ZTE ME3630 Users Manual

ME36

ARDWARE DEVELOPMENT GUIDE

Version: V1.0

Date: 2016-02-26

LTE Module Series

Website: www.ztewelink.com

E-mail: ztewelink@zte.com.cn

ME3630

Hardware Development Guide

EGAL INFORMATION

By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as ZTEWelink), you are deemed

to have agreed to the following terms. If you don’t agree to the following terms, please stop using the document.

proprietary information. Without the prior written permission of ZTEWelink, no entity or individual is allowed to reproduce, transfer,

distribute, use and disclose this document or any image, table, data or other information contained in this document.

is the registered trademark of ZTEWelink. The name and logo of ZTEWelink are ZTEWelink’s trademark or

registered trademark. Meanwhile, ZTEWelink is granted to use ZTE Corporation’s registered trademark. The other products or

company names mentioned in this document are the trademark or registered trademark of their respective owner. Without the prior

written permission of ZTEWelink or the third-party oblige, no one is allowed to read this document.

The product meets the design requirements of environmental protection and personal security. The storage, use or disposal of

products should abide by the product manual, relevant contract or the laws and regulations of relevant country.

ZTEWelink reserves the right to make modifications on the product described in this document without prior notice, and keeps

the right to revise or retrieve the document any time.

If you have any question about the manual, please consult the company or its distributors promptly.

EVISION HISTORY

Version Date Description

1.0 2016-02-26 1st released version

ME3630

Hardware Development Guide

BOUT THIS DOCUMENT

A. Application Range

This document is the Product Technical Specification for the ME3630 GSM/CDMA/WCDMA/ TD-SCDMA/LTE TDD/LTE FDD

module. It defines the high level product features and illustrates the interface for these features. This document is intended to cover

the hardware aspects of the product, including electrical and mechanical.

B. Reading Note

The symbols below are the reading notes you should pay attention on:

: Warning or Attention

: Note or Remark

C. Purpose

This document provides the hardware solutions and development fundamentals for a product with the module. By reading this

document, the user can have an overall knowledge of the module and a clear understanding of the technical parameters. With this

document, the user can successfully fulfill the application and development of wireless Internet product or equipment.

Besides the product features and technical parameters, this document also provides the product reliability tests and related

testing standards, RF performance indexes and a guide on the design of user circuits, to provide the user with a complete design

reference.

NOTE: To ensure the module manufacturing and welding quality, do as the chapter 7 of Manufacturing Guide in this document. The force on

the squeegee should be adjusted so as to produce a clean stencil surface on a single pass and ensure the module soldering quality.

D. Abbreviations

Table below is a list of abbreviations involved in this document, as well as the English full names.

Abbreviations Full Name

3GPP Third Generation Partnership Project

AP Another name of DTE

CHAP Challenge Handshake Authentication Protocol

CE European Conformity

CMOS Complementary Metal Oxide Semiconductor

DCE Data Communication Equipment

DL Downlink

DTE Data Terminal Equipment

EIA Electronic Industries Association

EMC Electromagnetic Compatibility

ESD Electro-Static discharge

ESR Equivalent Series Resistance

FDD Frequency Division Duplex

GPIO General-purpose I/O

LCC Leadless Chip Carrier

ME3630

Hardware Development Guide

LDO Low-Dropout

LED Light Emitting Diode

LTE Long Term Evolution

ME Mobile Equipment

MO Mobile Origination Call

MT Mobile Termination Call

MSB Most Significant Bit

PC Personal Computer

PCB Printed Circuit Board

PDA Personal Digital Assistant

PDU Protocol Data Unit

PAP Password Authentication Protocol

PPP Point to Point Protocol

RTC Real Time Clock

SMS Short Messaging Service

SMT Surface Mount Technology

SPI Serial Peripheral Interface

TBD To Be Determined

TCP Transmission Control Protocol

TIS Total Isotropic Sensitivity

TRP Total Radiated Power

TVS Transient Voltage Suppressor

UART Universal Asynchronous Receiver-Transmitter

UDP User Datagram Protocol

UL Up Link

USB Universal Serial Bus

USIM Universal Subscriber Identity Module

URC Unsolicited result code

VIH Logic High level of input voltage

VIL Logic Low level of input voltage

VOH Logic High level of output voltage

VOL Logic Low level of output voltage

ME3630

Hardware Development Guide

AFETY INFORMATION

The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any

cellular terminal or mobile incorporating ME3610 module. Manufacturers of the cellular terminal should send the following safety

information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not

so, ZTEWelink does not take on any liability for customer failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a

mobile while driving (even with a hands free kit) cause distraction and can lead to an accident. You must

comply with laws and regulations restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The

operation of wireless appliances in an aircraft is forbidden to prevent interference with communication

systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device

offers a Airplane Mode which must be enabled prior to boarding an aircraft.

Switch off your wireless device when in hospitals or clinics or other health care facilities. These

requests are designed to prevent possible interference with sensitive medical equipment.

GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and

cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While

you are in this condition and need emergent help, please remember using emergency call. In order to make

or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate

cellular signal strength.

Your cellular terminal or mobile contains a transmitter and receiver. When it is on, it receives and

transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or

other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices

such as your phone or other cellular terminals. Areas with potentially explosive atmospheres including

fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air

contains chemicals or particles such as grain, dust or metal powders.

Hardware Development Guide

ONTACT INFORMATION

Post 9/F, Tower A, Hans Innovation Mansion,

Web www.ztewelink.com

Phone +86-755-26902600

E-Mail ztewelink@zte.com.cn

Note: Consult our website for up-to-date product descriptions, documentation, application notes, firmware upgrades, troubleshooting tips,

and press releases

Besides, ZTEWelink provides various technical support ways to the customers, such as support by phone, website, instant

messaging, E-mail and on-site.

North Ring Rd., No.9018, Hi-Tech Industrial Park,

Nanshan District, Shenzhen.

ME3630

Hardware Development Guide

ONTENTS

1. Product Overview ......................................................................................................................................................................... 1

1.1. General Description....................................................................................................................................................................................................... 1

1.2. Key Features ........................................................................................................................................................................................................ 2

1.3. Function Diagram ........................................................................................................................................................................................................ 4

1.4. Evaluation Board ........................................................................................................................................................................................................ 5

2. Application Interface ..................................................................................................................................................................... 6

2.1. General Description ............................................................................................................................................................................. 6

2.2. Pin Assignment ................................................................................................................................................................................... 6

2.3. Pin Description ................................................................................................................................................................................... 7

2.4. Power Supply ................................................................................................................................................................................. 13

2.4.1. Power Supply Pins ................................................................................................................................................................... 13

2.4.2. Decrease Voltage Drop ............................................................................................................................................................ 13

2.4.3. Reference Circuit of Power Supply .......................................................................................................................................... 13

2.5. Turn on Scenarios .............................................................................................................................................................................. 14

2.6. USIM Card Interface........................................................................................................................................................................... 15

2.6.1. Description of PINs .................................................................................................................................................................. 15

2.6.2. Design Considerations for USIM Card Holder .......................................................................................................................... 17

2.7. USB Interface ................................................................................................................................................................................. 18

2.8. UART Interface ................................................................................................................................................................................. 20

2.9. Network Status Indication ................................................................................................................................................................. 22

2.10. ADC Interface ................................................................................................................................................................................. 22

2.11. WAKEUP_OUT Signal ....................................................................................................................................................................... 23

2.12. GPIO Interface ............................................................................................................................................................................... 23

3. Antenna Interface ....................................................................................................................................................................... 24

3.1. Pin Definition ................................................................................................................................................................................. 24

3.2. Reference Design ............................................................................................................................................................................... 24

3.3. Reference PCB Layout of Antenna ..................................................................................................................................................... 24

3.4. Suggestions for EMC & ESD Design .................................................................................................................................................... 25

3.4.1. EMC Design Requirements ...................................................................................................................................................... 25

3.4.2. ESD Design Requirements ....................................................................................................................................................... 25

3.5. Test Methods for Whole-Set Antenna OTA ....................................................................................................................................... 26

4. Electrical, Reliability and Radio Characteristics ............................................................................................................................ 27

4.1. Absolute Maximum Ratings ............................................................................................................................................................... 27

4.2. Operating Temperature ..................................................................................................................................................................... 27

4.3. Current Consumption ........................................................................................................................................................................ 27

4.4. RF Output Power ............................................................................................................................................................................... 28

4.5. RF Receiving Sensitivity ...................................................................................................................................................................... 28

4.6. GNSS Technical Parameters ............................................................................................................................................................... 29

ME3630

Hardware Development Guide

4.7. Electrostatic Discharge ...................................................................................................................................................................... 29

5. Mechanical Dimensions .............................................................................................................................................................. 30

5.1. Mechanical Dimensions of the Module ............................................................................................................................................. 30

5.2. Footprint of Recommendation .......................................................................................................................................................... 31

5.3. Top View of the Module .................................................................................................................................................................... 32

5.4. Bottom View of the Module .............................................................................................................................................................. 32

6. Related Test & Test Standard ...................................................................................................................................................... 33

6.1. Testing Reference .............................................................................................................................................................................. 33

6.2. Description of Testing Environment .................................................................................................................................................. 34

6.3. Reliability Testing Environment ......................................................................................................................................................... 35

7. SMT Process and Baking Guide .................................................................................................................................................... 36

7.1. Storage Requirements ....................................................................................................................................................................... 36

7.2. Module Plainness Standard ............................................................................................................................................................... 36

7.3. Process Routing Selection .................................................................................................................................................................. 36

7.3.1. Solder Paste Selection ............................................................................................................................................................. 36

7.3.2. Design of module PAD’s steel mesh opening on main board .................................................................................................. 36

7.3.3. Module Board’s SMT process .................................................................................................................................................. 37

7.3.4. Module Soldering Reflow Curve .............................................................................................................................................. 38

7.3.5. Reflow method ........................................................................................................................................................................ 39

7.3.6. Maintenance of defects .......................................................................................................................................................... 39

7.4. Module’s Baking Requirements ......................................................................................................................................................... 40

7.4.1. Module’s Baking Environment ................................................................................................................................................ 40

7.4.2. Baking device and operation procedure ................................................................................................................................. 40

7.4.3. Module Baking Conditions ...................................................................................................................................................... 40

ME3630

Hardware Development Guide

ABLES

Table 1-1 ME3630 Reference Using Area .................................................................................................................................................. 1

Table 1-2 ME3630 Supported Band ........................................................................................................................................................... 1

Table 1-3 ME3630 Key Features ............................................................................................................................................................. 3

Table 2-1 IO Parameters Definition ........................................................................................................................................................ 7

Table 2-2 Logic levels Description ........................................................................................................................................................... 8

Table 2-3 Pin Description ........................................................................................................................................................................ 8

Table 2-4 Power Supply ........................................................................................................................................................................ 13

Table 2-5 POWER_ON/OFF Pin Description .......................................................................................................................................... 14

Table 2-6 Power-on Time...................................................................................................................................................................... 15

Table 2-7 Pin Definition of the USIM Interface ..................................................................................................................................... 15

Table 2-8 Pin Description of Molex USIM Card Holder ......................................................................................................................... 17

Table 2-9 Pin Description of Amphenol USIM Card Holder .................................................................................................................. 18

Table 2-10 USB Pin Description ............................................................................................................................................................ 19

Table 2-11 Pin Definition of the Main UART Interface .......................................................................................................................... 20

Table 2-12 Pin Definition of the Debug UART Interface ....................................................................................................................... 20

Table 2-13 Pin Definition of Network Indicator .................................................................................................................................... 22

Table 2-14 Working State of the Network Indicator ............................................................................................................................. 22

Table 2-15 Pin Definition of the ADC .................................................................................................................................................... 22

Table 2-16 Characteristic of the ADC .................................................................................................................................................... 23

Table 2-17 Pin Definition of WAKEUP_OUT .......................................................................................................................................... 23

Table 2-18 Pin Definition of GPIO ......................................................................................................................................................... 23

Table 3-1 Pin Definition of GPIO ........................................................................................................................................................... 24

Table 4-1 Absolute Maximum Ratings .................................................................................................................................................. 27

Table 4-2 Operating Temperature ........................................................................................................................................................ 27

Table 4-3 Averaged standby DC power consumption [1] ..................................................................................................................... 27

Table 4-4 Averaged standby DC power consumption [2] ..................................................................................................................... 27

Table 4-5 Averaged standby DC power consumption [3] ..................................................................................................................... 28

Table 4-6 Conducted RF Output Power ................................................................................................................................................ 28

Table 4-7 Conducted RF Receiving Sensitivity [1] ................................................................................................................................. 28

Table 4-8 Conducted RF Receiving Sensitivity [2] ................................................................................................................................. 28

Table 4-9 GNSS Technical Parameters .................................................................................................................................................. 29

Table 4-10 ESD ...................................................................................................................................................................................... 29

Table 6-1 Testing Standard ................................................................................................................................................................... 33

Table 6-2 Testing Environment ............................................................................................................................................................. 34

Table 6-3 Testing Instrument & Device ................................................................................................................................................ 34

Table 6-4 Reliability Features ............................................................................................................................................................... 35

Table 7-1 Baking parameters ................................................................................................................................................................ 36

Table 7-2 LCC module PAD’s steel mesh opening ................................................................................................................................. 36

ME3630

Hardware Development Guide

IGURES

Figure 1-1 System Connection Structure ................................................................................................................................................ 5

Figure 2-1 Pin Assignment ...................................................................................................................................................................... 7

Figure 2-2 Structure of the Power Supply ............................................................................................................................................. 13

Figure 2-3 Reference circuit of AAT2138 .............................................................................................................................................. 14

Figure 2-4 Reference circuit of LDO ...................................................................................................................................................... 14

Figure 2-5 Timing of Turning on Mode ................................................................................................................................................. 15

Figure 2-6 Reference Circuit of the 8 Pin USIM Card ............................................................................................................................ 15

Figure 2-7 Reference Circuit of the 6 Pin USIM Card ............................................................................................................................ 16

Figure 2-8 Molex 91228 USIM Card Holder .......................................................................................................................................... 17

Figure 2-9 Amphenol C707 10M006 512 2 USIM Card Holder ............................................................................................................. 18

Figure 2-10 Reference Circuit of USB Application ................................................................................................................................. 19

Figure 2-11 Reference Circuit of USB Communication between module and AP ................................................................................. 19

Figure 2-12 Reference Circuit of Logic Level Translator........................................................................................................................ 21

Figure 2-13 RS232 Level Match Circuit ................................................................................................................................................. 21

Figure 2-14 Reference Circuit of Main UART with 4 Line Level Translator ........................................................................................... 21

Figure 2-15 Reference Circuit of UART with 2 Line Level Translator .................................................................................................... 21

Figure 2-16 Reference Circuit of the Network Indicator ....................................................................................................................... 22

Figure 2-17 The output signal of WAKEUP_OUT .................................................................................................................................. 23

Figure 3-1 Reference Circuit of Antenna Interface ............................................................................................................................... 24

Figure 3-2 The OTA test system of CTIA................................................................................................................................................ 26

Figure 5-1 ME3630 Top and Side Dimensions ...................................................................................................................................... 30

Figure 5-2 ME3630 Bottom Dimensions (Bottom view) ....................................................................................................................... 30

Figure 5-3 Recommended Footprint (Top view) ................................................................................................................................... 31

Figure 5-4 Location and dimension of test points ................................................................................................................................ 31

Figure 5-5 Top View of the Module ...................................................................................................................................................... 32

Figure 5-6 Bottom View of the Module ................................................................................................................................................ 32

Figure 7-1 Module Board’s Steel Mesh Diagram .................................................................................................................................. 37

Figure 7-2 Material Module Pallet ........................................................................................................................................................ 37

Figure 7-3 Tape Reel Dimension ........................................................................................................................................................... 38

Figure 7-4 Module Furnace Temperature Curve Reference Diagram ................................................................................................... 39

Hardware Development Guide

1. P

RODUCT OVERVIEW

1.1. G

ENERA L DES CRIPTION

ME3630 is a GSM/CDMA/ WCDMA/ TD-SCDMA/LTE TDD/LTE FDD wireless communication module with LCC interface. It is

widely applied to but not limited to the various products and equipment such as laptops, vehicle-mounted terminals, and electric

devices, by providing data services.

ME3630 a GSM/CDMA/ WCDMA/ TD-SCDMA/LTE TDD/LTE FDD wireless communication module. ME3630 contains three

variants ME3630-C1A, ME3630-C1B, ME3630-U1A, ME3630-E1A. Customer can choose the dedicated type based on the wireless

network configuration. The following tables show entire radio band configuration of ME3630 series.

Table 1-1 ME3630 Reference Using Area

Variants Description

ME3630-C1A GSM B3/8,CDMA1X CDMA EVDO,WCDMA B1,TD-SCDMA B34/39,LTE FDD B1/3,LTE TDD B38/39/40/41 for China

ME3630-C1B

GSM B3/8，CDMA1X CDMA EVDO，WCDMA B1，TD-SCDMA B34/39，LTE FDD B1/3，LTE TDD

B38/39/40/41 （GNSS and Rx-diversity are not supported yet）for China

ME3630-U1A WCDMA B2/5,LTE FDD B2/4/5/12/17 for America

ME3630-E1A GSM B3/8,WCDMA B1/8,LTE FDD B1/3/7/8/20 for Europe

Table 1-2 ME3630 Supported Band

PID RF support RF Band Transmit Frequency (TX) Receive Frequency (RX) Maximum Output Power

GSM B3 1710 to 1785 MHz 1805 to 1880 MHz 30dBm±2dBm

B8 880 to 915 MHz 925 to 960 MHz 33dBm±2dBm

ME3630-C1A

ME3630-U1A

CDMA

(EVDO/CDMA1X)

WCDMA B1 1920 to 1980 MHz 2110 to 2170 MHz 24dBm+1/-3dBm

TD-SCDMA B34 2010 to 2025 MHz 2010 to 2025 MHz 24dBm+1/-3dBm

LTE FDD B1

LTE TDD B38

LTE FDD

WCDMA

BC0 824 to 849MHz 869 to 894 MHz 23dBm~30dBm

B39 1880 to 1920 MHz 1880 to 1920 MHz 24dBm+1/-3dBm

B39

B40

B41

B12

B17

1920 to 1980 MHz

1710 to 1785 MHz

2570 to 2620MHZ

1880 to 1920MHZ

2300 to 2400MHZ

2496 to 2690MHZ

1850 to 1910 MHz

1710 to 1755 MHz

824 to 849 MHz

698 to 716 MHz

704 to 716 MHz

1850 to 1910 MHz

824 to 849 MHz

2110 to 2170 MHz

1805 to 1880MHZ

2570 to 2620MHZ

1880 to 1920MHZ

2300 to 2400MHZ

2496 to 2690MHZ

1930 to 1990 MHz

2110 to 2155 MHz

869 to 894 MHz

728 to 746 MHz

734 to 746 MHz

1930 to 1990 MHz

869 to 894 MHz

23dBm±2.7dBm

24dBm+1/-3dBm

Hardware Development Guide

LTE FDD

ME3630-E1A

NOTE:



For convenience of description, in the next content, the “ME3630” means the “ME3630 product serials”.



With a tiny profile of 30.0mm×30.0mm×2.3mm (without label, the label is 0.1mm), ME3630 can meet almost all requirements for M2M

application such as automotive, metering, tracking system, security solutions, routers, wireless POS, mobile computing devices, PDA phone

and tablet PC, etc.



ME3630 is an SMD type module, which can be embedded in customer application through its 96-pin pads including 80 LCC signal pads and

16 ground pads.

WCDMA

GSM

B20

1920 to 1980 MHz

1710 to 1785 MHz

2500 to 2570 MHz

880 to 915 MHz

832 to 862 MHz

1920 to 1980 MHz

880 to 915MHZ

1710 to 1785 MHz

880 to 915 MHz

2110 to 2170 MHz

1805 to 1880 MHz

2620 to 2690 MHz

925 to 960 MHz

791 to 821 MHz

2110 to 2170 MHz

925 to 960MHZ

1805 to 1880 MHz

925 to 960 MHz

23dBm±2.7dBm

24dBm+1/-3dBm

30dBm±2dBm

33dBm±2dBm



ME3630 is integrated with internet service protocols like TCP/UDP and PPP. Extended AT commands have been developed for customer to

use these internet service protocols easily.

1.2. K

EY FEATUR ES

The table below describes the detailed features of the ME3630 module.

Hardware Development Guide

Table 1-3 ME3630 Key Features

Feature Description

Physical

Power Supply

Frequency Bands

Transmission Date

Transmitting Power

Small form factor-30 mm × 30 mm × 2.3mm

RF connection pads (RF main interface)

LCC with 80 pins

The range of voltage supply is 3.4V-4.2V, typical value is 3.8V

C1A/C1B

U1A LTE FDD B2/B4 /B5/B12/B17

E1A LTE FDD B1/B3 /B7/B8/B20

LTE : Max 150Mbps(DL)/Max 50Mbps(UL)

Class 3 (23dBm±2.7dBm) for LTE

LTE FDD B1/B3

LTE TDD B38/B39/B40/B41

WCDMA B1

CDMA BC0

TD-SCDMA B34/B39

GSM B3/B8

WCDMA B2/B5

WCDMA B1/B8

GSM B3/B8

Internet Protocol Features

USIM Interface

UART Interface

USB Interface

Support TCP/PPP/UDP protocols

Support the protocols PAP and CHAP usually used for PPP connections

1.8v/3v support

SIM extraction/hot plug detection

Support SIM and USIM

Supports SIM application tool kit with proactive SIM commands

Support two UART interface: main UART interface and debug UART interface

Main UART interface:

Eight lines on main UART interface

Support RTS and CTS hardware flow control

Baud rate can reach up to 921600 bps,115200 bps by default

Used for AT command, data transmission or firmware upgrade

Multiplexing function

Debug UART interface:

Two lines on debug UART interface, can be used for software debug, firmware upgrade

Compliant with USB 2.0 specification (slave only)

Used for AT command communication, data transmission, software debug and firmware upgrade.

USB Driver: Support W indows XP, W indows Vista, Windows 7, Windows 8, Windows

Hardware Development Guide

10,Windows CE5.0/6.0 and later, Linux 2.6.20 and later, Android 2.3/4.X/5.X

SDIO interface

Antenna Interface

Rx-diversity

AT commands

Network Indication

SMS

Temperature Range

Firmware Upgrade

NOTE:

1.1)means when the module works within this temperature range, RF performance might degrade. For example, the frequency error and the phase

error would increase.

1.8v support (full speed) 4bits,SDIO compatible to WLAN (802.11)

Include main antenna ,diversity antenna and GPS antenna(C1B is not included)

Support WCDMA/LTE Rx-diversity(C1B is not included)

Compliant with 3GPP TS 27.007,27.005 and ZTEWelink enhanced AT commands

Use LED_MODE to indicate network connectivity status

Text and PDU mode

Point to point MO and MT

SMS saving/reading to SIM card or ME storage

SMS cell broadcast

Normal operation: -30°C to +75°C

Restricted operation1): -40°C~ -30°C and +75°C~ +85°C1)

Storage temperature: -40°C to +85°C

USB interface or main UART interface, debug UART interface

1.3. F

UNCTION DIAGRA M

The figure below shows a block diagram of the ME3630 and illustrates the major functional parts.

 Power management  Baseband  Memory (512MB flash + 256MB LPDDR2)  Radio frequency  Peripheral interface

--UART interface

--USIM card interface

--USB interface

--SDIO interface

--SPI interface

--I2C interface

--ADC interface

--Status interface (LED)

Hardware Development Guide

1.4. E

VALUATION BOARD

Figure 1-1 System Connection Structure

In order to help you to develop applications with ME3630, ZTEWelink supplies an evaluation board (G2000), RS-232 to USB

cable, USB data cable, power adapter, antenna and other peripherals to control or test the module. For details, please refer to the

related document [ZTEWelink G2000 Dev Board User Guide_V1.2].

Hardware Development Guide

2. A

PPLICATION INTERFACE

2.1. G

customer’s cellular application platform. Sub-interface included in these pads is described in detail in the following chapters:

2.2. P

ENERA L DES CRIPTION

ME3630 is equipped with an 80-pin 0.72mm pitch SMT pads plus 16-pin ground pads and reserved pads that connect to

 Pin assignment  Pin description  Power supply  Turn on/off scenarios  USIM interface  USB interface  HSIC interface  UART interface  SDIO interface  SPI interface  Network status interface (LED)  ADC interface  WAKEUP_OUT signal  GPIO interface

IN ASSIGNME NT

The following figure shows the pin assignment of the ME3630 module.

+ 35 hidden pages

ZTE ME3630 Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual