The TL V2211 is a single operational amplifier manufactured using the T exas Instruments Advanced LinCMOS
process. These devices are optimized and fully specified for single-supply 3-V and 5-V operation. For this
low-voltage operation combined with micropower dissipation levels, the input noise voltage performance has
been dramatically improved using optimized design techniques for CMOS-type amplifiers. Another added
benefit is that these amplifiers exhibit rail-to-rail output swing. The output dynamic range can be extended using
the TL V221 1 with loads referenced midway between the rails. The common-mode input voltage range is wider
than typical standard CMOS-type amplifiers. To take advantage of this improvement in performance and to
make this device available for a wider range of applications, V
voltage test limit of ± 5 mV , allowing a minimum of 0 to 2-V common-mode input voltage range for a 3-V power
supply .
is specified with a larger maximum input offset
ICR
AVAILABLE OPTIONS
PACKAGED DEVICES
A
0°C to 70°C3 mVTLV2211CDBVVACC
–40°C to 85°C3 mVTLV2211IDBVVACI
†
The DBV package available in tape and reel only.
°
SOT-23 (DBV)
†
CHIP FORM
(Y)
The Advanced LinCMOS process uses a silicon-gate technology to obtain input offset voltage stability with
temperature and time that far exceeds that obtainable using metal-gate technology . This technology also makes
possible input-impedance levels that meet or exceed levels offered by top-gate JFET and expensive
dielectric-isolated devices.
The TLV2211, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for
high-impedance sources such as piezoelectric transducers. Because of the low power dissipation levels
combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing
applications. In addition, the rail-to-rail output feature with single or split supplies makes these devices excellent
choices when interfacing directly to analog-to-digital converters (ADCs). All of these features combined with its
temperature performance make the TLV2211 ideal for remote pressure sensors, temperature control, active
voltage-resistive (VR) sensors, accelerometers, hand-held metering, and many other applications.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Advanced LinCMOS is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1997, Texas Instruments Incorporated
1
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
description (continued)
The device inputs and outputs are designed to withstand a 100-mA surge current without sustaining latch-up.
In addition, internal ESD-protection circuits prevent functional failures up to 2000 V as tested under
MIL-PRF-38535; however, care should be exercised when handling these devices as exposure to ESD may
result in degradation of the device parametric performance. Additional care should be exercised to prevent
V
supply-line transients under powered conditions. Transients of greater than 20 V can trigger the
DD +
ESD-protection structure, inducing a low-impedance path to V
sustained current supplied to the device must be limited to 100 mA or less. Failure to do so could result in a
latched condition and device failure.
/GND. Should this condition occur, the
DD –
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TLV2211Y chip information
This chip, when properly assembled, displays characteristics similar to the TLV2211C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
40
(2)
(1)
(3)
(5)
(4)
V
DD+
V
+
–
DD–
(5)
(2)
/GND
(4)
OUT
(1)
IN+
(3)
IN–
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (2) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
32
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
T
l
R
l
D
7
11
94
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
equivalent schematic
IN+
V
DD+
Q3Q6Q9Q12Q14Q16
R7
C2
R6
C1
OUT
TLV2211, TLV2211Y
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUARY 1997
Advanced LinCMOSRAIL-TO-RAIL
emp
ate
e
ease
ate:
–
–
IN–
Q4Q1
•
Q2Q5Q7Q8Q10Q11
R3
R4
COMPONENT COUNT
Transistors
Diodes
Resistors
Capacitors
†
Includes both amplifiers and all
ESD, bias, and trim circuitry
23
6
11
2
†
R5
V
DD–/GND
R1
R2
Q17Q15Q13
D1
D2
PACKAGE
A
UNIT
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
Differential input voltage, V
Input voltage range, V
Input current, I
Output current, I
Total current into V
Total current out of V
Operating free-air temperature range, T
Storage temperature range, T
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: DBV package 260°C. . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to V
2. Differential voltages are at the noninverting input with respect to the inverting input. Excessive current flows when input is brought
below V
3. The output may be shorted to either supply. Temperature and /or supply voltages must be limited to ensure that the maximum
Large-signal pulse responsevs Time35, 36, 37, 38
Small-signal pulse responsevs Time39, 40, 41, 42
Equivalent input noise voltagevs Frequency43, 44
Noise voltage (referred to input)Over a 10-second period45
p
Gain marginvs Load capacitance50
Unity-gain bandwidthvs Load capacitance51
Distribution1, 2
vs Common-mode input voltage
vs Supply voltage8
vs Free-air temperature9
vs Supply voltage16
vs Free-air temperature17
vs Load resistance20
vs Frequency
vs Free-air temperature23, 24
vs Frequency27
vs Free-air temperature28
vs Frequency29, 30
vs Free-air temperature
vs Load capacitance33
vs Free-air temperature34
vs Free-air temperature47
vs Supply voltage48
vs Frequency21, 22
vs Load capacitance
3, 4
21, 22
31
49
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
11
TLV2211, TLV2211Y
†
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
DISTRIBUTION OF TLV2211
INPUT OFFSET VOLTAGE
30
376 Amplifiers From 1 Wafer Lot
VDD = ±1.5 V
TA = 25°C
25
20
15
10
Precentage of Amplifiers – %
5
0
–1.5–1–0.500.511.5
VIO – Input Offset Voltage – mV
Figure 1
INPUT OFFSET VOLTAGE
vs
COMMON-MODE INPUT VOLTAGE
1
VDD = 3 V
0.8
RS = 50 Ω
TA = 25°C
0.6
DISTRIBUTION OF TLV2211
INPUT OFFSET VOLTAGE
30
376 Amplifiers From 1 Wafer Lot
VDD = ±2.5 V
TA = 25°C
25
20
15
10
Precentage of Amplifiers – %
5
0
–1.5–1–0.500.511.5
VIO – Input Offset Voltage – mV
Figure 2
INPUT OFFSET VOLTAGE
vs
COMMON-MODE INPUT VOLTAGE
1
VDD = 5 V
0.8
RS = 50 Ω
TA = 25°C
0.6
†
0.4
0.2
0
–0.2
–0.4
– Input Offset Voltage – mV
IO
–0.6
V
–0.8
–1
–1012
VIC – Common-Mode Input Voltage – V
3
Figure 3
†
For all curves where VDD = 5 V, all loads are referenced to 2.5 V. For all curves where VDD = 3 V, all loads are referenced to 1.5 V.
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.4
0.2
0
–0.2
–0.4
– Input Offset Voltage – mV
IO
–0.6
V
–0.8
–1
–1012345
VIC – Common-Mode Input Voltage – V
Figure 4
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
DISTRIBUTION OF TLV2211 INPUT OFFSET
VOLTAGE TEMPERATURE COEFFICIENT
50
32 Amplifiers From 1 Wafer Lot
VDD = ±1.5 V
P Package
40
TA = 25°C
30
20
Percentage of Amplifiers – %
10
0
–3–2–10123
α
– Temperature Coefficient – µV/°C
VIO
Figure 5
INPUT BIAS AND INPUT OFFSET CURRENTS
vs
FREE-AIR TEMPERATURE
100
V
= ±2.5 V
DD±
90
VIC = 0
VO = 0
80
RS = 50 Ω
70
60
50
40
30
20
IO
I
10
DISTRIBUTION OF TLV2211 INPUT OFFSET
VOLTAGE TEMPERATURE COEFFICIENT
50
32 Amplifiers From 1 Wafer Lot
VDD = ±2.5 V
P Package
40
TA = 25°C
30
20
Percentage of Amplifiers – %
10
0
–3–2–10123
α
– Temperature Coefficient – µV/°C
VIO
Figure 6
†
5
RS = 50 Ω
4
TA = 25°C
3
2
1
0
–1
– Input Voltage – V
–2
I
I
IB
I
IO
V
–3
–4
INPUT VOLTAGE
vs
SUPPLY VOLTAGE
| VIO | ≤5 mV
0
IB
IIB and IIO – Input Bias and Input Offset Currents – pA
I
25456585
TA – Free-Air Temperature – ° C
105125
Figure 7
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
–5
11.522.5
| V
| – Supply Voltage – V
DD±
Figure 8
33.54
13
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
INPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
5
VDD = 5 V
4
3
2
1
– Input Voltage – V
I
V
0
–1
–55 –35 –15525456585
TA – Free-Air Temperature – ° C
| VIO | ≤5 mV
Figure 9
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
1.2
V
= 3 V
DD
TA = 25°C
1
VIC = 0
0.8
0.6
0.4
– Low-Level Output Voltage – V
0.2
OL
V
†‡
VIC = 0.75 V
VIC = 1.5 V
105 125
‡
3
2.5
2
1.5
1
– High-Level Output Voltage – V
0.5
OH
V
0
1.4
1.2
1
0.8
0.6
0.4
– Low-Level Output Voltage – V
OL
V
0.2
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
TA = –40°C
TA = 25°C
TA = 85°C
TA = 125°C
0200400
| IOH | – High-Level Output Current – µA
Figure 10
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
VDD = 3 V
VIC = 1.5 V
TA = 125°C
T
= 85°C
A
TA = 25°C
TA = – 40°C
†‡
VDD = 3 V
600800
†‡
0
0123
IOL – Low-Level Output Current – mA
45
Figure 11
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
‡
For all curves where VDD = 5 V, all loads are referenced to 2.5 V. For all curves where VDD = 3 V, all loads are referenced to 1.5 V.
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0
012 3
IOL – Low-Level Output Current – mA
Figure 12
45
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
5
4
TA = 85°C
TA = 25°C
3
TA = –40°C
2
– High-Level Output Voltage – V
1
V
OH
VDD = 5 V
VIC = 2.5 V
0
0200400600
| IOH | – High-Level Output Current – µA
Figure 13
MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE
vs
FREQUENCY
5
VDD = 5 V
4
†‡
TA = 125°C
8001000
LOW-LEVEL OUTPUT VOLTAGE
†‡
vs
LOW-LEVEL OUTPUT CURRENT
1.4
VDD = 5 V
VIC = 2.5 V
1.2
TA = 125°C
1
TA = 85°C
0.8
TA = 25°C
0.6
0.4
– Low-Level Output Voltage – V
0.2
OL
V
0
01 2 3
IOL – Low-Level Output Current – mA
TA = –40°C
456
Figure 14
‡
SHORT-CIRCUIT OUTPUT CURRENT
vs
SUPPLY VOLTAGE
16
VO = VDD/2
VIC = VDD/2
14
TA = 25°C
12
VID = –100 mV
10
3
VDD = 3 V
2
1
– Maximum Peak-to-Peak Output Voltage – V
O(PP)
V
RI = 10 kΩ
TA = 25°C
0
2
10
3
10
f – Frequency – Hz
10
4
Figure 15
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
‡
For all curves where VDD = 5 V, all loads are referenced to 2.5 V. For all curves where VDD = 3 V, all loads are referenced to 1.5 V.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
8
6
4
2
– Short-Circuit Output Current – mA
OS
0
I
–2
2345
VDD – Supply Voltage – V
Figure 16
VID = 100 mV
678
15
TLV2211, TLV2211Y
‡
‡
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
SHORT-CIRCUIT OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
14
12
10
8
6
4
2
– Short-Circuit Output Current – mA
OS
0
I
–2
–50 –250255075100–75125
TA – Free-Air Temperature – ° C
VID = 100 mV
Figure 17
VDD = 5 V
VIC = 2.5 V
VO = 2.5 V
VID = –100 mV
†‡
OUTPUT VOLTAGE
vs
DIFFERENTIAL INPUT VOLTAGE
3
VDD = 3 V
2.5
2
1.5
– Output Voltage – VV
1
O
0.5
0
–250–500–750–1000250500750 10000
VID – Differential Input Voltage – µV
RI = 10 kΩ
VIC = 1.5 V
TA = 25°C
Figure 18
5
4
3
2
– Output Voltage – V
O
V
1
0
OUTPUT VOLTAGE
vs
DIFFERENTIAL INPUT VOLTAGE
VDD = 5 V
VIC = 2.5 V
RL = 10 kΩ
TA = 25°C
–250–500–750–1000250500750 10000
VID – Differential Input Voltage – µV
Figure 19
DIFFERENTIAL VOLTAGE AMPLIFICATION
vs
LOAD RESISTANCE
3
10
10
10
– Differential Voltage Amplification – V/mV
VD
A
V
= 2 V
O(PP)
TA = 25°C
2
1
1
0.1110
RL – Load Resistance – kΩ
VDD = 5 V
1
Figure 20
VDD = 3 V
2
10
10
‡
3
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
‡
For all curves where VDD = 5 V, all loads are referenced to 2.5 V. For all curves where VDD = 3 V, all loads are referenced to 1.5 V.
16
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
LARGE-SIGNAL DIFFERENTIAL VOLTAGE
AMPLIFICATION AND PHASE MARGIN
40
30
20
10
0
–10
Voltage Amplification – dB
–20
VD
AVD – Large-Signal Differential
A
–30
–40
3
10
10
f – Frequency – Hz
LARGE-SIGNAL DIFFERENTIAL VOLTAGE
AMPLIFICATION AND PHASE MARGIN
40
30
20
10
vs
FREQUENCY
Gain
4
Figure 21
vs
FREQUENCY
VDD = 3 V
RL = 10 kΩ
CL= 100 pF
TA = 25°C
Phase Margin
5
10
VDD = 5 V
RL= 10 kΩ
CL= 100 pF
TA = 25°C
Phase Margin
†
90°
45°
0°
m
om – Phase Margin
φ
–45°
–90°
6
10
†
90°
45°
10
0°
–45°
–90°
6
m
om – Phase Margin
φ
0
–10
Voltage Amplification – dB
–20
VD
AVD – Large-Signal Differential
A
–30
–40
3
10
10
f – Frequency – Hz
Gain
4
10
5
Figure 22
†
For all curves where VDD = 5 V, all loads are referenced to 2.5 V. For all curves where VDD = 3 V, all loads are referenced to 1.5 V.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
17
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
LARGE-SIGNAL DIFFERENTIAL
VOLTAGE AMPLIFICATION
vs
FREE-AIR TEMPERATURE
3
10
RL = 1 MΩ
2
10
1
10
Amplification – V/mV
– Large-Signal Differential Voltage
VD
A
VDD = 3 V
VIC = 1.5 V
VO = 0.5 V to 2.5 V
1
–75125
–50 –250255075100
TA – Free-Air Temperature – ° C
RL = 10 kΩ
Figure 23
†‡
LARGE-SIGNAL DIFFERENTIAL
VOLTAGE AMPLIFICATION
vs
FREE-AIR TEMPERATURE
4
10
3
10
RL = 1 MΩ
2
10
1
10
Amplification – V/mV
– Large-Signal Differential Voltage A
VD
1
–75 –50 –250255075100 125
RL = 10 kΩ
TA – Free-Air Temperature – ° C
VDD = 5 V
VIC = 2.5 V
VO = 1 V to 4 V
Figure 24
†‡
10
‡
3
OUTPUT IMPEDANCE
‡
vs
FREQUENCY
3
10
VDD = 3 V
TA = 25°C
Ω
2
10
1
1
10
AV = 100
AV = 10
AV = 1
1
10
– Output Impedance –
o
z
2
10
f– Frequency – Hz
10
3
10
4
3
10
VDD = 5 V
TA = 25°C
Ω
– Output Impedance –
o
z
10
10
2
1
1
10
AV = 100
AV = 10
AV = 1
1
Figure 25
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
‡
For all curves where VDD = 5 V, all loads are referenced to 2.5 V. For all curves where VDD = 3 V, all loads are referenced to 1.5 V.
OUTPUT IMPEDANCE
vs
FREQUENCY
2
10
f– Frequency – Hz
Figure 26
10
4
18
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
COMMON-MODE REJECTION RATIO
vs
FREQUENCY
100
VDD = 5 V
VO = 2.5 V
80
VDD = 3 V
60
VO = 1.5 V
40
20
CMRR – Common-Mode Rejection Ratio – dB
0
10
1
2
10
f – Frequency – Hz
10
3
Figure 27
SUPPLY-VOLTAGE REJECTION RATIO
vs
FREQUENCY
100
80
TA = 25°C
4
10
VDD = 3 V
TA = 25°C
†
COMMON-MODE REJECTION RATIO
†‡
vs
FREE-AIR TEMPERATURE
88
86
VDD = 5 V
10
84
VDD = 3 V
82
80
CMMR – Common-Mode Rejection Ratio – dB
5
78
– 50 – 250255075100
– 75125
TA – Free-Air Temperature – ° C
Figure 28
†
SUPPLY-VOLTAGE REJECTION RATIO
vs
FREQUENCY
100
80
k
SVR+
VDD = 5 V
TA = 25°C
†
k
60
40
k
SVR–
20
– Supply-Voltage Rejection Ratio – dB
0
SVR
k
–20
10
1
2
10
10
f – Frequency – Hz
Figure 29
†
For all curves where VDD = 5 V, all loads are referenced to 2.5 V. For all curves where VDD = 3 V, all loads are referenced to 1.5 V.
‡
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
SVR+
3
10
4
10
5
10
6
60
k
SVR–
40
20
– Supply-Voltage Rejection Ratio – dB
0
SVR
k
–20
10
1
2
10
f – Frequency – Hz
10
3
10
4
10
Figure 30
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
10
6
19
TLV2211, TLV2211Y
Á
Á
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
SUPPLY-VOLTAGE REJECTION RATIO
FREE-AIR TEMPERATURE
100
VDD = 2.7 V to 8 V
VIC = VO = VDD /2
98
96
94
92
– Supply-Voltage Rejection Ratio – dB
SVR
k
90
–50 –250255075100
TA – Free-Air Temperature – ° C
Figure 31
LOAD CAPACITANCE
0.040
0.035
0.030
sµ
V/
0.025
0.020
0.015
SR – Slew Rate –
0.010
VDD = 5 V
AV = –1
TA = 25°C
0.05
vs
SLEW RATE
vs
†
SUPPLY CURRENT
†
vs
SUPPLY VOLTAGE
30
VO = V
DD/2
VIC = V
No Load
25
Aµ
20
15
– Supply Current –
10
DD
I
5
125–75
0
0246
DD/2
TA = –40°C
VDD – Supply Voltage – V
TA = 25°C
TA = 85°C
810
Figure 32
‡
SLEW RATE
FREE-AIR TEMPERATURE
SR+
SR–
0.050
0.040
sµ
V/
0.030
0.020
SR – Slew Rate –
0.010
VDD = 5 V
RL = 10 kΩ
CL = 100 pF
AV = 1
†‡
vs
SR–
SR+
0
10
1
2
10
CL – Load Capacitance – pF
10
3
10
4
10
5
Figure 33
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
‡
For all curves where VDD = 5 V, all loads are referenced to 2.5 V. For all curves where VDD = 3 V, all loads are referenced to 1.5 V.
20
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0
–75125
–50 –250255075100
TA – Free-Air Temperature – ° C
Figure 34
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
INVERTING LARGE-SIGNAL PULSE
3
2.5
2
1.5
1
– Output Voltage – V
O
V
0.5
0
050 100 150 200 250 300
VOLTAGE-FOLLOWER LARGE-SIGNAL
PULSE RESPONSE
5
VDD = 5 V
RL = 10 kΩ
CL = 100 pF
4
AV = 1
TA = 25°C
RESPONSE
t – Time – µs
Figure 35
†
VDD = 3 V
RL = 10 kΩ
CL = 100 pF
AV = –1
TA = 25°C
350 400 450 500
†
INVERTING LARGE-SIGNAL PULSE
5
VDD = 5 V
RL = 10 kΩ
CL = 100 pF
4
AV = –1
TA = 25°C
3
2
– Output Voltage – V
O
V
1
0
050 100 150 200 250 300
Figure 36
VOLTAGE-FOLLOWER LARGE-SIGNAL
PULSE RESPONSE
5
VDD = 5 V
CL = 100 pF
AV = 1
4
TA = 25°C
RESPONSE
t – Time – µs
RL = 100 kΩ
Tied to 2.5 V
†
350 400 450 500
†
3
2
– Output Voltage – V
O
V
1
0
0 100 200 300 400 500 600
t – Time – µs
700 800 900 1000
Figure 37
†
For all curves where VDD = 5 V, all loads are referenced to 2.5 V. For all curves where VDD = 3 V, all loads are referenced to 1.5 V.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
2
– Output Voltage – V
O
V
RL = 10 kΩ
1
Tied to 2.5 V
0
0100200300400500
t – Time – µs
Figure 38
RL = 10 kΩ
Tied to 0 V
21
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
INVERTING SMALL-SIGNAL
PULSE RESPONSE
0.76
VDD = 3 V
RL = 10 kΩ
CL = 100 pF
074
AV = –1
TA = 25°C
0.72
0.7
– Output Voltage – V
0.68
O
V
0.66
0.64
0102030
t – Time – µs
Figure 39
VOLTAGE-FOLLOWER SMALL-SIGNAL
PULSE RESPONSE
0.76
VDD = 3 V
RL = 10 kΩ
0.74
0.72
CL = 100 pF
AV = 1
TA = 25°C
†
4050
†
INVERTING SMALL-SIGNAL
PULSE RESPONSE
2.58
VDD = 5 V
RL = 10 kΩ
2.56
CL = 100 pF
AV = –1
TA = 25°C
2.54
2.52
2.5
O
2.48
V
VO – Output Voltage – V
2.46
2.44
0102030
t – Time – µs
Figure 40
VOLTAGE-FOLLOWER SMALL-SIGNAL
PULSE RESPONSE
2.58
2.56
2.54
VDD = 5 V
RL = 10 kΩ
CL = 100 pF
AV = 1
TA = 25°C
†
4050
†
2.52
0.7
2.5
0.68
O
V
VO – Output Voltage – V
0.66
0.64
01020304050
t – Time – µs
Figure 41
†
For all curves where VDD = 5 V, all loads are referenced to 2.5 V. For all curves where VDD = 3 V, all loads are referenced to 1.5 V.
22
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
O
2.48
V
VO – Output Voltage – V
2.46
2.44
01020304050
t – Time – µs
Figure 42
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
80
Hz
70
nV/
60
50
40
30
20
10
– Equivalent Input Noise Voltage –
n
V
1000
750
500
250
EQUIVALENT INPUT NOISE VOLTAGE
vs
FREQUENCY
0
10
1
2
10
f – Frequency – Hz
10
Figure 43
INPUT NOISE VOLTAGE OVER
A 10-SECOND PERIOD
VDD = 5 V
f = 0.1 Hz to 10 Hz
TA = 25°C
VDD = 3 V
RS = 20 Ω
TA = 25°C
3
†
†
EQUIVALENT INPUT NOISE VOLTAGE
†
vs
FREQUENCY
80
10
70
nV/ Hz
60
50
40
30
20
10
– Equivalent Input Noise Voltage –
n
V
0
4
10
1
2
10
f – Frequency – Hz
10
3
VDD = 5 V
RS = 20 Ω
TA = 25°C
10
4
Figure 44
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
10
VDD = 10 V
VIC = 2.5 V
RL = 10 kΩ
TA = 25°C
AV = 100
1
†
0
AV = 10
–250
Noise Voltage – nV
–500
–750
–1000
0246
t – Time – s
810
Figure 45
†
For all curves where VDD = 5 V, all loads are referenced to 2.5 V. For all curves where VDD = 3 V, all loads are referenced to 1.5 V.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.1
AV = 1
0.01
THD + N – Total Harmonic Distortion Plus Noise – %
10
1
2
10
f – Frequency – Hz
Figure 46
10
3
10
4
23
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
GAIN-BANDWIDTH PRODUCT
FREE-AIR TEMPERATURE
80
VDD = 5 V
f = 10 kHz
RL = 10 kΩ
75
CL = 100 pF
70
65
60
Gain-Bandwidth Product – kHz
55
50
–50 – 250255010075
TA – Free-Air Temperature – ° C
Figure 47
PHASE MARGIN
LOAD CAPACITANCE
75°
TA = 25°C
vs
vs
†‡
GAIN-BANDWIDTH PRODUCT
vs
SUPPLY VOLTAGE
80
RL = 10 kΩ
CL = 100 pF
TA 25°C
75
70
65
60
Gain-Bandwidth Product – kHz
55
50
125–75
123 4 576
VDD – Supply Voltage – V
80
Figure 48
GAIN MARGIN
vs
LOAD CAPACITANCE
25
R
= 1000 Ω
null
60°
R
= 1000 Ω
null
45°
30°
m
om – Phase Margin
φ
15°
0
10
10 kΩ
V
10 kΩ
V
I
1
DD+
R
null
–
+
V
DD–
2
10
CL – Load Capacitance – pF
C
10
L
3
R
null
R
null
= 0
10
= 500 Ω
4
10
5
Figure 49
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
‡
For all curves where VDD = 5 V, all loads are referenced to 2.5 V. For all curves where VDD = 3 V, all loads are referenced to 1.5 V.
20
15
10
Gain Margin – dB
5
TA = 25°C
0
1
10
R
null
R
= 0
null
2
10
CL – Load Capacitance – pF
10
3
10
Figure 50
= 500 Ω
4
10
5
24
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
TYPICAL CHARACTERISTICS
UNITY-GAIN BANDWIDTH
vs
LOAD CAPACITANCE
80
TA = 25°C
70
60
50
40
30
20
– Unity-Gain Bandwidth – kHz
1
B
10
0
10
1
2
10
CL – Load Capacitance – pF
10
3
10
4
10
5
10
6
Figure 51
APPLICATION INFORMATION
driving large capacitive loads
The TLV2211 is designed to drive larger capacitive loads than most CMOS operational amplifiers. Figure 49
and Figure 50 illustrate its ability to drive loads up to 600 pF while maintaining good gain and phase margins
(R
= 0).
null
A smaller series resistor (R
when driving large capacitive loads. Figure 49 and Figure 50 show the effects of adding series resistances of
500 Ω and 1000 Ω. The addition of this series resistor has two effects: the first is that it adds a zero to the transfer
function and the second is that it reduces the frequency of the pole associated with the output load in the transfer
function.
The zero introduced to the transfer function is equal to the series resistance times the load capacitance. To
calculate the improvement in phase margin, equation (1) can be used.
–1
∆φ
m1
+
tan
ǒ
2 × π × UGBW × R
where :
∆φm1+
UGBW
R
null
C
improvement in phase margin
+
unity-gain bandwidth frequency
+
output series resistance
+
load capacitance
L
) at the output of the device (see Figure 52) improves the gain and phase margins
null
Ǔ
× C
null
L
(1)
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
25
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
APPLICATION INFORMATION
driving large capacitive loads (continued)
The unity-gain bandwidth (UGBW) frequency decreases as the capacitive load increases (see Figure 51). To
use equation (1), UGBW must be approximated from Figure 51.
10 kΩ
V
DD+
driving heavy dc loads
10 kΩ
V
I
–
+
V
DD–
Figure 52. Series-Resistance Circuit
/GND
R
null
C
L
The TL V2211 is designed to provide better sinking and sourcing output currents than earlier CMOS rail-to-rail
output devices. This device is specified to sink 500 µA and source 250 µA at V
maximum quiescent I
of 25 µA. This provides a greater than 90% power efficiency.
DD
= 3 V and VDD = 5 V at a
DD
When driving heavy dc loads, such as 10 kΩ, the positive edge under slewing conditions can experience some
distortion. This condition can be seen in Figure 37. This condition is affected by three factors.
D
Where the load is referenced. When the load is referenced to either rail, this condition does not occur. The
distortion occurs only when the output signal swings through the point where the load is referenced.
Figure 38 illustrates two 10-kΩ load conditions. The first load condition shows the distortion seen for a 10-kΩ
load tied to 2.5 V. The third load condition shows no distortion for a 10-kΩ load tied to 0 V.
D
Load resistance. As the load resistance increases, the distortion seen on the output decreases. Figure 38
illustrates the difference seen on the output for a 10-kΩ load and a 100-kΩ load with both tied to 2.5 V.
D
Input signal edge rate. Faster input edge rates for a step input result in more distortion than with slower input
edge rates.
26
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
macromodel information
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
APPLICATION INFORMATION
Macromodel information provided was derived using Microsim
with Microsim
PSpice
. The Boyle macromodel (see Note 6) and subcircuit in Figure 53 are generated using
the TLV2211 typical electrical and operating characteristics at T
Parts
, the model generation software used
= 25°C. Using this information, output
A
simulations of the following key parameters can be generated to a tolerance of 20% (in most cases):
D
Maximum positive output voltage swing
D
Maximum negative output voltage swing
D
Slew rate
D
Quiescent power dissipation
D
Input bias current
D
Open-loop voltage amplification
NOTE 6: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers”,
TLV2211, TLV2211Y
Advanced LinCMOS RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUAR Y 1997
MECHANICAL INFORMATION
DBV (R-PDSO-G5) PLASTIC SMALL-OUTLINE PACKAGE
0,95
1,30
1,00
0,40
0,20
45
1,80
1,50
2
1
3,10
2,70
3
0,05 MIN
M
0,25
3,00
2,50
Seating Plane
0,15 NOM
Gage Plane
0,25
0°–8°
0,10
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions include mold flash or protrusion.
4073253-3/A 09/95
28
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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