LP2985-N Micropower 150-mA Low-Noise Ultra-Low-Dropout Regulator in SOT-23 and
DSBGA Packages Designed for Use with Very Low ESR Output Capacitors
1Features3Description
1
•Input Voltage Range: 2.5 V to 16 V
•Ultra Low-Dropout Voltage
•Ensured 150 mA Output Current
•Smallest Possible Size (SOT-23 and DSBGA 0.5mm Pitch Packages)
•Requires Minimum External Components
•Stable With Low-ESR Output Capacitor
•< 1 µA Quiescent Current When Shut Down
•Low Ground Pin Current at All Loads
•Output Voltage Accuracy 1% (A Grade)
•High Peak Current Capability
•Low Z
: 0.3 Ω Typical (10 Hz to 1 MHz)
OUT
•Overtemperature and Overcurrent Protection
•−40°C to 125°C Junction Temperature Range
•Custom Voltages Available
2Applications
•Cellular Phone
•Palmtop and Laptop Computer
•Personal Digital Assistant (PDA)
•Camcorder, Personal Stereo, Camera
The LP2985-N low noise linear regulator delivers up
to 150-mA output current and only requires 300-mV
dropout voltage of input to output. Using an optimized
VIP (Vertically Integrated PNP) process, the LP2985N delivers unequaled performance for all batterypowered designs. The LP2985-N device provides 1%
tolerance precision output voltage with only 75 µA
quiescent current at 1 mA load and 850 µA at 150
mA load. By adding a 10-nF bypass capacitor, the
output noise can be reduced to 30 µV
in a 30-kHz
RMS
bandwidth.
The LP2985-N is designed to work with a ceramic
output capacitor with equivalent series resistance
(ESR) as low as 5 mΩ. The devices are available
with fixed output voltage from 2.5 V to 6.1 V. Contact
Texas Instrument Sales for specific voltage option
needs.
The smallest SOT-23 and DSBGA packages are
available for absolute minimum board space.
Device Information
PART NUMBERPACKAGEBODY SIZE
SOT-23 (5)2.90 mm x 1.60 mm (NOM)
LP2985-N1.159 mm x 0.981 mm (MAX)
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
DSBGA (5)
1.464 mm x 1.095 mm (MAX)
(1)
1
Simplified Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision W (September 2014) to Revision XPage
•Changed pin names in text and app circuit drawing "VOUT" and "VIN" to "OUT" and "IN"; replace Handling Ratings
with ESD Ratings; update Thermal Values ........................................................................................................................... 1
•Changed footnote 1 to Ab Max table per new format ........................................................................................................... 5
•Changed location of storage temperature range from Handling Ratings to Ab Max table..................................................... 5
•Added required Application Information section .................................................................................................................. 15
Changes from Revision V (April 2013) to Revision WPage
•Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
Changes from Revision U (April 2013) to Revision VPage
•Changed layout of National Data Sheet to TI format ........................................................................................................... 23
over operating free-air temperature range (unless otherwise noted)
Operating junction temperature–40125°C
Lead Temp. (Soldering, 5 sec.)260°C
Power dissipation
Input supply voltage (survival)–0.316V
Input supply voltage (operating)2.516V
Shutdown input voltage (survival)–0.316V
Output voltage (survival, See
I
(survival)Short Circuit Protected
OUT
Input-output voltage (survival, see
Storage temperature, T
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under RecommendedOperating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The maximum allowable power dissipation is a function of the maximum junction temperature, T
resistance, R
using:
(3)
(4)
)–0.39V
(5)
)–0.316V
stg
, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated
θJA
(1)(2)
MINMAXUNIT
Internally Limited
–65150°C
, the junction-to-ambient thermal
J_MAX
Where the value of R
package or 178.8°C/W for YPB type DSBGA package.
for the SOT-23 package is 175.7°C/W in a typical PC board mounting and 180°C/W for YZR type DSBGA
θJA
Exceeding the maximum allowable dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown.
(4) For 12V option, output voltage survival: –0.3 to +16 V. If used in a dual-supply system where the regulator load is returned to a negative
supply, the LP2985-N output must be diode-clamped to ground.
(5) The output PNP structure contains a diode between the IN to OUT pins that is normally reverse-biased. Reversing the polarity from IN to
OUT will turn on this diode.
7.2ESD Ratings
VALUEUNIT
All pins except 3 and 4 (SOT-23)
All pins except A3 and B2±1000
(DSBGA)
Pins 1, 2, and 5 (SOT-23)
Pins A1, C1, and C3 (DSBGA)
±2000
V
(ESD)
Electrostatic dischargeV
Human-body model (HBM), per
ANSI/ESDA/JEDEC JS-001
(1)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
7.3Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1) Exposing the DSBGA device to direct sunlight will cause misoperation. See DSBGA Light Sensitivity for additional information.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical
Quality Control (SQC) methods. The limits are used to calculate TI's Average Outgoing Quality Level (AOQL).
(3) Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below the value measured with a
(4) The ON/OFF input must be properly driven to prevent possible misoperation. For details, refer to ON/OFF Input Operation.
(5) The LP2985-N has foldback current limiting which allows a high peak current when V
current as V
is forced to ground (see Typical Characteristics curves).
The LP2985-N family of fixed-output, ultra-low-dropout and low-noise regulators offers exceptional, cost-effective
performance for battery-powered applications. Available in output voltages from 2.5 V to 5 V, the family has an
output tolerance of 1% for the A version (1.5% for the non-A version) and is capable of delivering 150-mA
continuous load current. Standard regulator features, such as overcurrent and overtemperature protection, are
also included.
Using an optimized Vertically Integrated PNP (VIP) process, the LP2985-N contains several features to facilitate
battery powered designs:
•Multiple voltage options
•Low dropout voltage, typical dropout of 300 mV at 150 mA load current and 7 mV at 1 mA load.
•Low quiescent current and low ground current, typically 850-μA at 150 mA load, and 75-μA at 1-mA load.
•A shutdown feature is available, allowing the regulator to consume only 0.01-uA typically when the ON/OFF
pin is pulled low.
•Over Temperature Protection and Over Current Protection circuitry is designed to safeguard the device during
unexpected conditions
•Enhanced Stability: The LP2985-N is stable with output capacitor ESR as low as 5-mΩ, which allows the use
of ceramic capacitors on the output.
•Low noise: A BYPASS pin allows for low-noise operation, with a typical output noise of 30 µV
use of a 10-nF bypass capacitor.
, with the
RMS
8.2Functional Block Diagram
8.3Feature Description
8.3.1 Multiple Voltage Options
In order to meet different application’s requirement, the LP2985-N family provide multiple fixed output options
from 2.5 V to 6.1 V. Please consult factory for custom voltages.
8.3.2 Output Voltage Accuracy
Output voltage accuracy specifies minimum and maximum output voltage error, relative to the expected nominal
output voltage stated as a percent. This accuracy error includes the errors introduced by the internal reference
and the load and line regulation across the full range of rated load and line operating conditions over
temperature, unless otherwise specified by the Electrical Characteristics. Output voltage accuracy also accounts
for all variations between manufacturing lots.
Generally speaking, the dropout voltage often refers to the voltage difference between the input and output
voltage (VDO= VIN– V
characterized by the classic R
nominal programmed output voltage at which the output voltage is expected to remain within its accuracy
boundary. If the input falls below this VDOlimit (VIN< V
follow the input voltage.
8.3.4 Low Ground Current
LP2985-N uses a vertical PNP process which allows for quiescent currents that are considerably lower than
those associated with traditional lateral PNP regulators, typically 850 μA at150 mA load, and 75 μA at 1-mA load.
8.3.5 Sleep Mode
When pull ON/OFF pin to low level, LP2985-N will enter sleep mode, and less than 2-μA quiescent current is
consumed. This function is designed for the application which needs a sleep mode to effectively enhance battery
life cycle.
8.3.6 Internal Protection Circuitry
8.3.6.1 Short Circuit Protection (Current Limit)
The internal current limit circuit is used to protect the LDO against high-load current faults or shorting events. The
LDO is not designed to operate in a steady-state current limit. During a current-limit event, the LDO sources
constant current. Therefore, the output voltage falls when load impedance decreases. Note also that if a current
limit occurs and the resulting output voltage is low, excessive power may be dissipated across the LDO, resulting
in a thermal shutdown of the output.
A fold back feature limits the short-circuit current to protect the regulator from damage under all load conditions.
If V
is forced below 0 V before EN goes high and the load current required exceeds the fold back current limit,
OUT
the device may not start up correctly.
), where the main current pass-FET is fully on in the ohmic region of operation and is
OUT
of the FET. VDOindirectly specifies a minimum input voltage above the
DS(ON)
+ VDO), then the output voltage decreases in order to
OUT
8.3.6.2 Thermal Protection
The LP2985-N contains a thermal shutdown protection circuit to turn off the output current when excessive heat
is dissipated in the LDO. The thermal time-constant of the semiconductor die is fairly short, and thus the output
cycles on and off at a high rate when thermal shutdown is reached until the power dissipation is reduced.
The internal protection circuitry of the LP2985-N is designed to protect against thermal overload conditions. The
circuitry is not intended to replace proper heat sinking. Continuously running the device into thermal shutdown
degrades its reliability.
8.3.7 Enhanced Stability
The LP2985-N is designed specifically to work with ceramic output capacitors, utilizing circuitry which allows the
regulator to be stable across the entire range of output current with an output capacitor whose ESR is as low as
5 mΩ. For output capacitor requirement, please refer to Output Capacitor.
8.3.8 Low Noise
The LP2985-N includes a low-noise reference ensuring minimal noise during operation because the internal
reference is normally the dominant term in noise analysis. Further noise reduction can be achieved by adding an
external bypass bapacitor between the BYPASS pin and the GND pin.
8.4 Device Functional Modes
8.4.1 Operation with V
OUT(TARGET)
The device operate if the input voltage is equal to, or exceeds V
minimum VINrequirement, the devices do not operate correctly and output voltage may not reach target value.
If the voltage on the ON/OFF pin is less than 0.15 V, the device is disabled, and in this state shutdown current
does not exceed 2 μA. Raising ON/OFF above 1.6 V initiates the start-up sequence of the device.
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LP2985-N is a linear voltage regulator operating from 2.5 V to 16 V on the input and regulates voltages
between 2.5 V to 6.1 V with 1% accuracy and 150-mA maximum output current. Efficiency is defined by the ratio
of output voltage to input voltage because the LP2985-N is a linear voltage regulator. To achieve high efficiency,
the dropout voltage (VIN– V
Successfully implementing an LDO in an application depends on the application requirements. If the
requirements are simply input voltage and output voltage, compliance specifications (such as internal power
dissipation or stability) must be verified to ensure a solid design. If timing, start-up, noise, power supply rejection
ratio (PSRR), or any other transient specification is required, then the design becomes more challenging.
9.2 Typical Application
) must be as small as possible, thus requiring a very-low-dropout LDO.
OUT
*ON/OFF input must be actively terminated. Tie to VINif this function is not to be used.
**Minimum capacitance is shown to ensure stability (may be increased without limit). Ceramic capacitor required for
output (see Output Capacitor).
***Reduces output noise (may be omitted if application is not noise critical). Use ceramic or film type with very low
leakage current (see Noise Bypass Capacitor).
Figure 21. Typical Application Schematic
9.2.1 Design Requirements
DESIGN PARAMETERSVALUE
Input voltage4.3 V, ±10% provided by the DC-DC converter switching at 1 MHz
Output voltage3.3 V, ±5%
Output current150 mA (maximum), 1 mA (minimum)
At 150-mA loading, the dropout of the LP2985-N has 575-mV maximum dropout over temperature, thus an 1000mV headroom is sufficient for operation over both input and output voltage accuracy. The efficiency of the
LP2985-N in this configuration is V
/ VIN= 76.7%. To achieve the smallest form factor, the SOT-23 package is
OUT
selected.
Input and output capacitors are selected in accordance with the Capacitor Characteristics section. Ceramic
capacitances of 1 μF for the input and one 2.2-μF capacitor for the output are selected. With an efficiency of
76.7% and a 150 mA maximum load, the internal power dissipation is 150-mW, which corresponds to a 26°C
junction temperature rise for the SOT-23 package. With an 85°C maximum ambient temperature, the junction
temperature is at 111°C. To minimize noise, a bypass capacitance (C
) of 0.01 μF is selected.
BYPASS
9.2.2.1 External Capacitors
Like any low-dropout regulator, the LP2985-N requires external capacitors for regulator stability. These
capacitors must be correctly selected for good performance.
9.2.2.1.1 Input Capacitor
An input capacitor whose capacitance is ≥ 1 µF is required between the LP2985-N input and ground (the amount
of capacitance may be increased without limit).
This capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean
analog ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.
NOTE
Tantalum capacitors can suffer catastrophic failure due to surge current when connected
to a low-impedance source of power (like a battery or very large capacitor). If a Tantalum
capacitor is used at the input, it must be ensured by the manufacturer to have a surge
current rating sufficient for the application.
There are no requirements for ESR on the input capacitor, but tolerance and temperature coefficient must be
considered when selecting the capacitor to ensure the capacitance will be ≥ 1 µF over the entire operating
temperature range.
9.2.2.1.2 Output Capacitor
The LP2985-N is designed specifically to work with ceramic output capacitors, utilizing circuitry which allows the
regulator to be stable across the entire range of output current with an output capacitor whose ESR is as low as
5 mΩ. It may also be possible to use Tantalum or film capacitors at the output, but these are not as attractive for
reasons of size and cost (see Capacitor Characteristics).
The output capacitor must meet the requirement for minimum amount of capacitance and also have an ESR
value which is within the stable range. Curves are provided which show the stable ESR range as a function of
load current (see Figure 22).
The output capacitor must maintain its ESR within the stable region over the full operating
temperature range of the application to assure stability.
The LP2985-N requires a minimum of 2.2 µF on the output (output capacitor size can be increased without limit).
It is important to remember that capacitor tolerance and variation with temperature must be taken into
consideration when selecting an output capacitor so that the minimum required amount of output capacitance is
provided over the full operating temperature range. It should be noted that ceramic capacitors can exhibit large
changes in capacitance with temperature (see Capacitor Characteristics). The output capacitor must be located
not more than 1 cm from the output pin and returned to a clean analog ground.
9.2.2.1.3 Noise Bypass Capacitor
Connecting a 10 nF capacitor to the BYPASS pin significantly reduces noise on the regulator output. It should be
noted that the capacitor is connected directly to a high-impedance circuit in the bandgap reference.
Because this circuit has only a few microamperes flowing in it, any significant loading on this node will cause a
change in the regulated output voltage. For this reason, DC leakage current through the noise bypass capacitor
must never exceed 100 nA, and should be kept as low as possible for best output voltage accuracy.
The types of capacitors best suited for the noise bypass capacitor are ceramic and film. High-quality ceramic
capacitors with either NPO or COG dielectric typically have very low leakage. 10 nF polypropolene and
polycarbonate film capacitors are available in small surface-mount packages and typically have extremely low
leakage current.
9.2.2.2 Capacitor Characteristics
The LP2985-N was designed to work with ceramic capacitors on the output to take advantage of the benefits
they offer: for capacitance values in the 2.2 µF to 4.7 µF range, ceramics are the least expensive and also have
the lowest ESR values (which makes them best for eliminating high-frequency noise). The ESR of a typical 2.2
µF ceramic capacitor is in the range of 10 mΩ to 20 mΩ, which easily meets the ESR limits required for stability
by the LP2985-N.
One disadvantage of ceramic capacitors is that their capacitance can vary with temperature. Most large value
ceramic capacitors (≥ 2.2 µF) are manufactured with the Z5U or Y5V temperature characteristic, which results in
the capacitance dropping by more than 50% as the temperature goes from 25°C to 85°C.
This could cause problems if a 2.2 µF capacitor were used on the output since it will drop down to approximately
1 µF at high ambient temperatures (which could cause the LM2985 to oscillate). If Z5U or Y5V capacitors are
used on the output, a minimum capacitance value of 4.7 µF must be observed.
A better choice for temperature coefficient in ceramic capacitors is X7R, which holds the capacitance within
±15%. Unfortunately, the larger values of capacitance are not offered by all manufacturers in the X7R dielectric.
Tantalum capacitors are less desirable than ceramics for use as output capacitors because they are more
expensive when comparing equivalent capacitance and voltage ratings in the 1 µF to 4.7 µF range.
Another important consideration is that Tantalum capacitors have higher ESR values than equivalent size
ceramics. This means that while it may be possible to find a Tantalum capacitor with an ESR value within the
stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic
capacitor with the same ESR value.
It should also be noted that the ESR of a typical Tantalum will increase about 2:1 as the temperature goes from
25°C down to −40°C, so some guard band must be allowed.
9.2.2.3 ON/OFF Input Operation
The LP2985-N is shut off by driving the ON/OFF input low, and turned on by pulling it high. If this feature is not to
be used, the ON/OFF input should be tied to VINto keep the regulator output on at all times.
To assure proper operation, the signal source used to drive the ON/OFF input must be able to swing above and
below the specified turn-on/turn-off voltage thresholds listed in the Electrical Characteristics section under
V
. To prevent mis-operation, the turn-on (and turn-off) voltage signals applied to the ON/OFF input must
ON/OFF
have a slew rate which is ≥ 40 mV/µs.
CAUTION
The regulator output voltage cannot be ensured if a slow-moving AC (or DC) signal is
applied that is in the range between the specified turn-on and turn-off voltages listed
under the electrical specification V
(see Electrical Characteristics).
ON/OFF
9.2.2.4 Reverse Input-Output Voltage
The PNP power transistor used as the pass element in the LP2985-N has an inherent diode connected between
the regulator output and input. During normal operation (where the input voltage is higher than the output) this
diode is reverse-biased).
However, if the output is pulled above the input, this diode will turn ON and current will flow into the regulator
output. In such cases, a parasitic SCR can latch which will allow a high current to flow into VIN(and out the
ground pin), which can damage the part.
In any application where the output may be pulled above the input, an external Schottky diode must be
connected from VINto V
(cathode on VIN, anode on V
OUT
), to limit the reverse voltage across the LP2985-N to
connect to input
control through inner
layer or bottom layer
Via
Input
Capacitor
Output
Capacitor
Bypass
Capacitor
C3
C1
A3
B2
A1
IN
GND
ON/OFF
OUT
BYPASS
Ground
V
OUT
V
IN
Input
Capacitor
Output
Capacitor
Bypass
Capacitor
LP2985-N
SNVS018X –MARCH 2000–REVISED MAY 2015
www.ti.com
10Power Supply Recommendations
The LP2985-N is designed to operate from an input voltage supply range between VINof 2.5 V and 16 V.
(Recommended minimum VINis the greater of 3.1 V or V
OUT(max)
+ rated dropout voltage (max) for operating load
current.) The input voltage range provides adequate headroom in order for the device to have a regulated output.
This input supply must be well regulated. If the input supply is noisy, additional input capacitors with low ESR can
help to improve the output noise performance.
11Layout
11.1 Layout Guidelines
For best overall performance, place all circuit components on the same side of the circuit board and as near as
practical to the respective LDO pin connections. Place ground return connections to the input and output
capacitor, and to the LDO ground pin as close to each other as possible, connected by a wide, component-side,
copper surface. The use of vias and long traces to create LDO circuit connections is strongly discouraged and
negatively affects system performance. This grounding and layout scheme minimizes inductive parasitics, and
thereby reduces load-current transients, minimizes noise, and increases circuit stability.
A ground reference plane is also recommended and is either embedded in the PCB itself or located on the
bottom side of the PCB opposite the components. This reference plane serves to assure accuracy of the output
voltage, shield noise, and behaves similar to a thermal plane to spread (or sink) heat from the LDO device. In
most applications, this ground plane is necessary to meet thermal requirements.
11.2 Layout Example
Figure 39. LP2985 SOT-23 Package Typical Layout
Figure 40. LP2985 DSBGA Package Typical Layout
11.3 DSBGA Mounting
The DSBGA package requires specific mounting techniques which are detailed in AN-1112 DSBGA Wafer Level
Chip Scale Package (SNVA009). Referring to the section Surface Mount Technology (SMT) Assembly
Considerations, it should be noted that the pad style which must be used with the 5-pin package is the NSMD
(non-solder mask defined) type.
For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the
Exposing the DSBGA device to direct sunlight will cause misoperation of the device. Light sources such as
Halogen lamps can also affect electrical performance if brought near to the device.
The wavelengths which have the most detrimental effect are reds and infra-reds, which means that the
fluorescent lighting used inside most buildings has very little effect on performance. A DSBGA test board was
brought to within 1 cm of a fluorescent desk lamp and the effect on the regulated output voltage was negligible,
showing a deviation of less than 0.1% from nominal.
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E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
1-Nov-2015
Samples
Addendum-Page 5
PACKAGE OPTION ADDENDUM
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(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
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0.981 mm, Min =
4215098/A 12/12
0.92 mm
YZR0005xxx
A
MECHANICAL DATA
D
0.600±0.075
E
NOTES:
D: Max =
E: Max =
. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
1.464 mm, Min =
1.095 mm, Min =
4215043/A12/12
TLA05XXX (Rev C)
1.403 mm
1.034 mm
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
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concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
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anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
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requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
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