Zhone Technologies Copper-Based Ethernet User Manual
E F M PRO DU C T GU I D E
Copper-Based Ethernet in the First Mile
Zhone TechnologiesZhone Technologies
13.4%
Fiber-connected
Copper-connected
86.6%
Ethernet Everywhere
• • •
Need high-bandwidth Ethernet service
over existing copper?
Zhone’s EFM Solutions make it easy and cost-effective.
Ethernet loop bonding delivers high-bandwidth services without the cost of fiber construction.
With more than 85% of all US businesses served by copper today, Ethernet in the
First Mile (EFM) loop bonding has seen a 65% CAGR, the highest growth rate in
telecommunications. It's no surprise, given the ease of deployment and the scalability
of bandwidth, without costly fiber builds or network re-designs.
Business service delivery
to US commercial buildings
with 20+ employees
Source: Vertical Systems Group
Key applications for EFM include:
n
Symmetrical enterprise data services
n
VLAN, E-Line, E-LAN services
n
T1 / E1 and Frame Relay replacement services
n
Mobile backhaul
n
Traffic lights and traffic control monitoring
n
Security and surveillance monitoring
n
Utility operations and control networks
Zhone’s broad portfolio of access aggregation platforms supporting EFM and Ethernet
Access Devices (EADs) are designed for flexibility to meet every need. When ease of
installation, rapid provisioning and deployment options are important, Zhone is your
best choice for EFM.
Zhone is the Global Market Leader in EFM
n
Deploying Ethernet over copper for 8 years
n
Delivering Loop Bonding for more than 6 years
n
More than 100,000 Ethernet Access devices in service
n
In use around the world
Bonding copper circuits for increased
Ethernet bandwidth
The key innovation in EFM is the loop bonding of multiple copper circuits to provide
increased bandwidth. By intelligently distributing traffic across multiple circuits,
using very high-efficiency hardware processing, these multiple circuits appear to the
network as a single, high-bandwidth link, overcoming the limitations of individual
copper circuits.
Two methods of hardware-based bonding are in widespread use, as described
below. Zhone offers both forms of bonding to provide maximum flexibility and
cost-effectiveness.
802.3ah EFM
The IEEE 802.3ah standard for EFM, covering both fiber and copper Ethernet
applications, specifies the type of encoding used, bonding methodology for
copper, and OAM (Operations, Administration and Maintenance) support. Zhone
supports 802.3ah in our Ethernet aggregation line cards and EtherXtend SHDSL
EAD products.
Grande Communications
Makes Carrier Ethernet
a Big Success
“ The addition of Zhone’s Ethernet
access technology in combination
with Grande’s extensive copper and
fiber network creates an unparalleled
delivery vehicle. The unique ability to
offer true 802.1 Q-in-Q Transparent
LAN Service with the requisite Layer
2 and 3 controls is an important
component of this product offering
for Grande.”
Lamar Horton,
Director Network Engineering
Grande Communications
HDLC-based Ethernet over Copper Bonding
HDLC-based bonding provides physical layer (PHY) bonding of DS1 / E1 / DS3 and
SHDSL circuits for highly efficient and reliable bandwidth gain. Widely deployed and
field proven, HDLC-based bonding is ideally suited for point-to-point and aggrega-
tion applications where simplicity and reliability are critical. Zhone supports HDLC-
based Ethernet over copper bonding technology in all of our EADs and aggregation
line cards.
Zhone Delivers Higher
Bandwidth to Netmedia
“ Using Zhone's Ethernet over Copper
solutions with both E1 and SHDSL
lines has enabled delivery of higher
bandwidth Ethernet business services
in Finland over existing copper lines,
thereby creating new and profitable
Ethernet business services by re-using
existing plant.”
Martin Sten, Founder
Netmedia, Finland
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