Texas Instruments HSS-MOTHERBOARDEVM User Manual
User's Guide
SLVUBD4A–January 2018–Revised December 2018
High Side Switch Motherboard Evaluation Module
The HSS-MOTHERBOARDEVM evaluation module is designed to evaluate the <50-mΩ Ron devices in
TI's high side switch portfolio. These devices include TPS1HA08-Q1, TPS2HB08-Q1, TPS2HB16-Q1,
TPS2HB35-Q1, and TPS2HB50-Q1. This board does not come with the devices populated but allows any
of the devices to be soldered down on the sample daughter card and used in the main motherboard. This
user's guide provides the connectors and test point description, schematic, bill of materials (BOM), and
board layout of the EVM.
NOTE: This EVM does NOT come with devices populated on the board. The user MUST order
samples separately.
Contents
1 Introduction ................................................................................................................... 2
1.1 Descriptions ......................................................................................................... 2
1.2 Applications.......................................................................................................... 2
1.3 Features.............................................................................................................. 3
2 HSS-MOTHERBOARDEVM Schematic .................................................................................. 4
3 Connections Descriptions................................................................................................... 7
3.1 Connectors and Test Points....................................................................................... 7
3.2 Jumpers.............................................................................................................. 8
4 TPS2HB08-50EVM EVM Assembly Drawings and Layout............................................................. 9
5 Current Limit ................................................................................................................ 11
6 Current Sense .............................................................................................................. 11
7 Transient Protection........................................................................................................ 11
8 Soldering Down U2 ........................................................................................................ 11
9 Bill of Materials ............................................................................................................. 11
1 HSS-MOTHERBOARDEVM Motherboard Schematic .................................................................. 5
2 HSS-MOTHERBOARDEVM Sample Daughter Card Schematic...................................................... 6
3 HSS-MOTHERBOARDEVM Layout and Routing (Top View) ......................................................... 9
4 HSS-MOTHERBOARDEVM Layout and Routing (Bottom View).................................................... 10
1 Connector and Test Point Descriptions................................................................................... 7
2 Jumper Descriptions......................................................................................................... 8
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List of Figures
List of Tables
High Side Switch Motherboard Evaluation Module
1
Introduction
1 Introduction
Texas Instruments' HSS-MOTHERBOARDEVM evaluation module has a central socket for the supporting
daughtercard with the high side switch device to be populated. The EVM supports the entire singlechannel and dual channel low Ron (≤50-mΩ) high-side driver applications. The purpose of this EVM is to
facilitate evaluation of the low Ron high side switches for the diagnostic features and drive resistive,
capacitive, and inductive loads.
The EVM is a combination of a central motherboard and a row of daughterboards. The mother board has
all connectors, jumpers, and test points. The daughter board has different footprints to support the low
Ron family of TI's high side switch portfolio. The daughter board also has limiting resistors for the channel
devices (TPS2HBxx-Q1) and since the 1 channel device (TPS1HA08-Q1) has a NC pin in that location the
daughtercards will work for all of the devices.
The daughterboards have 2 different footprints: 24 pin PWP and 16 pin PWP. For installation, a single
board from the panel has to broken, a device soldered down onto the main footprint, and connected to the
motherboard.
NOTE: Caution must be taken when soldering down the device as the main power pad on the back
needs to be soldered correctly as to not affect performance. Please see PowerPAD
Thermally Enhanced Package app note for more details about the solder profile and
techniques.
The current-limiting resistors are on the bottom side of the daughterboard. They are all 10-kΩ, 0805
package. For the desired current limit value, the resistor can be replaced with different value. Also for the
single channel devices the second resistor should be depopulated.
The jumpers are not installed. Refer to Table 1 and Table 2 for installation.
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1.1 Descriptions
The Texas Instruments HSS-MOTHERBOARDEVM helps designers evaluate the operation and
performance of the TPS1HA08-Q1, TPS2HB08-Q1, TPS2HB16-Q1, TPS2HB35-Q1 and TPS2HB50-Q1
devices.
These devices are fully-protected high-side switches, with an integrated NMOS power FET, and charge
pump. Full diagnostics and high-accuracy current sense features enable intelligent control of the load.
The device diagnostic reporting supports load current status and device temperature on an analog sense
output pin SNS. The SNS pin sources a current proportional to the selected parameter. By adding a
pulldown resistor on the SNS pin, the developed voltage is proportional to the selected parameter as well.
The diagnostics can be disabled for multiplexing the sense pin between different devices.
1.2 Applications
The EVM is used in the following applications:
• High-side relay drivers
• High-side power switch for submodule power supply
• Bulb driver
• General resistive, inductive, and capacitive loads
• Replace electromechanical relays and fuses
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High Side Switch Motherboard Evaluation Module
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1.3 Features
The EVM supports the following features:
• Single or Dual-channel high-side power switches, tested according to AECQ100-12
• Operating voltage 3 V to 18V
• Operating temperature: –40ºC to 125ºC
• Microcontroller input control: 3.3-V and 5-V logic compatible
• High-accuracy current sense
– Analog current sense as a ratio of the load current or device temperature
• Protection:
– Reverse battery protection with external ground network
– Short-circuit protection
– Overvoltage protection
– Thermal shutdown and thermal swing with self-recovery
– ESD protection
• Diagnostic:
– On and off state output open or short to battery detection
– Overload and short-to-ground detection and power limiting
– Thermal shutdown and thermal swing diagnostic
– Immediate shutdown or continuous clamping during fault current condition
– Diagnostic enable function for multiplexing of MCU analog or digital port
Introduction
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High Side Switch Motherboard Evaluation Module
3
HSS-MOTHERBOARDEVM Schematic
2 HSS-MOTHERBOARDEVM Schematic
Figure 1 and Figure 2 illustrate the TPS2HB08-50EVM motherboard and daughterboard schematics, respectively.
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4
High Side Switch Motherboard Evaluation Module
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HSS-MOTHERBOARDEVM Schematic
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Figure 1. HSS-MOTHERBOARDEVM Motherboard Schematic
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High Side Switch Motherboard Evaluation Module
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HSS-MOTHERBOARDEVM Schematic
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6
High Side Switch Motherboard Evaluation Module
Figure 2. HSS-MOTHERBOARDEVM Sample Daughter Card Schematic
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