Texas Instruments TMC57253DSB-X, TMC57253DSB Datasheet
TMC57253
DRIVER
SOCS040A – MARCH 1994 – REVISED NOVEMBER 1994
Copyright 1994, Texas Instruments Incorporated
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
• TTL-Compatible Inputs
• CCD-Compatible Outputs
• Adjustable Clock Levels
• High-Speed Clear
• Serial-Gate Midlevel for CDS Operation
• Solid-State Reliability
description
The TMC57253 is a monolithic CMOS integrated
circuit designed to drive image-area gates (IAG1,
IAG2), antiblooming gate (ABG), storage-area
gate (SAG), and serial-register gate (SRG) of the
Texas Instruments (TI) TC255 CCD image
sensor. The TMC57253 interfaces the CCD image
sensor to the TI TMC57751 ASIC or user-defined
timing generator; it receives TTL-input signals
from the timing generator and outputs levelshifted signals to the image sensor.
ABOUT follows ABIN and ABMIN and switches
between V
ABL
, VAB, and V
ABM
. IA1OUT and
IA2OUT follow IA1IN and IA2IN, respectively , and
switch between GND and V
IA
. The SAOUT output
follows the SAIN and switches GND and V
S
.
SROUT follows SRIN and SRMIN and switches
between GND, V
SM
, and VS.
The TMC57253 is available in a 24-pin HSOP-B
surface-mount package and is characterized for
operation from –20°C to 45°C.
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,
Method 3015; however, it is advised that precautions be taken to avoid application of any voltage higher than maximum-rated voltages
to these high-impedance circuits. During storage or handling, the device leads should be shorted together or the device should be
placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level, preferably either V
CC
or ground. Specific guidelines for handling devices of this type are contained in the publication
Guidelines for Handling
Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies
available from Texas Instruments.
HSOP TYPE-B
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
V
AB
V
CC
GND
EN
ABIN
ABMIN
IA1IN
IA2IN
SAIN
SRIN
SRMIN
GND
V
ABM
ABOUT
V
ABL
GND
IA1OUT
V
IA
IA2OUT
GND
SAOUT
V
S
SROUT
V
SM
7
8
9
4
5
6
24
10
11
13
ABOUT
23
IA1OU
T
20
IA2OU
T
18
SAOUT
16
SROUT
14
Φ
TTL/CCD
EN
ABIN
ABMIN
V
ABM
SRIN
SRMIN
V
SM
IA1IN
IA2IN
SAIN
logic symbol
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
TI is a trademark of Texas Instruments Incorporated.
TMC57253
DRIVER
SOCS040A – MARCH 1994 – REVISED NOVEMBER 1994
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Terminal Functions
TERMINAL
NAME NO.
I/O
DESCRIPTION
ABIN 5 I Antiblooming input
ABMIN 6 I Antiblooming midlevel input
ABOUT 23 O Antiblooming output
EN 4 I Enable control input
GND
3, 12, 17,
21
Ground
IA1IN 7 I Image area 1 input
IA1OUT 20 O Image area 1 output
IA2IN 8 I Image area 2 input
IA2OUT 18 O Image area 2 output
SAIN 9 I Storage area input
SAOUT 16 O Storage area output
SRIN 10 I Serial register input
SRMIN 11 I Serial register mid input
SROUT 14 O Serial register output
V
AB
1 High-level antiblooming supply voltage
V
ABL
22 Low-level antiblooming supply voltage
V
ABM
24 Midlevel antiblooming supply voltage
V
CC
2 Supply voltage
V
IA
19 Image supply voltage
V
S
15 Serial and storage-gate supply voltage
V
SM
13 Midlevel serial-gate supply voltage
TMC57253
DRIVER
SOCS040A – MARCH 1994 – REVISED NOVEMBER 1994
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
functional block diagram
Level
Shift
Level
Shift
Level
Shift
Level
Shift
Level
Shift
Level
Shift
Level
Shift
HV_BUF
and
Driver
HV_BUF
and
Driver
HV_BUF
and
Driver
HV_BUF
and
Driver
HV_BUF
and
Driver
Logic
4
2
1
5
6
7
8
9
10
11
22
23
24
20
19
18
16
15
14
13
V
ABM
ABOUT
V
ABL
IA1OUT
V
IA
IA2OUT
SAOUT
V
S
SROUT
V
SM
V
AB
V
CC
EN
ABIN
ABMIN
IA1IN
IA2IN
SAIN
SRIN
SRMIN
TMC57253
DRIVER
SOCS040A – MARCH 1994 – REVISED NOVEMBER 1994
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
†
Supply voltage range, V
CC
(see Note 1) 0 V to 20 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation at (or below) T
A
= 25°C:
Unmounted device (see Figure 1) 1990 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mounted device (see Figure 1) 2754 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, T
A
–20°C to 45°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
STG
–55°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature: 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1,6 mm (1/16 inch) from case for 3 seconds 350°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltages are with respect to GND.
01020304050605 152535455565
3000
2800
2600
2400
2200
2000
1800
1600
1400
1200
1000
TA– Free-Air Temperature–°C
P
D
– Power Dissipation – mW
70 75
Unmounted Device
Mounted Device
(see Note A)
POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
NOTE A: The mounted-device derating curve of Figure 1 is obtained under the following conditions:
The board is 50 mm by 50 mm by 1.6 mm thick.
The board material is glass epoxy.
The copper thickness of all the etch runs is 35 microns.
Etch-run dimensions – All twenty etch runs are 0.4 mm by 22 mm.
Each chip is soldered to the board.
An aluminum cooling fin 10 mm by 10 mm by 1 mm thick is coupled to the chip with thermal paste.
Figure 1
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