operate with a supply range from 2.7 V to 3.3 V.
The THS1030 has been designed to give circuit
developers more flexibility . The analog input to the
THS1030 can be either single-ended or differential. The THS1030 provides a wide selection of voltage
references to match the user’s design requirements. For more design flexibility, the internal reference can be
bypassed to use an external reference to suit the dc accuracy and temperature drift requirements of the
application. The out-of-range output is used to monitor any out-of-range condition in THS1030s input range.
The speed, resolution, and single-supply operation of the THS1030 are suited for applications in STB, video,
multimedia, imaging, high-speed acquisition, and communications. The speed and resolution ideally suit
charge-couple device (CCD) input systems such as color scanners, digital copiers, digital cameras, and
camcorders. A wide input voltage range between REFBS and REFTS allows the THS1030 to be applied in both
imaging and communications systems.
The THS1030I is characterized for operation from –40°C to 85°C
AVAILABLE OPTIONS
A
0°C to 70°CTHS1030CPWTHS1030CDW
–40°C to 85°CTHS1030IPWTHS1030IDW
28-TSSOP (PW)28-SOIC (DW)
PACKAGED DEVICES
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TI is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
MODE23IMode input
OE16IHI to the 3-state data bus, LO to enable the data bus
OVR13OOut-of-range indicator
REFBS25IReference bottom sense
REFBF24IReference bottom decoupling
REFSENSE18IReference sense
REFTF22IReference top decoupling
REFTS21IReference top sense
STBY17IHI = power down mode, LO = normal operation mode
V
REF
876M20IHI = THS1030 mode, LO = TLC876 mode (see section 4 for TLC876 mode)
28IAnalog supply
2IDigital driver supply
3
4
5
6
7
8
9
10
11
12
26I/OInternal and external reference for ADC
Digital I/O bit 0 (LSB)
Digital I/O bit 1
Digital I/O bit 2
Digital I/O bit 3
Digital I/O bit 4
I/O
Digital I/O bit 5
Digital I/O bit 6
Digital I/O bit 7
Digital I/O bit 8
Digital I/O bit 9 (MSB)
Lead temperature 1,6 mm (1/16 in) from case for 10 seconds 300°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions
digital inputs
MINNOMMAXUNIT
High-level input voltage, V
Low-level input voltage, V
IH
IL
analog inputs
Analog input voltage, V
Reference input voltage, V
Reference input voltage, V
Reference input voltage, V
I(AIN)
I(VREF)
I(REFTS)
I(REFBS)
power supply
AV
pp
y v
p
= 30
DV
DD
DD
REFTS, REFBS reference voltages (MODE = AVDD)
PARAMETERMINNOMMAXUNIT
REFTSReference input voltage (top)1AV
REFBSReference input voltage (bottom)0AVDD–1V
Differential input (REFTS – REFBS)12V
Switched input capacitance on REFTS0.5pF
2.4V
0.2 x DV
MINNOMMAXUNIT
REFBSREFTSV
12V
1AV
0AVDD–1V
MINNOMMAXUNIT
2.735.5
2.735.5
DD
DD
DD
V
V
V
sampling rate and resolution
Fs530MSPS
Resolution10Bits
4
PARAMETERMINNOMMAXUNIT
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Input common mode (REFTF
REFBF)/2
V
V
1 V
V
REFTF (MODE
AVDD)
V
V
V
V
V
V
REFBF (MODE
AVDD)
V
2 V
V
THS1030
2.7 V – 5.5 V, 10-BIT, 30 MSPS
CMOS ANALOG-TO-DIGITAL CONVERTER
SLAS243A – NOVEMBER 1999 – REVISED JANUARY 2000
electrical characteristics over recommended operating conditions, A VDD = 3 V , DVDD = 3 V , Fs = 30
MSPS/50% duty cycle, MODE = AV
–40°C to 85°C (unless otherwise noted)
analog inputs
PARAMETERMINTYPMAXUNIT
V
I(AIN)
C
I
FPBWFull power BW (–3 dB)150MHz
VREF reference voltages
REFTF, REFBF reference voltages
Differential input (REFTF – REFBF)12V
p
Input resistance between REFTF and REFBF600Ω
Analog input voltageREFBSREFTSV
Switched input capacitance1.2pF
DC leakage current (input = ±FS)60µA
PARAMETERMINTYPMAXUNIT
Internal 1 V reference (REFSENSE = V
Internal 2 V reference (REFSENSE = AVSS)1.9022.10V
External reference (REFSENSE = AVDD)12V
Reference input resistance18kΩ
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
+
=
=
, 2 V input span from 0.5 V to 2.5 V, external reference, TA =
External reference: The internal reference may be overridden by using an external reference. This
_
External-Divider Reference Mode
REF
condition is met by connecting REFSENSE to AVDD and an external reference circuit to the V
THS1030
ADC/DAC
REF
+
_
VBG
+
–
V
REF
= 1 + (Ra/Rb)
Ra
REFSENSE
Rb
AGND
V
= External
REF
REF
pin.
14
Figure 13. V
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
External Reference Mode
REF
REFSENSE
AV
DD
AGND
AGND
2.7 V – 5.5 V, 10-BIT, 30 MSPS
CMOS ANALOG-TO-DIGITAL CONVERTER
SLAS243A – NOVEMBER 1999 – REVISED JANUARY 2000
PRINCIPLES OF OPERATION
ADC reference
The MODE pin is used to select the reference source for the ADC.
D
Internal ADC Reference: Connect the MODE pin to A VDD to use the reference source for ADC generated
on the V
(REFTF+REFBF)/2 is set to a voltage for optimum operation of the ADC (near AVDD/2).
D
External ADC Reference: To supply an external reference source to the ADC, connect the MODE pin to
AGND. An external reference source should be connected to REFTF/REFTS and REFBF/REFBS.
MODE = AGND closes internal switches to allow a Kelvin connection through REFTS/REFBS, and disables
the on-chip amplifiers which drive on to the ADC references. Differential input is not supported
analog input mode
single-ended input
The single-ended input can be configured to work with either an external ADC reference or internal ADC
reference.
D
External ADC Reference Mode: A single-ended analog input is accepted at the AIN pin where the input
signal is bounded by the voltages on the REFTS and REFBS pins. Figure 14 shows an example of applying
external reference to REFTS and REFBS pins in which REFTS is connected to the low-impedance 2-V
source and REFBS is connected to the low-impedance 2-V source. REFTS and REFBS may be driven to
any voltage within the supply as long as the difference (REFTS – REFBS) is between 1 V and 2 V as
specified in Table 2. Figure 15 shows an example of an external reference using a Kelvin connection to
eliminate line voltage drop errors.
pin. (See V
REF
REFERENCE described in Table 2) such that (REFTF–REFBF) = V
Figure 15. Kelvin Connection With External ADC Reference Mode
D
Internal ADC Reference Mode With External Input Common Mode: The input common mode is supplied
to pins REFTS and REFBS while connected together. The input signal should be centered around this
common mode with peak-to-peak input equal to the voltage on the V
pin. Input can be either dc-coupled
REF
or ac-coupled to the same common mode voltage (see Figure 16) or any other voltage within the input
voltage range.
A/D
16
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
single-ended input (continued)
THS1030
2.7 V – 5.5 V, 10-BIT, 30 MSPS
CMOS ANALOG-TO-DIGITAL CONVERTER
SLAS243A – NOVEMBER 1999 – REVISED JANUARY 2000
PRINCIPLES OF OPERATION
2 V
1 V
1.5 V
AV
DD
AIN
REFTS
REFBS
MODE
V
REF
REFSENSE
+
_
THS1030
SHA
+–
1 V
Figure 16. External Input Common Mode
D
Internal ADC Reference Mode With Common Mode Input V
V
/2 by connecting REFTS to V
REF
and REFBS to AVSS. The input signal at AIN will swing between V
In this mode, the first differential input is applied to the AIN pin and the second differential input is applied to the
common point where REFTS and REFBS are tied together. The common mode of the input should be set to
AVDD/2 as shown in Figure 19. The maximum magnitude of the differential input signal should be equal to V
V
REF
0.1 µF
10 µF
0.1 µF
REF
.
AVDD/2
AV
DD
AIN
REFTS
REFBS
MODE
V
REF
V
is either internal or external
REF
Figure 19. Differential Input
THS1030
SHA
ADC
REF
A/D
REFTF
0.1 µF
REFBF
0.1 µF
10 µF
0.1 µF
18
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2.7 V – 5.5 V, 10-BIT, 30 MSPS
CMOS ANALOG-TO-DIGITAL CONVERTER
SLAS243A – NOVEMBER 1999 – REVISED JANUARY 2000
PRINCIPLES OF OPERATION
digital input mode
D
3-State Output: The digital outputs can be set to high-impedance state by applying a LO logic to the OE
pin.
D
Power Down: The whole device will power down by applying a HI logic to the STBY pin. The ADC will wake
up in 400 ns after the pin STBY is reset.
TLC876 mode
The THS1030 is pin compatible with the TI TLC876 and thus enables users of TLC876 to upgrade to higher
speed by dropping the THS1030 into their sockets. Floating the MODE pin effectively puts the THS1030 into
876 mode using the external ADC reference. The REFSENSE pin will be connected to DV
socket. In the TLC876/AD876 mode, the pipeline latency will be switched to 3.5 cycles to match TLC876/AD876
specifications.
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
20
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
THS1030
2.7 V – 5.5 V, 10-BIT, 30 MSPS
CMOS ANALOG-TO-DIGITAL CONVERTER
SLAS243A – NOVEMBER 1999 – REVISED JANUARY 2000
MECHANICAL DATA
DW (R-PDSO-G**) PLASTIC SMALL-OUTLINE
16 PINS SHOWN
0.050 (1,27)
16
1
0.020 (0,51)
0.014 (0,35)
9
0.299 (7,59)
0.293 (7,45)
8
A
0.010 (0,25)
0.419 (10,65)
0.400 (10,15)
M
0.010 (0,25) NOM
0°–8°
Gage Plane
0.010 (0,25)
0.050 (1,27)
0.016 (0,40)
0.104 (2,65) MAX
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-013
0.012 (0,30)
0.004 (0,10)
DIM
A MAX
A MIN
PINS **
16
0.410
(10,41)
0.400
(10,16)
Seating Plane
0.004 (0,10)
20
0.510
(12,95)
0.500
(12,70)
0.610
(15,49)
0.600
(15,24)
24
28
0.710
(18,03)
0.700
(17,78)
4040000/C 07/96
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
21
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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