All Rights reserved, No Spreading abroad without Permission I
ME3631
Hardware Development Guide
Abbreviations
Full Name
3GPP
Third Generation Partnership Project
AP
Another name of DTE
CHAP
Challenge Handshake Authentication Protocol
CE
European Conformity
CMOS
Complementary Metal Oxide Semiconductor
DCE
Data Communication Equipment
DL
Downlink
DTE
Data Terminal Equipment
EIA
Electronic Industries Association
EMC
Electromagnetic Compatibility
ESD
Electro-Static discharge
ESR
Equivalent Series Resistance
FDD
Frequency Division Duplex
GPIO
General-purpose I/O
LCC
Leadless Chip Carrier
ABOUT THIS DOCUMENT
A. Application Range
This document is the Product Technical Specification for the ME3631 GSM/WCDMA/LTE-FDD module. It defines the high level
product features and illustrates the interface for these features. This document is intended to cover the hardware aspects of the
product, including electrical and mechanical.
B. Reading Note
The symbols below are the reading notes you should pay attention on:
: WARNING or ATTENTION : NOTE or REMARK
C. Purpose
This document provides the hardware solutions and development fundamentals for a product with the module. By reading this
document, the user can have an overall knowledge of the module and a clear understanding of the technical parameters. With this
document, the user can successfully fulfill the application and development of wireless Internet product or equipment.
Besides the product features and technical parameters, this document also provides the product reliability tests and related
testing standards, RF performance indexes and a guide on the design of user circuits, to provide the user with a complete design
reference.
NOTE:
To ensure the module manufacturing and welding quality, do as the chapter 7 of Manufacturing Guide in
this document. The force on the squeegee should be adjusted so as to produce a clean stencil surface on a
single pass and ensure the module soldering quality.
D. Abbreviations
Table below is a list of abbreviations involved in this document, as well as the English full names.
All Rights reserved, No Spreading abroad without Permission II
ME3631
Hardware Development Guide
LDO
Low-Dropout
LED
Light Emitting Diode
LTE
Long Term Evolution
ME
Mobile Equipment
MO
Mobile Origination Call
MT
Mobile Termination Call
MSB
Most Significant Bit
PC
Personal Computer
PCB
Printed Circuit Board
PDA
Personal Digital Assistant
PDU
Protocol Data Unit
PAP
Password Authentication Protocol
PPP
Point to Point Protocol
RTC
Real Time Clock
SMS
Short Messaging Service
SMT
Surface Mount Technology
SPI
Serial Peripheral Interface
TBD
To Be Determined
TCP
Transmission Control Protocol
TIS
Total Isotropic Sensitivity
TRP
Total Radiated Power
TVS
Transient Voltage Suppressor
UART
Universal Asynchronous Receiver-Transmitter
UDP
User Datagram Protocol
UL
Up Link
USB
Universal Serial Bus
USIM
Universal Subscriber Identity Module
URC
Unsolicited result code
VIH
Logic High level of input voltage
VIL
Logic Low level of input voltage
VOH
Logic High level of output voltage
VOL
Logic Low level of output voltage
All Rights reserved, No Spreading abroad without Permission III
ME3631
Hardware Development Guide
Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a
mobile while driving (even with a hands free kit) cause distraction and can lead to an accident. You must
comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The
operation of wireless appliances in an aircraft is forbidden to prevent interference with communication
systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device
offers a Airplane Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals or clinics or other health care facilities. These
requests are designed to prevent possible interference with sensitive medical equipment.
GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and
cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While
you are in this condition and need emergent help, please remember using emergency call. In order to make
or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is on, it receives and
transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or
other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices
such as your phone or other cellular terminals. Areas with potentially explosive atmospheres including
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air
contains chemicals or particles such as grain, dust or metal powders.
SAFETY INFORMATION
The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any
cellular terminal or mobile incorporating ME3610 module. Manufacturers of the cellular terminal should send the following safety
information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not
so, ZTEWelink does not take on any liability for customer failure to comply with these precautions.
All Rights reserved, No Spreading abroad without Permission IV
ME3631
Hardware Development Guide
CONTENTS
LEGAL INFORMATION ........................................................................................................................................................................... I
REVISION HISTORY ........................................................................................................................................................................... I
ABOUT THIS DOCUMENT.......................................................................................................................................................................... II
SAFETY INFORMATION ......................................................................................................................................................................... IV
CONTENTS .......................................................................................................................................................................... V
TABLES ........................................................................................................................................................................ VII
FIGURES ......................................................................................................................................................................... IX
1.1. General Description ........................................................................................................................................................................... 11
1.2. Key Features ................................................................................................................................................................................. 11
1.3. Function Diagram............................................................................................................................................................................... 12
2.1. General Description ........................................................................................................................................................................... 14
2.4. Power Supply ................................................................................................................................................................................. 21
2.4.1. Power Supply Pins ................................................................................................................................................................... 21
2.4.2. Decrease Voltage Drop ............................................................................................................................................................ 21
2.4.3. Reference Circuit of Power Supply .......................................................................................................................................... 21
2.5. Turn on Scenarios .............................................................................................................................................................................. 22
2.6. Turn off Scenarios .............................................................................................................................................................................. 24
2.8.1. Description of PINs .................................................................................................................................................................. 25
2.8.2. Design Considerations for USIM Card Holder .......................................................................................................................... 27
2.9. USB Interface ................................................................................................................................................................................. 29
2.13. WAKEUP_IN Signal ........................................................................................................................................................................... 34
2.14. WAKEUP_OUT Signal ....................................................................................................................................................................... 35
2.15. GPIO Interface(not support yet) ...................................................................................................................................................... 36
All Rights reserved, No Spreading abroad without Permission V
3.5. Test Methods for Whole-Set Antenna OTA ....................................................................................................................................... 39
4. Electrical, Reliability and Radio Characteristics ............................................................................................................................ 40
4.1. Absolute Maximum Ratings ............................................................................................................................................................... 40
4.2. Operating Temperature ..................................................................................................................................................................... 40
4.3. Current Consumption ........................................................................................................................................................................ 40
4.4. RF Output Power ............................................................................................................................................................................... 41
5.1. Mechanical Dimensions of the Module ............................................................................................................................................. 42
5.2. Footprint of Recommendation .......................................................................................................................................................... 44
5.3. Top View of the Module .................................................................................................................................................................... 44
6. Related Test & Test Standard ...................................................................................................................................................... 46
7. SMT Process and Baking Guide .................................................................................................................................................... 49
7.3.2. Design of module PAD’s steel mesh opening on main board .................................................................................................. 49
7.3.3. Module Board’s SMT process .................................................................................................................................................. 50
All Rights reserved, No Spreading abroad without Permission 12
--ADC interface
Hardware Development Guide
Baseband
USB
USIM
UART
I2C
SDIO
SPI
LED
ADC
GPIO
FLASH
&
LPDDR2
Data
Control
Control
Rx&Tx
RF
Transceiver
RF PA
Duplexer
Duplexer
Tx
Rx
MAIN_ANT
80PIN LCC Connector Interface
Rx
GNSS
Rx
DIV_ANT
--Status interface (LED)
Figure 1–1 System Connection Structure
1.4. EVALUATION BOARD
In order to help you to develop applications with ME3631, ZTEWelink supplies an evaluation board (G2000/GE2015), RS-232 to
USB cable, USB data cable, power adapter, antenna and other peripherals to control or test the module. For details, please refer to
the related document [ZTEWelink G2000 Dev Board User Guide] or [ZTEWelink GE2015 Dev Board User Guide].
All Rights reserved, No Spreading abroad without Permission 13
Hardware Development Guide
2. APPLICATION INTERFACE
2.1. GENERAL DESCRIPTION
ME3631 is equipped with an 80-pin 0.72mm pitch SMT pads plus 16-pin ground pads and reserved pads that connect to
customer’s cellular application platform. Sub-interface included in these pads is described in detail in the following chapters:
Pin assignment
Pin description
Power supply
Turn on/off scenarios
USIM interface
USB interface
UART interface
Network status indication
ADC interface
WAKEUP_IN signal
WAKEUP_OUT signal
GPIO interface
2.2. PIN ASSIGNMENT
The following figure shows the pin assignment of the ME3631 module.
All Rights reserved, No Spreading abroad without Permission 14
Hardware Development Guide
Type
Description
IO
Bidirectional input/output
DI
Digital input
DO
Digital output
Keep all NC pins unconnected.
2.3. PIN DESCR IPTION
The following table shows the IO Parameters Definition.
All Rights reserved, No Spreading abroad without Permission 15
Figure 2–1 Pin Assignment
NOTE:
Table 2-1 IO Parameters Definition
Hardware Development Guide
PI
Power input
PO
Power output
AI
Analog input
AO
Analog output
OD
Open drain
Parameter
Min
Max
Unit
VIH
0.65*VDD_IO
VDD_IO+0.3
V
VIL
-0.3
0.35* VDD_IO
V
VOH
VDD_IO-0.45
VDD_IO
V
VOL 0 0.45
V
Power Supply
Pin Name
Pin NO.
I/O
Description
DC Characteristics
Comment
V_BAT
50.51
PI
Power supply for
module
Vmax = 4.2V
Vmin = 3.4V
Vnorm = 3.8V
It must be able to provide
sufficient current in a
transmitting burst which
typically rises to 2.0A
VREF_1V8
5
PO
Provide 1.8V for
external circuit
Vnorm = 1.8V
Imax = 300mA
Power supply for external
GPIO’S pull up circuits
GND
3,9,11,20,21,31,36,
46,49,52, 61,63,78,
80,
Ground
Turn On/Off
Pin Name
Pin NO.
I/O
Description
DC Characteristics
Comment
POWER_ON
1
DI
Turn on/off module
VIH max = 2.1V
VIH min = 1.17V
VIL max = 0.63V
Pull-up to 1.8V through 200K
resistance internally, active low
RESET_N
2
DI
Reset module
VIH max = 2.1V
VIH min = 1.17V
VIL max = 0.63V
Active low
Status Indication
Pin Name
Pin NO.
I/O
Description
DC Characteristics
Comment
LED_MODE
70
DO
Indicate the module
network registration
VOH min = 1.35V
VOL max = 0.45V
1.8V power domain
The logic levels are described in the following table.
NOTE:
VDD_IO is the voltage level of pins.
Table 2-2 Logic levels Description
The following tables show the ME3631’s pin definition.
Table 2-3 Pin Description
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