TPS718xx
TPS719xx
GND
EN1
EN2
OUT2
IN OUT1
V
IN
V
OUT
V
OUT
1 Fm
1 Fm
1 Fm
TypicalApplicationCircuit
2.7Vto6.5V 0.9Vto3.6V
0.9V 3.6V-
On
Off
On
Off
EN1
GND
GND
EN2
6
5
4
OUT1
IN
OUT2
1
2
3
TPS718xx,TPS719xx
DRVPackage
2mmx2mmSON-6
(TopView)
OUT1
IN
OUT2
EN1
GND
EN2
A1
B1
C1
A2
B2
C2
TPS718Axx,TPS719Axx
YZCPackage
6-BALLWCSP
(TopView)
OUT1
IN
OUT2
EN1
GND
EN2
C2
B2
A2
C1
B1
A1
TPS718xx,TPS719xx
YZCPackage
6-BALLWCSP
(TopView)
TPS718xx
TPS719xx
www.ti.com
..................................................................................................................................................... SBVS088C – FEBRUARY 2007 – REVISED MAY 2008
Dual, 200mA Output, Low Noise, High PSRR
Low-Dropout Linear Regulators
1
FEATURES DESCRIPTION
23
• Dual, 200mA High-Performance LDOs
• Low Total Quiescent Current: 90 µ A with Both
LDOs Enabled
• Low Noise: 70 µ V
• Active Output Pulldown (TPS719xx)
• Independent Enables for Each LDO
• PSRR: 65dB at 1kHz, 45dB at 1MHz
• Available in Multiple Fixed-Output Voltage
Combinations from 0.9V to 3.6V Using
Innovative Factory EEPROM Programming
• Fast Start-Up Time: 160 µ s
• Over-Current, Over-Temperature and
Under-Voltage Protection
• Low Dropout: 230mV at 200mA
• Stable with 1 µ F Ceramic Output Capacitor
• Available in 2mm × 2mm SON-6 and 6-Ball
WCSP Packages
/V
RMS
The TPS718xx and TPS719xx families of low-dropout
(LDO) regulators offer a high power-supply rejection
ratio (PSRR), low noise, fast start-up, and excellent
line and load transient responses while consuming a
very low 90 µ A (typical) at no load ground current with
both LDOs enabled. The TPS719xx also provides an
active pulldown circuit to quickly discharge output
loads. The TPS718xx and TPS719xx are stable with
ceramic capacitors and use an advanced BiCMOS
fabrication process to yield a typical dropout voltage
of 230mV at 200mA output loads. The TPS718xx and
TPS719xx also use a precision voltage reference and
feedback loop to achieve 3% overall accuracy over all
load, line, process, and temperature variations. Both
families of devices are fully specified from TJ= – 40 ° C
to +125 ° C and are offered in 2mm × 2mm SON-6 and
6-ball Wafer Chip-Scale (WCSP) packages that are
ideal for applications such as mobile handsets and
WLAN that require good thermal dissipation while
maintaining a very small footprint.
APPLICATIONS
• Digital Cameras and Camera Modules
• Cellular Camera and TV Phones
• Wireless LAN, Bluetooth
• Handheld Products
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 Bluetooth is a registered trademark of Bluetooth SIG, Inc.
3 All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
®
Copyright © 2007 – 2008, Texas Instruments Incorporated
TPS718xx
TPS719xx
SBVS088C – FEBRUARY 2007 – REVISED MAY 2008 .....................................................................................................................................................
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
PRODUCT V
(1)
(2) (3)
OUT
TPS718 xx-yywwwz A denotes device with rotated pin 1 orientation of wafer-chipscale package.
TPS718A xx-yywwwz XX is nominal output voltage for LDO1 (for example, 28 = 2.8V).
TPS719 xx-yywwwz YY is nominal output voltage for LDO2.
TPS719A xx-yywwwz WWW is package designator.
Z is tape and reel quantity (R = 3000, T = 250).
Examples: TPS71918 – 285DRVR XX = 18 = 1.8V, YYY = 285 = 2.85V
TPS719185-33DRVR XXX = 185 = 1.85V, YY = 33 = 3.3V
DRV = 2mm x 2mm SON package
Z = R = 3000 piece reel
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
(2) Both outputs are programmable from 0.9V to 3.6V in 50mV increments.
(3) Output voltages from 0.9V to 3.6V in 50mV increments are available through the use of innovative factory EEPROM programming;
minimum order quantities may apply. Contact factory for details and availability.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating temperature range (unless otherwise noted). All voltages are with respect to GND.
PARAMETER TPS718xx, TPS719xx UNIT
Input voltage range, V
Enable voltage range, V
Output voltage range, V
IN
and V
EN1
OUT
EN2
Peak output current Internally limited
Output short-circuit duration Indefinite
Junction temperature range, T
Storage temperature range , T
Total continuous power dissipation, P
J
STG
DISS
ESD rating, HBM 2 kV
ESD rating, CDM 500 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
– 0.3 to +7.0 V
– 0.3 to VIN+ 0.3V V
– 0.3 to +7.0 V
– 55 to +150 ° C
– 55 to +150 ° C
See Dissipation Ratings Table
DISSIPATION RATINGS
BOARD PACKAGE R
(1)
High-K
(1)
High-K
DRV 20 ° C/W 95 ° C/W 10.53mW/ ° C 1053mW 579mW 421mW
YZC 27 ° C/W 190 ° C/W 5.3mW/ ° C 530mW 295mW 215mW
θ JC
R
θ JA
(1) The JEDEC high-K (2s2p) board used to derive this data was a 3in × 3in, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
2 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TPS718xx TPS719xx
DERATING FACTOR
ABOVE TA= +25 ° C TA< +25 ° C TA= +70 ° C TA= +85 ° C
TPS718xx
TPS719xx
www.ti.com
..................................................................................................................................................... SBVS088C – FEBRUARY 2007 – REVISED MAY 2008
ELECTRICAL CHARACTERISTICS
Over operating temperature range (T
I
= 0.5mA, V
OUT
V
IN
V
, V
OUT1
OUT2
V
, V
OUT1
OUT2
Δ V
/ Δ V
OUT
IN
Δ V
/ Δ I
OUT
OUT
V
DO
I
CL
I
GND
I
SHDN
PSRR VIN= 3.8V, V
V
N
T
STR
T
SHUT
V
EN(HI)
V
EN(LO)
I
EN
UVLO
T
SD
T
J
(1) Minimum VIN= V
(2) V
(3) Time from V
is not measured for devices with V
DO
(4) Time from V
(5) See Shutdown section in the Applications Information for more details.
= V
EN1
= VIN, C
EN2
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input voltage range
Output voltage range 0.9 3.6 V
Output accuracy
Line regulation 130 µ V/V
Load regulation 0mA ≤ I
Dropout voltage
(V
= V
IN
(2)
OUT(NOM)
Output current limit (per output) V
Ground pin current
Shutdown current (I
Power-supply rejection ratio
I
OUT
OUT
= 200mA
Output noise voltage
BW = 100Hz to 100kHz
Startup time
Shutdown time
(3)
(4),(5)
(TPS719xx only) V
Enable high (enabled)
(EN1 and EN2)
Enable low (shutdown)
(EN1 and EN2)
Enable pin current, enabled
(EN1 and EN2)
Undervoltage lockout VINrising 2.38 2.45 2.52 V
Hysteresis VINfalling 150 mV
Thermal shutdown temperature
Operating junction temperature – 40 +125 ° C
+ V
or 2.7V, whichever is greater.
DO
OUT
OUT
= 1.25V to V
EN
= 0.4V to V
EN
OUT
= – 40 ° C to +125 ° C), V
J
= 1.0 µ F, unless otherwise noted. Typical values are at TJ= +25 ° C.
OUT
(1)
Nominal TJ= +25 ° C ± 2.5 mV
Over VIN, I
Temp 0mA ≤ I
, V
OUT
V
I
OUT
I
– 0.1V)
OUT
I
OUT1
I
OUT1
V
)
GND
TJ= – 40 ° C to +85 ° C
V
TJ= – 40 ° C to +85 ° C
f = 100Hz 63 dB
f = 1kHz 63 dB
= 2.8V, f = 10kHz 72 dB
f = 100kHz 58 dB
f = 1MHz 44 dB
RL= 14 Ω , V
C
RL= ∞ , C
VIN≤ 5.5V 1.2 6.5 V
5.5V < VIN≤ 6.5V 1.25 6.5 V
EN1 = EN2 = 6.5V 0.04 1.0 µ A
Shutdown, temperature increasing +160 ° C
Reset, temperature decreasing +140 ° C
= 95% (V
= 5% (V
OUT(NOM)
OUT(NOM)
< 2.8V because minimum VIN= 2.7V.
OUT(NOM)
).
).
= V
IN
OUT(TYP)
+ 0.5V or 2.7V, whichever is greater;
2.7 6.5 V
+ 0.5V ≤ VIN≤ 6.5V
OUT
OUT(NOM)
≤ 200mA
OUT
+ 0.5V ≤ VIN≤ 6.5V,
= 5mA
≤ 200mA 75 µ V/mA
OUT
– 3.0 +3.0 %
= 200mA 230 400 mV
= 0.9 × V
OUT
= I
OUT2
= I
OUT2
≤ 0.4V, 2.7V ≤ VIN< 4.5V,
EN1,2
≤ 0.4V, 4.5V ≤ VIN≤ 6.5V,
EN1,2
= 1.0 µ F
OUT
= 2.8V
OUT
OUT(NOM)
= 0.1mA 90 160 µ A
= 200mA 250 µ A
= 2.8V,
OUT
= 1.0 µ F,
OUT
240 340 575 mA
0.3 3.0 µ A
1.8 µ A
70 × V
OUT
160 µ s
180 µ s
0 0.4 V
µ V
RMS
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TPS718xx TPS719xx
GND
Bandgap
Bandgap
2.5 Am
2.5 Am
Current
Limit
Thermal
Shutdown
UVLO
Current
Limit
Thermal
Shutdown
UVLO
Enableand
Power
Control
Logic
60W
60W
OUT1
OUT2
EN1
EN2
IN
TPS719only
TPS719only
TPS718xx
TPS719xx
SBVS088C – FEBRUARY 2007 – REVISED MAY 2008 .....................................................................................................................................................
www.ti.com
DEVICE INFORMATION
Figure 1. Functional Block Diagram
4 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TPS718xx TPS719xx
EN1
GND
GND
EN2
6
5
4
OUT1
IN
OUT2
1
2
3
OUT1
IN
OUT2
EN1
GND
EN2
C2
B2
A2
C1
B1
A1
TPS718xx
TPS719xx
TPS718Axx
TPS719Axx
OUT1
IN
OUT2
EN1
GND
EN2
A1
B1
C1
A2
B2
C2
TPS718xx
TPS719xx
www.ti.com
..................................................................................................................................................... SBVS088C – FEBRUARY 2007 – REVISED MAY 2008
DRV PACKAGE
SON-6
(TOP VIEW)
YZC PACKAGE
6-BALL WCSP
(TOP VIEW)
YZC PACKAGE
6-BALL WCSP
(TOP VIEW)
PIN DESCRIPTIONS
TPS718xx TPS718Axx
TPS719xx TPS719Axx
NAME DRV YZC YZC DESCRIPTION
OUT1 1 C1 A2
IN 2 B1 B2 Input supply to both regulators.
OUT2 3 A1 C2
EN2 4 A2 C1 Regulator 2. Driving this pin low puts Regulator 2 into shutdown mode,
GND 5 B2 B1 Ground. DRV thermal pad should also be connected to ground.
EN1 6 C2 A1 Regulator 1. Driving this pin low puts Regulator 1 into shutdown mode,
(1) A option denotes devices with rotated Pin 1 orientation on Wafer Chipscale packages.
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TPS718xx TPS719xx
(1)
(1)
Output of Regulator 1. A small ceramic capacitor (typically ≥ 1 µ F) is
needed from this pin to ground to assure stability.
Output of Regulator 2. A small ceramic capacitor (typically ≥ 1 µ F) is
needed from this pin to ground to assure stability.
Enable pin for Regulator 2. Driving the Enable pin (EN2) high turns on
reducing operating current.
Enable pin for Regulator 1. Driving the Enable pin (EN1) high turns on
reducing operating current.
4
3
2
1
0
1
2
3
4
-
-
-
-
DV (mV)
OUT
2.5 5.5 6.5
V (V)
IN
3.5 4.5
I =5mA
OUT
T =+25 CJ°
T =+85 CJ°
T =+125 CJ°
T = 0 CJ-4 °
0
1
2
3
4
5
-
-
-
-
-
DV (mV)
OUT
T =+85 CJ°
T =+125 CJ°
T =+25 CJ°
T = 40 C
J
- °
I =200mA
OUT
2.5 5.5 6.5
V (V)
IN
3.5 4.5
4
2
0
2
4
6
8
10
-
-
-
-
-
I (mA)
OUT
DV (mV)
OUT
0 5
1 2
3
4
T =+85 CJ°
T =+125 CJ°
T =+25 CJ°
T = 40 C
J
- °
5
0
5
10
15
20
25
30
35
40
-
-
-
-
-
-
-
-
0 50 100 150 200
I (mA)
OUT
D
V
(mV)
OUT
T =+125 C
J
T =+85 C
T =+25 C
T = 40 C
J
J
J
-
°
°
°
°
2.805
2.800
2.795
2.790
2.785
2.780
2.775
2.770
2.765
2.760
V
(V)
OUT
-40 65 125
T ( C)
J
°
5 35-25 -10 20 50 80 95 110
I =5mA
OUT
I =0.1mA
OUT
I =200mA
OUT
350
300
250
200
150
100
50
0
0 100 200
I (mA)
OUT
V (mV)
DO
50 150
T =+125 CJ°
T =+85 CJ°
T =+25 CJ°
T = 40 C-J°
TPS718xx
TPS719xx
SBVS088C – FEBRUARY 2007 – REVISED MAY 2008 .....................................................................................................................................................
Over operating temperature range (T
I
= 0.5mA, V
OUT
LOAD REGULATION UNDER LIGHT LOADS LOAD REGULATION
TYPICAL CHARACTERISTICS
= – 40 ° C to +125 ° C), VIN= V
= VIN, C
J
= 1.0 µ F, unless otherwise noted. Typical values are at TJ= +25 ° C.
OUT
= V
EN1
EN2
OUT(TYP)
LINE REGULATION LINE REGULATION
Figure 2. Figure 3.
+ 0.5V or 2.7V, whichever is greater;
www.ti.com
OUTPUT VOLTAGE vs DROPOUT VOLTAGE vs
TEMPERATURE OUTPUT CURRENT
6 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Figure 4. Figure 5.
Figure 6. Figure 7.
Product Folder Link(s): TPS718xx TPS719xx
200
160
120
80
40
0
0 100 200
I (mA)
OUT
I
( A)m
GND
50 150
T =+125 CJ°
T = 0 CJ-4 °
T =+85 CJ°
T =+25 CJ°
60
50
40
30
20
10
0
I
(
A)m
GND
2.5 5.5 6.5
V (V)
IN
3.5 4.5
I =1mA
OUT
-40 65 125
T ( C)
J
°
5 35-25 -10 20 50 80 95 110
140
120
100
80
60
40
20
0
I
( A)m
GND
I =0mA
OUT
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
ShutdownCurrent( A)m
T = 40 CJ- °
2.5 5.5 6.5
V (V)
IN
3.5 4.5
T =+125 CJ°
T =+85 CJ°
T =+25 CJ°
450
425
400
375
350
325
300
275
250
CurrentLimit(mA)
2.5 5.5 6.5
V (V)
IN
3.5 4.5
T =+125 C
J
T =+85 C
T =+25 C
T = 40 C
J
J
J
-
°
°
°
°
90
80
70
60
50
40
30
20
10
0
PSRR(dB)
10 100k 10M
Frequency(Hz)
1k
10k100
1M
5mA
100mA
200mA
TPS718xx
TPS719xx
www.ti.com
..................................................................................................................................................... SBVS088C – FEBRUARY 2007 – REVISED MAY 2008
Over operating temperature range (T
I
OUT
= 0.5mA, V
= V
EN1
= VIN, C
EN2
GROUND PIN CURRENT vs GROUND PIN CURRENT vs
OUTPUT CURRENT INPUT VOLTAGE
Figure 8. Figure 9.
GROUND PIN CURRENT vs SHUTDOWN CURRENT vs
TEMPERATURE (BOTH LDOs ENABLED) INPUT VOLTAGE
TYPICAL CHARACTERISTICS (continued)
= – 40 ° C to +125 ° C), V
J
= 1.0 µ F, unless otherwise noted. Typical values are at TJ= +25 ° C.
OUT
= V
IN
OUT(TYP)
+ 0.5V or 2.7V, whichever is greater;
Figure 10. Figure 11.
CURRENT LIMIT vs POWER-SUPPLY RIPPLE REJECTION vs
INPUT VOLTAGE FREQUENCY (V
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
Figure 12. Figure 13.
Product Folder Link(s): TPS718xx TPS719xx
– V
IN
= 0.5V)
OUT