Texas Instruments TPS2378EVM-602 User Manual

User's Guide
SLVUAG7A–May 2015–Revised July 2017
TPS2378EVM-602 Evaluation Module
Contents
1 Introduction ................................................................................................................... 2
2 Electrical Specifications .................................................................................................... 2
3 Description ................................................................................................................... 2
4 Schematic..................................................................................................................... 3
5 General Configuration and Description .................................................................................. 6
6 TPS2378EVM-602 Performance Data.................................................................................... 8
7 EVM Assembly Drawing and Layout Guidelines ...................................................................... 10
8 Bill of Materials ............................................................................................................. 15
List of Figures
1 TPS2378EVM-602 PD Front-End Schematic ........................................................................... 3
2 TPS2378EVM-602 Dual PD section ...................................................................................... 4
3 TPS2378EVM-602 DCDC Converter Section ........................................................................... 5
4 Typical TPS2378EVM-602 Test Setup ................................................................................... 7
5 Startup Response to 26-W Load for a 48-V Input....................................................................... 8
6 Transient Response from 290 mA to 2.9 A for a 48-V Input........................................................... 8
7 Efficiency of the TPS2378EVM-602....................................................................................... 9
8 Top Side Component Placement ........................................................................................ 10
9 Top Side Routing........................................................................................................... 10
10 Layer 2 Routing............................................................................................................. 11
11 Layer 3 Routing............................................................................................................. 11
12 Bottom Side Routing....................................................................................................... 12
13 Bottom Component Placement .......................................................................................... 12
1 TPS2378EVM-602 Electrical and Performance Specifications at 25°C.............................................. 2
2 Connector Functionality .................................................................................................... 6
3 Test Points ................................................................................................................... 6
4 TPS2378EVM-602 BOM .................................................................................................. 15
Trademarks
All trademarks are the property of their respective owners.
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List of Tables
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TPS2378EVM-602 Evaluation Module
1
Introduction
1 Introduction
The TPS2378EVM-602 allows reference circuitry evaluation of a dual TPS2378 forced four pair UPOE compliant application. It contains input and output power connectors and an array of onboard test points for circuit and evaluation.
1.1 Features
Excellent efficiency, driven, synchronous flyback design.
Forced four-pair UPOE compliant
19 V at 2.3 A DC output (2.9-A capable)
1.2 Applications
Universal power over ethernet (UPOE) compliant devices
Video and VoIP telephones
Multiband access points
Security cameras
Pico-base stations
2 Electrical Specifications
Table 1. TPS2378EVM-602 Electrical and Performance Specifications at 25°C
Parameter Condition MIN TYP MAX Unit
Power Interface
Input Voltage Applied to the power pins of connectors J1 or J3 42.5 57 Operating Voltage
Input UVLO, POE input J1
Detection voltage Classification voltage Classification current
Operating current-limit
DC/DC Converter
Output Voltage 42.5 VIN≤ 57 V, I Output Current 42.5 VIN≤ 57 V 19-V output 2.9 A Output ripple voltage, pk-to-pk VIN= 48 V, I Efficiency, dc-dc converter VIN= 48 V, I Efficiency, end- to-end VIN= 48 V, I Switching frequency 225 270 kHz
(1)
Per TPS2378 PD
(1)
(1)
(1)
(1)
(1)
(1)
(1)
After start up. 30 57 Rising input voltage 40 Falling input voltage 30 at device terminals 1.4 10.1 at device terminals 11.9 23.0 R
= 63.4 Ω 38 42
class
100 180 850 1200
I
LOAD
= 2.9 A 19-V output 225 mV
LOAD
= 2.9 A 93%
LOAD
= 2.9 A 19-V output 90%
LOAD
(max) 19-V output 19.01 19.04 19.07 V
LOAD
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V
mAInrush current-limit
3 Description
TPS2378EVM-602 enables full evaluation of a forced four pair UPOE compliant application. A detailed discussion regarding this type of high power PoE can be found in SLVA625.
The TPS23861EVM-612 contains two high power ports in which either one can be connected to the TPS2378EVM-602 with a CAT5E cable to power the EVM. This is described in Section 5.2.
2
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POE INPUT
ETHERNET DATA
42.5-57VDC
CHGND
CHGND
2 3 4
1
5 6 7 8
J3
2 3 4
1
5 6 7 8
J4
0.01µF
C26
0.01µF
C27
0.01µF
C28
0.01µF
C29
75.0
R32
75.0
R33
75.0
R34
75.0
R35
75.0
R28
75.0
R29
75.0
R30
75.0
R31
1000pF
C25
1000pF
C32
1000pF
C30
1000pF
C31
100 ohm
L3
100 ohm
L4
100 ohm
L5
100 ohm
L6
PAIR12
PAIR36
PAIR45
PAIR78
CHGND
D8 D 9
D10 D11
D12 D13
D14 D15
1
2
3
4
J8
DNP
J9
DNP
J10
DNP
~BRG1
~BRG2
+BRG1
-BRG1
+BRG2
-BRG2
TP16
TP12
TP13
TP14
TP15
VSS2
VSS1
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1:1
1:1
1:1
1:1
T3
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Schematic
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TPS2378EVM-602 Evaluation Module
4 Schematic
Figure 1. TPS2378EVM-602 PD Front-End Schematic
UPOE OUTPUT 60WMAX
T2P1+
T2P1-
T2P2+
T2P2-
PWRGND
0.1µF
C34
0.1µF
C36
24.9k
R55
24.9k
R49
63.4
R52
63.4
R44
100k
R41
100k
R56
100k
R40
100k
R48
10.0k
R39
10.0k
R38
0.01µF
C37
0.01µF
C38
BAT46W-7-F
D21
BAT46W-7-F
D22
47µF
C35
47µF
C33
4
1 2 3
J6
VDD
1
DEN
2
CLS
3
VSS4RTN
5
CDB
6
T2P
7
APD
8
PWPD
9
U3
TPS2378DDA
VDD
1
DEN
2
CLS
3
VSS4RTN
5
CDB
6
T2P
7
APD
8
PWPD
9
U4
TPS2378DDA
1
2
4
3
FOD817DS
U5
1
2
4
3
FOD817DS
U8
58V
SMAJ58A
D17
BSS123Q6BSS123
Q7
58V
SMAJ58A
D19
4
7,8
1,2,3
5,6,
FDMS86105
Q9
4
7,8
1,2,3
5,6,
FDMS86105
Q8
0
R43
DNP
BAT46W-7-F
D20
30.1k
R42
20.0k
R50
DNP
VBIAS
VBIAS
PGND
LO E6SF -ABCB-24-1-Z
D16
VOUT
PGND
LO E6SF -ABCB-24-1-Z
D18
49.9k
R46
10.0k
R47
VBIAS
VOUT
49.9k
R53
VOUT
T2P-VPU1
MMBT5550LT1G
Q5
1
2
4
3
HMHA2801A
U7
8.87k
R45
78.7k
R51
VOUT
PGNDPWRGND
5.6k 1W
R37
5.6k 1W
R36
J5
J7
VOUT
T2P-VPU2
12.1k
R57
33.2k
R58
10.0k
R54
TP18
TP17
VDD
VSS1
TP19
VSS2
RTN1
RTN2
VSS1
VSS2
SS
VDD
100
R59
DNP
VBIAS
Schematic
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TPS2378EVM-602 Evaluation Module
Figure 2. TPS2378EVM-602 Dual PD section
SPGND
19V/2.9A
PGND
PGND
PGND
PGND
PWRGND
PWRGND
PWRGND
PWRGND
PWRGND
PGND
PGND
PGND
PGND
PWRGND
PWRGND
PWRGND
PWRGND
PWRGND
PGND
0.1µF
C2
0.1µF
C6
200k
R24
10.0k
R18
10.0k
R19
10.0k
R11
0
R14
2.2µFC32.2µFC42.2µFC539k
R1
MURA120T3G
D1
2200pF
C1
4.7
R2
MMSD4148T1G
D2
MMSD4148T1G
D5
4
7,8
1,2,3
5,6,
FDMS86252
Q1
MMBT3906
Q2
MMBT3906
Q4
0.1
R4
1.00k
R5
100pF
C13
20.0
R8
BAT54S-7-F
D6
BAT54S-7-F
D7
BAT54S-7-F
D4
1µF
C11
1µF
C23
0.047µF
C21
10µFC810µFC910µF
C10
68µF
C7
J1
470pF
C12
0.47µF
C15
0.47µF
C16
47pF
C19
20.0
R7
3.83k
R17
49.9k
R23
2200pF
C17
1 4
8 5
PA0184NLT
T2
22µF
C14
4
7,8
1,2,3
5,6,
FDMS86105
Q3
7.5k
R26
PWRGND
PWRGND
121k
R9
121k
R12
1µF
C22
0.039µF
C24
VIN
1
NC
2
RTDEL
3
RON
4
ROFF
5
VREF
6
SYNC
7
GND
8
CS
9
RSLOPE10FB
11
SS/SD
12
PGND
13
AUX
14
OUT
15
PVDD
16
VDD
17
LINEUV
18
LINEOV
19
NC
20
U6
UCC2897APW
0.01µF
C18
80.6k
R16
61.9k
R20
100k
R21
1µF
C20
2.61k
R10
4.22k
R13
7.50k
R15
10
1W
R6
VBIAS
VOUT
LY E6SF- AABA-46-1-Z
D3
PGND
10.0k
R3
HMHA2801A
U1
J2
LPS4018-332MLB
L1
1
3
12
11
567
8 9
10
T1
L2
3
4
5
NC1NC
2
U2 TL431AIDBV
4
7,8
1,2,3
5,6,
Q10 CSD18504Q5A
1
2
J11
LoadDelayDisable
25.5k
R62
25.5k
R63
0.1µF
C40
2.2µF
C39
1.43k
R61
47.5k
R60
RESET
1
NC
2
CT
3
SENSE
4
VCC
8
NC
7
NC
6
GND
5
U9
TL7700CDGKR
PGND
PGND
PGND
VOUT
Optional Load Delay Circuit
0.1µF
C41
TP4
TP11
FB
PGND
TP21
SPGND
TP7
PWRGND
TP2
PWRGND
TP10
VREF
6.81k
R25
2.00k
R27
1.21M
R22
TP8
VBIAS
TP5
OUT
TP6
CS
TP3
DRAIN
TP9
LOOP
TP1
VOUT
TP20
RL_INHBT
VDD
SS
RL_INHBT
RL_INHBT
PWRGND
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Schematic
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Figure 3. TPS2378EVM-602 DCDC Converter Section
General Configuration and Description
5 General Configuration and Description
5.1 Physical Access
Table 2 lists the EVM connector functionality. Table 3 describes the test point availability, and describes
the jumper functionality.
Table 2. Connector Functionality
Connector Label Description
J1 VOUT 19-V output voltage of the DCDC converter J2 LED output ON signal J3 PWR+DATA PoE input. Connect to PSE power and data source. J4 DATA Ethernet data passthrough. Connect to downstream Ethernet device J5 T2P-VPU1 T2P Pull up voltage of PD1 J6 T2P T2P output signals for both TPS2378 PDs J7 T2P-VPU2 T2P Pull up voltage of PD2
J11 Load Delay Disable Disables load delay
Table 3. Test Points
Test Points Label Description
TP1 Output Output voltage
TP2, TP7 PWRGND Primary Ground
TP3 DRAIN Primary FET drain voltage TP4 PGND Secondary Ground TP5 OUT Primary FET gate voltage TP6 CS Current sense voltage TP8 VBIAS Aux bias voltage
TP9 LOOP AC Injector point for measuring loop response TP10 VREF Reference voltage TP11 FB Opto Feedback voltage TP12 PAIR12 Voltage on pairs 1 and 2 of the Ethernet cable TP13 PAIR36 Voltage on pairs 3 and 6 of the Ethernet cable TP14 PAIR45 Voltage on pairs 4 and 5 of the Ethernet cable TP15 PAIR78 Voltage on pairs 7 and 8 of the Ethernet cable TP16 CHGND Chassis ground TP17 VDD Chassis ground TP18 VSS1 VSS1 pin of PD1 TP19 VSS2 VSS2 pin of PD2 TP20 RL_INHBT Gate voltage of load delay FET TP21 SPGND Load ground
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TPS2378EVM-602
J3
J4
J1
PSE
Ethernet Cable
VOUT
GND
Ethernet
Device
TPS23861EVM-612
J9 or J21
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5.2 Test Setup
Figure 4 shows the typical test set for the TPS2378EVM-602 using the TPS23861EVM-612.
1. Power the TPS23861EVM-612 as described in SLUUAY8.
2. Connect J3 of the TPS2378EVM-602 to J9 or J21 of the TPS23861EVM-612 using a standard CAT5E cable.
3. Vary the load as necessary for test purposes.
General Configuration and Description
Figure 4. Typical TPS2378EVM-602 Test Setup
5.2.1 Testing the TPS2378EVM-602 without a PSE
The TPS2378EVM-602 can be evaluated without a PSE and only a power supply.
1. Set the power supply between 42.5 V – 57 V Turn off the power supply
2. Short TP15 to TP13
3. Short TP14 to TP12
4. Connect the positive lead of the power supply to TP15
5. Connect the return lead of the power supply to TP14
6. Turn on the power supply
7. Vary the input voltage and output load as necessary for test purposes
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7
2 ms/div
500 mV/div
1 A/div
50 ms/div
20 V/div
200 mA/div
TPS2378EVM-602 Performance Data
6 TPS2378EVM-602 Performance Data
6.1 Startup
Figure 5 illustrates the startup response of the TPS2378EVM-602 (Ch2-VOUT) with 26-W output load.
Ch1 and Ch4 show the input current of each TPS2378 PD when the TPS23861EVM-612 is connected to the EVM. It shows Type 2 hardware classification and subsequent inrush before starting up and sharing current.
Figure 5. Startup Response to 26-W Load for a 48-V Input
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6.2 Transient Response
Figure 6 illustrates the transient response of the TPS2378EVM-602.
Figure 6. Transient Response from 290 mA to 2.9 A for a 48-V Input
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Output Current (A)
Efficiency
0 0.5 1 1.5 2 2.5 3
0
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
D001
PoE Converter
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6.3 Efficiency
Figure 7 illustrates the efficiency of the TPS2378EVM-602.
Figure 7. Efficiency of the TPS2378EVM-602
6.4 Startup to Resistive Overload with TPS23861EVM-612
The IEEE802.3at standard requires the PD to startup with less than 13 W (per pair) for 80 ms during PSE inrush. When using the TPS2378EVM-602 EVM with the TPS23861EVM-612 for evaluation while using resistive loads, the output load must be light enough (< 1 A) at startup to meet this requirement. When the output is operational, the load can be further increased to nominal 2.3A.
For startup to higher loads (> 1 A) the TPS2378EVM-602 contains an optional load delay circuit (shown in
Figure 3) that delays connecting the resistive load while the PSE finishes inrush.
The load delay circuit is for evaluation only of the EVM using resistive loads. In final system PD designs, it is the load’s task to accommodate the PSEs inrush time.
To disable the load delay circuit, shunt J11.
TPS2378EVM-602 Performance Data
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EVM Assembly Drawing and Layout Guidelines
7 EVM Assembly Drawing and Layout Guidelines
7.1 PCB Drawings
Figure 8 to Figure 13 show component placement and layout of the TPS2378EVM-602.
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Figure 8. Top Side Component Placement
Figure 9. Top Side Routing
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space
EVM Assembly Drawing and Layout Guidelines
Figure 10. Layer 2 Routing
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Figure 11. Layer 3 Routing
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EVM Assembly Drawing and Layout Guidelines
Figure 12. Bottom Side Routing
space
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TPS2378EVM-602 Evaluation Module
Figure 13. Bottom Component Placement
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7.2 Layout Guidelines
The layout of the PoE front end should follow power and EMI/ESD best-practice guidelines. A basic set of recommendations include:
Parts placement must be driven by power flow in a point-to-point manner; RJ-45, Ethernet transformer, diode bridges, TVS and 0.1-μF capacitor, and TPS2378 converter input bulk capacitor.
Make all leads as short as possible with wide power traces and paired signal and return.
No crossovers of signals from one part of the flow to another are allowed.
Spacing consistent with safety standards like IEC60950 must be observed between the 48-V input voltage rails and between the input and an isolated converter output.
Place the TPS2378 over split, local ground planes referenced to VSS for the PoE input and to COM/RTN for the converter. Whereas the PoE side may operate without a ground plane, the converter side must have one. Do not place logic ground and power layers under the Ethernet input or the converter primary side.
Use large copper fills and traces on SMT power-dissipating devices, and use wide traces or overlay copper fills in the power path.
The DC/DC Converter layout benefits from basic rules such as:
Use large copper fills and traces on SMT power-dissipating devices, and use wide traces or overlay copper fills in the power path.
Minimize trace length of high current, power semiconductors, and magnetic components.
Where possible, use vertical pairing
Use the ground plane for the switching currents carefully.
Keep the high-current and high-voltage switching away from low-level sensing circuits including those outside the power supply.
Proper spacing around the high-voltage sections of the converter
EVM Assembly Drawing and Layout Guidelines
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EVM Assembly Drawing and Layout Guidelines
7.3 EMI Containment
Use compact loops for dv/dt and di/dt circuit paths (power loops and gate drives)
Use minimal, yet thermally adequate, copper areas for heat sinking of components tied to switching nodes (minimize exposed radiating surface).
Use copper ground planes (possible stitching) and top-layer copper floods (surround circuitry with ground floods)
Use a 4-layer PCB, if economically feasible (for better grounding)
Minimize the amount of copper area associated with input traces (to minimize radiated pickup)
Hide copper associated with switching nodes under shielded magnetics, where possible
Heat sink the quiet side of components instead of the switching side, where possible (like the output side of inductor)
Use Bob Smith terminations, Bob Smith EFT capacitor, and Bob Smith plane
Use Bob Smith plane as ground shield on input side of PCB (creating a phantom or literal earth ground)
Use LC filter at DC/DC input
Dampen high-frequency ringing on all switching nodes, if present (allow for possible snubbers)
Control rise times with gate-drive resistors and possibly snubbers
Switching frequency considerations
Use of EMI bridge capacitor across isolation boundary (isolated topologies)
Observe the polarity dot on inductors (embed noisy end)
Use of ferrite beads on input (allow for possible use of beads or 0-Ω resistors)
Maintain physical separation between input-related circuitry and power circuitry (use ferrite beads as boundary line)
Balance efficiency versus acceptable noise margin
Possible use of common-mode inductors
Possible use of integrated RJ-45 jacks (shielded with internal transformer and Bob Smith terminations)
End-product enclosure considerations (shielding)
countless
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Bill of Materials
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8 Bill of Materials
Table 4. TPS2378EVM-602 BOM
Designator Quantity Value Description Package Reference Part Number Manufacturer
C1, C17 2 2200pF CAP, CERM, 2200pF, 2000V, +/-10%, X7R, 1812 1812 C4532X7R3D222K TDK
C2, C6, C34, C36 4 0.1uF CAP, CERM, 0.1uF, 100V, +/-10%, X7R, 0805 0805 C0805C104K1RACTU Kemet
C3 1 CAP, CERM, 2.2uF, 100V, +/-10%, X7R, 1210 1210 HMK325B7225KN-T Taiyo Yuden
C4, C5 2 2.2uF CAP, CERM, 2.2uF, 100V, +/-10%, X7R, 1210 1210 HMK325B7225KN-T Taiyo Yuden
C7 1 68uF CAP, AL, 68uF, 25V, +/-20%, 0.36 ohm, SMD SMT Radial D EEE-FK1E680P Panasonic
C8, C9, C10 3 10uF CAP, CERM, 10uF, 25V, +/-20%, X5R, 1210 1210 C3225X5R1E106K TDK
C11, C22, C23 3 1uF CAP, CERM, 1uF, 25V, +/-10%, X5R, 0805 0805 08053D105KAT2A AVX
C12 1 470pF CAP, CERM, 470pF, 100V, +/-5%, X7R, 0603 0603 06031C471JAT2A AVX C13 1 100pF CAP, CERM, 100pF, 50V, +/-5%, C0G/NP0, 0603 0603 C1608C0G1H101J TDK C14 1 22uF CAP, AL, 22uF, 25V, +/-20%, 0.7 ohm, SMD SMTRadial C EEE-FK1E220R Panasonic
C15, C16 2 0.47uF CAP, CERM, 0.47uF, 16V, +/-10%, X7R, 0603 0603 C0603C474K4RACTU Kemet
C18 1 0.01uF CAP, CERM, 0.01uF, 50V, +/-5%, X7R, 0603 0603 C0603C103J5RACTU Kemet C19 1 47pF CAP, CERM, 47pF, 50V, +/-5%, C0G/NP0, 0603 0603 06035A470JAT2A AVX C20 1 1uF CAP, CERM, 1uF, 16V, +/-10%, X5R, 0603 0603 C0603C105K4PACTU Kemet C21 1 0.047uF CAP, CERM, 0.047 µF, 50 V, +/- 10%, X7R, 0603 0603 GRM188R71H473KA61D Murata C24 1 0.039uF CAP, CERM, 0.039 µF, 25 V, +/- 10%, X7R, 0603 0603 06033C393KAT2A AVX
C25, C32 2 1000pF CAP, CERM, 1000pF, 2000V, +/-10%, X7R, 1210 1210 C1210C102KGRACTU Kemet
C26, C27, C28, C29, C37,
C38
6 0.01uF CAP, CERM, 0.01uF, 100V, +/-10%, X7R, 0603 0603 06031C103KAT2A AVX
C30, C31 2 1000pF CAP, CERM, 1000pF, 100V, +/-10%, X7R, 0603 0603 06031C102KAT2A AVX C33, C35 2 47uF CAP, AL, 47uF, 63V, +/-20%, 0.65 ohm, SMD SMT Radial F EEE-FK1J470P Panasonic
C39 1 2.2uF CAP, CERM, 2.2 µF, 50 V, +/- 10%, X5R, 0805 0805 C2012X5R1H225K125AB TDK
C40, C41 2 0.1uF CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0603 0603 06035C104KAT2A AVX
D1 1 200V Diode, Ultrafast, 200V, 1A, SMA SMA MURA120T3G ON Semiconductor
D2, D5 2 100V Diode, Switching, 100V, 0.2A, SOD-123 SOD-123 MMSD4148T1G ON Semiconductor
D3 1 Yellow LED, Yellow, SMD Power TOPLED LY E6SF-AABA-46-1-Z OSRAM
D4, D6, D7 3 30V Diode, Schottky, 30V, 0.2A, SOT-23 SOT-23 BAT54S-7-F Diodes Inc.
D8, D9, D10, D11, D12,
D13, D14, D15
8 100V Diode, Schottky, 100V, 3A, SMC SMC B3100-13-F Diodes Inc.
D16 1 LED, Orange, SMD Power TOPLED LO E6SF-ABCB-24-1-Z OSRAM
D17, D19 2 58V Diode, TVS, Uni, 58V, 400W, SMA SMA SMAJ58A Diodes Inc.
D18 1 Orange LED, Orange, SMD Power TOPLED LO E6SF-ABCB-24-1-Z OSRAM D20 1 Diode, Schottky, 100V, 0.15A, SOD-123 SOD-123 BAT46W-7-F Diodes Inc.
D21, D22 2 100V Diode, Schottky, 100V, 0.15A, SOD-123 SOD-123 BAT46W-7-F Diodes Inc.
H1, H2, H3, H4 4 Bumpon, Hemisphere, 0.375 X 0.235, Black Black Bumpon SJ61A2 3M
Bill of Materials
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TPS2378EVM-602 Evaluation Module
Table 4. TPS2378EVM-602 BOM (continued)
Designator Quantity Value Description Package Reference Part Number Manufacturer
J1 1 Terminal Block, 6A, 3.5mm Pitch, 2-Pos, TH 7.0x8.2x6.5mm ED555/2DS On-Shore Technology
J2, J5, J7, J11 4 Header, 100mil, 2x1, Gold plated, TH Header,2x1, 100mil 5-146261-1 TE Connectivity
J3, J4 2 RJ-45, Right Angle, No LED, tab up RJ-45 Jack 1-406541-1 AMP
J6 1
Header, TH, 100mil, 4x1, Gold plated, 230 mil above insulator
4x1 Header TSW-104-07-G-S Samtec
L1 1 3.3uH
Inductor, Shielded Drum Core, Ferrite, 3.3uH, 1.9A,
0.08 ohm, SMD
LPS4018 LPS4018-332MLB Coilcraft
L2 1 400nH
Inductor, Shielded, Composite, 400nH, 12.5A, 0.01 ohm, SMD
4x2.1x4mm XAL4020-401MEB Coilcraft
L3, L4, L5, L6 4 100 ohm 4A Ferrite Bead, 100 ohm @ 100MHz, SMD 0805 MPZ2012S101A Murata
Q1 1 150V MOSFET, N-CH, 150V, 4.6A, PQFN08A PQFN08A FDMS86252 Fairchild Semiconductor
Q2, Q4 2 0.25V Transistor, PNP, 40V, 0.2A, SOT-23 SOT-23 MMBT3906 Fairchild Semiconductor
Q3, Q8, Q9 3 100V MOSFET, N-CH, 100V, 26A, PowerPAK SO-8 PowerPAK SO-8 FDMS86105 Fairchild Semiconductor
Q5 1 0.25V Transistor, NPN, 140V, 0.6A, SOT-23 SOT-23 MMBT5550LT1G ON Semiconductor
Q6, Q7 2 100V MOSFET, N-CH, 100V, 0.17A, SOT-23 SOT-23 BSS123 Fairchild Semiconductor
Q10 1 40V MOSFET, N-CH, 40 V, 15 A, SON 5x6mm SON 5x6mm CSD18504Q5A Texas Instruments
R1 1 39k RES, 39k ohm, 5%, 0.25W, 1206 1206 CRCW120639K0JNEA Vishay-Dale R2 1 4.7 RES, 4.7 ohm, 5%, 0.1W, 0603 0603 CRCW06034R70JNEA Vishay-Dale
R3, R47, R54 3 10.0k RES, 10.0 k, 1%, 0.1 W, 0603 0603 CRCW060310K0FKEA Vishay-Dale
R4 1 0.1 RES, 0.1, 1%, 2 W, 2512 2512 CSRN2512FKR100 Stackpole Electronics Inc R5 1 1.00k RES, 1.00k ohm, 1%, 0.1W, 0603 0603 CRCW06031K00FKEA Vishay-Dale R6 1 10 RES, 10 ohm, 5%, 1W, 2512 2512 ERJ-1TYJ100U Panasonic R7 1 20.0 RES, 20.0 ohm, 1%, 0.1W, 0603 0603 CRCW060320R0FKEA Vishay-Dale R8 1 20.0 RES, 20.0 ohm, 1%, 0.125W, 0805 0805 CRCW080520R0FKEA Vishay-Dale
R9, R12 2 121k RES, 121k ohm, 1%, 0.1W, 0603 0603 CRCW0603121KFKEA Vishay-Dale
R10 1 2.61k RES, 2.61k ohm, 1%, 0.1W, 0603 0603 CRCW06032K61FKEA Vishay-Dale
R11, R18, R19, R38, R39 5 10.0k RES, 10.0k ohm, 1%, 0.1W, 0603 0603 CRCW060310K0FKEA Vishay-Dale
R13 1 4.22k RES, 4.22k ohm, 1%, 0.1W, 0603 0603 CRCW06034K22FKEA Vishay-Dale R14 1 0 RES, 0 ohm, 5%, 0.1W, 0603 0603 CRCW06030000Z0EA Vishay-Dale R15 1 7.50k RES, 7.50k ohm, 1%, 0.1W, 0603 0603 ERJ-3EKF7501V Panasonic R16 1 80.6k RES, 80.6k ohm, 1%, 0.1W, 0603 0603 CRCW060380K6FKEA Vishay-Dale R17 1 3.83k RES, 3.83k ohm, 1%, 0.1W, 0603 0603 CRCW06033K83FKEA Vishay-Dale R20 1 61.9k RES, 61.9k ohm, 1%, 0.1W, 0603 0603 CRCW060361K9FKEA Vishay-Dale
R21, R40, R41, R48, R56 5 100k RES, 100k ohm, 1%, 0.1W, 0603 0603 CRCW0603100KFKEA Vishay-Dale
R22 1 1.21Meg RES, 1.21 M, 1%, 0.1 W, 0603 0603 CRCW06031M21FKEA Vishay-Dale R23 1 49.9k RES, 49.9k ohm, 1%, 0.1W, 0603 0603 CRCW060349K9FKEA Vishay-Dale R24 1 200k RES, 200 k, 1%, 0.1 W, 0603 0603 CRCW0603200KFKEA Vishay-Dale R25 1 6.81k RES, 6.81 k, 1%, 0.1 W, 0603 0603 CRCW06036K81FKEA Vishay-Dale
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Bill of Materials
17
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TPS2378EVM-602 Evaluation Module
Table 4. TPS2378EVM-602 BOM (continued)
Designator Quantity Value Description Package Reference Part Number Manufacturer
R26 1 7.5k RES, 7.5k ohm, 5%, 0.1W, 0603 0603 CRCW06037K50JNEA Vishay-Dale R27 1 2.00k RES, 2.00 k, 1%, 0.1 W, 0603 0603 CRCW06032K00FKEA Vishay-Dale
R28, R29, R30, R31, R32,
R33, R34, R35
8 75.0 RES, 75.0 ohm, 1%, 0.1W, 0603 0603 CRCW060375R0FKEA Vishay-Dale
R36, R37 2 5.6k RES, 5.6k ohm, 5%, 1W, 2512 2512 ERJ-1TYJ562U Panasonic
R42 1 30.1k RES, 30.1k ohm, 1%, 0.1W, 0603 0603 CRCW060330K1FKEA Vishay-Dale
R44, R52 2 63.4 RES, 63.4 ohm, 1%, 0.125W, 0805 0805 CRCW080563R4FKEA Vishay-Dale
R45 1 8.87k RES, 8.87k ohm, 1%, 0.1W, 0603 0603 CRCW06038K87FKEA Vishay-Dale R46, R53 2 49.9k RES, 49.9 k, 1%, 0.1 W, 0603 0603 CRCW060349K9FKEA Vishay-Dale R49, R55 2 24.9k RES, 24.9k ohm, 1%, 0.1W, 0603 0603 CRCW060324K9FKEA Vishay-Dale
R51 1 78.7k RES, 78.7k ohm, 1%, 0.125W, 0805 0805 ERJ-6ENF7872V Panasonic
R57 1 12.1k RES, 12.1 k, 1%, 0.1 W, 0603 0603 CRCW060312K1FKEA Vishay-Dale
R58 1 33.2k RES, 33.2 k, 1%, 0.1 W, 0603 0603 CRCW060333K2FKEA Vishay-Dale
R60 1 47.5k RES, 47.5 k, 1%, 0.1 W, 0603 0603 CRCW060347K5FKEA Vishay-Dale
R61 1 1.43k RES, 1.43 k, 1%, 0.1 W, 0603 0603 CRCW06031K43FKEA Vishay-Dale R62, R63 2 25.5k RES, 25.5 k, 1%, 0.1 W, 0603 0603 CRCW060325K5FKEA Vishay-Dale
SH-J1, SH-J2, SH-J3, SH-J4 4 1x2 Shunt, 100mil, Gold plated, Black Shunt 969102-0000-DA 3M
T1 1 62uH Transformer, 62uH, SMT 26.4x13.7x32mm 750315775 Wurth Elektronik T2 1 1.2mH Transformer, Gate Drive, 1.2mH, SMT 9.02x7.62x8.64mm PA0184NLT PulseEngineering T3 1 350uH TRANSFORMER/CMC MOD, GIGABIT POE+, SMT 12.2X6.6X18.16 mm H6096NL Pulse Engineering
TP1, TP3, TP5, TP6, TP8,
TP9, TP10, TP11, TP12,
TP13, TP14, TP15, TP17,
TP20
14 SMT Test Point, Miniature, SMT Testpoint_Keystone_Miniature 5015 Keystone
TP2, TP4, TP7, TP16, TP18,
TP19
6 Test Point, Miniature, SMT Test Point, Miniature, SMT 5019 Keystone
U1, U7 2 Optocoupler, 3.75kV RMS, SMT Mini Flat Package HMHA2801A Fairchild Semiconductor
U2 1
PRECISION PROGRAMMABLE REFERENCE, DBV0005A
DBV0005A TL431AIDBV Texas Instruments
U3, U4 2
IEEE 802.3at PoE High-Power PD Interface, DDA0008E
DDA0008E TPS2378DDA Texas Instruments
U5, U8 2 Optocoupler, 5kV RMS, SMT DIP-4L Gullwing FOD817DS Fairchild Semiconductor
U6 1
Advanced Active Clamp PWM Controller with Current Control, -40 to +125 degC, 20-pin TSSOP (PW), Green (RoHS & no Sb/Br)
PW0020A UCC2897APW Texas Instruments
U9 1 SUPPLY-VOLTAGE SUPERVISOR, DGK0008A DGK0008A TL7700CDGKR Texas Instruments
FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy or mount. Fiducial N/A N/A
J8 0 Receptacle, 100mil, 4x1, TH 4x1 Receptacle 76308-204LF FCI
J9, J10 0 Receptacle 100mil 2x1, Tin, TH Receptacle, 2x1, 100mil, Tin PPTC021LFBN-RC Sullins Connector Solutions
R43 0 0 RES, 0 ohm, 5%, 0.1W, 0603 0603 CRCW06030000Z0EA Vishay-Dale
Bill of Materials
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18
SLVUAG7A–May 2015 –Revised July 2017
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TPS2378EVM-602 Evaluation Module
Table 4. TPS2378EVM-602 BOM (continued)
Designator Quantity Value Description Package Reference Part Number Manufacturer
R50 0 20.0k RES, 20.0k ohm, 1%, 0.1W, 0603 0603 CRCW060320K0FKEA Vishay-Dale
R59 0 100 RES, 100, 1%, 0.1 W, 0603 0603 CRCW0603100RFKEA Vishay-Dale
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Revision History
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (May 2015) to A Revision ........................................................................................................... Page
Changed T1 transformer in the BOM from PA4036NL (Pulse Engineering), to 750315775 (Wurth Elektronik). ........... 15
SLVUAG7A–May 2015–Revised July 2017
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Revision History
19
STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system.
2 Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM. User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10) business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period.
3 Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs (which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18328日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures.
4 EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free.
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications (and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your non­compliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services. These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
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