•For Complete Module Descriptions, See the
MSP430x2xx Family User’s Guide (SLAU144)
DESCRIPTION
The Texas Instruments MSP430 family of ultra-low-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low-power
modes, is optimized to achieve extended battery life in portable measurement applications. The device features a
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.
The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 µs.
The MSP430G2x55 series are ultra-low-power mixed signal microcontrollers with built-in 16-bit timers, up to 32
I/O touch-sense-enabled pins, a versatile analog comparator, and built-in communication capability using the
universal serial communication interface. For configuration details, see Table 1.
Typical applications include low-cost sensor systems that capture analog signals, convert them to digital values,
and then process the data for display or for transmission to a host system.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
P1.0/General-purpose digital I/O pin
TACLK/3129I/OTimer_A, clock signal TACLK input
ADC10CLKADC10, conversion clock
P1.1/General-purpose digital I/O pin
TA0.0Timer_A, capture: CCI0A input, compare: OUT0 output or BSL transmit
P1.2/General-purpose digital I/O pin
TA0.1Timer_A, capture: CCI1A input, compare: OUT1 output
P1.3/General-purpose digital I/O pin
TA0.2Timer_A, capture: CCI2A input, compare: OUT2 output
P1.4/General-purpose digital I/O pin
SMCLK/3533I/OSMCLK signal output
TCKJTAG test clock, input terminal for device programming and test
P1.5/General-purpose digital I/O pin
TA0.0/3634I/OTimer_A, compare: OUT0 output
TMSJTAG test mode select, input terminal for device programming and test
P1.6/General-purpose digital I/O pin /
TA0.1/Timer_A, compare: OUT1 output
TDI/JTAG test data input terminal during programming and test
TCLKJTAG test clock input terminal during programming and test
P1.7/General-purpose digital I/O pin
TA0.2/Timer_A, compare: OUT2 output
TDO/JTAG test data output terminal during programming and test
(1)
TDI
P2.0/General-purpose digital I/O pin
TA1CLK/Timer1_A3.TACLK
ACLK/ACLK output
A0ADC10, analog input A0
P2.1/General-purpose digital I/O pin
TAINCLK/Timer_A, clock signal at INCLK
SMCLK/SMCLK signal output
A1ADC10, analog input A1
P2.2/General-purpose digital I/O pin
TA0.0/108I/OTimer_A, capture: CCI0B input or BSL receive, compare: OUT0 output
A2ADC10, analog input A2
P2.3/General-purpose digital I/O pin
TA0.1/Timer_A, capture CCI1B input, compare: OUT1 output
A3/2927I/OADC10, analog input A3
VREF-/Negative reference voltage output
VEREF-Negative reference voltage input
P2.4/General-purpose digital I/O pin
TA0.2/Timer_A, compare: OUT2 output
A4/3028I/OADC10, analog input A4
VREF+/Positive reference voltage output
VEREF+Positive reference voltage input
NO.I/ODESCRIPTION
DARHA
3230I/O
3331I/O
3432I/O
3735I/O
3836I/O
JTAG test data input terminal during programming and test
P4.3/General-purpose digital I/O pin
TB0.0/Timer_B, capture: CCI0B input, compare: OUT0 output
A12/ADC10 analog input A12
CA3Comparator_A+, CA3 input
P4.4/General-purpose digital I/O pin
TB0.1/Timer_B, capture: CCI1B input, compare: OUT1 output
A13/ADC10 analog input A13
CA4Comparator_A+, CA4 input
P4.5/General-purpose digital I/O pin
TB0.2/Timer_B, compare: OUT2 output
A14/ADC10 analog input A14
CA5Comparator_A+, CA5 input
P4.6/General-purpose digital I/O pin
TBOUTH/Timer_B, switch all TB0 to TB3 outputs to high impedance
CAOUT/2321I/OComparator_A+ Output
A15/ADC10 analog input A15
CA6Comparator_A+, CA6 input
P4.7/General-purpose digital I/O pinCB0
TBCLK/Timer_B, clock signal TBCLK input
CAOUT/Comparator_A+ Output
CA7Comparator_A+, CA7 input
RST/Reset or nonmaskable interrupt input
NMI/SBWTDIOSpy-Bi-Wire test data input/output during programming and test
TEST/Selects test mode for JTAG pins on Port 1. The device protection fuse is
SBWTCKSpy-Bi-Wire test clock input during programming and test
DV
CC
AV
CC
DV
SS
AV
SS
QFN PadNAPadNAQFN package pad; connection to DVSSrecommended.
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions, are
performed as register operations in conjunction with
seven addressing modes for source operand and four
addressing modes for destination operand.
The CPU is integrated with 16 registers that provide
reduced instruction execution time. The register-toregister operation execution time is one cycle of the
CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register, and
constant generator,respectively. Theremaining
registers are general-purpose registers.
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled with
all instructions.
The instruction set consists of the original 51
instructions with three formats and seven address
modes and additional instructions for the expanded
address range. Each instruction can operate on word
and byte data.
MSP430G2955
MSP430G2855
MSP430G2755
SLAS800 –MARCH 2013
Instruction Set
The instruction set consists of 51 instructions with
three formats and seven address modes. Each
instruction can operate on word and byte data.
Table 3 shows examples of the three types of
instruction formats; Table 4 shows the address
modes.
Dual operands, source-destinationADD R4,R5R4 + R5 ---> R5
Single operands, destination onlyCALL R8PC -->(TOS), R8--> PC
Relative jump, un/conditionalJNEJump-on-equal bit = 0
The MSP430 has one active mode and five software selectable low-power modes of operation. An interrupt
event can wake up the device from any of the low-power modes, service the request, and restore back to the
low-power mode on return from the interrupt program.
The following six operating modes can be configured by software:
•Active mode (AM)
– All clocks are active.
•Low-power mode 0 (LPM0)
– CPU is disabled.
– ACLK and SMCLK remain active.
– MCLK is disabled.
•Low-power mode 1 (LPM1)
– CPU is disabled
– ACLK and SMCLK remain active.
– MCLK is disabled.
– DCO's dc generator is disabled if DCO not used in active mode.
•Low-power mode 2 (LPM2)
– CPU is disabled.
– ACLK remains active.
– MCLK and SMCLK are disabled.
– DCO's dc generator remains enabled.
•Low-power mode 3 (LPM3)
– CPU is disabled.
– ACLK remains active.
– MCLK and SMCLK are disabled.
– DCO's dc generator is disabled.
•Low-power mode 4 (LPM4)
– CPU is disabled.
– ACLK, MCLK, and SMCLK are disabled.
– DCO's dc generator is disabled.
– Crystal oscillator is stopped.
The interrupt vectors and the power-up starting address are located in the address range 0FFFFh to 0FFC0h.
The vector contains the 16-bit address of the appropriate interrupt handler instruction sequence.
If the reset vector (located at address 0FFFEh) contains 0FFFFh (for example, flash is not programmed), the
CPU goes into LPM4 immediately after power-up.
Table 5. Interrupt Sources, Flags, and Vectors
INTERRUPT SOURCEINTERRUPT FLAGPRIORITY
Power-UpPORIFG
External ResetRSTIFG
Watchdog Timer+WDTIFGReset0FFFEh31, highest
Flash key violationKEYV
PC out-of-range
(1) A reset is generated if the CPU tries to fetch instructions from within the module register memory address range (0h to 01FFh) or from
within unused address ranges.
(2) Multiple source flags
(3) (non)-maskable: the individual interrupt-enable bit can disable an interrupt event, but the general interrupt enable cannot.
(4) Interrupt flags are located in the module.
(5) In SPI mode: UCB0RXIFG. In I2C mode: UCALIFG, UCNACKIFG, ICSTTIFG, UCSTPIFG.
(6) In UART or SPI mode: UCB0TXIFG. In I2C mode: UCB0RXIFG, UCB0TXIFG.
(7) This location is used as bootstrap loader security key (BSLSKEY). A 0xAA55 at this location disables the BSL completely. A zero (0h)
disables the erasure of the flash if an invalid password is supplied.
(8) The interrupt vectors at addresses 0FFDEh to 0FFC0h are not used in this device and can be used for regular program code if
Most interrupt and module enable bits are collected into the lowest address space. Special function register bits
not allocated to a functional purpose are not physically present in the device. Simple software access is provided
with this arrangement.
Legendrw:Bit can be read and written.
rw-0,1:Bit can be read and written. It is reset or set by PUC.
rw-(0,1):Bit can be read and written. It is reset or set by POR.
SFR bit is not present in device.
Table 6. Interrupt Enable Register 1 and 2
Address76543210
00hACCVIENMIIEOFIEWDTIE
rw-0rw-0rw-0rw-0
WDTIEWatchdog timer interrupt enable. Inactive if watchdog mode is selected. Active if Watchdog timer is configured in
WDTIFGSet on watchdog timer overflow (in watchdog mode) or security key violation.
OFIFGFlag set on oscillator fault.
PORIFGPower-on reset interrupt flag. Set on VCCpower-up.
RSTIFGExternal reset interrupt flag. Set on a reset condition at RST/NMI pin in reset mode. Reset on VCCpower-up.
NMIIFGSet via RST/NMI pin
Address76543210
03hUCB0TXIFGUCB0RXIFG UCA0TXIFGUCA0RXIFG
UCA0RXIFGUSCI_A0 receive interrupt flag
UCA0TXIFGUSCI_A0 transmit interrupt flag
UCB0RXIFGUSCI_B0 receive interrupt flag
UCB0TXIFGUSCI_B0 transmit interrupt flag
Reset on VCCpower-on or a reset condition at the RST/NMI pin in reset mode.
MemorySize32kB48kB56kB
Main: interrupt vectorFlash0xFFFF to 0xFFC00xFFFF to 0xFFC00xFFFF to 0xFFC0
Main: code memoryFlash0xFFFF to 0x80000xFFFF to 0x40000xFFFF to 0x2100
Information memorySize256 Byte256 Byte256 Byte
Flash0x10FF to 0x10000x10FF to 0x10000x10FF to 0x1000
RAM (total)Size4kB4kB4kB
0x20FF to 0x11000x20FF to 0x11000x20FF to 0x1100
ExtendedSize2KB2KB2KB
0x20FF to 0x19000x20FF to 0x19000x20FF to 0x1900
MirroredSize2KB2KB2KB
0x18FF to 0x11000x18FF to 0x11000x18FF to 0x1100
RAM (mirrored at 0x18FF to
0x1100)
Peripherals16-bit0x01FF to 0x01000x01FF to 0x01000x01FF to 0x0100
Size2KB2KB2KB
0x09FF to 0x02000x09FF to 0x02000x09FF to 0x0200
8-bit0x00FF to 0x00100x00FF to 0x00100x00FF to 0x0010
8-bit SFR0x000F to 0x00000x000F to 0x00000x000F to 0x0000
SLAS800 –MARCH 2013
Bootstrap Loader (BSL)
The MSP430 BSL enables users to program the flash memory or RAM using a UART serial interface. Access to
the MSP430 memory via the BSL is protected by user-defined password. For complete description of the
features of the BSL and its implementation, see the MSP430 Programming Via the Bootstrap Loader User'sGuide (SLAU319).
Table 9. BSL Function Pins
BSL FUNCTIONDA PACKAGE PINSRHA PACKAGE PINS
Data transmit32 - P1.130 - P1.1
Data receive10 - P2.28 - P2.2
Flash Memory
The flash memory can be programmed via the Spy-Bi-Wire or JTAG port or in-system by the CPU. The CPU can
perform single-byte and single-word writes to the flash memory. Features of the flash memory include:
•Flash memory has n segments of main memory and four segments of information memory (A to D) of
64 bytes each. Each segment in main memory is 512 bytes in size.
•Segments 0 to n may be erased in one step, or each segment may be individually erased.
•Segments A to D can be erased individually or as a group with segments 0 to n. Segments A to D are also
called information memory.
•Segment A contains calibration data. After reset segment A is protected against programming and erasing. It
can be unlocked but care should be taken not to erase this segment if the device-specific calibration data is
required.
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all
instructions. For complete module descriptions, see the MSP430x2xx Family User's Guide (SLAU144).
Oscillator and System Clock
The clock system is supported by the basic clock module that includes support for a 32768-Hz watch crystal
oscillator, an internal very-low-power low-frequency oscillator and an internal digitally controlled oscillator (DCO).
The basic clock module is designed to meet the requirements of both low system cost and low power
consumption. The internal DCO provides a fast turn-on clock source and stabilizes in less than 1 µs. The basic
clock module provides the following clock signals:
•Auxiliary clock (ACLK), sourced either from a 32768-Hz watch crystal or the internal LF oscillator.
•Main clock (MCLK), the system clock used by the CPU.
•Sub-Main clock (SMCLK), the sub-system clock used by the peripheral modules.
The DCO settings to calibrate the DCO output frequency are stored in the information memory segment A.
CAL_ADC_15VREF_FACTOR0x0006wordREF2_5 = 0, TA= 30°C, I
CAL_ADC_OFFSET0x0004wordExternal VREF = 1.5 V, f
CAL_ADC_GAIN_FACTOR0x0002wordExternal VREF = 1.5 V, f
CAL_BC1_1MHZ0x0009byte-
CAL_DCO_1MHZ0x0008byte-
CAL_BC1_8MHZ0x0007byte-
CAL_DCO_8MHZ0x0006byte-
CAL_BC1_12MHZ0x0005byte-
CAL_DCO_12MHZ0x0004byte-
CAL_BC1_16MHZ0x0003byte-
CAL_DCO_16MHZ0x0002byte-
ADDRESS
OFFSET
VREF+
VREF+
ADC10CLK
ADC10CLK
= 1 mA
= 0.5 mA
= 5 MHz
= 5 MHz
SLAS800 –MARCH 2013
Brownout
The brownout circuit is implemented to provide the proper internal reset signal to the device during power on and
power off.
Digital I/O
Four 8-bit I/O ports are implemented:
•All individual I/O bits are independently programmable.
•Any combination of input, output, and interrupt condition (port P1 and port P2 only) is possible.
•Edge-selectable interrupt input capability for all bits of port P1 and port P2.
•Read and write access to port-control registers is supported by all instructions.
•Each I/O has an individually programmable pullup or pulldown resistor.
•Each I/O has an individually programmable pin oscillator enable bit to enable low-cost touch sensing.
Watchdog Timer (WDT+)
The primary function of the watchdog timer (WDT+) module is to perform a controlled system restart after a
software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog
function is not needed in an application, the module can be disabled or configured as an interval timer and can
generate interrupts at selected time intervals.
Timer0_A3 and Timer1_A3 are 16-bit timers/counters with three capture/compare registers. Timer_A3 can
support multiple capture/compares, PWM outputs, and interval timing. Timer_A3 also has extensive interrupt
capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the
capture/compare registers.
Timer0_B3 is a 16-bit timer/counter with three capture/compare registers. Timer0_B3 can support multiple
capture/compares, PWM outputs, and interval timing. Timer0_B3 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
The USCI module is used for serial data communication. The USCI module supports synchronous
communication protocols such as SPI (3 or 4 pin) and I2C, and asynchronous communication protocols such as
UART, enhanced UART with automatic baudrate detection (LIN), and IrDA.
USCI_A0 provides support for SPI (3 or 4 pin), UART, enhanced UART, and IrDA.
USCI_B0 provides support for SPI (3 or 4 pin) and I2C.
Comparator_A+
The primary function of the comparator_A+ module is to support precision slope analog-to-digital conversions,
battery-voltage supervision, and monitoring of external analog signals.
ADC10
The ADC10 module supports fast 10-bit analog-to-digital conversions. The module implements a 10-bit SAR
core, sample select control, reference generator, and data transfer controller (DTC) for automatic conversion
result handling, allowing ADC samples to be converted and stored without any CPU intervention.
USCI_B0 receive bufferUCB0RXBUF06Eh
USCI_B0 statusUCB0STAT06Dh
USCI B0 I2C Interrupt enableUCB0CIE06Ch
USCI_B0 bit rate control 1UCB0BR106Bh
USCI_B0 bit rate control 0UCB0BR006Ah
USCI_B0 control 1UCB0CTL1069h
USCI_B0 control 0UCB0CTL0068h
USCI_B0 I2C slave addressUCB0SA011Ah
USCI_B0 I2C own addressUCB0OA0118h
USCI_A0USCI_A0 transmit bufferUCA0TXBUF067h
USCI_A0 receive bufferUCA0RXBUF066h
USCI_A0 statusUCA0STAT065h
USCI_A0 modulation controlUCA0MCTL064h
USCI_A0 baud rate control 1UCA0BR1063h
USCI_A0 baud rate control 0UCA0BR0062h
USCI_A0 control 1UCA0CTL1061h
USCI_A0 control 0UCA0CTL0060h
USCI_A0 IrDA receive controlUCA0IRRCTL05Fh
USCI_A0 IrDA transmit controlUCA0IRTCTL05Eh
USCI_A0 auto baud rate controlUCA0ABCTL05Dh
ADC10ADC analog enable 0ADC10AE004Ah
ADC analog enable 1ADC10AE104Bh
ADC data transfer control register 1ADC10DTC1049h
ADC data transfer control register 0ADC10DTC0048h
Comparator_A+Comparator_A+ port disableCAPD05Bh
Comparator_A+ control 2CACTL205Ah
Comparator_A+ control 1CACTL1059h
Basic Clock System+Basic clock system control 3BCSCTL3053h
Basic clock system control 2BCSCTL2058h
Basic clock system control 1BCSCTL1057h
DCO clock frequency controlDCOCTL056h
Port P4Port P4 selection 2P4SEL2044h
Port P4 resistor enableP4REN011h
Port P4 selectionP4SEL01Fh
Port P4 directionP4DIR01Eh
Port P4 outputP4OUT01Dh
Port P4 inputP4IN01Ch
Port P3Port P3 selection 2P3SEL2043h
Port P3 resistor enableP3REN010h
Port P3 selectionP3SEL01Bh
Port P3 directionP3DIR01Ah
Port P3 outputP3OUT019h
Port P3 inputP3IN018h
Table 16. Peripherals With Byte Access (continued)
MODULEREGISTER DESCRIPTIONOFFSET
Port P2Port P2 selection 2P2SEL2042h
Port P2 resistor enableP2REN02Fh
Port P2 selectionP2SEL02Eh
Port P2 interrupt enableP2IE02Dh
Port P2 interrupt edge selectP2IES02Ch
Port P2 interrupt flagP2IFG02Bh
Port P2 directionP2DIR02Ah
Port P2 outputP2OUT029h
Port P2 inputP2IN028h
Port P1Port P1 selection 2P1SEL2041h
Port P1 resistor enableP1REN027h
Port P1 selectionP1SEL026h
Port P1 interrupt enableP1IE025h
Port P1 interrupt edge selectP1IES024h
Port P1 interrupt flagP1IFG023h
Port P1 directionP1DIR022h
Port P1 outputP1OUT021h
Port P1 inputP1IN020h
Supply voltage range,
during flash memory
programming
Supply voltage range,
during program execution
Legend:
16 MHz
System Frequency - MHz
12 MHz
6 MHz
1.8 V
Supply Voltage - V
3.3 V
2.7 V
2.2 V
3.6 V
MSP430G2955
MSP430G2855
MSP430G2755
www.ti.com
Absolute Maximum Ratings
Voltage applied at VCCto V
Voltage applied to any pin
Diode current at any device pin±2 mA
Storage temperature range, T
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is
applied to the TEST pin when blowing the JTAG fuse.
(3) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
SS
(2)
stg
(1)
(3)
Unprogrammed device–55°C to 150°C
Programmed device–55°C to 150°C
Recommended Operating Conditions
Typical values are specified at VCC= 3.3 V and TA= 25°C (unless otherwise noted)
V
V
T
f
SYSTEM
(1) The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse duration of the
(2) Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
Supply voltageV
CC
Supply voltage0V
SS
Operating free-air temperature-4085°C
A
Processor frequency (maximum MCLK frequencyVCC= 2.7 V,
using the USART module)
specified maximum frequency.
(1)(2)
During program execution1.83.6
During flash programming or erase2.23.6
VCC= 1.8 V,
Duty cycle = 50% ± 10%
Duty cycle = 50% ± 10%
VCC= 3.3 V,
Duty cycle = 50% ± 10%
SLAS800 –MARCH 2013
–0.3 V to 4.1 V
–0.3 V to VCC+ 0.3 V
MINNOMMAX UNIT
dc6
dc12 MHz
dc16
Note:Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum V
Electrical Characteristics
Active Mode Supply Current Into VCCExcluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETERTEST CONDITIONST
f
= f
MCLK
= 0 Hz,
= f
DCO
f
ACLK
I
AM,1MHz
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
(2) The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external
load capacitance is chosen to closely match the required 9 pF.
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
(2) The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external
load capacitance is chosen to closely match the required 9 pF.
(3) Current for brownout and WDT clocked by SMCLK included.
(4) Current for brownout and WDT clocked by ACLK included.
(5) Current for brownout included.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETERTEST CONDITIONSV
V
V
V
R
C
Positive-going input threshold voltageV
IT+
Negative-going input threshold voltageV
IT–
Input voltage hysteresis (V
hys
Pullup or pulldown resistor3 V203550kΩ
Pull
Input capacitanceVIN= VSSor V
I
IT+
– V
)3 V0.31V
IT–
For pullup: VIN= V
For pulldown: VIN= V
SS
CC
CC
CC
3 V1.352.25
3 V0.751.65
MINTYPMAX UNIT
0.45 V
CC
0.25 V
CC
5pF
Leakage Current, Ports Px
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
I
lkg(Px.y)
PARAMETERTEST CONDITIONSV
High-impedance leakage current
(1) (2)
CC
3 V±50nA
(1) The leakage current is measured with VSSor VCCapplied to the corresponding pin(s), unless otherwise noted.
(2) The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup/pulldown resistor is
disabled.
MINMAX UNIT
0.75 V
0.55 V
www.ti.com
CC
CC
Outputs, Ports Px
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETERTEST CONDITIONSV
V
V
High-level output voltageI
OH
Low-level output voltageI
OL
(1) The maximum total current, I
specified.
(OHmax)
and I
= –6 mA
(OHmax)
= 6 mA
(OLmax)
, for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop
(OLmax)
(1)
(1)
CC
3 VVCC– 0.3V
3 VVSS+ 0.3V
MINTYPMAX UNIT
Output Frequency, Ports Px
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
f
Px.y
f
Port_CLK
PARAMETERTEST CONDITIONSV
Port output frequency
(with load)
Px.y, CL= 20 pF, RL= 1 kΩ
Clock output frequencyPx.y, CL= 20 pF
(2)
(1) (2)
CC
3 V12MHz
3 V16MHz
(1) A resistive divider with two 0.5-kΩ resistors between VCCand VSSis used as load. The output is connected to the center tap of the
divider.
(2) The output voltage reaches at least 10% and 90% VCCat the specified toggle frequency.