Indicator ...................................................................... 33
Table 2-15 Pin Definition of the ADC ............................................................................................ 33
Table 2-16 Characteristic of the ADC ........................................................................................... 33
Table 2-17 Pin Definition of WAKEUP_IN .................................................................................... 34
Table 2-18 Pin Definition of WAKEUP_OUT ................................................................................ 35
Table 2-19 Pin Definition of GPIO ................................................................................................ 36
Table 3-1 Pin Definition of GPIO .................................................................................................. 37
Table 4-1 Absolute Maximum Ratings .......................................................................................... 40
Table 4-2 Operating Temperature ................................................................................................ 40
Table 4-3 ESD characteristic ........................................................................................................ 40
Table 4-4 Averaged standby DC power consumption [1] .............................................................. 40
Table 4-5 Averaged standby DC power consumption [2] .............................................................. 40
Table 4-6 Averaged standby DC power consumption [3] .............................................................. 41
Table 4-7 Conducted RF Output Power........................................................................................ 41
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ME3631
Hardware Development Guide
Table 4-8 Conducted RF Receiving Sensitivity Typical Value [1] .................................................. 41
Table 4-9 Conducted RF Receiving Sensitivity Typical Value [2] .................................................. 41
Table 4-10 GNSS Technical Parameters ...................................................................................... 42
Table 6-1 Testing Standard .......................................................................................................... 46
Table 6-2 Testing Environment .................................................................................................... 47
Table 6-3 Testing Instrument & Device......................................................................................... 47
Table 6-4 Reliability Features ....................................................................................................... 48
Table 7-1 Baking parameters ....................................................................................................... 49
Table 7-2 LCC module PAD’s steel mesh opening ................................................................................ 49
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ME3631
Hardware Development Guide
FIGURES
Figure 1–1 System Connection Structure ..................................................................................... 13
Figure 2–1 Pin Assignment .......................................................................................................... 15
Figure 2–2 Reference circuit of AAT2138 ..................................................................................... 22
Figure 2–3 Reference circuit of LDO ............................................................................................ 22
Figure 2–4 reference circuit to turn-on/off module(1) .................................................................... 23
Figure 2–5 Timing of Turning on Mode ......................................................................................... 23
Figure 2–6 Timing of Turning off Mode ......................................................................................... 24
Figure 2–7 reference circuit to reset module(1) ............................................................................ 25
Figure 2–8 Timing of Reset Mode ................................................................................................ 25
Figure 2–9 Reference Circuit of the 8 Pin USIM Card .................................................................. 26
Figure 2–10 Reference Circuit of the 6 Pin USIM Card ................................................................ 26
Figure 2–11 Molex 91228 USIM Card Holder ............................................................................... 28
Figure 2–12 Amphenol C707 10M006 512 2 USIM Card Holder .................................................. 29
Figure 2–13 Reference Circuit of USB Application ....................................................................... 30
Figure 2–14 Reference Circuit of USB Communication between module and AP ......................... 30
Figure 2–15 Reference Circuit of Logic Level Translator .............................................................. 31
Figure 2–16 RS232 Level Match Circuit ....................................................................................... 32
Figure 2–17 Reference Circuit of Main UART with 4 Line Level Translator .................................. 32
Figure 2–18 Reference Circuit of UART with 2 Line Level Translator ........................................... 32
Figure 2–19 Reference Circuit of the Network Indicator ............................................................... 33
Figure 2–20 WAKEUP_IN input sequence ................................................................................. 34
Figure 2–21 Connections of the WAKEUP_IN pin ........................................................................ 34
Figure 2–22 The output signal of WAKEUP_OUT ........................................................................ 35
Figure 2–23 Connections of the WAKEUP_OUT pin .................................................................... 35
Figure 3–1 Reference Circuit of Antenna Interface ....................................................................... 37
Figure 3–2 Reference Circuit of GNSS Antenna ........................................................................... 38
Figure 3–3 The OTA test system of CTIA ..................................................................................... 39
Figure 5–1 ME3631 Top and Side Dimensions ............................................................................ 42
Figure 5–2 ME3631 Bottom Dimensions (Bottom view) ................................................................ 43
Figure 5–3 Recommended Footprint (Top view) ........................................................................... 44
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ME3631
Hardware Development Guide
Figure 7–1 Module Board’s Steel Mesh Diagram ......................................................................... 50
Figure 7–2 Material Module Pallet ................................................................................................ 50
Figure 7–3 Tape Reel Dimension ................................................................................................. 51
Figure 7–4 Module Furnace Temperature Curve Reference Diagram .......................................... 52
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Hardware Development Guide
PID
RF support
RF Band
Transmit Frequency (TX)
Receive Frequency (RX)
ME3631
LTE FDD
WCDMA
GSM
B2
B4
B5
B12
B17
B2
B5
GSM850
PCS1900
1850 to 1910 MHz
1710 to 1755 MHz
824 to 849 MHz
698 to 716 MHz
704 to 716 MHz
1850 to 1910 MHz
824 to 849 MHz
825 to849 MHz
1850 to 1910 MHz
1930 to 1990 MHz
2110 to 2155 MHz
869 to 894 MHz
728 to 746 MHz
734 to 746 MHz
1930 to 1990 MHz
869 to 894 MHz
869 to 894 MHz
1930 to 1990 MHz
Feature
Description
Physical
Small form factor-30 mm × 30 mm × 2.3mm
LCC with 80 pins Power Supply
The range of voltage supply is 3.4V-4.2V, typical value is 3.8V
Frequency Bands
ME3631
LTE FDD:B2,B4,B5,B12,B17
WCDMA:B2,B5
GSM: GSM 850, PCS 1900
Transmission Date
LTE FDD: Max 150Mbps(DL)/Max 50Mbps(UL)
Network Protocols
Support TCP/PPP/UDP protocols
Support PAP, CHAP protocols used for PPP connection.
USIM Interface
1.8V/3 V support
SIM extraction/hot plug detection
Support SIM and USIM
UART Interface
Support two UART interface: main UART interface and debug UART interface
Main UART interface:
Eight lines on main UART interface
1. PRODUCT OVERVIEW
1.1. GENERAL DESCRIPTION
ME3631 is a WCDMA /LTE FDD wireless communication module with LCC interface. It is widely applied to but not limited to the
various products and equipment such as laptops, vehicle-mounted terminals, and electric devices, by providing data services.
Customer can choose the dedicated type based on the wireless network configuration and using area. The following table
shows the entire radio band configuration of ME3631 series.
Table 1-1 ME3631 Supported Band
1.2. KEY FE ATURES
The table below describes the detailed features of the ME3631 module.
Table 1-2 ME3631 Key Features
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Hardware Development Guide
Support RTS and CTS hardware flow control
Baud rate can reach up to 921600 bps,115200 bps by default
Used for AT command, data transmission or firmware upgrade
Debug UART interface:
Two lines on debug UART interface, can be used for software debug, firmware upgrade
USB Interface
Compliant with USB 2.0 specification (slave only)
Used for AT command communication, data transmission, software debug and firmware upgrade.
USB Driver
Support Windows XP, Windows Vista, Windows 7, Windows 8, Windows 10,
Windows CE5.0/6.0 and later,
Linux 2.6.20 and later,
Android 2.3 / 4.X/ 5.X
SDIO interface
1.8V support (full speed) 4bits,SDIO compatible to WLAN (802.11)
Antenna Interface
Include main antenna ,diversity antenna and GNSS antenna
Rx-diversity
Support WCDMA/LTE Rx-diversity
AT commands
Compliant with 3GPP TS 27.007,27.005 and ZTEWelink enhanced AT commands
Network Indication
Use LED_MODE to indicate network connectivity status
SMS
Text and PDU mode
Point to point MO and MT
SMS saving/reading to SIM card or module storage
SMS cell broadcast
Temperature Range
Normal operation: -30°C to +75°C
Restricted operation1): -40°C~ -30°C and +75°C~ +85°C1)
Storage temperature: -40°C to +85°C
Firmware Upgrade
USB interface or UART interface or OTA(WEFOTA)
1.3. FUNCTI ON DIAG RA M
The figure below shows a block diagram of the ME3631 and illustrates the major functional parts.
Power management Baseband Memory RF send-receive Peripheral interface
--UART interface
--USIM card interface
--USB interface
--SDIO interface
--SPI interface
--I2C interface
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--ADC interface
Hardware Development Guide
Baseband
USB
USIM
UART
I2C
SDIO
SPI
LED
ADC
GPIO
FLASH
&
LPDDR2
Data
Control
Control
Rx&Tx
RF
Transceiver
RF PA
Duplexer
Duplexer
Tx
Rx
MAIN_ANT
80PIN LCC Connector Interface
Rx
GNSS
Rx
DIV_ANT
--Status interface (LED)
Figure 1–1 System Connection Structure
1.4. EVALUATION BOARD
In order to help you to develop applications with ME3631, ZTEWelink supplies an evaluation board (G2000/GE2015), RS-232 to
USB cable, USB data cable, power adapter, antenna and other peripherals to control or test the module. For details, please refer to the related document [ZTEWelink G2000 Dev Board User Guide] or [ZTEWelink GE2015 Dev Board User Guide].
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Hardware Development Guide
2. APPLICATION INTERFACE
2.1. GENERAL DESCRIPTION
ME3631 is equipped with an 80-pin 0.72mm pitch SMT pads plus 16-pin ground pads and reserved pads that connect to
customer’s cellular application platform. Sub-interface included in these pads is described in detail in the following chapters:
Pin assignment Pin description Power supply Turn on/off scenarios USIM interface USB interface UART interface Network status indication ADC interface WAKEUP_IN signal WAKEUP_OUT signal GPIO interface
2.2. PIN ASSIGNMENT
The following figure shows the pin assignment of the ME3631 module.
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Hardware Development Guide
Type
Description
IO
Bidirectional input/output
DI
Digital input
DO
Digital output
Keep all NC pins unconnected.
2.3. PIN DESCR IPTION
The following table shows the IO Parameters Definition.
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Figure 2–1 Pin Assignment
NOTE:
Table 2-1 IO Parameters Definition
Hardware Development Guide
PI
Power input
PO
Power output
AI
Analog input
AO
Analog output
OD
Open drain
Parameter
Min
Max
Unit
VIH
0.65*VDD_IO
VDD_IO+0.3
V
VIL
-0.3
0.35* VDD_IO
V
VOH
VDD_IO-0.45
VDD_IO
V
VOL 0 0.45
V
Power Supply Pin Name
Pin NO.
I/O
Description
DC Characteristics
Comment
V_BAT
50.51
PI
Power supply for
module
Vmax = 4.2V
Vmin = 3.4V
Vnorm = 3.8V
It must be able to provide
sufficient current in a
transmitting burst which
typically rises to 2.0A
VREF_1V8
5
PO
Provide 1.8V for
external circuit
Vnorm = 1.8V
Imax = 300mA
Power supply for external
GPIO’S pull up circuits
GND
3,9,11,20,21,31,36,
46,49,52, 61,63,78,
80,
Ground
Turn On/Off Pin Name
Pin NO.
I/O
Description
DC Characteristics
Comment
POWER_ON
1
DI
Turn on/off module
VIH max = 2.1V
VIH min = 1.17V
VIL max = 0.63V
Pull-up to 1.8V through 200K
resistance internally, active low
RESET_N
2
DI
Reset module
VIH max = 2.1V
VIH min = 1.17V
VIL max = 0.63V
Active low
Status Indication
Pin Name
Pin NO.
I/O
Description
DC Characteristics
Comment
LED_MODE
70
DO
Indicate the module
network registration
VOH min = 1.35V
VOL max = 0.45V
1.8V power domain
The logic levels are described in the following table.
NOTE:
VDD_IO is the voltage level of pins.
Table 2-2 Logic levels Description
The following tables show the ME3631s pin definition.
Table 2-3 Pin Description
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