Texas Instruments TLV2217-33PWLE, TLV2217-33PWR, TLV2217-33MJB, TLV2217-33MFKB, TLV2217-33KTPR Datasheet
TLV2217-33
LOW-DROPOUT 3.3-V FIXED-VOLTAGE REGULATORS
SLVS067G – MARCH 1992 – REVISED JULY 1999
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Fixed 3.3-V Output
D
±1% Maximum Output Voltage Tolerance at
TJ = 25°C
D
500-mV Maximum Dropout V oltage at
500 mA
D
500-mA Dropout Current
D
±2% Absolute Output Voltage Variation
D
Internal Overcurrent Limiting
D
Internal Thermal-Overload Protection
D
Internal Overvoltage Protection
D
Package Options Include Plastic Flange
Mounted (KTP), Power (KC), and Thin
Shrink Small-Outline (PW) Packages
description
The TLV2217-33 is a low-dropout 3.3-V fixedvoltage regulator. The regulator is capable of
sourcing 500 mA of current with an input-output
differential of 0.5 V, or less. The TLV2217-33
provides internal overcurrent limiting, thermaloverload protection, and overvoltage protection.
The 0.5-V dropout for the TLV2217-33 makes it
ideal for battery applications in 3.3-V logic
systems. For example, battery input voltage to the
regulator can drop as low as 3.8 V, and the
TL V2217-33 can continue to regulate the system.
For higher voltage systems, the TL V2217-33 can
be operated with a continuous input voltage of
12 V.
The TLV2217-33 regulators are characterized for virtual junction temperature operation from 0°C to 125°C .
AVAILABLE OPTIONS
PACKAGED DEVICES
T
J
PLASTIC
POWER
(KC)
SURFACE
MOUNT
(PW)
PLASTIC
FLANGE MOUNT
(KTP)
CHIP FORM
(Y)
0°C to 125°C TLV2217-33KC TLV2217-33PW TLV2217-33KTP TLV2217-33Y
The KTP and PW packages are available taped and reeled only. Add R suffix to device type
(e.g., TLV2212-33PWR). Chip forms are tested at 25°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
OUTPUT
GND
INPUT
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
GND
INPUT
GND
OUTPUT
PW PACKAGE
(TOP VIEW)
HEAT
SINK
HEAT
SINK
HEAT
SINK
HEAT
SINK
KC PACKAGE
(TOP VIEW)
HEAT SINK – These terminals have an internal resistive connection
to ground and should be grounded or electrically isolated.
OUTPUT
GND
INPUT
GND
KTP PACKAGE
(TOP VIEW)
The GND terminal is in electrical contact with the mounting base.
The GND terminal is in electrical contact with the mounting base.
GND
TLV2217-33
LOW-DROPOUT 3.3-V FIXED-VOLTAGE REGULATORS
SLVS067G – MARCH 1992 – REVISED JULY 1999
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating virtual junction temperature range (unless otherwise
noted)
†
Continuous input voltage, VI 16 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 1 and 2): KC package 22°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
KTP package 28°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Maximum power dissipation is a function of TJ(max),
θ
JA
, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) – TA)/
θ
JA
. Operating at the absolute maximum TJ of 150°C can impact reliability. Due to
variation in individual device electrical characteristics and thermal resistance, the built-in thermal overload protection may be
activated at power levels slightly above or below the rated dissipation.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
recommended operating conditions
MIN MAX UNIT
Input voltage, V
I
3.8 12 V
Output current, I
O
0 500 mA
Operating virtual junction temperature range, T
J
0 125 °C
electrical characteristics at V
I
= 4.5 V, IO = 500 mA, T
J
= 25°C (unless otherwise noted)
TLV2217-33 UNIT
PARAMETER
TEST CONDITIONS
‡
MIN TYP MAX UNIT
p
TJ = 25°C 3.267 3.30 3.333
Output voltage
I
O
= 20 mA to
500 mA
,
V
I
= 3.8 V to 5.5
V
TJ = 0°C to 125°C 3.234 3.366
V
Input voltage regulation VI = 3.8 V to 5.5 V 5 15 mV
Ripple rejection f = 120 Hz, V
ripple
= 1 V
PP
–62 dB
Output voltage regulation IO = 20 mA to 500 mA 5 30 mV
Output noise voltage f = 10 Hz to 100 kHz 500 µV
p
IO = 250 mA 400
Dropout voltage
IO = 500 mA 500
mV
IO = 0 2 5
Bias current
IO = 500 mA 19 49
mA
‡
Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal effects
must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 22-µF tantalum capacitor
with equivalent series resistance of 1.5 Ω on the output.
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