TEXAS INSTRUMENTS TPS793xx Technical data

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324

DBV PACKAGE

(TOP VIEW)

1IN

GND

OUT

Fixed Option

324

DBV PACKAGE

(TOP VIEW)

GND

OUT

Adjustable Option

TPS79328

RIPPLE REJECTION

FREQUENCY

OUT

GND

YEQ, YZQ

PACKAGE

(TOP VIEW)

10 100 1 k 10 k

100 k 1 M 10 M

Ripple Rejection (dB)

Frequency (Hz)

OUT

= 10 mA

VIN = 3.8 V C

OUT

= 10 µF

= 0.01 µF

OUT

= 200 mA

100

A3 A1

C3 C1

0.05

0.10

0.15

0.20

0.25

0.30

100 1 k 10 k 100 k

Frequency (Hz)

OUT

= 1 mA

VIN = 3.8 V C

OUT

= 2.2 µF

= 0.1 µF

OUT

= 200 mA

TPS79328

OUTPUT SPECTRAL NOISE DENSITY

FREQUENCY

Output Spectral Noise Density (µV/√Hz)

TPS793xx

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SLVS348K – JULY 2001 – REVISED OCTOBER 2007

ULTRALOW-NOISE, HIGH PSRR, FAST RF 200mA LOW-DROPOUT LINEAR

REGULATORS IN NanoStar™ WAFER CHIP SCALE AND SOT23

FEATURES DESCRIPTION

234

• 200mA RF Low-Dropout Regulator

With Enable

• Available in Fixed Voltage Versions from 1.8V

to 4.75V and Adjustable (1.22V to 5.5V)

• High PSRR (70dB at 10kHz)

• Ultralow-Noise (32 μ V

, TPS79328)

RMS

• Fast Start-Up Time (50 μ s)

• Stable With a 2.2 μ F Ceramic Capacitor

• Excellent Load/Line Transient Response

• Very Low Dropout Voltage (112mV at 200mA,

TPS79330)

• 5- and 6-Pin SOT23 (DBV) and NanoStar Wafer

Chip Scale (YEQ, YZQ) Packages

APPLICATIONS

• RF: VCOs, Receivers, ADCs current is reduced to less than 1 μ A. The TPS79328

• Audio

• Cellular and Cordless Telephones

• Bluetooth

• Handheld Organizers, PDAs

, Wireless LAN

The TPS793xx family of low-dropout (LDO) low-power linear voltage regulators features high power-supply rejection ratio (PSRR), ultralow-noise, fast start-up, and excellent line and load transient responses in NanoStar wafer chip scale and SOT23 packages. NanoStar packaging gives an ultrasmall footprint as well as an ultralow profile and package weight, making it ideal for portable applications such as handsets and PDAs. Each device in the family is stable, with a small 2.2 μ F ceramic capacitor on the output. The TPS793xx family uses an advanced, proprietary BiCMOS fabrication process to yield extremely low dropout voltages (for example, 112mV at 200mA, TPS79330). Each device achieves fast start-up times (approximately 50 μ s with a 0.001 μ F bypass capacitor) while consuming very low quiescent current (170 μ A typical). Moreover, when the device is placed in standby mode, the supply

exhibits approximately 32 μ V

RMS

noise at 2.8V output with a 0.1 μ F bypass capacitor. Applications with analog components that are noise-sensitive, such as portable RF electronics, benefit from the high PSRR and low-noise features as well as the fast response time.

of output voltage

2 NanoStar is a trademark of Texas Instruments. 3 Bluetooth is a registered trademark of Bluetooth SIG, Inc. 4 All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Figure 1.

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TPS793xx

SLVS348K – JULY 2001 – REVISED OCTOBER 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

PRODUCT V

(1)

(2)

OUT

TPS793 xxyyyz XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable).

YYY is package designator. Z is package quantity.

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com .

(2) Output voltages from 1.2V to 4.8V in 50mV increments are available; minimum order quantities may apply. Contact factory for details

and availability.

ABSOLUTE MAXIMUM RATINGS

Over operating temperature range (unless otherwise noted)

VINrange – 0.3V to 6V V

range – 0.3V to 6V

OUT

Peak output current Internally limited ESD rating, HBM 2kV ESD rating, CDM 500V Continuous total power dissipation See Dissipation Ratings Table Junction temperature range, DBV package – 40 ° C to +150 ° C Junction temperature range, YEQ package – 40 ° C to +125 ° C Storage temperature range, T

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

stg

(1)

UNIT

– 65 ° C to +150 ° C

DISSIPATION RATINGS TABLE

BOARD PACKAGE R

(1)

Low-K

(2)

High-K

(1)

Low-K

(2)

High-K

DBV 65 ° C/W 255 ° C/W 3.9mW/ ° C 390mW 215mW 155mW DBV 65 ° C/W 180 ° C/W 5.6mW/ ° C 560mW 310mW 225mW YEQ 27 ° C/W 255 ° C/W 3.9mW/ ° C 390mW 215mW 155mW YEQ 27 ° C/W 190 ° C/W 5.3mW/ ° C 530mW 296mW 216mW

θ JC

θ JA

ABOVE TA= +25 ° C RATING RATING RATING

(1) The JEDEC low-K (1s) board design used to derive this data was a 3-inch x 3-inch, two layer board with 2 ounce copper traces on top

of the board.

(2) The JEDEC high-K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1 ounce internal power and

ground planes and 2 ounce copper traces on top and bottom of the board.

DERATING FACTOR POWER POWER POWER

TA≤ +25 ° C TA= +70 ° C TA= +85 ° C

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TPS793xx

SLVS348K – JULY 2001 – REVISED OCTOBER 2007

ELECTRICAL CHARACTERISTICS

Over recommended operating temperature range TJ= – 40 ° C to +125 ° C, V C

OUT

= 10 μ F, C

= 0.01 μ F (unless otherwise noted). Typical values are at +25 ° C.

= VIN, V

= V

OUT(nom)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VINInput voltage I

Continuous output current 0 200 mA

OUT

Internal reference (TPS79301) 1.201 1.225 1.250 V

Output voltage range (TPS79301) V

Output voltage TPS793285 0 μ A < I

Line regulation ( Δ V Load regulation ( Δ V

Dropout voltage (V

= V

OUT(nom)

Output current limit V GND pin current 0 μ A < I Shutdown current FB pin current V

Power-supply ripple rejection TPS79328 dB

Output noise voltage (TPS79328) μ V

Time, start-up (TPS79328) RL= 14 Ω , C

(1)

TPS79318 0 μ A < I TPS79325 0 μ A < I TPS79328 0 μ A < I

TPS79330 0 μ A < I TPS79333 0 μ A ≤ I TPS793475 0 μ A < I

(1)

%/ Δ VIN)

OUT

%/ Δ I

OUT

) 0 μ A < I

OUT

TPS79328 I

(2)

– 0.1V)

TPS793285 I TPS79330 I TPS79333 I TPS793475 I

(3)

OUT

OUT OUT OUT OUT OUT

OUT

EN FB

f = 100Hz, TJ= +25 ° C, I f = 100Hz, TJ= +25 ° C, I f = 10kHz, TJ= +25 ° C, I f = 100kHz, TJ= +25 ° C, I

BW = 200Hz to 100kHz, I

OUT

< 200mA, 2.8V < VIN< 5.5V 1.764 1.8 1.836 V

OUT

< 200mA, 3.5V < VIN< 5.5V 2.45 2.5 2.55 V

OUT

< 200mA, 3.8V < VIN< 5.5V 2.744 2.8 2.856 V

OUT

< 200mA, 3.85V < VIN< 5.5V 2.793 2.85 2.907 V

OUT

< 200mA, 4V < VIN< 5.5V 2.94 3 3.06 V

OUT

< 200mA, 4.3V < VIN< 5.5V 3.234 3.3 3.366 V

OUT

< 200mA, 5.25V < VIN< 5.5V 4.655 4.75 4.845 V

OUT

+ 1V < VIN≤ 5.5V 0.05 0.12 %/V

< 200mA, TJ= +25 ° C 5 mV

OUT

= 200mA 120 200 = 200mA 120 200 = 200mA 112 200 mV = 200mA 102 180 = 200mA 77 125

= 0V 285 600 mA

< 200mA 170 220 μ A

OUT

= 0V, 2.7V < VIN< 5.5V 0.07 1 μ A

= 1.8V 1 μ A

= 10mA 70

OUT

= 200mA 68

OUT

= 200mA 70

OUT

= 200mA 43

OUT

= 0.001 μ F 55

= 0.0047 μ F 36

= 200mA

= 1 μ F C

OUT

= 0.01 μ F 33

= 0.1 μ F 32

= 0.001 μ F 50

= 0.0047 μ F 70 μ s

= 0.01 μ F 100

2.7 5.5 V

High level enable input voltage 2.7V < VIN< 5.5V 1.7 V Low level enable input voltage 2.7V < VIN< 5.5V 0 0.7 V EN pin current V UVLO threshold V

= 0V – 1 1 μ A

rising 2.25 2.65 V

UVLO hysteresis 100 mV

(1) Minimum VINis 2.7V or V (2) Dropout is not measured for the TPS79318 and TPS79325 since minimum VIN= 2.7V. (3) For adjustable versions, this parameter applies only after VINis applied; then V

+ VDO, whichever is greater.

OUT

transitions high to low.

(1)

+ 1V

, I

= 1mA,

OUT

5.5 – V

RMS

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Thermal

Shutdown

Bandgap

Reference

1.22V

Current

Sense

GND

SHUTDOWN

ref

UVLO

ILIM

External to the Device

UVLO

2.45V

250 kΩ

59 k

QuickStart

OUTIN

Thermal

Shutdown

Current

Sense

GND

SHUTDOWN

ref

UVLO

ILIM

250 kΩ

QuickStart

Bandgap

Reference

1.22V

UVLO

2.45V

R2 = 40 kΩ

IN OUT

TPS793xx

SLVS348K – JULY 2001 – REVISED OCTOBER 2007

ADJUSTABLE VERSION

FUNCTIONAL BLOCK DIAGRAMS

FIXED VERSION

Table 1. Terminal Functions

TERMINAL

NAME ADJ FIXED FIXED DESCRIPTION

GND 2 2 A1 Regulator ground

OUT 6 5 C1 Output of the regulator.

SOT23 SOT23 WCSP

NR 4 4 B2

EN 3 3 A3 FB 5 N/A N/A This terminal is the feedback input voltage for the adjustable device.

IN 1 1 C3 Input to the device.

Connecting an external capacitor to this pin bypasses noise generated by the internal bandgap. This improves power-supply rejection and reduces output noise.

Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into shutdown mode. EN can be connected to IN if not used.

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2.795

2.796

2.797

2.798

2.799

2.800

2.801

2.802

2.803

2.804

2.805

0 50 100 150 200

OUT

(mA)

VIN = 3.8 V C

OUT

= 10 µF

TJ = 25°C

OUT

(V)

100

150

200

250

−40−25−10 5 20 35 50 65 80 95 110 125

TJ (°C)

OUT

= 1 mA

VIN = 3.8 V C

OUT

= 10 µF

OUT

= 200 mA

GND

(µA)

2.775

2.780

2.785

2.790

2.795

2.800

2.805

−40−25−10 5 20 35 50 65 80 95 110 125

(°C)

OUT

= 200 mA

OUT

= 1 mA

VIN = 3.8 V C

OUT

= 10 µF

OUT

(V)

0.05

0.10

0.15

0.20

0.25

0.30

100 1 k 10 k 100 k

Frequency (Hz)

OUT

= 1 mA

VIN = 3.8 V C

OUT

= 2.2 µF

= 0.1 µF

OUT

= 200 mA

Output Spectral Noise Density (µV/√Hz)

0.05

0.10

0.15

0.20

0.25

0.30

100 1 k 10 k 100 k

Frequency (Hz)

OUT

= 1 mA

OUT

= 200 mA

VIN = 3.8 V C

OUT

= 10 µF

= 0.1 µF

Output Spectral Noise Density (µV/√Hz)

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

100 1 k 10 k 100 k

Frequency (Hz)

VIN = 3.8 V I

OUT

= 200 mA

OUT

= 10 µF

CNR = 0.1 µF

CNR = 0.001 µF

CNR = 0.0047 µF

CNR = 0.01 µF

Output Spectral Noise Density (µV/√Hz)

100 1 M10 1 k

Frequency (Hz)

10 k 100 k

OUT

= 1 mA

0.5

1.0

1.5

2.0

2.5

OUT

= 100 mA

10 M

VIN = 3.8 V C

OUT

= 10 µF

TJ = 25° C

ZO (Ω)

100

120

140

160

180

−40−25−10 5 20 35 50 65 80 95 110 125

OUT

= 200 mA

OUT

= 10 mA

VIN = 2.7 V C

OUT

= 10 µF

TJ (°C)

(mV)

0.001 0.01 0.1

(µF)

OUT

= 2.8 V

OUT

= 200 mA

OUT

= 10 µF

BW = 100 Hz to 100 kHz

RMS, Output Noise (V

RMS

)

SLVS348K – JULY 2001 – REVISED OCTOBER 2007

TYPICAL CHARACTERISTICS (SOT23 PACKAGE)

TPS79328 TPS79328 TPS79328

OUTPUT VOLTAGE OUTPUT VOLTAGE GROUND CURRENT

vs vs vs

OUTPUT CURRENT JUNCTION TEMPERATURE JUNCTION TEMPERATURE

Figure 2. Figure 3. Figure 4.

TPS79328 OUTPUT SPECTRAL TPS79328 OUTPUT SPECTRAL TPS79328 OUTPUT SPECTRAL

NOISE DENSITY NOISE DENSITY NOISE DENSITY

vs vs vs

FREQUENCY FREQUENCY FREQUENCY

TPS793xx

ROOT MEAN SQUARE OUTPUT TPS79328

Figure 5. Figure 6. Figure 7.

NOISE OUTPUT IMPEDANCE DROPOUT VOLTAGE

vs vs vs

FREQUENCY JUNCTION TEMPERATURE

Figure 8. Figure 9. Figure 10.

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10 100 1 k 10 k

100 k 1 M 10 M

Ripple Rejection (dB)

Frequency (Hz)

OUT

= 10 mA

VIN = 3.8 V C

OUT

= 10 µF

CNR = 0.01 µF

OUT

= 200 mA

100

10 100 1 k 10 k

100

100 k 1 M 10 M

Ripple Rejection (dB)

Frequency (Hz)

VIN = 3.8 V C

OUT

= 2.2 µF

CNR = 0.01 µF

OUT

= 10 mA

OUT

= 200 mA

10 100 1 k 10 k

100

100 k 1 M 10 M

Ripple Rejection (dB)

Frequency (Hz)

VIN = 3.8 V C

OUT

= 2.2 µF

CNR = 0.1 µF

OUT

= 10 mA

OUT

= 200 mA

Time (µs)

0 604020 80 100 140120 160 180 200

VIN = 3.8 V V

OUT

= 2.8 V

OUT

= 200 mA

OUT

= 2.2 µF

TJ = 25°C

2 0

CNR = 0.0047 µF

CNR = 0.01 µF

CNR = 0.001 µF

(V)V

OUT

(V)

Time (µs)

0 302010 40 50 7060 80 90 100

OUT

= 200 mA

OUT

= 2.2 µF

CNR = 0.01 µF

-20

3.8

0.4 V

µs

4.8

(mV) V

OUT

(mV)

Time (µs)

0 15010050 200 250 350300 400 450

−20

100

500

VIN = 3.8 V C

OUT

= 10 µF

−40

200

300

di dt

0.02A

µs

1mA

OUT

(mA) ∆V

OUT

(mV)

500 mV/div

1s/div

OUT

= 3 V

RL = 15 Ω

100

0 20 40 60 80 100 120

150

200

250

140 160 180 200

OUT

(mA)

TJ = 125°C

TJ = 25°C

TJ = −55°C

(mV)

100

150

200

2.5 3.0 3.5 4.0 4.5

5.0

(V)

OUT

= 200 mA

TJ = 25°C

TJ = −40°C

TJ = 125°C

(mV)

TPS793xx

SLVS348K – JULY 2001 – REVISED OCTOBER 2007

TYPICAL CHARACTERISTICS (SOT23 PACKAGE) (continued)

TPS79328 TPS79328 TPS79328

RIPPLE REJECTION RIPPLE REJECTION RIPPLE REJECTION

TPS79328 OUTPUT VOLTAGE,

ENABLE VOLTAGE

vs vs vs

FREQUENCY FREQUENCY FREQUENCY

Figure 11. Figure 12. Figure 13.

vs TPS79328 TPS79328

TIME (START-UP) LINE TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE

POWER-UP / POWER-DOWN OUTPUT CURRENT INPUT VOLTAGE

Figure 14. Figure 15. Figure 16.

DROPOUT VOLTAGE DROPOUT VOLTAGE

vs vs

Figure 17. Figure 18. Figure 19.

TPS79301

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0.01

0.1

100

0 0.02 0.04 0.06 0.08 0.20

OUT

(A)

Region of Instability

Region of Stability

OUT

= 2.2 µF

VIN = 5.5 V, V

OUT

≥ 1.5 V

TJ = −40°C to 125°C

ESR, Equivalent Series Resistance (Ω)

0.01

0.1

100

0 0.02 0.04 0.06 0.08

0.20

OUT

(A)

Region of Instability

Region of Stability

OUT

= 10 µF VIN = 5.5 V TJ = −40°C to 125°C

ESR, Equivalent Series Resistance (Ω)

TYPICAL CHARACTERISTICS (SOT23 PACKAGE) (continued)

TYPICAL REGIONS OF STABILITY TYPICAL REGIONS OF STABILITY

EQUIVALENT SERIES RESISTANCE EQUIVALENT SERIES RESISTANCE

(ESR) (ESR)

vs vs

OUTPUT CURRENT OUTPUT CURRENT

Figure 20. Figure 21.

TPS793xx

SLVS348K – JULY 2001 – REVISED OCTOBER 2007

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TPS793xx

GNDEN NR

IN OUT

OUT

0.1µF

0.01µF

2.2µF

OUT

TPS793xx

SLVS348K – JULY 2001 – REVISED OCTOBER 2007

APPLICATION INFORMATION

The TPS793xx family of low-dropout (LDO) regulators has been optimized for use in noise-sensitive battery-operated equipment. The device features extremely low dropout voltages, high PSRR, ultralow output noise, low quiescent current (170 μ A typically), and enable-input to reduce supply currents to less than 1 μ A when the regulator is turned off.

A typical application circuit is shown in Figure 22 .

Figure 22. Typical Application Circuit

External Capacitor Requirements

A 0.1 μ F or larger ceramic input bypass capacitor, connected between IN and GND and located close to the TPS793xx, is required for stability and improves transient response, noise rejection, and ripple rejection. A higher-value input capacitor may be necessary if large, fast-rise-time load transients are anticipated or the device is located several inches from the power source.

Like most low-dropout regulators, the TPS793xx requires an output capacitor connected between OUT and GND to stabilize the internal control loop. The minimum recommended capacitance is 2.2 μ F. Any 2.2 μ F or larger ceramic capacitor is suitable, provided the capacitance does not vary significantly over temperature. If load current is not expected to exceed 100mA, a 1.0 μ F ceramic capacitor can be used.

The internal voltage reference is a key source of noise in an LDO regulator. The TPS793xx has an NR pin which is connected to the voltage reference through a 250k Ω internal resistor. The 250k Ω internal resistor, in conjunction with an external bypass capacitor connected to the NR pin, creates a low-pass filter to reduce the voltage reference noise and, therefore, the noise at the regulator output. In order for the regulator to operate properly, the current flow out of the NR pin must be at a minimum, because any leakage current creates an IR drop across the internal resistor, thus creating an output error. Therefore, the bypass capacitor must have minimal leakage current. The bypass capacitor should be no more than 0.1 μ F to ensure that it is fully charged during the quickstart time provided by the internal switch shown in the Functional Block Diagrams .

As an example, the TPS79328 exhibits only 32 μ V

of output voltage noise using a 0.1 μ F ceramic bypass

RMS

capacitor and a 2.2 μ F ceramic output capacitor. Note that the output starts up slower as the bypass capacitance increases due to the RC time constant at the NR pin that is created by the internal 250k Ω resistor and external capacitor.

Board Layout Recommendation to Improve PSRR and Noise Performance

To improve ac measurements like PSRR, output noise, and transient response, it is recommended that the board be designed with separate ground planes for V pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the GND pin of the device.

and V

, with each ground plane connected only at the GND

OUT

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D(max

)

max*T

QJA

VIN*V

OUT

+ V

REF

1 )

OUT

REF

* 1Ǔ R

(3 x 10*7) x (R

) R2)

x R2)

TPS793xx

SLVS348K – JULY 2001 – REVISED OCTOBER 2007

Power Dissipation and Junction Temperature

Specified regulator operation is assured to a junction temperature of +125 ° C; the maximum junction temperature should be restricted to +125 ° C under normal operating conditions. This restriction limits the power dissipation the regulator can handle in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation, P equal to P

D(max)

The maximum power dissipation limit is determined using Equation 1 :

Where:

• TJmax is the maximum allowable junction temperature.

• R

• TAis the ambient temperature.

is the thermal resistance junction-to-ambient for the package (see the Dissipation Ratings Table ).

θ JA

The regulator dissipation is calculated using Equation 2 :

Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal protection circuit.

, and the actual dissipation, PD, which must be less than or

D(max)

(1)

(2)

Programming the TPS79301 Adjustable LDO Regulator

The output voltage of the TPS79301 adjustable regulator is programmed using an external resistor divider as shown in Figure 23 . The output voltage is calculated using Equation 3 :

Where:

• V

Resistors R for improved noise performance, but the solution consumes more power. Higher resistor values should be avoided as leakage current into/out of FB across R1/R increases/decreases the feedback voltage and thus erroneously decreases/increases V design procedure is to choose R calculate R

In order to improve the stability of the adjustable version, it is suggested that a small compensation capacitor be placed between OUT and FB. For voltages less than 1.8V, the value of this capacitor should be 100pF. For voltages greater than 1.8V, the approximate value of this capacitor can be calculated as shown in Equation 5 :

The suggested value of this capacitor for several resistor ratios is shown in the table below. If this capacitor is not used (such as in a unity-gain configuration) or if an output voltage less than 1.8V is chosen, then the minimum recommended output capacitor is 4.7 μ F instead of 2.2 μ F.

= 1.2246V typ (the internal reference voltage)

REF

and R

using Equation 4 :

should be chosen for approximately 50 μ A divider current. Lower value resistors can be used

creates an offset voltage that artificially

= 30.1k Ω to set the divider current at 50 μ A, C

. The recommended

OUT

= 15pF for stability, and then

(3)

(4)

(5)

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GNDNR

IN OUT

OUT

1 Fm

2.2 Fm

0.01 Fm

TPS79301

OUTPUTVOLTAGE

PROGRAMMINGGUIDE

2.5V

3.3V

3.6V

1.22V

OUTPUT

VOLTAGE

31.6kW

short

51kW

59kW

open

30.1kW

0pF

22pF

15pF

TPS793xx

SLVS348K – JULY 2001 – REVISED OCTOBER 2007

Figure 23. TPS79301 Adjustable LDO Regulator Programming

Regulator Protection

The TPS793xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input voltage drops below the output voltage (for example, during power-down). Current is conducted from the output to the input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be appropriate.

The TPS793xx features internal current limiting and thermal protection. During normal operation, the TPS793xx limits output current to approximately 400mA. When current limiting engages, the output voltage scales back linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure, care should be taken not to exceed the power dissipation ratings of the package or the absolute maximum voltage ratings of the device. If the temperature of the device exceeds approximately +165 ° C, thermal-protection circuitry shuts it down. Once the device has cooled down to below approximately +140 ° C, regulator operation resumes.

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TPS793xxYEQ, YZQ NanoStar ™ Wafer Chip Scale Information

0.625 Max

NOTES:A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice. C. NanoStar package configuration.

NanoStar is a trademark of Texas Instruments.

1,30 1,34

0,79 0,84

TPS793xx

SLVS348K – JULY 2001 – REVISED OCTOBER 2007

Figure 24. NanoStar ™ Wafer Chip Scale Package

PACKAGE OPTION ADDENDUM

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PACKAGING INFORMATION

Orderable Device Status

TPS79301DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS &

TPS79301DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS &

TPS79318DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

TPS79318DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

TPS79318DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &

TPS79318DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &

TPS79318YEQR NRND DSBGA YEQ 5 3000 TBD Call TI Call TI TPS79318YEQT NRND DSBGA YEQ 5 250 TBD Call TI Call TI TPS79318YZQR ACTIVE DSBGA YZQ 5 3000 Green (RoHS &

TPS79318YZQT ACTIVE DSBGA YZQ 5 250 Green (RoHS &

TPS79325DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

TPS79325DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

TPS79325YEQR NRND DSBGA YEQ 5 TBD Call TI Call TI TPS79325YEQT NRND DSBGA YEQ 5 TBD Call TI Call TI TPS79325YZQR ACTIVE DSBGA YZQ 5 3000 Green (RoHS &

TPS793285DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

TPS793285DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

TPS793285DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &

TPS793285DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &

TPS793285YEQR NRND DSBGA YEQ 5 TBD Call TI Call TI

TPS793285YEQT NRND DSBGA YEQ 5 TBD Call TI Call TI

TPS793285YZQR ACTIVE DSBGA YZQ 5 3000 Green (RoHS &

TPS793285YZQT ACTIVE DSBGA YZQ 5 250 Green (RoHS &

TPS79328DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

TPS79328DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

TPS79328YEQR NRND DSBGA YEQ 5 TBD Call TI Call TI TPS79328YEQT NRND DSBGA YEQ 5 TBD Call TI Call TI TPS79328YZQR ACTIVE DSBGA YZQ 5 3000 Green (RoHS &

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

no Sb/Br)

(2)

Lead/Ball Finish MSL Peak Temp

CU NIPDAU Level-1-260C-UNLIM

SnAgCu Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

SnAgCu Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

SnAgCu Level-1-260C-UNLIM

SNAGCU Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM

SnAgCu Level-1-260C-UNLIM

18-Sep-2008

(3)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

Orderable Device Status

(1)

Package

Type

Package Drawing

Pins Package

Qty

Eco Plan

TPS79328YZQT ACTIVE DSBGA YZQ 5 250 Green (RoHS &

(2)

Lead/Ball Finish MSL Peak Temp

SnAgCu Level-1-260C-UNLIM

18-Sep-2008

(3)

no Sb/Br)

TPS79330DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TPS79330DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br) TPS79330YEQR NRND DSBGA YEQ 5 3000 TBD Call TI Call TI TPS79330YEQT NRND DSBGA YEQ 5 250 TBD Call TI Call TI TPS79330YZQR ACTIVE DSBGA YZQ 5 3000 Green (RoHS &

SnAgCu Level-1-260C-UNLIM

no Sb/Br)

TPS79330YZQT ACTIVE DSBGA YZQ 5 250 Green (RoHS &

SNAGCU Level-1-260C-UNLIM

no Sb/Br) TPS79333DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TPS79333DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TPS793475DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TPS793475DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &

CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TPS79301, TPS79318, TPS79325, TPS793285, TPS79333, TPS793475 :

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

Automotive: TPS79301-Q1, TPS79318-Q1, TPS79325-Q1, TPS793285-Q1, TPS79333-Q1, TPS793475-Q1

•

Enhanced Product: TPS79301-EP, TPS79318-EP, TPS79325-EP, TPS79333-EP, TPS793475-EP

•

NOTE: Qualified Version Definitions:

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

•

Enhanced Product - Supports Defense, Aerospace and Medical Applications

•

18-Sep-2008

Addendum-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL INFORMATION

6-Nov-2008

*All dimensions are nominal

Device Package

TPS79301DBVR SOT-23 DBV 6 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS79318DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

TPS79318DBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

TPS79318YZQR DSBGA YZQ 5 3000 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1

TPS79318YZQT DSBGA YZQ 5 250 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1 TPS79325DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS79325YZQR DSBGA YZQ 5 3000 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1

TPS793285DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

TPS793285DBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

TPS793285YZQR DSBGA YZQ 5 3000 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1

TPS793285YZQT DSBGA YZQ 5 250 178.0 8.4 0.96 1.46 0.69 4.0 8.0 Q1 TPS793285YZQT DSBGA YZQ 5 250 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1

TPS79328DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS79328YZQR DSBGA YZQ 5 3000 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1

TPS79328YZQT DSBGA YZQ 5 250 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1 TPS79330DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS79330YZQR DSBGA YZQ 5 3000 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1

TPS79330YZQT DSBGA YZQ 5 250 178.0 8.4 0.98 1.46 0.69 4.0 8.0 Q1

Type

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

Device Package

TPS79330YZQT DSBGA YZQ 5 250 178.0 8.4 0.96 1.46 0.69 4.0 8.0 Q1 TPS79333DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS79333DBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3

TPS793475DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

Type

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

6-Nov-2008

(mm)W(mm)

Pin1

Quadrant

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPS79301DBVR SOT-23 DBV 6 3000 195.0 200.0 45.0 TPS79318DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0

TPS79318DBVT SOT-23 DBV 5 250 195.0 200.0 45.0

TPS79318YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0

TPS79318YZQT DSBGA YZQ 5 250 217.0 193.0 35.0 TPS79325DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0 TPS79325YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0

TPS793285DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0 TPS793285DBVT SOT-23 DBV 5 250 195.0 200.0 45.0 TPS793285YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0 TPS793285YZQT DSBGA YZQ 5 250 187.0 187.0 25.6 TPS793285YZQT DSBGA YZQ 5 250 217.0 193.0 35.0

TPS79328DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPS79328YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0

TPS79328YZQT DSBGA YZQ 5 250 217.0 193.0 35.0 TPS79330DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0 TPS79330YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0

TPS79330YZQT DSBGA YZQ 5 250 217.0 193.0 35.0

TPS79330YZQT DSBGA YZQ 5 250 187.0 187.0 25.6 TPS79333DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0 TPS79333DBVR SOT-23 DBV 5 3000 182.0 182.0 20.0

TPS793475DBVR SOT-23 DBV 5 3000 195.0 200.0 45.0

6-Nov-2008

Pack Materials-Page 3

IMPORTANT NOTICE

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TEXAS INSTRUMENTS TPS793xx Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES DESCRIPTION

APPLICATIONS

ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS TABLE

ELECTRICAL CHARACTERISTICS

ADJUSTABLE VERSION

FUNCTIONAL BLOCK DIAGRAMS

FIXED VERSION

TYPICAL CHARACTERISTICS (SOT23 PACKAGE)

APPLICATION INFORMATION

External Capacitor Requirements

Board Layout Recommendation to Improve PSRR and Noise Performance

Power Dissipation and Junction Temperature

Programming the TPS79301 Adjustable LDO Regulator

Regulator Protection