High-Impedance State During Power Up
and Power Down
D
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
D
Flow-Through Architecture Optimizes PCB
Layout
D
High-Drive Outputs (–32-mA IOH, 64-mA IOL)
D
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
D
Latch-Up Performance Exceeds 500 mA Per
JESD 17
D
Package Options Include Plastic Shrink
Small-Outline (DL), Thin Shrink
Small-Outline (DGG), and Thin Very
Small-Outline (DGV) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
Using 25-mil Center-to-Center Spacings
description
SN54ABTH16245 . . . WD PACKAGE
SN74ABTH16245 . . . DGG, DGV, OR DL PACKAGE
1DIR
1B1
1B2
GND
1B3
1B4
V
CC
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
V
CC
2B5
2B6
GND
2B7
2B8
2DIR
(TOP VIEW)
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1OE
1A1
1A2
GND
1A3
1A4
V
CC
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
V
CC
2A5
2A6
GND
2A7
2A8
2OE
The ’ABTH16245 devices are 16-bit noninverting
3-state transceivers that provide synchronous
two-way communication between data buses.
The control-function implementation minimizes
external timing requirements.
These devices can be used as two 8-bit transceivers or one 16-bit transceiver. They allow data transmission
from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control
(DIR) input. The output-enable (OE
) input can be used to disable the devices so that the buses are effectively
isolated.
When VCC is between 0 and 2.1 V , the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 2.1 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN54ABTH16245 is characterized for operation over the full military temperature range of –55°C to 125°C.
The SN74ABTH16245 is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus and EPIC-ΙΙB are trademarks of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 1999, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
SN54ABTH16245, SN74ABTH16245
OPERATION
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS662I – MARCH 1996 – REVISED MARCH 1999
FUNCTION TABLE
(each 8-bit section)
INPUTS
DIR
OE
LLB data to A bus
LHA data to B bus
HXIsolation
logic symbol
†
1OE
1DIR
2OE
2DIR
1A1
1A2
1A3
1A4
1A5
1A6
1A7
1A8
2A1
2A2
2A3
2A4
2A5
2A6
2A7
2A8
48
1
25
24
47
46
44
43
41
40
38
37
36
35
33
32
30
29
27
26
G3
3 EN1 [BA]
3 EN2 [AB]
G6
6 EN4 [BA]
6 EN5 [AB]
1
4
2
1B1
2
5
11
12
13
14
16
17
19
20
22
23
3
1B2
5
1B3
6
1B4
8
1B5
9
1B6
1B7
1B8
2B1
2B2
2B3
2B4
2B5
2B6
2B7
2B8
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
UNIT
logic diagram (positive logic)
SN54ABTH16245, SN74ABTH16245
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS662I – MARCH 1996 – REVISED MARCH 1999
1DIR
1A1
1
47
To Seven Other Channels
48
1OE
2
1B1
2DIR
2A1
24
36
To Seven Other Channels
25
13
2OE
2B1
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TA = 25°CSN54ABTH16245SN74ABTH16245
MINTYP†MAXMINMAXMINMAX
V
IK
OH
V
hys
Control
inputs
I
A or B ports
I(hold)
OZPU
OZPD
I
off
I
CEX
‡
I
O
I
A or B ports
CC
§
∆I
CC
Control
C
i
inputs
C
A or B ports VO = 2.5 V or 0.5 V6pF
io
* On products compliant to MIL-PRF-38535, this parameter does not apply.
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
†
All typical values are at VCC = 5 V.
‡
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
§
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
SN54ABTH16245, SN74ABTH16245
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS662I – MARCH 1996 – REVISED MARCH 1999
PARAMETER MEASUREMENT INFORMATION
500 Ω
t
w
1.5 V
500 Ω
1.5 V
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Input
Input
Output
Output
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
1.5 V1.5 V
t
PLH
t
PHL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
S1
t
PHL
1.5 V
t
PLH
1.5 V1.5 V
3 V
0 V
V
V
V
V
7 V
GND
OH
OL
OH
OL
Open
3 V
0 V
Timing Input
Data Input
Output
Control
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
TESTS1
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
t
su
1.5 V1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
t
PZL
1.5 V
t
PZH
1.5 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Open
Open
1.5 V
t
7 V
h
1.5 V1.5 V
VOL + 0.3 V
VOH – 0.3 V
t
PLZ
t
PHZ
3 V
0 V
3 V
0 V
3 V
0 V
3.5 V
V
OL
V
OH
≈ 0 V
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICA TIONS USING SEMICONDUCT OR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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