查询UCD8220供应商
DIGITALLY MANAGED PUSH-PULL ANALOG PWM CONTROLLERS
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
FEATURES
• For Digitally Managed Power Supplies Using
µ Cs or the TMS320 ™ DSP Family
• Voltage or Peak Current Mode Control with
Cycle-by-Cycle Current Limiting
• Clock input from Digital Controller to set
Operating Frequency and Max Duty Cycle
• Analog PWM Comparator
• 2-MHz Switching Frequency
• 110-V Input Startup Circuit and Thermal
Shutdown (UCD8620)
• Internal Programmable Slope Compensation
• 3.3-V, 10-mA Linear Regulator
• DSP/ µ C Compatible Inputs
• Dual ±4-A TrueDrive™ High Current Drivers
• 10-ns Typical Rise and Fall Times with 2.2-nF
• 25-ns Input-to-Output Propagation Delay
• 25-ns Current Sense-to-Output Propagation
Delay
• Programmable Current Limit Threshold
• Digital Output Current Limit Flag
• 4.5-V to 15.5-V Supply Voltage Range
• Rated from -40°C to 105°C
APPLICATIONS
• Digitally Managed Switch Mode Power
Supplies
• Push-Pull, Half-Bridge, or Full-Bridge
Converters
• Battery Chargers
DESCRIPTION
The UCD8220 and UCD8620 are members of the UCD8K family of analog pulse-width modulator devices to be
used in digitally managed power supplies using a microcontroller or the TMS320™ DSP family.
UCD8220 and UCD8620 are double-ended PWM controllers configured with push-pull drive logic. The UCD8620
has a 110-V high-voltage startup circuit which can directly start up the controller from a 48-V telecom input line.
Systems using UCD8K devices close the PWM feedback loop with traditional analog methods, but the UCD8K
controllers include circuitry to interpret a time-domain digital pulse train. The pulse train contains the operating
frequency and maximum duty cycle limit which are used to control the power supply operation. This eases
implementation of a converter with high level control features without the added complexity or possible PWM
resolution limitations of closing the control loop in the discrete time domain.
Figure 1. UCD8220 Typical Simplified Push-Pull Converter Application Schematic
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TMS320, TrueDrive, PowerPAD are trademarks of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily
include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
DESCRIPTION (continued)
The UCD8220 and UCD8620 can be configured for either peak current mode or voltage mode control. They
provide a programmable current limit function and a digital output current limit flag which can be monitored by the
host controller to set the current limit operation. For fast switching speeds, the output stages use the TrueDrive™
architecture, which delivers rated current of ±4 A into the gate of a MOSFET. Finally they also include a 3.3-V,
10-mA linear regulator to provide power to the digital controller or act as a reference in the system.
The UCD8K controller family is compatible with the standard 3.3-V I/O ports of UCD9K digital power controllers,
DSPs, Microcontrollers, or ASICs and is offered in PowerPAD™ HTSSOP and QFN packages.
SIMPLIFIED APPLICATION DIAGRAMS
Figure 2. UCD8220 Typical Simplified Half-Bridge Converter Application Schematic
2
SIMPLIFIED APPLICATION DIAGRAMS (continued)
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
Figure 3. UCD8620 Typical Simplified Push-Pull Converter Application Schematic
Figure 4. UCD8620 Typical Simplified Half-Bridge Converter Application Schematic
3
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
HTSSOP PACKAGE (PWP −16)
UCD8620 (TOP VIEW)
NC − No internal connection
NC
CLK
3V3
ISET
AGND
CTRL
CLF
ILIM
VIN
NC
VDD
PVDD
OUT1
OUT2
PGND
CS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
HTSSOP PACKAGE (PWP −16)
UCD8220 (TOP VIEW)
NC − No internal connection
NC
CLK
3V3
ISET
AGND
CTRL
CLF
ILIM
NC
NC
VDD
PVDD
OUT1
OUT2
PGND
CS
3V3
ISET
AGND
CTRL
CLF
NC
ILIM
NC
CS
NC
VDD
PVDD
OUT1
OUT2
PGND
QFN PACKAGE (RGW−20)
UCD8620 (BOTTOM VIEW)
20
19
18
17
16
6
7
8
9
10
CLK
NC
NC
VIN
NC
15 14 13 12 11
1 2 3 4 5
3V3
ISET
AGND
CTRL
16
15
14
13
CLK
NC
NC
VDD
QFN PACKAGE (RSA−16)
UCD8220 (BOTTOM VIEW)
5
6
7
8
1
CLF
ILIM
NC
CS
2 3 4
12 11 10 9
PVDD
OUT1
OUT2
PGND
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
CONNECTION DIAGRAMS
TEMPERATURE RANGE
-40°C to 105°C No UCD8220PWP UCD8220RSA -
(1) HTSSOP-16 (PWP), QFN-16 (RSA), and QFN-20 (RGW) packages are available taped and reeled. Add R suffix to device type (e.g.
UCD8620PWPR) to order quantities of 2,000 devices per reel for the PWP package and 1,000 devices per reel for the RSA and RGW
packages.
(2) These products are packaged in Pb-Free and Green lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255°C to 260°C
peak reflow temperature to be compatible with either lead free or Sn/Pb soldering operations.
(3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com .
(4) Contact factory for availability of QFN packaging.
(5) Product preview stage of development.
4
ORDERING INFORMATION
110-V HV STARTUP
CIRCUIT
Yes UCD8620PWP
PowerPAD™
HTSSOP-16 (PWP)
PACKAGED DEVICES
QFN-16 (RSA)
(5)
- UCD8620RGW
(1) (2) (3)
(4)
QFN-20 (RGW)
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
PACKAGING INFORMATION
PACKAGE SUFFIX θ JC( ° C/W) θ JA( ° C/W) = 70 ° C, TJ= 125 ° C ABOVE 70 ° C
POWER RATING T
(mW) (mW/ ° C)
PowerPad™
MSSOP-16
PWP 2.07 37.47
(1)
1470 27
QFN-16 RSA - - - QFN-20 RGW - - - -
(1) PowerPad™ soldered to the PWB with TI recommended PWB as defined in TI's Application Report ( TI Literature Number SLMA002 )
with OLFM.
RATING FACTOR
A
ABSOLUTE MAXIMUM RATINGS
(1) (2)
SYMBOL PARAMETER UCD8x20 UNIT
V
I
V
DD
I
DD
V
O
I
O(sink)
I
O(source)
Input Line Voltage UCD8620 only 110
Supply Voltage 16
Supply Current mA
Quiescent 20
Switching, TA= 25 ° C, TJ= 125 ° C, V
= 12 V 200
DD
Output Gate Drive Voltage OUT -1 to PVDD V
Output Gate Drive Current OUT A
4.0
-4.0
Analog Input ISET, CS, CTRL, ILIM -0.3 to 3.6 V
Digital I/O’s CLK, CLF -0.3 to 3.6
TA= 25°C (PWP-16 package) 2.67
Power Dissipation TA= 25°C (QFN-16 package) -
TA= 25°C (QFN-20 package) -
T
J
T
stg
HBM Human body model 2000
CDM Change device model 500
Junction Operating
Temperature
Storage Temperature -65 to 150
ESD Rating
(3)
UCD8220 -55 to 150
UCD8620 -55 to 130 °C
Lead Temperature (Soldering, 10 sec) 300 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal.
(3) Tested to JEDEC standard EIA/JESD22 - A114-B.
V
W
V
5
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
ELECTRICAL CHARACTERISTICS
V
= 12 V, 4.7-µF capacitor from V
DD
TA= TJ= -40°C to 105°C, (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY SECTION
Supply current, OFF V
Supply current, ON mA
LOW VOLTAGE UNDERVOLTAGE LOCKOUT (UCD8220 only)
V
UVLO ON 4.25 4.5 4.75
DD
V
UVLO OFF 4.05 4.25 4.45
DD
V
UVLO hysteresis 150 250 350 mV
DD
110-V HIGH VOLTAGE UNDERVOLTAGE LOCKOUT AND JFET CONTROL (UCD8620 ONLY)
V
UVLO ON 12.5 13 13.5
DD
V
UVLO OFF 7 7.5 8
DD
JFET turn-off threshold (V
JFET turn-on threshold No switching 11.5 12 12.5
JFET on/off hysteresis 1
High voltage JFET current mA
Thermal shutdown, OFF
Thermal shutdown, ON
REFERENCE / EXTERNAL BIAS SUPPLY
3V3 initial set point TA= 25°C, I
3V3 set point over temperature 3.234 3.3 3.366
3V3 load regulation I
3V3 line regulation VDD = 4.75 V to 12 V, I
Short circuit current VDD = 4.75 to 12 V 11 20 35 mA
3V3 OK threshold, ON 3.3 V rising 2.9 3.0 3.1
3V3 OK threshold, OFF 3.3 V falling 2.7 2.8 2.9
CLOCK INPUT (CLK)
HIGH, positive-going input threshold
voltage (VIT+)
LOW negative-going input threshold
voltage (VIT-)
Input voltage hysteresis,
(VIT+ - VIT-)
Frequency OUTx = 1 MHz - - 2 MHz
Minimum allowable off time
SLOPE COMPENSATION (ISET)
ISET Voltage V
m, V
m, V
(I-Mode) R
SLOPE
(V-Mode) R
SLOPE
START_JFET
(1)
(1)
(1)
to AGND, 1 µ F from PVDD to PGND, 0.22-µF capacitor from 3V3 to AGND,
DD
= 4.2 V µA
DD
UCD8620 500 800
UCD8220 300 500
(UCD8620), outputs not switching, CLK = low 2 3
(UCD8220), outputs not switching, CLK = low 2 3
) No switching, JFET on at startup 12.5 13 13.5 V
V
< 5 V, VIN = 18 V to 76 V 3 5 8
DD
V
= 12 V, VIN = 18 V to 76 V 10
DD
V
= 5 V to 12 V 130 145 160
DD
V
> 5 V 110 125 140
DD
= 0 3.267 3.3 3.333
LOAD
= 1 mA to 10 mA, VDD = 5 V - 1 6.6
LOAD
= 10 mA - 1 6.6
LOAD
1.65 - 2.08
1.16 - 1.5 V
0.6 - 0.8
, 3V3 = 3.3 V, +/-2% 1.78 1.84 1.90 V
ISET
R
= 6.19 k Ω to AGND, CS = 0.25 V, CTRL = 2.5 V 1.48 2.12 2.76
ISET
= 100 k Ω to AGND, CS = 0.25 V, CTRL = 2.5 V 0.099 0.142 0.185
ISET
R
= 499 k Ω to AGND, CS = 0.25 V, CTRL = 2.5 V 0.019 0.028 0.037
ISET
R
= 4.99 k Ω to 3V3, CTRL = 2.5 V 1.44 2.06 2.68
ISET
= 100 k Ω to 3V3, CTRL = 2.5 V 0.079 0.114 0.148
ISET
R
= 402 k Ω to 3v3, CTRL = 2.5 V 0.019 0.027 0.035
ISET
V
°C
V
mV
V
20 ns
V/µs
(1) Ensured by design. Not 100% tested in production.
6
VIT−
10%
90%
INPUT
OUTPUT
VIT+
t
D1
t
F
t
F
t
D2
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
ELECTRICAL CHARACTERISTICS (continued)
V
= 12 V, 4.7-µF capacitor from V
DD
TA= TJ= -40°C to 105°C, (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISET resistor range Current mode control; R
ISET resistor range Voltage mode control; R
ISET current range 3.7 300 µ A
PWM
PWM offset at CTRL input 3V3 = 3.3 V +/-2% 0.45 0.51 0.6 V
CTRL buffer gain
CURRENT LIMIT (ILIM)
ILIM internal current limit threshold ILIM = OPEN 0.466 0.5 0.536 V
ILIM maximum current limit threshold ILIM = 3.3 V 0.975 1.025 1.075
ILIM current limit threshold ILIM = 0.75 V 0.700 0.725 0.750
ILIM minimum current limit threshold ILIM = 0.25 V 0.21 0.23 0.25 V
CLF output high level CS > ILIM , I
CLF output low level CS ≤ ILIM, I
Propagation delay from CLK to CLF CLK rising to CLF falling after a current limit event - 15 25 ns
CURRENT SENSE COMPARATOR
Bias voltage Includes CS comp offset 5 25 50 mV
Input bias current - –1 - µ A
Propagation delay from CS to OUTx ILIM = 0.5 V, measured on OUTx, CS = threshold + 60 mV - 25 40
Propagation delay from CS to CLF ILIM = 0.5 V, measured on CLF, CS = threshold + 60 mV - 25 50
CURRENT SENSE DISCHARGE TRANSISTOR
Discharge resistance CLK = low, resistance from CS to AGND 10 35 75 Ω
OUTPUT DRIVERS
Source current
Sink current
Source current
Sink current
Rise time, t
Fall time, t
Output with V
Propagation delay from CLK to OUTx ns
(2) Ensured by design. Not 100% tested in production.
(1)
(2)
(2)
(2)
(2)
R
F
< UVLO V
DD
to AGND, 1 µ F from PVDD to PGND, 0.22-µF capacitor from 3V3 to AGND,
DD
connected to AGND 6.19 499
ISET
connected to 3V3 4.99 402
ISET
Voltage mode control with Feed-Forward; R
VIN
ISET
connected to
Gain from CTRL to PWM comparator input 0.5 V/V
= -7 mA 2.64 - -
LOAD
= 7 mA - - 0.66
LOAD
V
= 12 V, CLK = high, OUTx = 5 V - 4 -
DD
V
= 12 V, CLK = low, OUTx = 5 V - 4 -
DD
V
= 4.75 V, CLK = high, OUTx = 0 - 2 -
DD
V
= 4.75 V, CLK = low, OUTx = 4.75 V - 3 -
DD
C
C
C
C
LOAD
LOAD
DD
LOAD
LOAD
= 2.2 nF, V
= 2.2 nF, V
= 1.0 V, I
= open, V
= open, V
= 12 V - 10 20
DD
= 12 V - 10 15
DD
= 10 mA - 0.8 1.2 V
SINK
= 12 V, CLK rising, t
DD
= 12 V, CLK falling, t
DD
D1
D2
- 25 35
25 35
k Ω
V
V
ns
A
ns
Figure 5. Timing Diagram
7
CURRENT
LIMIT
PWM
PWM
DRIVE
LOGIC
CURRENT
SENSE
3V3 Regulator
and
Reference
UVLO
14 VDD
15
NC
16
NC
13
12
11
10
PVDD
OUT1
OUT2
PGND
4
5
3
3V3
ISET
AGND
8
ILIM
7
CLF
6
CTRL
2
CLK
1
NC
9
CS
CURRENT
LIMIT
PWM
PWM
DRIVE
LOGIC
CURRENT
SENSE
3V3 Regulator
and
Reference
UVLO
14
VDD
15
NC
16
VIN
13
12
11
10
PVDD
OUT1
OUT2
PGND
4
5
3
3V3
ISET
AGND
8
ILIM
7
CLF
6
CTRL
2
CLK
1
NC
9
CS
110− V HV
Start− up
and
JFET Control
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
FUNCTIONAL BLOCK DIAGRAMS
8
Figure 6. UCD8220
Figure 7. UCD8620
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
TERMINAL FUNCTIONS
PIN NUMBER
PIN NAME I/O FUNCTION
CLK 2 16 2 20 I 3.3-V logic level signals up to 2 MHz. There is an internal Schmitt trigger
CLF 7 5 7 5 O high. The CLF signal is latched high until the device receives the next rising
ISET 4 2 4 2 I sation in Peak-Current Mode control or to set the frequency in voltage mode
3V3 3 1 3 1 O sourcing up to 10 mA of current. Place 0.22 µ F of ceramic capacitance from
AGND 5 3 5 3 - Analog ground return
ILIM 8 6 8 7 I
CTRL 6 4 6 4 I input is multiplied by 0.5 and routed to the negative input of the PWM
NC 1, 15, 16 7, 14, 15 1, 15 - No connection.
CS 9 8 9 9 I used to protect the power stage by implementing cycle-by-cycle current
PGND
OUT2 11 10 11 12 O The high-current TrueDrive™ driver output.
OUT1 12 11 12 13 O The high-current TrueDrive™ driver output.
PVDD 13 12 13 14 to the VDD supply rail. The bypass capacitor for this pin should be returned to
VDD 14 13 14 15 I
VIN
UCD8220 UCD8620
HTSSOP-16 QFN-16 HTSSOP-16 QFN-20
(PWP) (RSA) (PWP) (RGW)
Clock. Input pulse train contains operating frequency and maximum duty
cycle limit. This pin is a high impedance digital input capable of accepting
comparator which isolates the internal circuitry CLK 2 16 2 20 I from any
external noise.
Current limit flag. When the CS level is greater than the ILIM voltage minus
25 mV, the output driver is forced low and the current limit flag (CLF) is set
edge on the CLK pin. This signal is also used for the start-up handshaking
between the Digital controller and the analog controller
Pin for programming the current used to set the amount of slope compencontrol.
Regulated 3.3-V rail. The onboard linear voltage regulator is capable of
this pin to analog ground.
Current limit threshold set pin. The current limit threshold can be set to any
value between 0.25 V and 1.0 V. The default value while open is 0.5 V.
Input for the error feedback voltage from the external error amplifier. This
comparator
6, 8, 10,
16, 18, 19
Current sense pin. Fast current limit comparator connected to the CS pin is
limiting.
10 9 10 11 - Power ground return. This pin should be connected close to the source of the
power MOSFET.
Supply pin provides power for the output drivers. It is not connected internally
PGND.
Supply input pin to power the control circuitry. Bypass the pin with at least
4.7 µ F of capacitance, returned to AGND.
- - 16 17 I Input to the internal start-up circuitry rated to 110 V. This pin connects directly
to the input power rail.
9
−50 50
5.0
4.5
2.5
2.0
1.5
0.5
0.0
−25 0 25 75 100
4.0
1.0
3.5
3.0
UVLO on
UVLO off
UVLO hysteresis
t − Temperature − °C
125
V
UVLO
− UVLO Thresholds − V
−50 50
5.0
4.5
2.5
2.0
1.5
0.5
0.0
−25 0 25 75 100
4.0
1.0
3.5
3.0
UVLO on
UVLO off
TBD
UVLO hysteresis
t − Temperature − °C
125
V
UVLO
− UVLO Thresholds − V
−50 50 125−25 0 25 75 100
20.0
20.5
21.0
21.5
22.0
22.5
23.0
t − Temperature − °C
I
SHORT_CKT
− Short Circuit Current − mA
VDD = 4.75 V
VDD = 12 V
−50 50 125−25 0 25 75 100
3.24
3.26
3.28
3.30
3.32
3.34
3.36
t − Temperature − °C
3V3 − Reference Voltage − V
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
UCD8220 UCD8620
UVLO THRESHOLD UVLO THRESHOLD
vs vs
TEMPERATURE TEMPERATURE
TYPICAL CHARACTERISTICS
Figure 8. Figure 9.
3V3 REFERENCE VOLTAGE 3V3 SHORT-CIRCUIT CURRENT
vs vs
TEMPERATURE TEMPERATURE
Figure 10. Figure 11.
10
0 1000 1500500
0
20
40
60
80
100
120
140
160
f − Frequency − kHz
I
DD
− Supply Current − mA
C
LOAD
= 10 nF
C
LOAD
= 4.7 nF
C
LOAD
= 2.2 nF
C
LOAD
= 1 nF
0
40
80
120
160
200
240
280
0 500
1000
1500
f − Frequency − kHz
I
DD
− Supply Current − mA
C
LOAD
= 10 nF
C
LOAD
= 4.7 nF
C
LOAD
= 2.2 nF
C
LOAD
= 1 nF
0
40
80
120
160
200
240
280
320
0 500
1000
1500
f − Frequency − kHz
I
DD
− Supply Current − mA
C
LOAD
= 10 nF
C
LOAD
= 4.7 nF
C
LOAD
= 2.2 nF
C
LOAD
= 1 nF
0
50
100
150
200
250
300
350
400
0
500
1000
1500
f − Frequency − kHz
I
DD
− Supply Current − mA
C
LOAD
= 10 nF
C
LOAD
= 4.7 nF
C
LOAD
= 2.2 nF
C
LOAD
= 1 nF
TYPICAL CHARACTERISTICS (continued)
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
SUPPLY CURRENT SUPPLY CURRENT
vs vs
FREQUENCY (V
= 5 V) FREQUENCY (V
DD
Figure 12. Figure 13.
= 8 V)
DD
SUPPLY CURRENT SUPPLY CURRENT
FREQUENCY (V
vs vs
= 10 V) FREQUENCY (V
DD
Figure 14. Figure 15.
= 12 V)
DD
11
0
50
100
150
200
250
300
350
400
450
500
0
500
1000
1500
f − Frequency − kHz
I
DD
− Supply Current − mA
C
LOAD
= 10 nF
C
LOAD
= 4.7 nF
C
LOAD
= 2.2 nF
C
LOAD
= 1 nF
−50 50 125−25 0 25 75 100
0.0
0.5
1.0
1.5
2.0
2.5
TJ− Temperature − °C
V − CLK Input V
I
oltage − V
CLK Input Rising
CLK Input Falling
5
15
25
35
45
55
65
5 7.5 10 12.5 15
VDD − Supply Voltage − V
t − Output Rise T
R
ime − ns
C
LOAD
= 10 nF
C
LOAD
= 4.7 nF
C
LOAD
= 2.2 nF
C
LOAD
= 1 nF
−50 50 125−25 0 25 75 100
0
2
4
6
8
10
12
14
16
18
TJ− Temperature − °C
t
R,
t
F
− Rise and Fall Times − ns
tR= Rise Time
tF= Fall Time
C
LOAD
= 2.2 nF
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS (continued)
SUPPLY CURRENT CLK INPUT THRESHOLD
vs vs
FREQUENCY (V
= 15 V) TEMPERATURE
DD
Figure 16. Figure 17.
OUTPUT RISE TIME AND FALL TIME OUTPUT RISE TIME
TEMPERATURE (V
12
Figure 18. Figure 19.
vs vs
= 12 V) SUPPLY VOLTAGE
DD
0
5
10
15
20
5 7.5 10 12.5 15
VDD − Supply Voltage − V
t
PD
− Propagation Delay, Rising − ns
C
LOAD
= 10 nF
C
LOAD
= 4.7 nF
C
LOAD
= 2.2 nF
C
LOAD
= 1 nF
5
10
15
20
25
30
35
40
45
5 7.5 10 12.5 15
VDD − Supply Voltage − V
t − Output Fall T
F
ime − ns
C
LOAD
= 10 nF
C
LOAD
= 4.7 nF
C
LOAD
= 2.2 nF
C
LOAD
= 1 nF
5
10
15
20
25
5 7.5 10 12.5 15
VDD − Supply Voltage − V
t
PD
− Propagation Delay, Falling − ns
C
LOAD
= 10 nF
C
LOAD
= 4.7 nF
C
LOAD
= 2.2 nF
C
LOAD
= 1 nF
−50 50 125−25 0 25 75 100
0.51
0.52
0.53
0.54
0.55
0.56
0.57
0.58
0.59
TJ− Temperature − °C
V
CS
− Current Limit Threshold − V
TYPICAL CHARACTERISTICS (continued)
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
OUTPUT FALL TIME CLK to OUTx PROPAGATION DELAY RISING
vs vs
SUPPLY VOLTAGE SUPPLY VOLTAGE
Figure 20. Figure 21.
CLK TO OUTx PROPAGATION DELAY FALLING DEFAULT CURRENT LIMIT THRESHOLD
vs vs
SUPPLY CURRENT TEMPERATURE
Figure 22. Figure 23.
13
−50 50−25 0 25 75 100
0
5
10
15
20
25
30
35
40
45
50
TJ− Temperature − °C
t
PD
− CS to CLF Propagation Delay − ns
125
−50 50 125−25 0 25 75 100
0
5
10
15
20
25
30
35
40
TJ− Temperature − °C
t
PD
− CS to OUTx Propagation Delay − ns
t − Time − 40 ms/div
VDD (2 V/div)
CLK = CTRL = 3V3
OUTx (2 V/div)
3V3 (2 V/div)
−50 50 125−25 0 25 75 100
0
5
10
15
20
25
30
35
TJ− Temperature − °C
t
PD
− Propagation Delay − ns
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS (continued)
CS TO OUTx PROPAGATION DELAY CS TO CLF PROPAGATION DELAY
vs vs
TEMPERATURE TEMPERATURE
Figure 24. Figure 25.
CLK TO OUT PROPAGATION DELAY UCD8220
TEMPERATURE
14
vs START-UP BEHAVIOR AT V
Figure 26. Figure 27.
= 12 V
DD
t − Time − 40 ms/div
VDD (2 V/div)
OUTx (2 V/div)
3V3 (2 V/div)
CLK = CTRL = 3V3
t − Time − 40 ms/div
TBD
CLK = CTRL = 3V3
t − Time − 40 ms/div
VDD (2 V/div)
3V3 (2 V/div)
OUTx (2 V/div)
CLK = AGND
CTRL = 3V3
t − Time − 40 ms/div
TBD
CLK = CTRL = 3V3
TYPICAL CHARACTERISTICS (continued)
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
START-UP BEHAVIOR AT V
UCD8620 UCD8220
Figure 28. Figure 29.
UCD8620 UCD8220
SHUT-DOWN BEHAVIOR AT V
= 12 V SHUT-DOWN BEHAVIOR AT V
DD
= 12 V START-UP BEHAVIOR AT V
DD
= 12 V
DD
= 12 V
DD
Figure 30. Figure 31.
15
t − Time − 40 ms/div
VDD (2 V/div)
3V3 (2 V/div)
OUTx (2 V/div)
CLK = AGND
CTRL = 3V3
t − Time − 40 ms/div
TBD
CLK = AGND
CTRL = 3V3
t − Time − 40 ns/div
Output Voltage − 2 V/div
t − Time − 40 ms/div
TBD
CLK = AGND
CTRL = 3V3
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS (continued)
START-UP BEHAVIOR AT V
UCD8620 UCD8220
Figure 32. Figure 33.
UCD8620 OUTPUT RISE AND FALL TIME
SHUT-DOWN BEHAVIOR AT V
= 12 V SHUT-DOWN BEHAVIOR AT V
DD
= 12 V (V
DD
DD
= 12 V, C
= 12 V
DD
= 10 nF)
LOAD
16
Figure 34. Figure 35.
−50 50 125−25 0 25 75 100
TJ− Temperature − °C
Current Mode Slope,
R = 100 k
ISET
0.134
0.136
0.138
0.140
0.142
0.144
0.146
Internal Slope Compensation in CMC - V/ms
0.518
0.520
0.522
0.524
0.526
0.528
0.530
0.532
PWM Offset at CTRL Input − V
−50 50 125−25 0 25 75 100
TJ− Temperature − °C
−50 50 125−25 0 25 75 100
TJ− Temperature − °C
V = 76 V
I
V = 18 V
I
V = 12 V
DD
Source Current - mA
TBD
TYPICAL CHARACTERISTICS (continued)
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
INTERNAL SLOPE COMPENSATION IN CMC PWM OFFSET AT CTRL INPUT
vs vs
TEMPERATURE TEMPERATURE
Figure 36. Figure 37.
HIGH VOLTAGE JFET CURRENT
vs
TEMPERATURE
Figure 38.
17
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
APPLICATION INFORMATION
Introduction
operating frequency and maximum duty cycle limit
and hence controls the power supply operation as
The UCD8220 and UCD8620 are digitally managed listed above. The pulse train uses a Texas Instruanalog PWM controllers configured with push-pull ments communication protocol which is a proprietary
drive logic. The UCD8620 has a 110-V high-voltage communication system that provides handles for
startup circuit which can directly start up the controller control of the power supply operation through
from a 48-V telecom input line. software programming. The rising edge of the CLK
In systems using UCD8K devices, the PWM feedback
loop is closed using the traditional analog methods,
but the UCD8K controllers include circuitry to interpret
a time-domain digital pulse train from a digital controller. The pulse train contains the operating frequency
and maximum duty cycle limit and hence controls the
power supply operation. This eases implementing a
converter with high-level control features without the
added complexity or digital PWM resolution limitations encountered when closing the voltage control
loop in the discrete time domain.
The UCD8220 and UCD8620 can be configured for
either peak current mode or voltage mode control.
They provide a programmable current limit function
and a digital output current limit flag which can be
monitored by the host controller. For fast switching
speeds, the output stages use the TrueDrive™ output
architecture, which delivers rated current of ±4 A into
the gate of a MOSFET during the Miller plateau
region of the switching transition. Finally they also
include a 3.3-V, 10-mA linear regulator to provide
power for the digital controller.
The UCD8620 includes circuitry and features to ease
implementing a converter that is managed by a
microcontroller or a digital signal processor. Digitally
managed power supplies provide software
programmability and monitoring capability of the
power supply operation including:
• Switching frequency
• Synchronization
• D
MAX
• V x S clamp
• Input UVLO start/stop voltage
• Input OVP start/stop voltage
• Soft-start profile
• Current limit operation
• Shutdown
• Temperature shutdown
signal represents the switching frequency. Figure 39
depicts the operation of the UCD8K device in one of
5 modes. At the time when the internal signal REF
OK is low, the UCD8K device is not ready to accept
CLK inputs. Once the REF OK signal goes high, then
the device is ready to process inputs. While the CLK
input is low, the outputs are disabled and the CLK
signal is used as an enable input. Once the Digital
controller completes its initialization routine and ver-
ifies that all voltages are within their operating range,
then it starts the soft-start procedure by slowly
ramping up the duty cycle of the CLK signal, while
maintaining the desired switching frequency. The duty
cycle continues to increase until it reaches
steady-state where the analog control loop takes over
and regulates the output voltage to the desire set
point. During steady state, the maximum duty cycle
can be set using a volt second product calculation in
order to protect the primary of the power transformer
from saturation during transients. When the power
supply enters current limit, the outputs are quickly
turned off, and the CLF signal is set high in order to
notify the digital controller that the last power pulse
was truncated because of an overcurrent event. The
benefit of this technique is in the flexibility it offers.
The software is now in charge of the response to
overcurrent events. In typical analog designs, the
power supply response to overcurrent is hardwired in
the silicon. With this method, the user can configure
the response differently for different applications. For
example, the software can be configured to latch-off
the power supply in response the first overcurrent
event, or to allow a fixed number of current limit
events, so that the supply is capable of starting up
into a capacitive load. The user can also configure
the supply to enter into hiccup mode immediately or
after a certain number of current limit events. As
described later in this data sheet, the current limit
threshold can be varied in time to create unique
current limit profiles. For example, the current limit set
point can be set high for a predefined number of
cycles to blow a manual fuse, and can be reduced
down to protect the system in the event of a faulty
CLK Input Time-Domain Digital Pulse Train
fuse.
While the loop is closed in the analog domain, the
UCD8K devices are managed by a time-domain
digital pulse train from a digital controller. The pulse
train, shown as CLK in Figure 39 , contains the
18
OUT
RAMP*
CTRL
CLF
CLK
UVLO and
REF OK*
* - Internal signals
PWM*
Start up Steady State Current Limit
CS
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
Figure 39. UCD8220 and UCD8620 Timing and Circuit Operation Diagram
JFET Operation (UCD8620 Only)
to switch. The JFET remains off provided the outputs
are switching and the VDD voltage stays above 7.5
The UCD8620 digitally managed push-pull analog V. If the VDD voltage drops below 7.5 V while the
PWM Controller contains a 110-V start-up JFET to outputs are switching, the outputs are immediately
simplify the start-up and standby power requirements disabled, and the JFET is switched back on. It then
for systems with digital controllers. The JFET circuit attempts to charge the VDD voltage back up to 13 V.
has two operating modes. When the VDD voltage is Once the VDD voltage reaches 13 V, the outputs are
less than 5 V, the circuit is limited to 5 mA of source enabled again and allowed to switch. If the CLK input
current into VDD. The VDD reaches 5 V, the circuit is not switched by the digital controller, then the VDD
switches into temperature protection mode and pro- voltage decays to 12 V, and the JFET turns on again.
vides 10 mA until the temperature of the die exceeds This charges the VDD capacitor back to 13 V where
145 ° C. Figure 40 shows the operation of the JET the cycle repeats until the input voltage drops to a
circuitry during various operating conditions. At point where the VDD voltage can no longer be
start-up, the JFET is on and charges up the VDD maintained. Figure 41 shows the graph of available
capacitor. Once the VDD voltage reaches its UVLO of source current as a function of input and VDD
13 V, the JFET turns off and the outputs are allowed voltage.
19
0 2 4 6 8 10 12 14
−50
−40
−30
−20
−10
0
10
16
20
30
TBD
V - Supply Voltage - V
DD
I − Supp;y Current
DD
− mA
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
(1) For VDD to go below 12 V, the input supply must be dropping out.
Figure 40. UCD8620 JFET Operation Waveforms
Reference / External Bias Supply
All devices in the UCD8K family are capable of
supplying a regulated 3.3-V rail to power various
types of external loads such as a microcontroller or
an ASIC. The onboard linear voltage regulator is
capable of sourcing up to 10 mA of current. For
normal operation, place 0.22-µF of ceramic capaci-
tance between the 3V3 pin and the AGND pin.
Supply
The UCD8K devices accept an input range of 4.5 V
to 15.5 V. The device has an internal precision linear
regulator that produces the 3V3 output from this VDD
input. A separate pin, PVDD, not connected internally
to the VDD supply rail provides power for the output
drivers. In all applications the same bus voltage must
supply the two pins. It is recommended that a low
value of resistance be placed between the two pins
so that the local capacitance on each pin forms low
pass filters to attenuate any switching noise that may
be on the bus.
Figure 41. UCD8620 Supply Current vs Supply
Voltage
Current Sensing and Protection
Figure 42. Current Sense Filter
A fast current limit comparator connected to the CS
pin is used to protect the power stage by im-
plementing cycle-by-cycle current limiting.Figure 43
shows various methods for setting the ILIM threshold.
The current limit threshold may be set to any value
between 0.25 V and 1 V by applying the desired
threshold voltage to the current limit (ILIM) pin. If the
ILIM pin is left floating, the internal current limit
threshold is 0.5 V. When the CS level is greater than
the ILIM voltage minus 25 mV, the output of the
driver is forced low and the current limit flag (CLF) is
set high. The CLF signal is latched high until the
UCD8K device receives the next rising edge on the
CLK pin.
20
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
When the CS voltage is below ILIM, the driver output restart the device in the event that it is not operating
follows the PWM command. The CLF digital output properly. But these peripherals typically do not react
flag is monitored by the host controller to determine fast enough to save the power stage. The UCD87K’s
when a current limit event occurs, and to then apply local current limit comparator provides the required
the appropriate algorithm to obtain the desired current fast protection for the power stage.
limit profile (i.e. straight line, fold back, hickup, or
latch-off).
A benefit of this local protection feature is that the CS pin is at ground, the CLF flag latches high until
UCD8620 devices protects the power stage if the the CLK pin receives a pulse. At start-up, it is
software code in the digital controller becomes cor- necessary to ensure that the ILIM pin is always
rupted. If the controller’s PWM output stays high, the greater than the CS pin for the handshaking to work.
local current sense circuit turns off the driver output If for any reason the CS pin comes to within 25 mV of
when an overcurrent event occurs. The system then the ILIM pin during start-up, then the CLF flag is
goes into retry mode because most DSP and latched high and the digital controller must poll the
microcontrollers have an on-board watchdog, UCD8620 device, by sending it a narrow CLK pulse.
brown-out, and other supervisory peripherals to If a fault condition is not present, the CLK pulse
The CS threshold is 25 mV below the ILIM voltage. If
the user attempts to command zero current while the
resets the CLF signal to low indicating that the
UCD8620 device is ready to process power pulses.
21
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
Figure 43. ILIM Settings
22
PWM
+
-
3V3
CTRL
(6)
+
ISET
(4)
C
9.4 pF
int
OUT
TO CLEAR
of
PWM LATCH
ON OFF
I_SC = (3.3 - 1.85) / (11 x R_ISET)
R_ISET
0.25 V
S1
R
R
3V3
(3)
PWM
+
-
3V3
CTRL
(6)
+
ISET
(4)
OUT
ON OFF
R_ISET
0.25 V
S1
R
R
VIN
C
9.4 pF
int
I_SC = (3.3 - 1.85) / (11 x R_ISET)
TO CLEAR
of
PWM LATCH
11 x 1.4 x fclk x 1000 x 9.4
12
(3.3 - 1.85) x 10
W
R_ISET =
11 x 1.4 x fclk x 9.4
12
(Vin_max - 1.85) x 10
R_ISET =
W
1 k
10 k
100 k
1 M
1000 1000010 100
Clock Frequency − kHz
R_ISET Resistance − W
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
Selecting the ISET Resistor for Voltage Mode
Control
Figure 44. UCD8x20 Configured in Voltage Mode
Control with an Internal Timing Capacitor
When the ISET resistor is configured as shown in
Figure 44 with the ISET resistor connected between
the ISET pin and the 3V3 pin, the device is set-up for
voltage mode control. For purposes of voltage loop
compensation the, voltage ramp is 1.4 V from the
valley to the peak. See Equation 1 for selecting the
proper resistance for a desired clock frequency.
Where:
fclk = Desired Clock Frequency in Hz.
Figure 45 shows the nominal value of resistance to
use for a desired clock frequency. Note that for the
UCD8220 and the UCD8620 controllers, which have
two outputs controlled by Push-Pull logic, the output
ripple frequency is equal to the clock frequency; and
each output switches at half the clock frequency.
Selecting the ISET Resistor for Voltage Mode
Control with Voltage Feed forward
Figure 46. UCD8x20 Configured in Voltage Mode
Control with Voltage Feed Forward
When the ISET resistor is configured as shown in
(1)
Figure 46 with the ISET resistor connected between
the ISET pin and the input voltage, VIN, the device is
configured for voltage mode control with voltage feed
forward. For the purposes of voltage loop compen-
sation, the voltage ramp is 1.4 x Vin/Vin_max Volts
from the valley to the peak. See Equation 2 for
selecting the proper resistance for a desired clock
frequency and input voltage range.
Figure 45. ISET Resistance vs Clock Frequency
(2)
Where:
fclk = Desired Clock Frequency in Hz.
For a general discussion of the benefits of Voltage
Mode Control with Voltage feed forward, see Refer-
ence [5].
23
CS
(9)
+
-
3V3
+
OUT
ON OFF
S1
S2
R
R
CTRL
(6)
ISET
(4)
R_ISET
PWM
0.25 V
C
12 pF
int
I_SC = 1.85 / (11 x R_ISET)
TO CLEAR
of
PWM LATCH
11 x R_ISET x 12
V/ sm
6
1.85 x 10
SLOPE =
0.01
0.1
1
10
100
1 k
10 k
1 k
10 k 100 k
1 M
101100
R_ISET Resistance - W
Slope - V/ sm
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
Selecting the ISET Resistor for Peak Current
Mode Control with Internal Slope Compensation
Figure 47. UCCD8x20 Configured in Peak Current
Control with Internal Slope Compensation
When the ISET resistor is configured as shown in
Figure 47 with the ISET resistor connected between
the ISET pin and AGND, the device is configured for
peak current mode control with internal slope compensation. The voltage at the ISET pin is 1.85 volts
so the internal slope compensation current, I_SC,
being fed into the internal slope compensation capacitor is equal to 1.85 / (11x R_ISET). The voltage
slope at the PWM comparator input which is generated by this current is equal to:
The amount of slope compensation required depends
on the design of the power stage and the output
specifications. A general rule is to add an up-slope
equal to the down slope of the output inductor.
Handshaking
The UCD8K family of devices have a built-in hand-
shaking feature to facilitate efficient start-up of the
digitally managed power supply. At start-up the CLF
flag is held high until all the internal and external
supply voltages of the UCD8K device are within their
operating range. Once the supply voltages are within
acceptable limits, the CLF goes low and the device
processes the CLK signals. The digital controller
should monitor the CFL flag at start-up and wait for
the CLF flag to go LOW before sending CLK pulses
to the UCD8K device.
Driver Output
The high-current output stage of the UCD8K device
family is capable of supplying ±4-A peak current
pulses and swings to both PVDD and PGND.
The drive output uses the Texas Instruments
TrueDrive™ architecture, which delivers rated current
into the gate of a MOSFET when it is most needed,
during the Miller plateau region of the switching
transition providing efficiency gains.
TrueDrive™ consists of pull-up/pull-down circuits with
bipolar and MOSFET transistors in parallel. The peak
output current rating is the combined current from the
bipolar and MOSFET transistors. This hybrid output
stage also allows efficient current sourcing at low
(3)
supply voltages.
24
Figure 48. Slope vs RISET Resistance
Source/Sink Capabilities During Miller Plateau
Large power MOSFETs present a large load to the
control circuitry. Proper drive is required for efficient,
reliable operation. The UCD8K drivers have been
optimized to provide maximum drive to a power
MOSFET during the Miller plateau region of the
switching transition. This interval occurs while the
drain voltage is swinging between the voltage levels
dictated by the power topology, requiring the charg-
ing/discharging of the drain-gate capacitance with
current supplied or removed by the driver device. See
Reference [2].
Drive Current and Power Requirements
The UCD8620 family of controllers contains drivers
which can deliver high current into a MOSFET gate
for a period of several hundred nanoseconds.
High-peak current is required to turn on a MOSFET.
Then, to turn off a MOSFET, the driver is required to
sink a similar amount of current to ground. This
repeats at the operating frequency of the power
device.
P = 2.2 nF x 12 x 300 kHz = 0.095 W
2
I =
=
P
V
0.095 W
12 V
= 7.9 mA
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
Reference [2] discusses the current required to drive ture range the package must allow for the efficient
a power MOSFET and other capacitive-input removal of the heat produced while keeping the
switching devices. junction temperature within rated limits. The UCD8K
When a driver device is tested with a discrete,
capacitive load it is a fairly simple matter to calculate
the power that is required from the bias supply. The
energy that must be transferred from the bias supply
to charge the capacitor is given by:
where C is the load capacitor and V is the bias
voltage feeding the driver.
There is an equal amount of energy transferred to
ground when the capacitor is discharged. This leads
to a power loss given by the following:
where f is the switching frequency.
This power is dissipated in the resistive elements of
the circuit. Thus, with no external resistor between
the driver and gate, this power is dissipated inside the
driver. Half of the total power is dissipated when the
capacitor is charged, and the other half is dissipated
when the capacitor is discharged.
With V
DD
= 12 V, C
= 2.2 nF, and f = 300 kHz,
LOAD
the power loss can be calculated as:
With a 12-V supply, this would equate to a current of:
Thermal Information
The useful range of a driver is greatly affected by the
drive power requirements of the load and the thermal
characteristics of the device package. In order for a
power driver to be useful over a particular tempera-
(4)
(5)
(6)
(7)
family of drivers is available in PowerPAD™ TSSOP
and QFN/DFN packages to cover a range of appli-
cation requirements. Both have an exposed pad to
enhance thermal conductivity from the semiconductor
junction.
As illustrated in Reference [3], the PowerPAD™
packages offer a leadframe die pad that is exposed at
the base of the package. This pad is soldered to the
copper on the PC board (PCB) directly underneath
the device package, reducing the θ
down to
JA
37.47°C/W. The PC board must be designed with
thermal lands and thermal vias to complete the heat
removal subsystem, as summarized in Reference [4].
Note that the PowerPAD™ is not directly connected
to any leads of the package. However, it is electrically
and thermally connected to the substrate which is the
ground of the device. The PowerPAD™ should be
connected to the quiet ground of the circuit.
Circuit Layout Recommendations
In a MOSFET driver operating at high frequency, it is
critical to minimize stray inductance to minimize
overshoot/undershoot and ringing. The low output
impedance of the drivers produces waveforms with
high di/dt. This tends to induce ringing in the parasitic
inductances. It is advantageous to connect the driver
device close to the MOSFETs. It is recommended
that the PGND and the AGND pins be connected to
the PowerPAD™ of the package with a thin trace. It
is critical to ensure that the voltage potential between
these two pins does not exceed 0.3 V. The use of
schottky diodes on the outputs to PGND and PVDD is
recommended when driving gate transformers.
25
UCD8220, UCD8620
SLUS652B – MARCH 2005 – REVISED SEPTEMBER 2005
REFERENCES
1. Power Supply Seminar SEM-1600 Topic 6: A Practical Introduction to Digital Power Supply Control, by
Laszlo Balogh, Texas Instruments Literature No. SLUP224
2. Power Supply Seminar SEM–1400 Topic 2: Design And Application Guide For High Speed MOSFET Gate
Drive Circuits, by Laszlo Balogh, Texas Instruments Literature No. SLUP133.
3. Technical Brief, PowerPad Thermally Enhanced Package, Texas Instruments Literature No. SLMA002
4. Application Brief, PowerPAD™ Made Easy, Texas Instruments Literature No. SLMA004
5. Power Supply Seminar SEM-300 Topic 2, "Closing the Feedback Loop", by Lloyd Dixon Jr., Texas
Instruments, (Literature Number SLUP068)
RELATED PRODUCTS
PRODUCT DESCRIPTION FEATURES
UCD9501 Digital Power Controller for High Performance Multi-loop Applications
MSP430F1232 Microcontroller
REVISION HISTORY
DATE REVISION CHANGE DESCRIPTION
03/05 SLUS652 Initial release.
08/05 SLUS652A Extensive changes throughout
09/05 SLUS652B Extensive changes throughout
26
PACKAGE OPTION ADDENDUM
www.ti.com
23-Sep-2005
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
UCD8220PWP PREVIEW HTSSOP PWP 16 90 TBD Call TI Call TI
UCD8220PWPR PREVIEW HTSSOP PWP 16 2000 TBD Call TI Call TI
UCD8220RSA PREVIEW QFN RSA 16 250 TBD Call TI Call TI
UCD8220RSAR PREVIEW QFN RSA 16 3000 TBD Call TI Call TI
UCD8620PWP PREVIEW HTSSOP PWP 16 90 TBD Call TI Call TI
UCD8620PWPR PREVIEW HTSSOP PWP 16 2000 TBD Call TI Call TI
UCD8620RGWR PREVIEW QFN RGW 20 3000 TBD Call TI Call TI
UCD8620RGWT PREVIEW QFN RGW 20 250 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
3-Oct-2005
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
UCD8220PWP ACTIVE HTSSOP PWP 16 90 Green (RoHS &
no Sb/Br)
UCD8220PWPR ACTIVE HTSSOP PWP 16 2000 Green (RoHS &
no Sb/Br)
UCD8220RSA PREVIEW QFN RSA 16 250 TBD Call TI Call TI
UCD8220RSAR PREVIEW QFN RSA 16 3000 TBD Call TI Call TI
UCD8620PWP PREVIEW HTSSOP PWP 16 90 TBD Call TI Call TI
UCD8620PWPR PREVIEW HTSSOP PWP 16 2000 TBD Call TI Call TI
UCD8620RGWR PREVIEW QFN RGW 20 3000 TBD Call TI Call TI
UCD8620RGWT PREVIEW QFN RGW 20 250 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
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