TEXAS INSTRUMENTS TLV571 Technical data

TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT,
PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
features
Fast Throughput Rate: 1.25 MSPS at 5 V,
625 KSPS at 3 V
Wide Analog Input: 0 V to AV
Differential Nonlinearity Error: < ± 0.5 LSB
Integral Nonlinearity Error: < ± 0.5 LSB
Single 2.7-V to 5.5-V Supply Operation
Low Power: 12 mW at 3 V and 35 mW at 5 V
Auto Power Down of 1 mA Max
Software Power Down: 10 µA Max
Internal OSC
Hardware Configurable
DSP and Microcontroller Compatible
DD
Parallel Interface
Binary/Twos Complement Output
Hardware Controlled Extended Sampling
Hardware or Software Start of Conversion
description
The TLV571 is an 8-bit data acquisition system
applications
Mass Storage and HDD
Automotive
Digital Servos
Process Control
General-Purpose DSP
Image Sensor Processing
DW OR PW PACKAGE
(TOP VIEW)
CS
WR
RD
CLK
DGND
DV
DD
INT/EOC
DGND DGND
D0 D1 D2
NC – No internal connection
1 2 3 4 5 6 7 8 9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
NC AIN AV AGND REFM REFP CSTART A1/D7 A0/D6 D5 D4 D3
that combines a high-speed 8-bit ADC and a parallel interface. The device contains two on-chip control registers allowing control of software conversion start and power down via the bidirectional parallel port. The control registers can be set to a default mode using a dummy RD
while WR is tied low allowing the registers to be hardware configurable.
DD
The TL V571 operates from a single 2.7-V to 5.5-V power supply. It accepts an analog input range from 0 V to AVDD and digitizes the input at a maximum 1.25 MSPS throughput rate at 5 V . The power dissipations are only 12 mW with a 3-V supply or 35 mW with a 5-V supply. The device features an auto power-down mode that automatically powers down to 1 mA 50 ns after conversion is performed. In software power-down mode, the ADC is further powered down to only 10 µA.
Very high throughput rate, simple parallel interface, and low power consumption make the TLV571 an ideal choice for high-speed digital signal processing.
AVAILABLE OPTIONS
PACKAGE
T
A
–40°C to 85°C TLV571IPW TLV571IDW
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
24 TSSOP
(PW)
24 SOIC
(DW)
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 2000, Texas Instruments Incorporated
1
TLV571
I/O
DESCRIPTION
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
functional block diagram
CLK
CS RD
WR
CSTART
Internal
Clock
MUX
AV
DD
AIN
Input Registers
and Control Logic
REFP
8-BIT
SAR ADC
REFM DV
Three
State
Latch
DGNDAGND
DD
D0 – D5
D6/A0 D7/A1
INT/EOC
Terminal Functions
TERMINAL
NAME NO.
AGND 21 Analog ground AIN 23 I ADC analog input AV
DD
A0/D6 16 I/O Bidirectional 3-state data bus. D6/A0 along with D7/A1 is used as address lines to access CR0 and CR1 for
A1/D7 17 I/O Bidirectional 3-state data bus. D7/A1 along with D6/A0 is used as address lines to access CR0 and CR1 for
CLK 4 I External clock input CS 1 I Chip select. A logic low on CS enables the TLV571. CSTAR T 18 I Hardware sample and conversion start input. The falling edge of CSTAR T starts sampling and the rising edge
DGND 5, 8, 9 Digital ground DV
DD
D0 – D5 10–15 I/O Bidirectional 3-state data bus INT/EOC
NC 24 Not connected RD
REFM 20 I Lower reference voltage (nominally ground). REFM must be supplied or REFM pin must be grounded. REFP 19 I Upper reference voltage (nominally AVDD). The maximum input voltage range is determined by the difference
WR
22 Analog supply voltage, 2.7 V to 5.5 V
initialization.
initialization.
of CSTART
6 Digital supply voltage, 2.7 V to 5.5 V
7 O End-of-conversion/interrupt
3 I Read data. A falling edge on RD enables a read operation on the data bus when CS is low.
between the voltage applied to REFP and REFM.
2 I Write data. A rising edge on the WR latches in configuration data when CS is low. When using software
conversion start, a rising edge on WR the ADC in nonprogrammable (hardware configuration mode).
starts conversion.
also initiates an internal sampling start pulse. When WR is tied to ground,
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
detailed description
analog-to-digital SAR converter
Ain
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT,
PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
Charge
Redistribution
DAC
_ +
REFM
SAR
Register
Control
Logic
ADC Code
Figure 1
The TLV571 is a successive-approximation ADC utilizing a charge redistribution DAC. Figure 1 shows a simplified version of the ADC.
The sampling capacitor acquires the signal on Ain during the sampling period. When the conversion process starts, the SAR control logic and charge redistribution DAC are used to add and subtract fixed amounts of charge from the sampling capacitor to bring the comparator into a balanced condition. When the comparator is balanced, the conversion is complete and the ADC output code is generated.
sampling frequency, f
s
The TLV571 requires 16 CLKs for each conversion, therefore the equivalent maximum sampling frequency achievable with a given CLK frequency is:
f
s(max)
= (1/16) f
CLK
The TL V571 is software configurable. The first two MSB bits, D(7,6) are used to address which register to set. The remaining six bits are used as control data bits. There are two control registers, CR0 and CR1, that are user configurable. All of the register bits are written to the control register during write cycles. A description of the control registers is shown in Figure 2.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
3
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
detailed description (continued)
control registers
A1 A0 D4 D3 D2 D1 D0D5
Control Register Zero (CR0)
A(1:0)=00
STARTSEL
D4D5 D3 D2 D1 D0
PROGEOC
CLKSEL SWPWDN Don’t Care
Don’t Care
0: HARDWARE START (CSTART)
1: SOFTWARE START
Control Register One (CR1)
A(1:0)=01
Reserved
0: Reserved Bit Always Write 0
hardware configuration option
0: INT
1: EOC
D4D5 D1 D0
OSCSPD 0 Reserved 0 Reserved OUTCODE Reserved
0: INT. OSC. SLOW 1: INT. OSC. FAST
0: Internal Clock
1: External Clock
0: Reserved Bit Always Write 0
0: NORMAL
1: Powerdown
D3 D2
0: Reserved Bit, Always Write 0
Don’t Care
0: Binary
1: 2’s Complement
Don’t Care
0: Reserved Bit, Always Write 0
Figure 2. Input Data Format
The TLV571 can configure itself. This option is enabled when the WR
pin is tied to ground and a dummy RD signal is applied. The ADC is now fully configured. Zeros or default values are applied to both control registers. The ADC is configured ideally for 3-V operation, which means the internal OSC is set at 10 MHz and hardware start of conversion using CSTART.
ADC conversion modes
The TLV571 provides two start of conversion modes. Table 1 explains these modes in more detail.
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
REGISTER
D5D4D3D2D1
D0
COMMENT
detailed description (continued)
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT,
PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
Table 1. Conversion Modes
START OF
CONVERSION
Hardware start
(CSTAR T)
CR0.D5 = 0
Software start
CR0.D5 = 1
Repeated conversions from AIN
CSTART
CSTART
If in INT mode, one INT
If in EOC mode, EOC will go high to low at start of conversion, and return high
at end of conversion.
Repeated conversions from AIN
WR
rising edge of RD
Conversion begins after 6 clocks after sampling has begun. Thereafter, if in INT mode, one INT
If in EOC mode, EOC will go high to low at start of conversion and return high at end of conversion.
falling edge to start sampling rising edge to start conversion
rising edge to start sampling initially. Thereafter, sampling occurs at the
.
pulse generated after each conversion
OPERATION COMMENTS – FOR INPUT
CSTAR T rising edge must be applied a minimum of 5 ns before or after CLK rising edge.
pulse generated after each conversion
With external clock, WR and RD rising edge must be a minimum 5 ns before or after CLK rising edge.
configure the device
The device can be configured by writing to control registers CR0 and CR1.
Table 2. TLV571 Programming Examples
INDEX
D7 D6
EXAMPLE1
CR0 0 0 0 0 0 0 0 0 Normal, INT OSC CR1 0 1 0 0 0 0 0 0 Binary
EXAMPLE2
CR0 0 0 0 1 1 1 0 0 Power down, EXT OSC CR1 0 1 0 0 0 0 1 0 2’s complement output
power down
The TLV571 offers two power down modes, auto power down and software power down. This device will automatically proceed to auto power down mode if RD is not present one clock after conversion. Software power down is controlled directly by the user by pulling CS to DVDD.
Table 3. Power Down Modes
PARAMETERS/MODES AUTO POWER DOWN
Maximum power down dissipation current 1 mA 10 µA Comparator Power down Power down Clock buffer Power down Power down Control registers Saved Saved Minimum power down time 1 CLK 2 CLK Minimum resume time 1 CLK 2 CLK
SOFTWARE POWER DOWN
(CS
= DVDD)
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
5
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
detailed description (continued)
reference voltage input
The TL V571 has two reference input pins: REFP and REFM. The voltage levels applied to these pins establish the upper and lower limits of the analog inputs to produce a full-scale and zero-scale reading respectively . The values of REFP, REFM, and the analog input should not exceed the positive supply or be less than GND consistent with the specified absolute maximum ratings. The digital output is at full scale when the input signal is equal to or higher than REFP and is at zero when the input signal is equal to or lower than REFM.
sampling/conversion
All sampling, conversion, and data output in the device are started by a trigger. This could be the RD, WR, or CSTART signal depending on the mode of conversion and configuration. The rising edge of RD, WR, and CSTART signal are extremely important, since they are used to start the conversion. These edges need to stay close to the rising edge of the external clock (if it is used as CLK). The minimum setup and hold time with respect to the rising edge of the external clock should be 5 ns minimum. When the internal clock is used, this is not an issue since these two edges will start the internal clock automatically . Therefore, the setup time is always met. Software controlled sampling lasts 6 clock cycles. This is done via the CLK input or the internal oscillator if enabled. The input clock frequency can be 1 MHz to 20 MHz, translating into a sampling time from 0.6 µs to
0.3 µs. The internal oscillator frequency is 9 MHz minimum (ocillator frequency is between 9 MHz to 22 MHz), translating into a sampling time from 0.6 µs to 0.3 µs. Conversion begins immediately after sampling and lasts 10 clock cycles. This is again done using the external clock input (1 MHz–20 MHz) or the internal oscillator (9 MHz minimum) if enabled. Hardware controlled sampling, via CST AR T length of the active CSTART
signal. This allows more control over the sampling time, which is useful when sampling sources with large output impedances. On rising CSTART, conversion begins. Conversion in hardware controlled mode also lasts 10 clock cycles. This is done using the external clock input (1 MHz–20 MHz) or the internal oscillator (9 MHz minimum) as is the case in software controlled mode.
, begins on falling CST AR T lasts the
ExtClk
WR
OR
RD
OR
t
d(EXTCLK_CSTARTL)
CSTART
NOTE: tsu = setup time, th = hold time
Figure 3. Trigger Timing – Software Start Mode Using External Clock
≥5 ns
t
h(WRL_EXTCLKH)
t
h(RDL_EXTCLKH)
t
h(CSTARTL_EXTCLKH)
5 ns
t
su(WRH_EXTCLKH)
≥5 ns
t
su(RDH_EXTCLKH)
t
su(CSTARTH_EXTCLKH)
≥5 ns
≥5 ns
≥5 ns
5 ns
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT,
PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
start of conversion mechanism
There are two ways to convert data: hardware and software. In the hardware conversion mode the ADC begins sampling at the falling edge of CSTART and begins conversion at the rising edge of CSTART. Software start mode ADC samples for 6 clocks, then conversion occurs for ten clocks. The total sampling and conversion process lasts only 16 clocks in this case. If RD proceeds to a power-down state. Data is valid on the rising edge of INT in both conversion modes.
hardware CST ART conversion
external clock
With CS low and WR low, data is written into the ADC. The sampling begins at the falling edge of CSTART and conversion begins at the rising edge of CST AR T. At the end of conversion, EOC goes from low to high, telling the host that conversion is ready to be read out. The external clock is active and is used as the reference at all times. With this mode, it is required that CST ART is not applied at the rising edge of the clock (see Figure 4).
is not detected during the next clock cycle, the ADC automatically
TLV571
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
7
8
start of conversion mechanism (continued)
CLK
t
su(CSL_WRL)
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUAR Y 2000
TLV571
2.7 V to 5.5 V, 1-CHANNEL, 8-BIT
RARALLEL ANALOG-TO-DIGITAL CONVERTER
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
OR
CS
WR
CSTART
RD
D[0:7]
INT
EOC
t
h(WRH_CSH)
t
d(CSH_CSTARTL)
t
(sample)
t
su(DAV_WRH)
Config
Data
t
h(WRH_DAV)
t
c
(10 CLKs)
t
su(CSL_RDL)
t
h(RDH_CSH)
t
c
t
(sample)
t
dis(RDH_DAV)
ADC ADC
t
en(RDL_DAV)
t
en(RDL_DAV)
t
su(CSL_RDL)
Figure 4. Input Conversion – Hardware CSTART, External Clock
Auto Powerdown
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
9
internal clock
With CS low and WR low, data is written into the ADC. The sampling begins at the falling edge of CST AR T , and conversion begins at the rising edge of CSTART. The internal clock turns on at the rising edge of CSTART. The internal clock is disabled after each conversion.
t
su(CSL_WRL)
CS
WR
CSTART
INTCLK
RD
D[0:7]
Config
Data
t
t
h(WRH_CSH)
t
d(CSH_CSTARTL)
t
(sample)
su(DAV_WRH)
t
h(WRH_DAV)
10
t
(STARTOSC)
10
9
t
su(CSL_RDL)
t
h(RDH_CSH)
t
dis(RDH_DAV)
ADC Data
t
en(RDL_DAV)
t
(STARTOSC)
t
c
t
su(CSL_RDL)
ADC Data
t
en(RDL_DAV)
P ARALLEL ANALOG-T O-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUAR Y 2000
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT
OR
INT
EOC
t
c
Auto Powerdown
Figure 5. Input Conversion – Hardware CSTART, Internal Clock
TLV571
Auto Powerdown
10
software START conversion
external clock
With CS low and WR low, data is written into the ADC. Sampling begins at the rising edge of WR. The conversion process begins 6 clocks after sampling begins. At the end of conversion, the INT goes low telling the host that conversion is ready to be read out. EOC B low during the conversion. The external clock is active and used as the reference at all times. With this mode, WR and RD should not be applied at the rising edge of the clock (see Figure 3).
TLV571
2.7 V to 5.5 V, 1-CHANNEL, 8-BIT
RARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUAR Y 2000
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
OR
CLK
CS
WR
RD
D[0:7]
INT
EOC
015671516
t
su(CSL_WRL)
t
h(WRH_CSH)
t
su(DAV_WRH)
Config
Data
t
(sample)
t
h(WRH_DAV)
04515
t
su(CSL_RDL)
t
h(RDH_CSH)
t
c
t
(sample)
t
dis(RDH_DAV)
ADC Data ADC Data
t
en(RDL_DAV)
t
c
t
su(CSL_RDL)
t
en(RDL_DAV)
Figure 6. Input Conversion – Software Start, External Clock
Auto Powerdown
software START conversion (continued)
internal clock
With CS low and WR low, data is written into the ADC. Sampling begins at the rising edge of WR. Conversion begins 6 clocks after sampling begins. The internal clock begins at the rising edge of WR. The internal clock is disabled after each conversion. Subsequent sampling begins at the rising edge of RD.
t
su(CSL_RDL)
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
11
OR
CS
WR
RD
INTCLK
D[0:7]
INT
t
su(CSL_WRL)
t
h(WRH_CSH)
t
su(DAV_WRH)
Config
Data
t
(STARTOSC)
456 045015 15
t
(sample)
t
h(WRH_DAV)
t
h(RDH_CSH)
t
(STARTOSC)
P ARALLEL ANALOG-T O-DIGITAL CONVERTER
t
(sample)
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUAR Y 2000
t
c
t
dis(RDH_DAV)
ADC Data
t
en(RDL_DAV)
t
c
ADC
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT
EOC
Auto Powerdown
Figure 7. Input Conversion – Software Start, Internal Clock
Auto Powerdown
TLV571
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
software START conversion (continued) system clock source
The TL V571 internally derives multiple clocks from the SYSCLK for dif ferent tasks. SYSCLK is used for most conversion subtasks. The source of SYSCLK is programmable via control register zero, bit 3. The source of SYSCLK is changed at the rising edge of WR
internal clock (CR0.D3 = 0, SYSCLK = internal OSC)
The TLV571 has a built-in 10 MHz OSC. When the internal OSC is selected as the source of SYSCLK, the internal clock starts with a delay (one half of the OSC period max) after the falling edge of the conversion trigger (either WR, RD, or CST ART). The OSC speed can be set to 10 ± 1 MHz or 20 ± 2 MHz by setting register bit CR1.D4.
external clock (CR0.D3 = 1, SYSCLK = external clock)
The TLV571 is designed to accept an external clock input (CMOS/TTL logic) with frequencies from 1 MHz to 20 MHz.
host processor interface
The TLV571 provides a generic high-speed parallel interface that is compatible with high-performance DSPs and general-purpose microprocessors. The interface includes D(0–7), INT/EOC, RD, and WR.
of the cycle when CR0.D3 is programmed.
output format
The data output format is unipolar (code 0 to 255). The output code format can be either binary or twos complement by setting register bit CR1.D1.
power up and initialization
After power up, CS cycles to configure the two control registers. The first conversion after the device has returned from the power down state may be invalid and should be disregarded.
must be low to begin an I/O cycle. INT/EOC is initially high. The TL V571 requires two write
definitions of specifications and terminology
integral nonlinearity
Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero through full scale. The point used as zero occurs 1/2 LSB before the first code transition. The full-scale point is defined as level 1/2 LSB beyond the last code transition. The deviation is measured from the center of each particular code to the true straight line between these two points.
differential nonlinearity
An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. A differential nonlinearity error of less than ±1 LSB ensures no missing codes.
zero offset
The major carry transition should occur when the analog input is at zero volts. Zero error is defined as the deviation of the actual transition from that point.
gain error
The first code transition should occur at an analog value 1/2 LSB above negative full scale. The last transition should occur at an analog value 1 1/2 LSB below the nominal full scale. Gain error is the deviation of the actual difference between first and last code transitions and the ideal difference between first and last code transitions.
12
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT,
PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
software START conversion (continued) signal-to-noise ratio + distortion (SINAD)
Signal-to-noise ratio + disortion is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in decibels.
effective number of bits (ENOB)
For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following formula,
N = (SINAD – 1.76)/6.02
it is possible to get a measure of performance expressed as N, the effective number of bits. Thus, the effective number of bits for a device for sine wave inputs at a given input frequency can be calculated directly from its measured SINAD.
total harmonic distortion (THD)
T otal harmonic distortion is the ratio of the rms sum of the first six harmonic components to the rms value of the measured input signal and is expressed as a percentage or in decibels.
spurious free dynamic range (SFDR)
TLV571
Spurious free dynamic range is the difference in dB between the rms amplitude of the input signal and the peak spurious signal.
DSP interface
The TL V571 is a 8-bit single input channel analog-to-digital converter with throughput up to 1.25 MSPS at 5 V and up to 625 KSPS at 3 V . To achieve 1.25 MSPS throughput, the ADC must be clocked at 20 MHz. Likewise to achieve 625 KSPS throughout, the ADC must be clocked at 10 MHz. The TL V571 can be easily interfaced to microcontrollers, ASICs, and DSPs. Figure 8 shows the pin connections to interface the TLV571 to the TMS320C6x DSP.
TMS320C6X
A0–A15
TLV571
Address
HW
HR
INTx
D0–D15
EN
Decoder
CS
WR RD EOC D0–D7
AIN
REF
REFP
REFM
Figure 8. TMS320C6x DSP Interface
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
13
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
grounding and decoupling considerations
General practices should apply to the PCB design to limit high frequency transients and noise that are fed back into the supply and reference lines. This requires that the supply and reference pins be sufficiently bypassed. In most cases 0.1-µF ceramic chip capacitors are adequate to keep the impedance low over a wide frequency range. Since their effectiveness depends largely on the proximity to the individual supply pin, they should be placed as close to the supply pins as possible.
To reduce high frequency and noise coupling, it is highly recommended that digital and analog grounds be shorted immediately outside the package. This can be accomplished by running a low impedance line between DGND and AGND under the package.
DD
REFP
AV
DD
100 nF
100 nF
V
REFP
V
REFM
100 nF
DV
DD
DV
DD
DGND
TLV571
AV
AGND
REFM
Figure 9. Placement for Decoupling Capacitors
power supply ground layout
Printed-circuit boards that use separate analog and digital ground planes offer the best system performance. Wire-wrap boards do not perform well and should not be used. The two ground planes should be connected together at the low-impedance power-supply source. The best ground connection may be achieved by connecting the ADC AGND terminal to the system analog ground plane making sure that analog ground currents are well managed.
Driving Source
R
s
V
V
S
I
AIN
TLV571
R
i(ADC)
V
C
C 15 pF
VI= Input Voltage at AIN VS= External Driving Source Voltage Rs= Source Resistance R Ci= Input Capacitance VC= Capacitance Charging Voltage
i
= Input Resistance of ADC
i(ADC)
14
Driving source requirements:
Noise and distortion for the source must be equivalent to the resolution of the converter.
Rs must be real at the input frequency.
Figure 10. Equivalent Input Circuit Including the Driving Source
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
simplified analog input analysis
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT,
PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
Using the equivalent circuit in Figure 10, the time required to charge the analog input capacitance from 0 to V within 1/2 LSB, tch(1/2 LSB), can be derived as follows.
The capacitance charging voltage is given by:
–tchń
RtC
+
V
i(ADC)
ǒ
VSń
ǒ
1–e
S
i
512Ǔ+
V
C(t)
Where
R
= Rs + R
t
Ri = R tch = Charge time
The input impedance Ri is 718 at 5 V , and is higher (~ 1.25 k) at 2.7 V. The final voltage to 1/2 LSB is given by:
VC (1/2 LSB) = VS – (VS/512)
Equating equation 1 to equation 2 and solving for cycle time tc gives:
VS*
and time to change to 1/2 LSB (minimum sampling time) is:
t
(1/2 LSB) = Rt × Ci × ln(512)
ch
Where
i
Ǔ
(1)
(2)
–tchń
RtC
ǒ
V
1–e
S
i
Ǔ
(3)
S
ln(512) = 6.238
Therefore, with the values given, the time for the analog input signal to settle is:
tch (1/2 LSB) = (Rs + 718 Ω) × 15 pF × ln(512)
This time must be less than the converter sample time shown in the timing diagrams. Which is 6x SCLK.
tch (1/2 LSB) 6x 1/f
Therefore the maximum SCLK frequency is:
Max(f
(SCLK)
) = 6/tch (1/2 LSB) = 6/(ln(512) × Rt × Ci)
(SCLK)
(4)
(5)
(6)
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
15
TLV571
Input CLK frequenc
Pulse duration, CLK high, t
Pulse duration, CLK low, t
(CLKL)
ns
VREFP
VREFM
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, GND to VCC –0.3 V to 6.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog input voltage range –0.3 V to AVDD + 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reference input voltage range AVDD + 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital input voltage range –0.3 V to DV
DD
+ 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature range, TJ –40°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, TA, –40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions
power supplies
MIN MAX UNIT
Analog supply voltage, A V Digital supply voltage, DV
NOTE 1: Abs (AVDD – DVDD) < 0.5 V
DD
DD
analog inputs
Analog input voltage, AIN AGND VREFP V
2.7 5.5 V
2.7 5.5 V
MIN MAX UNIT
digital inputs
High-level input voltage, V Low level input voltage, V
p
Rise time, I/O and control, CLK, CS 50 pF output load 4 Fall time, I/O and control, CLK, CS 50 pF output load 4
IH
IL
y
w(CLKH)
w
DVDD = 2.7 V to 5.5 V 2.1 2.4 V DVDD = 2.7 V to 5.5 V 0.8 V DVDD = 4.5 V to 5.5 V 20 MHz DVDD = 2.7 V to 3.3 V 10 MHz DVDD = 4.5 V to 5.5 V, f DVDD = 2.7 V to 3.3 V, f DVDD = 4.5 V to 5.5 V, f DVDD = 2.7 V to 3.3 V, f
= 20 MHz 23 ns
CLK
= 10 MHz 46 ns
CLK
= 20 MHz 23 ns
CLK
= 10 MHz 46 ns
CLK
reference specifications
MIN NOM MAX UNIT
AVDD = 3 V 2 AV AVDD = 5 V 2.5 AV
External reference voltage
VREFP – VREFM 2 AVDD–AGND V
AVDD = 3 V AGND 1 V AVDD = 5 V AGND 2 V
MIN NOM MAX UNIT
DD DD
V V
16
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Internal clock
MHz
CiInput capacitance
Operating supply current, I
I
PD
Power dissipation
Software
I
I
IPDSupply current in power-down mode
Auto
I
I
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT,
PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
electrical characteristics over recommended operating free-air temperature range, supply voltages, and reference voltages (unless otherwise noted)
digital specifications
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Logic inputs
I
High-level input current DVDD = 5 V, DVDD = 3 V, Input = DV
IH
I
Low-level input current DVDD = 5 V, DVDD = 3 V, Input = 0 V –1 1 µA
IL
C
Input capacitance 10 15 pF
i
Logic outputs
V
High-level output voltage IOH = 50 µA to 0.5 mA DVDD–0.4 V
OH
V
Low-level output voltage IOL = 50 µA to 0.5 mA 0.4 V
OL
I
High-impedance-state output current DVDD = 5 V, DVDD = 3 V, Input = DV
OZ
I
Low-impedance-state output current DVDD = 5 V, DVDD = 3 V, Input = 0 V –1 µA
OL
C
Output capacitance 5 pF
o
dc specifications
Resolution 8 Bits
Accuracy
Integral nonlinearity, INL Best fit ±0.3 ±0.5 LSB Differential nonlinearity , DNL ±0.3 ±0.5 LSB Missing codes 0
E
Offset error ±0.15% ±0.3% FSR
O
E
Gain error ±0.2% ±0.4% FSR
G
Analog input
p
p
I
Input leakage current V
lkg
Voltage reference input
r
Input resistance 2 k
i
C
Input capacitance 300 pF
i
Power supply
p
p
pp
DD
DD
3 V, AVDD = DV 5 V, AVDD = DV
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
pp
p
DD
+
REF
DD DD
AIN, AVDD = 3 V, AVDD = 5 V 15 pF MUX input, AVDD = 3 V, AVDD = 5 V 25 pF
= 0 to AV
AIN
AVDD = DVDD = 3 V, f AVDD = DVDD = 5 V, f AVDD+DVDD = 3 V 12 17 mW AVDD+DVDD = 5 V 35 43 mW
+
DD
+
DD
REF
REF
DD
= 10 MHz 4 5.5 mA
CLK
= 20 MHz
CLK
AVDD = 3 V 1 8 µA AVDD = 5 V 2 10 µA AVDD = 3 V 0.5 1 mA AVDD = 5 V 0.5 1 mA
–1 1 µA
1 µA
9 10 11
18 20 22
±1 µA
7 8.5 mA
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
17
TLV571
Signal-to-noise ratio, SNR
I
,
Signal-to-noise ratio
distortion, SINAD
I
,
Total harmonic distortion, THD
I
,
Effective number of bits, ENOB
I
,
Spurious free dynamic range, SFDR
I
,
Full-power bandwidth
Small-signal bandwidth
Sam ling rate, f
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
electrical characteristics over recommended operating free-air temperature range, supply voltages, and reference voltages (unless otherwise noted) (continued)
ac specifications, AVDD = DVDD = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fs = 1.25 MSPS, A VDD = 5 V 47 49 dB fs = 625 KSPS, AVDD = 3 V 47 49 dB fs = 1.25 MSPS, A VDD = 5 V 47 49 dB fs = 625 KSPS, AVDD = 3 V 47 49 dB fs = 1.25 MSPS, A VDD = 5 V –64 –52 dB fs = 625 KSPS, AVDD = 3 V –62 –52 dB fs = 1.25 MSPS, A VDD = 5 V 7.5 7.9 Bits fs = 625 KSPS, AVDD = 3 V 7.5 7.9 Bits fs = 1.25 MSPS, A VDD = 5 V –65 –51 dB fs = 625 KSPS, AVDD = 3 V –64 –51 dB
p
Analog input
f
= 100 kHz,
80% of FS f
+
p
p
s
–1 dB Full-scale 0 dB input sine wave 12 18 MHz –3 dB Full-scale 0 dB input sine wave 30 MHz –1 dB –20 dB input sine wave 15 20 MHz –3 dB –20 dB input sine wave 35 MHz
= 100 kHz,
80% of FS f
= 100 kHz,
80% of FS f
= 100 kHz,
80% of FS f
= 100 kHz,
80% of FS
AVDD = 4.5 V to 5.5 V 0.0625 1.25 MSPS AVDD = 2.7 V to 3.3 V 0.0625 0.625 MSPS
18
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
t
(CLK)
In ut clock Cycle time
t
(RDL_DAV)
Enable time, data out
t
dis(RDH_DAV)
Disable time, data out
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT,
PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
timing requirements, AVDD = DVDD = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
c
t
(sample)
t
c
t
wL(EOC)
t
wL(INT)
t
(STARTOSC)
t
d(CSH_CSTARTL)
en
t
su(CSL_WRL)
t
h(WRH_CSH)
t
w(WR)
t
w(RD)
t
su(DAV_WRH)
t
h(WRH_DAV)
t
su(CSL_RDL)
t
h(RDH_CSH)
t
h(WRL_EXTXLKH)
t
h(RDL_EXTCLKH)
t
h(CSTARTL_EXTCLKH)
t
su(WRH_EXTCLKH)
t
su(RDH_EXTCLKH)
t
su(CSTARTH_EXTCLKH)
t
d(EXTCLK_CSTARTL)
NOTE: Specifications subject to change without notice.
Data valid is denoted as DAV.
p
Reset and sampling time 6
Total conversion time 10
Pulse width, end of conversion, EOC 10
Pulse width, interrupt 1 Start-up time, internal oscillator 100 ns
Delay time, CS high to CSTART low 10 ns
Setup time, CS to WR 5 ns Hold time, CS to WR 5 ns
Pulse width, write 1
Pulse width, read 1 Setup time, data valid to WR 10 ns
Hold time, data valid to WR 5 ns Setup time, CS to RD 5 ns Hold time, CS to RD 5 ns Hold time WR to clock high 5 ns Hold time RD to clock high 5 ns Hold time CSTAR T to clock high 5 ns Setup time WR high to clock high 5 ns Setup time RD high to clock high 5 ns Setup time CSTAR T high to clock high 5 ns Delay time clock low to CSTART low 5 ns
DVDD = 4.5 V to 5.5 V 50 ns DVDD = 2.7 V to 3.3 V 100 ns
DVDD = 5 V at 50 pF 20 ns DVDD = 3 V at 50 pF 40 ns DVDD = 5 V at 50 pF 5 ns DVDD = 3 V at 50 pF 10 ns
TLV571
SYSCLK
Cycles
SYSCLK
Cycles
SYSCLK
Cycles
SYSCLK
Cycles
Clock
Period
Clock
Period
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
19
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
FREE AIR TEMPERATURE
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
– Supply Current – mA
2.5
CC
I
2.0
1.5
1.0
0.5
0.0 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80
AVDD = DVDD = 5 V, 20 MHz
AVDD = DVDD = 3 V, 10 MHz
TA – Free Air Temperature – °C
Figure 11
vs
SUPPLY CURRENT
vs
CLOCK FREQUENCY
7
6
5
4
3
– Supply Current – mA
2
CC
I
1
0
0 2 4 6 8 101214161820
AVDD = DVDD = 5 V
AVDD = DVDD = 3 V
f
– Clock Frequency – MHz
clock
Figure 12
ANALOG INPUT BANDWIDTH
FREQUENCY
1
0
–1
–2
–3
AVDD = DVDD = 5 V,
–4
Analog Input Bandwidth – dB
AIN = 90% of FS, REF = 5 V,
–5
TA = 25°C
–6
0.1 1 f – Frequency – MHz
Figure 13
vs
10 100
20
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT,
PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
TYPICAL CHARACTERISTICS
DIFFERENTIAL NONLINEARITY
vs
DIGITAL OUTPUT CODE
0.15
0.10
0.05
–0.00
–0.05
–0.10
–0.15
DNL – Differential Nonlinearity – LSB
0 64 128 192 256
Digital Output Code
Figure 14
AVDD = DVDD = 3 V, External Ref = 3 V, CLK = 10 MHz, TA = 25°C
INTEGRAL NONLINEARITY
vs
DIGITAL OUTPUT CODE
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00 –0.02 –0.04
INL – Integral Nonlinearity – LSB
–0.06
0 64 128 192 256
AVDD = DVDD = 3 V, External Ref = 3 V, CLK = 10 MHz, TA = 25°C
Digital Output Code
Figure 15
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
21
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
TYPICAL CHARACTERISTICS
DIFFERENTIAL NONLINEARITY
vs
DIGITAL OUTPUT CODE
0.12
0.10
0.08
0.06
0.04
0.02
0.00 –0.02 –0.04 –0.06 –0.08
DNL – Differential Nonlinearity – LSB
0 64 128 192 256
Digital Output Code
Figure 16
AVDD = DVDD = 5 V, External Ref = 5 V, CLK = 20 MHz, TA = 25
°C
INTEGRAL NONLINEARITY
vs
DIGITAL OUTPUT CODE
0.14
AVDD = DVDD = 5 V,
0.12
External Ref = 5 V,
0.10
CLK = 20 MHz,
0.08
TA = 25°C
0.06
0.04
0.02
0.00 –0.02 –0.04 –0.06
INL – Integral Nonlinearity – LSB
–0.08
0 64 128 192 256
Digital Output Code
Figure 17
22
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT,
PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
TYPICAL CHARACTERISTICS
EFFECTIVE NUMBER OF BITS
vs
FREQUENCY
10
9
8
7
6
ENOB – Effective Number of Bits – BITS
5
0 100 200 300
AVDD = DVDD = 3 V, External Ref = 3 V
f – Frequency – kHz
Figure 18
EFFECTIVE NUMBER OF BITS
vs
FREQUENCY
10
9
8
7
6
ENOB – Effective Number of Bits – BITS
5
0 200 400 600
AVDD = DVDD = 5 V, External Ref = 5 V
f – Frequency – kHz
Figure 19
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
23
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
TYPICAL CHARACTERISTICS
FAST FOURIER TRANSFORM
vs
FREQUENCY
20
0 –20 –40 –60 –80
Magnitude – dB
–100 –120 –140
AIN = 200 KHz CLK = 10 MHz AVDD = DVDD = 3 V External Ref = 3 V
0 100000 200000 300000
f – Frequency – Hz
Figure 20
20
0 –20 –40 –60 –80
Magnitude – dB
–100 –120 –140
0 200000 400000 600000
FAST FOURIER TRANSFORM
vs
FREQUENCY
AIN = 200 KHz CLK = 20 MHz AVDD = DVDD = 5 V External Ref = 5 V
f – Frequency – Hz
Figure 21
24
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT,
PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
MECHANICAL DATA
DW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
16 PINS SHOWN
0.050 (1,27)
16
1
0.020 (0,51)
0.014 (0,35) 9
0.299 (7,59)
0.293 (7,45)
8
A
0.010 (0,25)
0.419 (10,65)
0.400 (10,15)
M
0.010 (0,25) NOM
0°–8°
Gage Plane
0.010 (0,25)
0.050 (1,27)
0.016 (0,40)
0.104 (2,65) MAX
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). D. Falls within JEDEC MS-013
0.012 (0,30)
0.004 (0,10)
DIM
A MAX
A MIN
PINS **
16
0.410
(10,41)
0.400
(10,16)
Seating Plane
0.004 (0,10)
20
0.510
(12,95)
0.500
(12,70)
0.610
(15,49)
0.600
(15,24)
24
28
0.710
(18,03)
0.700
(17,78)
4040000/C 07/96
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
25
TLV571
2.7 V TO 5.5 V, 1-CHANNEL, 8-BIT, PARALLEL ANALOG-TO-DIGITAL CONVERTER
SLAS239A – SEPTEMBER 1999 – REVISED FEBRUARY 2000
MECHANICAL DATA
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30 0,19
8
4,50 4,30
PINS **
7
Seating Plane
0,15 0,05
8
1
A
DIM
6,60 6,20
14
0,10
0,10
M
0,15 NOM
Gage Plane
0,25
0°–8°
2016
24
28
0,75 0,50
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
26
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
Loading...