Texas Instruments CY74FCT191CTSOCT, CY74FCT191CTSOC, CY74FCT191CTQCT, CY74FCT191CTQC, CY74FCT191ATSOCT Datasheet

...
4-Bit Up/Down Binary Counter
CY74FCT191T
SCCS016 - May 1994 - Revised February 2000
Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered.
Copyright © 2000, Texas Instruments Incorporated
Features
• Function, pinout, and drive compatible with FCT and F logic
• FCT-C speed at 6.2 ns max, FCT-A speed at 7.8 ns max.
• Reduced V
OH
(typically = 3.3V) versions of equivalent
FCT functions
• Edge-rate control circuitry for significantly improved noise characteristics
• Power-off disable permits live insertion
• ESD > 2000V
Matched rise and fall times
• Sink current 64 mA Source current 32 mA
Functional Description
The FCT191T is a reversible modulo-16 binary counter, featuringsynchronouscountingandasynchronouspresetting. The preset allows the FCT191T to be used in programmable dividers. The count enable input, terminal count output, and ripple clock output make possible a variety of methods of implementing multiusage counters. In the counting modes, state changes are initiated by the rising edge of the clock.
The outputs are designed with a power-off disable feature to allow for live insertion of boards.
Logic Block Diagram
CP
RC Q
0
J
Q
CLOCK
PRESET
K
CLEAR
Q
J
Q
CLOCK
PRESET
K
CLEAR
Q
J
Q
CLOCK
PRESET
K
CLEAR
Q
J
Q
CLOCK
PRESET
K
CLEAR
Q
Q
1
Q
2
Q
3
TC
CEP
0
P
1
P
2
P
3
PLU/D
Pin Configurations
1 2 3 4 5 6 7 8
Q
1
Q
0
CE
U/D
Q
2
Q
3
V
CC
GND
Top View
SOIC/QSOP
16 15 14 13 12 11
10
9
P
1
PL P
2
P
3
P
0
CP RC TC
Pin Description
Name Description
CE Count Enable Input (Active LOW) CP Clock Pulse Input (Active Rising Edge) P Parallel Data Inputs PL Asynchronous Parallel Load Input (Active LOW) U/D Up/Down Count Control Input Q Flip-Flop Outputs RC Ripple Clock Output (Active LOW) TC Terminal Count Output
RC Function Table
[1]
Inputs Outputs
CE CP T
[2]
RC
L H X
X X
H X
L
H H
CY74FCT191T
2
Maximum Ratings
[3, 4]
(Above which the useful life may be impaired. For user guide­lines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–65°C to +135°C
Supply Voltage to Ground Potential............... –0.5V to +7.0V
DC Input Voltage ........................................... –0.5V to +7.0V
DC Output Voltage......................................... –0.5V to +7.0V
DC Output Current (Maximum Sink Current/Pin) ......120 mA
Power Dissipation..........................................................0.5W
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Notes:
1. H = HIGH Voltage Level, L = LOW Voltage Level, X = Don‘t Care, = LOW-to-HIGH clock transition. =Low Pulse.
2. TC is generated internally.
Mode Select
[1]
Inputs
PL CE U/D CP Mode
H H
L
H
L L X
H
L H X X
X X
Count Up Count Down Preset (Asynchronous) No Change (Hold)
RC Function Table
[1]
Inputs Outputs
CE CP T
[2]
RC
Operating Range
Range
Ambient
Temperature V
CC
Commercial –40°C to +85°C 5V ± 5%
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Typ.
[5]
Max. Unit
V
OH
Output HIGH Voltage VCC=Min., IOH=–32 mA 2.0 V
VCC=Min., IOH=–15 mA 2.4 3.3 V
V
OL
Output LOW Voltage VCC=Min., IOL=64 mA 0.3 0.55 V
V
IH
Input HIGH Voltage 2.0 V
V
IL
Input LOW Voltage 0.8 V
V
H
Hysteresis
[6]
All inputs 0.2 V
V
IK
Input Clamp Diode Voltage VCC=Min., IIN=–18 mA –0.7 –1.2 V
I
I
Input HIGH Current VCC=Max., VIN=V
CC
5 µA
I
IH
Input HIGH Current VCC=Max., VIN=2.7V ±1 µA
I
IL
Input LOW Current VCC=Max., VIN=0.5V ±1 µA
I
OS
Output Short Circuit Current
[7]
VCC=Max., V
OUT
=0.0V –60 –120 –225 mA
I
OFF
Power-Off Disable VCC=0V, V
OUT
=4.5V ±1 µA
Capacitance
[6]
Parameter Description Typ.
[5]
Max. Unit
C
IN
Input Capacitance 5 10 pF
C
OUT
Output Capacitance 9 12 pF
Notes:
3. Unless otherwise noted, these limits are over the operating free-air temperature range.
4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V
CC
or ground.
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.
6. This parameter is specified but not tested.
7. Not more than one output should beshorted ata time. Duration ofshort should not exceed one second. The use of high-speedtest apparatus and/or sample and hold techniques are preferable in order to minimize internal chipheating and more accurately reflect operational values. Otherwiseprolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last.
CY74FCT191T
3
Power Supply Characteristics
Parameter Description Test Conditions Typ.
[5]
Max. Unit
I
CC
Quiescent Power Supply Current VCC=Max., VIN< 0.2V,
V
IN
> VCC–0.2V
0.1 0.2 mA
I
CC
Quiescent Power Supply Current (TTL inputs HIGH)
VCC=Max., VIN=3.4V,
[8]
f1=0, Outputs Open
0.5 2.0 mA
I
CCD
Dynamic Power Supply Current
[9]
VCC=Max.,OneBit Toggling,Preset Mode, 50% Duty Cycle, Outputs Open, MR=VCC=SR, PL=CE=U/D=CP=GND, V
IN
< 0.2V or VIN> VCC–0.2V
0.06 0.12 mA/MHz
I
C
Total Power Supply Current
[10]
VCC=Max., Preset Mode, 50% Duty Cycle, Outputs Open, One Bit Toggling at f
1
=5 MHz, PL=CE=U/D=CP=GND, V
IN=VCC,VIN
=GND
0.4 0.8 mA
VCC=Max., Preset Mode, 50% Duty Cycle, Outputs Open, One Bit Toggling at f
1
=5 MHz, V
IN
=3.4V or VIN=GND
0.7 1.8 mA
VCC=Max., Preset Mode, 50% Duty Cycle, Outputs Open, Four Bits Toggling at f
1
=5 MHz, PL=CE=U/D=CP=GND, V
IN=VCC,VIN
=GND
1.3 2.6
[11]
mA
VCC=Max., Preset Mode, 50% Duty Cycle, Outputs Open, Four Bits Toggling at f
1
=5 MHz, PL=CE=U/D=CP=GND, V
IN
=3.4V or VIN=GND
2.3 6.6
[11]
mA
Notes:
8. Per TTL driven input (V
IN
=3.4V); all other inputs at VCC or GND.
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
10. I
C=IQUIESCENT
+ I
INPUTS
+ I
DYNAMIC
IC=ICC+ICCDHNT+I
CCD(f0
/2 + f1N1)
I
CC
= Quiescent Current with CMOS input levels
I
CC
= Power Supply Current for a TTL HIGH input (VIN=3.4V)
D
H
= Duty Cycle for TTL inputs HIGH
N
T
= Number of TTL inputs at D
H
I
CCD
= Dynamic Current caused by an input transition pair
(HLH or LHL)
f
0
= Clock frequency for registered devices, otherwise zero
f
1
= Input signal frequency
N
1
= Number of inputs changing at f
1
All currents are in milliamps and all frequencies are in megahertz.
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
CY74FCT191T
4
Document #: 38-00286-B
Switching Characteristics Over the Operating Range
Parameter Description
CY74FCT191AT CY74FCT191CT
Unit Fig. No.
[13]
Min.
[12]
Max. Min.
[12]
Max.
t
PLH
t
PHL
Propagation Delay CP to Q
n
1.5 7.8 1.5 6.2 ns 1, 5
t
PLH
t
PHL
Propagation Delay CP to TC
1.5 11.8 1.5 9.4 ns 1, 5
t
PLH
t
PHL
Propagation Delay CP to
RC
1.5 8.5 1.5 6.8 ns 1, 5
t
PLH
t
PHL
Propagation Delay CE to RC
1.5 7.2 1.5 6.0 ns 1, 5
t
PLH
t
PHL
Propagation Delay U/D to RC
1.5 13.0 1.5 11.0 ns 1, 5
t
PLH
t
PHL
Propagation Delay U/D to TC
1.5 7.2 1.5 6.1 ns 1, 5
t
PLH
t
PHL
Propagation Delay P
n
to Q
n
1.5 9.1 1.5 7.7 ns 1, 5
t
PLH
t
PHL
Propagation Delay PL to Q
n
2.0 8.5 2.0 7.2 ns 1, 5
t
SU
Set-Up Time HIGH or LOW P
n
to PL
4.0 3.5 ns 4
t
H
Hold Time HIGH or LOW P
n
to PL
1.5 1.0 ns 4
t
SU
Set-Up Time LOW CE to CP
9.0 7.2 ns 4
t
H
Hold Time LOW
CE to CP
0 0 ns 4
t
SU
Set-Up Time HIGH or LOW
U/D to CP
10.0 8.0 ns 4
t
H
Hold Time HIGH or LOW
U/D to CP
0 0 ns 4
t
W
PL Pulse Width LOW 5.5 5.0 ns 5
t
W
Clock Pulse Width
[6]
HIGH or LOW
4.0 4.0 ns 5
t
REM
Recovery Time PL to CP
5.0 4.5 ns 6
Notes:
12. Minimum limits are specified but not tested on Propagation Delays.
13. See “Parameter Measurement Information” in the General Information section.
Ordering Information
Speed
(ns) Ordering Code
Package
Name Package Type
Operating
Range
6.2 CY74FCT191CTQCT Q1 16-Lead (150-Mil) QSOP Commercial CY74FCT191CTSOC/SOCT S1 16-Lead (300-Mil) Molded SOIC
7.8 CY74FCT191ATSOC/SOCT S1 16-Lead (300-Mil) Molded SOIC Commercial
CY74FCT191T
5
Package Diagrams
16-Lead Quarter Size Outline Q1
16-Lead Molded SOIC S1
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MA Y INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICA TIONS IS UNDERSTOOD T O BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
Loading...