Zeiss Crossbeam Family User Manual
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Product Information
Version 3.2
ZEISS Crossbeam Family
Your FIB-SEM for High Throughput 3D Analysis and
Sample Preparation
Your FIB-SEM for High Throughput 3D Analysis and Sample Preparation
› In Brief
› The Advantages
› The Applications
› The System
› Technology and Details
› Service
ZEISS Crossbeam combines the powerful imaging and analytical
performance of a field emission scanning electron microscope (FE-SEM)
column with the superior processing ability of a next-generation
focused ion beam (FIB).
Crossbeam gives your 3D work that dynamic edge, whether you are milling,
imaging or performing 3D analytics. Extract true sample information from your
SEM images using Gemini electron optics. The Ion-sculptor FIB column introduces
an altogether new way of FIB-processing. By minimizing sample damage you’ll
maximize sample quality—and perform experiments faster at the same time.
Customize your instrument to achieve both high quality and high throughput in TEM lamella preparation. Exploit the variable pressure capabilities
of Crossbeam 350. Or use Crossbeam 550 to prepare and characterize your
most demanding samples, choosing the chamber size that best suits your
samples.
You may be working on your own or in a multi-user facility, as an academic or
in an industrial lab. If you’ve set your sights on high impact results, Crossbeam’s
modular platform concept lets you upgrade your system as your needs grow.
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Simpler. More Intelligent. More Integrated.
› In Brief
› The Advantages
› The Applications
› The System
› Technology and Details
› Service
Maximize Sample Insights in Both 2D and 3D
Count on excellent images from any sample thanks to the Gemini electron optics of your ZEISS Crossbeam. You will
achieve high resolution and contrast while reaping the benefits of high signal-to-noise ratios, right down to very
low accelerating voltages. Prepare high quality samples, like TEM lamellae, using the FIB's low voltage perfor-
mance and characterize your samples comprehensively in 3D. Use a wide choice of detectors, including the
unique Inlens EsB (energy selective backscatter) detector for pure material contrast. Investigate non-conductive
specimens undisturbed by charging artifacts, offset either with local charge compensation while keeping
high vacuum in the chamber or with variable pressure available in Crossbeam 350.
Increase Your Sample Throughput
Combine Gemini optics with a new way of FIB machining: the superior low voltage performance of the Ion-
sculptor FIB column delivers fast and precise results while keeping amorphization damage on your sample
to a minimum. Use these advantages especially for the preparation of TEM lamellae – even challenging
samples. Benefit further from the FIB’s high current capability that saves time and achieves excellent
FIB profiles with up to 100 nA current—without compromising the ultimate FIB resolution.
Save even more time with automatically prepared batches of cross-sections or with any user-defined pattern.
And the benefits just keep on coming throughout your long-term experiments as optimized routines
enhance FIB source lifetime and stability.
Count on excellent images thanks to Gemini electron optics.
Benefit from the superior low voltage performance of the
Ion-sculptor FIB-column, especially for TEM lamella preparation.
Experience Best 3D Resolution
Enjoy precise and reliable results in FIB-SEM tomography with best 3D resolution and leading isotropic voxel
size. The Inlens EsB detector lets you probe and image less than 3 nm in depth. Expand the capacity of your
Crossbeam with Atlas 5, our market-leading package for fast, precise tomography. You will save time by
collecting your serial section images while milling. You also have the advantage of trackable voxel sizes
and automated routines for active control of image quality. Meanwhile, Atlas 5’s new integrated Analytics
module enables 3D EDS and 3D EBSD analysis during tomography runs.
3D tomogram of a solid oxide fuel cell anode made of the heat
resistant composite material Nickel Samaria-doped ceria.
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Your Insight into the Technology Behind It
› In Brief
› The Advantages
› The Applications
› The System
› Technology and Details
› Service
Profi t from Gemini Optics
Crossbeam’s FE-SEM column is based on Gemini
electron optics. You will appreciate the long-term
stability of your SEM alignment and the effortless
way it adjusts all system parameters such as probe
current and acceleration voltage. Unlike other
FE-SEMs, Gemini optics don’t expose your
specimen to a magnetic fi eld. This allows you
to achieve distortion-free, high resolution imaging
over large fi elds of view as well as to tilt the
specimen without infl uencing the electron optical
performance. Even magnetic samples can be
imaged easily.
Choose between Two Columns:
• The Gemini VP column of Crossbeam 350 gives
you maximum sample fl exibility and multi-
purpose environments. With the optional
Variable Pressure (VP) you can perform in situ
experiments under excellent analytical condi-
tions, even with outgassing or charging samples.
• The Gemini II column of Crossbeam 550 has
a double condenser system that enables high
resolution, even at low voltage and high
current. It’s ideal for high resolution imaging
at high beam current and for fast analytics
• Simultaneous Inlens SE and Inlens EsB imaging
provides unique topographical and material
contrast. That means you will gain more
information in less time.
FE-Gun
Electromagnetic
aperture changer
Condenser
Inlens EsB detector
Filter grid
Inlens SE detector
Magnetic lens
Objective
Scan coils
Electrostatic lens
Specimen
ZEISS Crossbeam 350: Gemini colum with single condenser,
two Inlens detectors and VP capability.
FE-Gun
Beam
booster
Single-Pole Lens
Gemini lens
Magnetic fi eld strength (in arbitrary units)
WD (mm)
Magnetic fi eld leakage of the Gemini lens compared to a traditional single-pole lens design. The minimum magnetic fi eld on the sample
allows highest ion and electron beam performance on a tilted sample as well as high resolution imaging of magnetic materials.
Double condenser
Inlens EsB detector
Filter grid
Inlens SE detector
Magnetic lens
Objective
Scan coils
Electrostatic lens
Specimen
ZEISS Crossbeam 550: Gemini II column with double
condenser and two Inlens detectors.
Beam
booster
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Your Insight into the Technology Behind It
› In Brief
› The Advantages
› The Applications
› The System
› Technology and Details
› Service
Discover a New Way of FIB-Machining – From Massive Ablation to Nanometer Precision
Maximize sample quality by using the low voltage capabilities of the Ion-sculptor FIB column. Minimizing
amorphization of delicate specimens will give you the best results after thinning or polishing—with the added
advantage of fast probe current exchanges to accelerate your FIB applications. Or opt for high current
performance and double the speed of your 3D FIB-SEM applications by working with the high gallium
ion beam currents. You’ll get precise and reproducible results with maximum stability during the acquisition
time. The column design gives you access to fi ve orders of magnitude in beam current, from 1 pA up to
100 nA. The larger beam currents of up to 100 nA allow fast and precise material removal and milling
processes. Meanwhile, at low currents you will achieve exceptionally high FIB resolution of less than 3 nm.
The gallium focused ion beam source – the so-called LMIS (liquid metal ion source) Ga source—is designed
for a typical lifetime larger than 3000 μAh when operating at a target emission current of 2 μA. For long-
term experiments, you have the bonus of the Crossbeam family’s automatic FIB emission recovery.
SEM column
FE-Gun
FIB column
Double condenser
2.50
2.40
2.30
2.20
2.10
2.00
1.90
1.80
FIB Emission Current [µA]
1.70
1.60
1.50
0
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Regulation characteristic of Ga source emission current.
The suppressor voltage regulates the total emission current
between 1.9 µA and 2.1 µA.
2000
1800
1600
1400
1200
1000
800
600
400
200
Suppressor Voltage [V]
Ga-Reservoir
Suppressor
Extractor
Condenser
Differential Pumping Aperture
Beam Defining Apertures
Blanker Plates
Octopoles
Objective
ZEISS Crossbeam 550: FIB- and FE-SEM column arranged at an inclination angle of 54°.
Inlens EsB detector
Filter grid
Inlens SE detector
Objective
Specimen
Beam
booster
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Expand Your Possibilities
› In Brief
› The Advantages
› The Applications
› The System
› Technology and Details
› Service
Customize Your Crossbeam with the Remote
Application Programming Interface
Innovative experiments will often require new
functionality beyond what is provided by the
operating software of your electron microscope.
That’s why the open programming interface of
Crossbeam is designed to allow access to almost
every microscope parameter. The remote API lets
you take complete control of electron and ion
optics, stage, vacuum system, detectors, scanning
and image acquisition from custom programs –
whether running on the system PC or on a
remote workstation.
ZEISS provides both documentation and code
examples in various programming languages –
plus technical support to make sure you get
the results you want. Quickly.
Rotate
sample
Rough repositioning
of sample using x, y
stage movement
Workflow for lathe milling, implemented in the custom application SmartLathe and using the API interface.
SEM drift
correction
Fine repositioning
of sample
10 µm 10 µm
FIB drift
correction
Start
milling
Pillar for compression testing after being machined using lathe milling: SEM top view (left), SEM side view (right).
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Expand Your Possibilities
› In Brief
› The Advantages
› The Applications
› The System
› Technology and Details
› Service
It’s Easy to Create TEM Lamellae
Simply use Automatic Sample Preparation (ASP)
for your TEM sample: it includes all necessary
steps and it’s ready for lift out.
How it Works
• Click on the TEM sample icon.
• Draw a line to defi ne the location of
the lamella on your sample.
• Trigger execution.
Prepare Batches of TEM Lamellae –
Automatically
• Execute a batch of TEM samples at
predefi ned sites without supervision.
How it Works
• Defi ne location of single TEM lamella and
transfer to process list.
• Repeat step 1 as often as required or
perform copy & paste in sample mode.
• Execute process list.
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sample holder. Use the patented X²-preparation method
X
to prepare ultra-thin, stable TEM lamellae and obtain a
homogeneous thickness of less than 10 nm without causing
sample damage.
10 µm
Illustration of the simple three-step workfl ow for TEM sample preparation (depo stands for deposition, DC for drift correction)
20 µm
Array of TEM lamellae prepared automatically.
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Expand Your Possibilities
› In Brief
› The Advantages
› The Applications
› The System
› Technology and Details
› Service
Select Your Micromanipulator for
TEM Lamella Lift-out
When starting a TEM lamella preparation work-
flow find your region of interest quickly with
the help of the super-eucentric 6-axis stage and
always stay at eucentricity when tilting the sample
no matter which working distance. Prepare your
sample and eventually utilize a micromanipulator
for the next steps in the workflow.
It's quick and easy to lift out a prepared TEM
lamella from the bulk. Select a micromanipulator
that is targeted to your needs in flexibility, free-
dom of operation and ease-of-use in control.
Attach your lamella to a grid for final thinning
and low kV polishing.
Find your region of interest quickly with the help of the super-eucentric 6-axis stage and always stay at eucentricity when tilting the
sample. Prepare your sample. Lift out your TEM lamella, eventually.
The micromanipulator of your choice will be configured to
enable optimized workflows.
Attach the needle of the micromanipulator to the lamella, lift it out of the bulk and attach it to the TEM-grid for further investigation in
transmission mode. (from left to right)
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