Texas Instruments TMDS 351 INSTALLATION INSTRUCTIONS

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DigitalTV
DVDPlayer
Game
Console
TMDS351
3-to-1
PHY SX
2.5 Gbps 3-TO-1 DVI/HDMI SWITCH
TMDS351
SLLS840 – MAY 2007

FEATURES

Compatible with HDMI 1.3a
Supports 2.5 Gbps Signaling Rate for 480i/p,
HBM ESD Protection Exceeds 8 kV to TMDS
Inputs
3.3-V Fixed Supply to TMDS I/Os
720i/p, and 1080i/p Resolutions up to 12-Bit 5-V Fixed Supply to HPD, DDC, and Source Color Depth Selection Circuits
Integrated Receiver Termination 64-Pin TQFP Package
Selectable Receiver Equalization to ROHS Compatible and 260 ° C Reflow Rated
Accommodate to Different Input Cable Lengths
Intra-Pair Skew < 40 ps
Inter-Pair Skew < 65 ps

APPLICATIONS

Digital TV
Digital Projector

DESCRIPTION

The TMDS351 is a 3-port digital video interface (DVI) or high-definition multimedia interface (HDMI) switch that allows up to 3 DVI or HDMI ports to be switched to a single display terminal. Four TMDS channels, one hot plug detector, and a digital display control (DDC) interface are supported on each port. Each TMDS channel supports signaling rates up to 2.5 Gbps to allow 1080p resolution in 12-bit color depth.
When S1 is high and S2 is low, all input terminations are disconnected, TMDS inputs are high impedance with standard TMDS terminations, all internal MOSFETs are turned off to disable the DDC links, and all HPD outputs are connected to the HPD_SINK. This allows the initiation of the HDMI physical address discovery process.
Termination resistors (50- ), pulled up to V are not required. A precision resistor is connected externally from the VSADJ pin to ground for setting the differential output voltage to be compliant with the TMDS standard.
The TMDS351 provides two levels of receiver input equalization for different ranges of cable lengths. Each TMDS receiver owns frequency responsive equalization circuits. When EQ sets low, the receiver supports the input connection in short range HDMI cables. When EQ sets high, the receiver supports the input connection in long range HDMI cables. The TMDS351 supports power saving operation. When a system is under standby mode and there is no digital audio/visual content from a connected source, the 3.3-V supply voltage, V be powered off to minimize power consumption from the TMDS inputs, outputs, and internal switching circuits. The HPD, DDC, and source selection circuits are powered up by the 5-V supply voltage, V system hot plug detect response, the DDC link from the selected source to the sink under system standby operation. The device is characterized for operation from 0 ° C to 70 ° C.
, are integrated at each TMDS receiver input. External terminations
CC
, to maintain the
DD
CC
, can
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Typical Application
Copyright © 2007, Texas Instruments Incorporated
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SCL_SINK SDA_SINK
HPD_SINK
S1
S2
.
.
.
.
.
.
.
.
.
Control
Logic
Y4
Z4
VSADJ
TMDS Driver
TMDS Driver
TMDS Driver
TMDS Driver
EQ
V
DD
Vcc
R
INT
TMDS
Rx
R
INT
Vcc
R
INT
TMDS
Rx
R
INT
Vcc
R
INT
TMDS
Rx
R
INT
Vcc
R
INT
TMDS
Rx
R
INT
Vcc
R
INT
TMDS
Rx
R
INT
Vcc
R
INT
TMDS
Rx
R
INT
Vcc
R
INT
TMDS
Rx
R
INT
Vcc
R
INT
TMDS
Rx
R
INT
Vc c
R INT
TMDS
Rx
R INT
Vc c
R INT
TMDS
Rx
R INT
Vc c
R INT
TMDS
Rx
R INT
Vc c
R INT
TMDS
Rx
R INT
B11
A1 1
B12
A12
B13
A13
B14
A14
A24
B24
A23
B23
A22
B22
A21
B21
A34
B34
A33
B33
A32
B32
A31
B31
HPD1
HPD2
HPD3
SCL1
SDA1
SCL2
SDA2
SCL3
SDA3
Y3
Z3
Y1
Z1
Y2
Z2
HPD/DDC
PowerSupply
TMDS351
SLLS840 – MAY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
FUNCTIONAL BLOCK DIAGRAM
2
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1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TMDS351
64-pin TQFP
SDA3
SCL3
GND
B31 A31
Vcc B32 A32
GND
B33 A33
Vcc B34 A34
GND
VSADJ
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Y4
Z4
Vcc
Y3
Z3
GND
Y2
Z2
Vcc
Y1
Z1
GND
SCL_SINK
SDA_SINK
HPD_SINK
S1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
A14 B14 Vcc A13 B13 GND A12 B12 Vcc A11 B11 SCL1 SDA1 HPD1 EQ S2
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
HPD3
A24
B24
Vcc
A23
B23
GND
A22
B22
Vcc
A21
B21
SCL2
SDA2
HPD2
VDD
TMDS351
SLLS840 – MAY 2007
PFC PACKAGE
(TOP VIEW)
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TMDS351
SLLS840 – MAY 2007
TERMINAL FUNCTIONS
TERMINAL
NAME NO.
A11, A12, A13, A14 39, 42, 45, 48 I Source port 1 TMDS positive inputs A21, A22, A23, A24 54, 57, 60, 63 I Source port 2 TMDS positive inputs A31, A32, A33, A34 5, 8, 11, 14 I Source port 3 TMDS positive inputs B11, B12, B13, B14 38, 41, 44, 47 I Source port 1 TMDS negative inputs B21, B22, B23, B24 53, 56, 59, 62 I Source port 2 TMDS negative inputs B31, B32, B33, B34 4, 7, 10, 13 I Source port 3 TMDS negative inputs
GND Ground
EQ 34 I EQ = Low HDMI 1.3 compliant cable
HPD1 35 O Source port 1 hot plug detector output (status pin) HPD2 50 O Source port 2 hot plug detector output (status pin) HPD3 64 O Source port 3 hot plug detector output (status pin) HPD_SINK 31 I Sink port hot plug detector input (status pin) SCL1 37 I/O Source port 1 DDC I2C clock line SCL2 52 I/O Source port 2 DDC I2C clock line SCL3 2 I/O Source port 3 DDC I2C clock line SCL_SINK 29 I/O Sink port DDC I2C clock line SDA1 36 I/O Source port 1 DDC I2C data line SDA2 51 I/O Source port 2 DDC I2C data line SDA3 1 I/O Source port 3 DDC I2C data line SDA_SINK 30 I/O Sink port DDC I2C data line S1, S2 32. 33 I Source selector
V
CC
V
DD
VSADJ 16 I TMDS compliant voltage swing control (control pin) Y1, Y2, Y3, Y4 26,23,20,17 O Sink port TMDS positive outputs Z1, Z2, Z3, Z4 27,24,21,18 O Sink port TMDS negative outputs
3, 9, 15, 22, 28,
43, 58
6, 12, 19, 25, 40,
46, 55, 61
49 HPD/DDC Power supply
I/O DESCRIPTION
TMDS Input equalization selector (control pin) EQ = High 10m 28 AWG HDMI cable
Power supply
4
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Table 1. Source Selection Lookup
CONTROL PINS I/O SELECTED HOT PLUG DETECT STATUS S1 S2 Y/Z HPD1 HPD2 HPD3
A1/B1 SCL1
H H HPD_SINK L L
H L L HPD_SINK L
L L L L HPD_SINK
L H None (Z) None (Z) HPD_SINK HPD_SINK HPD_SINK
(1) H: Logic high; L: Logic low; X: Don't care; Z: High impedance
Terminations of A2/B2 SDA1
and A3/B3 are
disconnected
A2/B2 SCL2
Terminations of A1/B1 SDA2
and A3/B3 are
disconnected
A3/B3 SCL3
Terminations of A1/B1 SDA3
and A2/B2 are
disconnected
All terminations are Are pulled HIGH by
disconnected external pull-up
SCL_SINK
SDA_SINK
termination
(1)
TMDS351
SLLS840 – MAY 2007
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TMDSInputStage
A B
V
CC
50 W
Z
TMDSOutputStage
Y
10mA
StatusandSourceSelector
HPD_SINK
S1 S2
V
DD
ControlInputStage
EQ
V
CC
SCL/SCA
Source
DDCpassgate
HPDoutputstage
HPD1 HPD2 HPD3
V
DD
50 W
V
DD
SCL/SCA
Sink
V
CC
TMDS351
SLLS840 – MAY 2007

EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS

6
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TMDS351
SLLS840 – MAY 2007
ORDERING INFORMATION
PART NUMBER PART MARKING PACKAGE
TMDS351PAG TMDS351 64-PIN TQFP
TMDS351PAGR TMDS351 64-PIN TQFP Tape/Reel
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)
Supply voltage V
(2)
range
Voltage range Ym, Zm, VSADJ, EQ –0.5V to 4 V
Electrostatic discharge
Continuous power dissipation
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. (3) n = 1, 2, 3; m = 1, 2, 3, 4 (4) Tested in accordance with JEDEC Standard 22, Test Method A114-B (5) Tested in accordance with JEDEC Standard 22, Test Method C101-A (6) Tested in accordance with JEDEC Standard 22, Test Method A115-A
CC
V
DD
(3)
Anm
, Bnm 2.5 V to 4 V
SCLn, SCL_SINK, SDAn, SDA_SINK, HPDn, HPD_SINK, S1, S2 –0.5 V to 6 V
Human body model
Charged-device model Machine model
(4)
(5)
(all pins) ± 1500 V
(6)
(all pins) ± 200 V
(1)
Anm, Bnm ± 8000 V All pins ± 4000 V
(1)
UNIT
–0.5 V to 4 V –0.5 V to 6 V
See Dissipation Rating
Table

DISSIPATION RATINGS

PACKAGE TA≤ 25 ° C
64-TQFP PAG
PCB JEDEC DERATING FACTOR STANDARD ABOVE TA= 25 ° C POWER RATING
Low-K 1111 mW 11.19 mW/ ° C 611 mW
High-K 1492 mW 14.92 820 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
(1)

THERMAL CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX
R
Junction-to-board thermal
θ JB
resistance
R
Junction- to-case thermal
θ JC
resistance
P
Device power dissipation Am/Bm(2:4) = 2.5-Gbps HDMI data pattern, 590 750 mW
D
Am/Bm(1) = 250-MHz clock
(1) The maximum rating is simulation under 3.6-V VCC, 5.5-V VDD, and 600 mV VID.
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VIH= VCC, VIL= V
- 0.6 V, RT= 50 , AV
CC
= 3.3V,
CC
TA= 70 ° C
(1)
33.4 ° C/W
15.6 ° C/W
UNIT
7
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TMDS351
SLLS840 – MAY 2007

RECOMMENDED OPERATING CONDITIONS

V
CC
V
DD
T
A
TMDS DIFFERENTIAL PINS
V
IC
V
ID
R
VSADJ
AV
CC
R
T
CONTROL PINS
V
IH
V
IL
DDC I/O PINS
V
I(DDC)
STATUS and SOURCE SELECTOR PINS
V
IH
V
IL
Supply voltage 3 3.3 3.6 V Standby supply voltage 4.5 5 5.5 V Operating free-air temperature 0 70 ° C
Input common mode voltage VCC–0.4 VCC+0.01 V Receiver peak-to-peak differential input voltage 150 1560 mVp-p Resistor for TMDS compliant voltage swing range 3.66 4.02 4.47 k TMDS output termination voltage, see Figure 1 3 3.3 3.6 V Termination resistance, see Figure 1 45 50 55 Signaling rate 0 2.5 Gbps
LVTTL High-level input voltage 2 V LVTTL Low-level input voltage GND 0.8 V
DDC Input voltage GND V
LVTTL High-level input voltage 2 V LVTTL Low-level input voltage GND 0.8 V
MIN NOM MAX UNIT
V
CC
V
DD
V
DD

ELECTRICAL CHARACTERISTICS

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
VIH= VCC, VIL= VCC– 0.6 V, S1/S2 = RT= 50 , AV
I
CC
I
DD
Supply current mA
Power supply current, 5-V 2 5 mA
TMDS DIFFERENTIAL PINS
V
OH
V
OL
V
swing
V
OD(O)
V
OD(U)
V I
(OS)
V
I(open)
R
Single-ended high-level output voltage AV Single-ended low-level output voltage AV Single-ended output swing voltage 400 600 mV Overshoot of output differential voltage 15% 2 × V Undershoot of output differential voltage 25% 2 × V Change in steady-state common-mode
OC(SS)
output voltage between logic states Short circuit output current See Figure 3 -12 12 mA Single-ended input voltage under high
impedance input or open input Input termination resistance VIN= 2.9 V 45 50 55
INT
CONTROL PINS
I
IH
I
IL
High-level digital input current Low-level digital input current
DDC I/O PINS
I
lkg
C
Input leakage current VI= 0.1 VDDto 0.9 VDDto isolated DDC inputs -10 10 µA Input/output capacitance V
IO
(2)
(2)
Am/Bm(2:4) = 2.5 Gbps HDMI data Low/High, pattern High/High Am/Bm(1) = 250 MHz clock
VIH= VCC, VIL= VCC– 0.6 V, RT= 50 , AV Am/Bm(2:4) = 2.5 Gbps HDMI data pattern Am/Bm(1) = 250 MHz clock
See Figure 2 , AV RT= 50
II= 10 µA VCC–10 VCC+10 mV
VIH= 2 V or V VIL= GND or 0.8 V -10 10 µA
= 1 V, 100 kHz 10 pF
I(pp)
= 3.3 V Low/Low,
CC
= 3.3 V
CC
= 3.3 V,
CC
CC
S1/S2 = High/Low
(1)
176 200
8 20
–10 AV
CC
–600 AV
CC
CC
-10 10 µA
MAX UNIT
+10 mV
CC
–400 mV
swing swing
5 mV
(1) All typical values are at 25 ° C and with a 3.3-V supply. (2) IIHand IILspecifications are not applicable to the VSADJ pin.
8
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