Eight (‘388) or Sixteen (‘386) Line Receivers
Meet or Exceed the Requirements of ANSI
TIA/EIA-644 Standard
D
Integrated 110-Ω Line Termination
Resistors on LVDT Products
D
Designed for Signaling Rates† Up To
630 Mbps
D
SN65 Version’s Bus-Terminal ESD Exceeds
15 kV
D
Operates From a Single 3.3-V Supply
D
Typical Propagation Delay Time of 2.6 ns
D
Output Skew 100 ps (Typ)
Part-To-Part Skew is Less Than 1 ns
D
LVTTL Levels are 5-V Tolerant
D
Open-Circuit Fail Safe
D
Flow-Through Pin Out
D
Packaged in Thin Shrink Small-Outline
Package With 20-mil Terminal Pitch
description
The ‘LVDS388 and ‘LVDT388 (T designates
integrated termination) are eight and the
‘LVDS386 and ‘LVDT386 sixteen differential line
receivers respectively that implement the electrical characteristics of low-voltage differential
signaling (L VDS). This signaling technique lowers
the output voltage levels of 5-V differential
standard levels (such as EIA/TIA-422B) to reduce
the power, increase the switching speeds, and
allow operation with a 3-V supply rail. Any of the
eight or sixteen differential receivers will provide
a valid logical output state with a ±100 mV
differential input voltage within the input commonmode voltage range. The input common-mode
voltage range allows 1 V of ground potential
difference between two L VDS nodes. Additionally ,
the high-speed switching of L VDS signals almost
always require the use of a line impedance
matching resistor at the receiving end of the cable
or transmission media. The LVDT products
eliminate this external resistor by integrating it
with the receiver.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
†
Signaling rate, 1/t, where t is the minimum unit interval and is expressed in the units bits/s (bits per second)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
The intended application of this device and signaling technique is for point-to-point baseband data transmission
over controlled impedance media of approximately 100 Ω. The transmission media may be printed circuit board
traces, backplanes, or cables. The large number of receivers integrated into the same substrate along with the
low pulse skew of balanced signaling, allows extremely precise timing alignment of clock and data for
synchronous parallel data transfers. When used with its companion, 8- or 16-channel driver, the SN65LVDS389
or SN65L VDS387, over 300 million data transfers per second in single-edge clocked systems are possible with
very little power. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation
characteristics of the media, the noise coupling to the environment, and other system characteristics.)
Lead temperature 1,6 mm (1/16 in) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
‡
This is the inverse of the junction-to-ambient thermal resistance when board-mounted (low-k) and with no air flow.
2. Tested in accordance with MIL-STD-883C Method 3015.7.
Differential input current (IIA – IIB)‘LVDT
Power–off Input current (A or B inputs)‘LVDSVCC = 0 V, VI=2.4 V12±20µA
Power–off Input current (A or B inputs)‘LVDTVCC = 0 V, VI=2.4 V±40µA
High–level input current (enables)VIH = 2 V10µA
Low–level input current (enables)VIL = 0.8 V10µA
p
Input Capacitance, A or B input to GNDVID = 0.4 sin 2.5E09 t V5pF
T ermination impedanceVID = 0.4 sin 2.5E09 t V88132Ω
p
’
p
Enabled, No load5070
Disabled3
VI = 0 V–13–20
VI = 2.4 V–1.2–3
VI = 0 V, other input open–40
VI = 2.4 V, other input open–2.4
VIA= 0 V,VIB = 0.1V,
VIA= 2.4 V,VIB = 2.3 V
VIA= 0.2 V,VIB = 0V,
VIA= 2.4 V,VIB = 2.2 V
VO = 0 V±1
VO = 3.6 V10
–100mV
1.52.2mA
100mV
±2µA
µ
µ
switching characteristics over recommended operating conditions (unless otherwise noted)
PARAMETERTEST CONDITIONSMIN TYP†MAXUNIT
t
PLH
t
PHL
t
r
t
f
t
sk(p)
t
sk(o)
t
sk(pp)
t
PZH
t
PZL
t
PHZ
t
PLZ
†
All typical values are at 25°C and with a 3.3 V supply.
‡
t
sk(o)
§
t
sk(pp)
with the same supply voltages, at the same temperature, and have identical packages and test circuits.
Propagation delay time, low-to-high-level output12.64ns
Propagation delay time, high-to-low-level output12.54ns
Differential output signal rise time5008001200ps
Differential output signal fall time
Pulse skew (|t
Output skew
Part-to-part skew
Propagation delay time, high-impedance-to-high-level output715ns
Propagation delay time, high-impedance-to-low-level output
Propagation delay time, high-level-to-high-impedance output
Propagation delay time, low-level-to-high-impedance output715ns
is the magnitude of the time difference between the t
is the magnitude of the difference in propagation delay times between any specified terminals of two devices when both devices operate
‡
PHL
– t
|)
PLH
§
or t
PLH
of all drivers of a single device with all of their inputs connected together.
PHL
See Figure 2
5008001200ps
150600ps
100400ps
1ns
715ns
715ns
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
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