TEXAS INSTRUMENTS TPS718xx, TPS719xx Technical data

TPS718xx TPS719xx
GND
EN1
EN2
OUT2
V
IN
V
OUT
V
OUT
1 Fm
1 Fm
1 Fm
TypicalApplicationCircuit
2.7Vto6.5V 0.9Vto3.6V
0.9V 3.6V-
On
Off
On
Off
EN1
GND
GND
EN2
6
5
4
OUT1
IN
OUT2
1
2
3
TPS718xx,TPS719xx
DRVPackage
2mmx2mmSON-6
(TopView)
OUT1
IN
OUT2
EN1
GND
EN2
A1
B1
C1
A2
B2
C2
TPS718Axx,TPS719Axx
YZCPackage
6-BALLWCSP
(TopView)
OUT1
IN
OUT2
EN1
GND
EN2
C2
B2
A2
C1
B1
A1
TPS718xx,TPS719xx
YZCPackage
6-BALLWCSP
(TopView)
TPS718xx TPS719xx
www.ti.com
..................................................................................................................................................... SBVS088C – FEBRUARY 2007 – REVISED MAY 2008
Dual, 200mA Output, Low Noise, High PSRR
Low-Dropout Linear Regulators
1

FEATURES DESCRIPTION

23
Dual, 200mA High-Performance LDOs
Low Total Quiescent Current: 90 µ A with Both
LDOs Enabled
Low Noise: 70 µ V
Active Output Pulldown (TPS719xx)
Independent Enables for Each LDO
PSRR: 65dB at 1kHz, 45dB at 1MHz
Available in Multiple Fixed-Output Voltage
Combinations from 0.9V to 3.6V Using Innovative Factory EEPROM Programming
Fast Start-Up Time: 160 µ s
Over-Current, Over-Temperature and
Under-Voltage Protection
Low Dropout: 230mV at 200mA
Stable with 1 µ F Ceramic Output Capacitor
Available in 2mm × 2mm SON-6 and 6-Ball
WCSP Packages
/V
RMS
The TPS718xx and TPS719xx families of low-dropout (LDO) regulators offer a high power-supply rejection ratio (PSRR), low noise, fast start-up, and excellent line and load transient responses while consuming a very low 90 µ A (typical) at no load ground current with both LDOs enabled. The TPS719xx also provides an active pulldown circuit to quickly discharge output loads. The TPS718xx and TPS719xx are stable with ceramic capacitors and use an advanced BiCMOS fabrication process to yield a typical dropout voltage of 230mV at 200mA output loads. The TPS718xx and TPS719xx also use a precision voltage reference and feedback loop to achieve 3% overall accuracy over all load, line, process, and temperature variations. Both families of devices are fully specified from TJ= 40 ° C to +125 ° C and are offered in 2mm × 2mm SON-6 and 6-ball Wafer Chip-Scale (WCSP) packages that are ideal for applications such as mobile handsets and WLAN that require good thermal dissipation while maintaining a very small footprint.

APPLICATIONS

Digital Cameras and Camera Modules
Cellular Camera and TV Phones
Wireless LAN, Bluetooth
Handheld Products
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 Bluetooth is a registered trademark of Bluetooth SIG, Inc. 3 All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
®
Copyright © 2007 – 2008, Texas Instruments Incorporated
TPS718xx TPS719xx
SBVS088C – FEBRUARY 2007 – REVISED MAY 2008 .....................................................................................................................................................
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
PRODUCT V
(1)
(2) (3)
OUT
TPS718 xx-yywwwz A denotes device with rotated pin 1 orientation of wafer-chipscale package.
TPS718A xx-yywwwz XX is nominal output voltage for LDO1 (for example, 28 = 2.8V).
TPS719 xx-yywwwz YY is nominal output voltage for LDO2.
TPS719A xx-yywwwz WWW is package designator.
Z is tape and reel quantity (R = 3000, T = 250).
Examples: TPS71918 – 285DRVR XX = 18 = 1.8V, YYY = 285 = 2.85V
TPS719185-33DRVR XXX = 185 = 1.85V, YY = 33 = 3.3V
DRV = 2mm x 2mm SON package Z = R = 3000 piece reel
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com . (2) Both outputs are programmable from 0.9V to 3.6V in 50mV increments. (3) Output voltages from 0.9V to 3.6V in 50mV increments are available through the use of innovative factory EEPROM programming;
minimum order quantities may apply. Contact factory for details and availability.

ABSOLUTE MAXIMUM RATINGS

(1)
Over operating temperature range (unless otherwise noted). All voltages are with respect to GND.
PARAMETER TPS718xx, TPS719xx UNIT
Input voltage range, V Enable voltage range, V Output voltage range, V
IN
and V
EN1
OUT
EN2
Peak output current Internally limited Output short-circuit duration Indefinite Junction temperature range, T Storage temperature range , T Total continuous power dissipation, P
J
STG
DISS
ESD rating, HBM 2 kV ESD rating, CDM 500 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
– 0.3 to +7.0 V
– 0.3 to VIN+ 0.3V V
– 0.3 to +7.0 V
– 55 to +150 ° C – 55 to +150 ° C
See Dissipation Ratings Table

DISSIPATION RATINGS

BOARD PACKAGE R
(1)
High-K
(1)
High-K
DRV 20 ° C/W 95 ° C/W 10.53mW/ ° C 1053mW 579mW 421mW YZC 27 ° C/W 190 ° C/W 5.3mW/ ° C 530mW 295mW 215mW
θ JC
R
θ JA
(1) The JEDEC high-K (2s2p) board used to derive this data was a 3in × 3in, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
2 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TPS718xx TPS719xx
DERATING FACTOR
ABOVE TA= +25 ° C TA< +25 ° C TA= +70 ° C TA= +85 ° C
TPS718xx TPS719xx
www.ti.com
..................................................................................................................................................... SBVS088C – FEBRUARY 2007 – REVISED MAY 2008

ELECTRICAL CHARACTERISTICS

Over operating temperature range (T I
= 0.5mA, V
OUT
V
IN
V
, V
OUT1
OUT2
V
, V
OUT1
OUT2
Δ V
/ Δ V
OUT
IN
Δ V
/ Δ I
OUT
OUT
V
DO
I
CL
I
GND
I
SHDN
PSRR VIN= 3.8V, V
V
N
T
STR
T
SHUT
V
EN(HI)
V
EN(LO)
I
EN
UVLO
T
SD
T
J
(1) Minimum VIN= V (2) V (3) Time from V
is not measured for devices with V
DO
(4) Time from V (5) See Shutdown section in the Applications Information for more details.
= V
EN1
= VIN, C
EN2
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input voltage range Output voltage range 0.9 3.6 V
Output accuracy
Line regulation 130 µ V/V Load regulation 0mA I
Dropout voltage (V
= V
IN
(2)
OUT(NOM)
Output current limit (per output) V
Ground pin current
Shutdown current (I
Power-supply rejection ratio I
OUT
OUT
= 200mA
Output noise voltage BW = 100Hz to 100kHz
Startup time Shutdown time
(3)
(4),(5)
(TPS719xx only) V Enable high (enabled)
(EN1 and EN2) Enable low (shutdown)
(EN1 and EN2) Enable pin current, enabled
(EN1 and EN2) Undervoltage lockout VINrising 2.38 2.45 2.52 V Hysteresis VINfalling 150 mV
Thermal shutdown temperature
Operating junction temperature – 40 +125 ° C
+ V
or 2.7V, whichever is greater.
DO
OUT
OUT
= 1.25V to V
EN
= 0.4V to V
EN
OUT
= 40 ° C to +125 ° C), V
J
= 1.0 µ F, unless otherwise noted. Typical values are at TJ= +25 ° C.
OUT
(1)
Nominal TJ= +25 ° C ± 2.5 mV Over VIN, I
Temp 0mA I
, V
OUT
V I
OUT
I
0.1V)
OUT
I
OUT1
I
OUT1
V
)
GND
TJ= – 40 ° C to +85 ° C V
TJ= – 40 ° C to +85 ° C f = 100Hz 63 dB f = 1kHz 63 dB
= 2.8V, f = 10kHz 72 dB
f = 100kHz 58 dB f = 1MHz 44 dB
RL= 14 , V C
RL= , C
VIN≤ 5.5V 1.2 6.5 V
5.5V < VIN≤ 6.5V 1.25 6.5 V
EN1 = EN2 = 6.5V 0.04 1.0 µ A
Shutdown, temperature increasing +160 ° C Reset, temperature decreasing +140 ° C
= 95% (V
= 5% (V
OUT(NOM)
OUT(NOM)
< 2.8V because minimum VIN= 2.7V.
OUT(NOM)
).
).
= V
IN
OUT(TYP)
+ 0.5V or 2.7V, whichever is greater;
2.7 6.5 V
+ 0.5V VIN≤ 6.5V
OUT
OUT(NOM)
200mA
OUT
+ 0.5V VIN≤ 6.5V,
= 5mA
200mA 75 µ V/mA
OUT
– 3.0 +3.0 %
= 200mA 230 400 mV
= 0.9 × V
OUT
= I
OUT2
= I
OUT2
0.4V, 2.7V VIN< 4.5V,
EN1,2
0.4V, 4.5V VIN≤ 6.5V,
EN1,2
= 1.0 µ F
OUT
= 2.8V
OUT
OUT(NOM)
= 0.1mA 90 160 µ A = 200mA 250 µ A
= 2.8V,
OUT
= 1.0 µ F,
OUT
240 340 575 mA
0.3 3.0 µ A
1.8 µ A
70 × V
OUT
160 µ s
180 µ s
0 0.4 V
µ V
RMS
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TPS718xx TPS719xx
GND
Bandgap
Bandgap
2.5 Am
2.5 Am
Current
Limit
Thermal
Shutdown
UVLO
Current
Limit
Thermal
Shutdown
UVLO
Enableand
Power
Control
Logic
60W
60W
OUT1
OUT2
EN1
EN2
IN
TPS719only
TPS719only
TPS718xx TPS719xx
SBVS088C – FEBRUARY 2007 – REVISED MAY 2008 .....................................................................................................................................................
www.ti.com

DEVICE INFORMATION

Figure 1. Functional Block Diagram
4 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TPS718xx TPS719xx
EN1
GND
GND
EN2
6
5
4
OUT1
IN
OUT2
1
2
3
OUT1
IN
OUT2
EN1
GND
EN2
C2
B2
A2
C1
B1
A1
TPS718xx TPS719xx
TPS718Axx TPS719Axx
OUT1
IN
OUT2
EN1
GND
EN2
A1
B1
C1
A2
B2
C2
TPS718xx TPS719xx
www.ti.com
..................................................................................................................................................... SBVS088C – FEBRUARY 2007 – REVISED MAY 2008
DRV PACKAGE
SON-6
(TOP VIEW)
YZC PACKAGE
6-BALL WCSP
(TOP VIEW)
YZC PACKAGE
6-BALL WCSP
(TOP VIEW)
PIN DESCRIPTIONS
TPS718xx TPS718Axx TPS719xx TPS719Axx
NAME DRV YZC YZC DESCRIPTION
OUT1 1 C1 A2
IN 2 B1 B2 Input supply to both regulators.
OUT2 3 A1 C2
EN2 4 A2 C1 Regulator 2. Driving this pin low puts Regulator 2 into shutdown mode,
GND 5 B2 B1 Ground. DRV thermal pad should also be connected to ground.
EN1 6 C2 A1 Regulator 1. Driving this pin low puts Regulator 1 into shutdown mode,
(1) A option denotes devices with rotated Pin 1 orientation on Wafer Chipscale packages.
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TPS718xx TPS719xx
(1) (1)
Output of Regulator 1. A small ceramic capacitor (typically 1 µ F) is needed from this pin to ground to assure stability.
Output of Regulator 2. A small ceramic capacitor (typically 1 µ F) is needed from this pin to ground to assure stability.
Enable pin for Regulator 2. Driving the Enable pin (EN2) high turns on reducing operating current.
Enable pin for Regulator 1. Driving the Enable pin (EN1) high turns on reducing operating current.
4
3
2
1
0
1
2
3
4
-
-
-
-
DV (mV)
OUT
2.5 5.5 6.5 V (V)
IN
3.5 4.5
I =5mA
OUT
T =+25 CJ°
T =+85 CJ°
T =+125 CJ°
T = 0 CJ-4 °
0
1
2
3
4
5
-
-
-
-
-
DV (mV)
OUT
T =+85 CJ°
T =+125 CJ°
T =+25 CJ°
T = 40 C
J
- °
I =200mA
OUT
2.5 5.5 6.5 V (V)
IN
3.5 4.5
4
2
0
2
4
6
8
10
-
-
-
-
-
I (mA)
OUT
DV (mV)
OUT
0 5
1 2
3
4
T =+85 CJ°
T =+125 CJ°
T =+25 CJ°
T = 40 C
J
- °
5
0
5
10
15
20
25
30
35
40
-
-
-
-
-
-
-
-
0 50 100 150 200
I (mA)
OUT
D
V
(mV)
OUT
T =+125 C
J
T =+85 C T =+25 C
T = 40 C
J
J
J
-
°
°
°
°
2.805
2.800
2.795
2.790
2.785
2.780
2.775
2.770
2.765
2.760
V
(V)
OUT
-40 65 125 T ( C)
J
°
5 35-25 -10 20 50 80 95 110
I =5mA
OUT
I =0.1mA
OUT
I =200mA
OUT
350
300
250
200
150
100
50
0
0 100 200
I (mA)
OUT
V (mV)
DO
50 150
T =+125 CJ°
T =+85 CJ°
T =+25 CJ°
T = 40 C-J°
TPS718xx TPS719xx
SBVS088C – FEBRUARY 2007 – REVISED MAY 2008 .....................................................................................................................................................
Over operating temperature range (T
I
= 0.5mA, V
OUT
LOAD REGULATION UNDER LIGHT LOADS LOAD REGULATION

TYPICAL CHARACTERISTICS

= 40 ° C to +125 ° C), VIN= V
= VIN, C
J
= 1.0 µ F, unless otherwise noted. Typical values are at TJ= +25 ° C.
OUT
= V
EN1
EN2
OUT(TYP)
LINE REGULATION LINE REGULATION
Figure 2. Figure 3.
+ 0.5V or 2.7V, whichever is greater;
www.ti.com
OUTPUT VOLTAGE vs DROPOUT VOLTAGE vs
TEMPERATURE OUTPUT CURRENT
6 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Figure 4. Figure 5.
Figure 6. Figure 7.
Product Folder Link(s): TPS718xx TPS719xx
200
160
120
80
40
0
0 100 200
I (mA)
OUT
I
( A)m
GND
50 150
T =+125 CJ°
T = 0 CJ-4 °
T =+85 CJ°
T =+25 CJ°
60
50
40
30
20
10
0
I
(
A)m
GND
2.5 5.5 6.5 V (V)
IN
3.5 4.5
I =1mA
OUT
-40 65 125 T ( C)
J
°
5 35-25 -10 20 50 80 95 110
140
120
100
80
60
40
20
0
I
( A)m
GND
I =0mA
OUT
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
ShutdownCurrent( A)m
T = 40 CJ- °
2.5 5.5 6.5 V (V)
IN
3.5 4.5
T =+125 CJ°
T =+85 CJ°
T =+25 CJ°
450
425
400
375
350
325
300
275
250
CurrentLimit(mA)
2.5 5.5 6.5 V (V)
IN
3.5 4.5
T =+125 C
J
T =+85 C T =+25 C T = 40 C
J
J
J
-
°
°
°
°
90
80
70
60
50
40
30
20
10
0
PSRR(dB)
10 100k 10M
Frequency(Hz)
1k
10k100
1M
5mA
100mA
200mA
TPS718xx TPS719xx
www.ti.com
..................................................................................................................................................... SBVS088C – FEBRUARY 2007 – REVISED MAY 2008
Over operating temperature range (T I
OUT
= 0.5mA, V
= V
EN1
= VIN, C
EN2
GROUND PIN CURRENT vs GROUND PIN CURRENT vs
OUTPUT CURRENT INPUT VOLTAGE
Figure 8. Figure 9.
GROUND PIN CURRENT vs SHUTDOWN CURRENT vs
TEMPERATURE (BOTH LDOs ENABLED) INPUT VOLTAGE
TYPICAL CHARACTERISTICS (continued)
= 40 ° C to +125 ° C), V
J
= 1.0 µ F, unless otherwise noted. Typical values are at TJ= +25 ° C.
OUT
= V
IN
OUT(TYP)
+ 0.5V or 2.7V, whichever is greater;
Figure 10. Figure 11.
CURRENT LIMIT vs POWER-SUPPLY RIPPLE REJECTION vs
INPUT VOLTAGE FREQUENCY (V
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
Figure 12. Figure 13.
Product Folder Link(s): TPS718xx TPS719xx
V
IN
= 0.5V)
OUT
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