Packages (DL) and 380-mil Fine-Pitch
Ceramic Flat Packages Using 25-mil
Center-to-Center Pin Spacings
• Provides Extra Data Width Necessary for
Wider Address/Data Paths or Buses with
Parity
• Flow-Through Architecture to Optimize
Printed-Circuit-Board (PCB) Layout
• Distributed V
and GND Pin Configuration
CC
to Minimize High-Speed Switching Noise
• EPIC (Enhanced-Performance Implanted
CMOS) 1-µm Process
• 500-mA Typical Latch-Up Immunity at 125°C
description
These 20-bit flip-flops feature three-state outputs
designed specifically for driving highly-capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing wider buffer
registers, I/O ports, bidirectional bus drivers with
parity, and working registers.
These devices can be used as two 10-bit flip-flops
or one 20-bit flip-flop.
On the positive transition of the clock the Q outputs
will follow the D inputs. A buffered output enable
(OE
) input can be used to place the twenty outputs
in either a normal logic state (high or low) or a
high-impedance state. In the high-impedance
state the outputs neither load nor drive the bus
lines significantly. The output enable (OE
not affect the internal operation of the flip-flops.
Old data can be retained or new data can be
entered while the outputs are in the
high-impedance state.
The 74AC16821 is packaged in TI’s shrink small-outline package (DL), which provides twice the I/O pin count
and functionality of standard small-outline packages in the same printed-circuit-board area.
The 54AC16821 is characterized over the full military temperature range of –55°C to 125°C. The 74AC16821
is characterized for operation from –40°C to 85°C.
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other specifications
are design goals. Texas Instruments reserves the right to change or
discontinue these products without notice.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1991, Texas Instruments Incorporated
1
54AC16821,74AC16821
20-BIT BUS INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
DXXXX, SEPTEMBER 1991
FUNCTION TABLE
INPUTS
OECLKDQ
L↑HH
L↑LL
LLXQ
HXXZ
OUTPUT
0
logic symbol
1
1OE
56
1CLK
28
2OE
29
2CLK
PRODUCT PREVIEW
55
1D1
54
1D2
52
1D3
51
1D4
49
1D5
48
1D6
47
1D7
45
1D8
44
1D91Q9
43
1D10
42
2D1
41
2D2
40
2D3
38
2D4
37
2D5
36
2D6
34
2D7
33
2D8
31
2D9
30
2D10
†
EN2
EN4
1D
3D
C1
C3
1
2
4
1
10
12
13
14
15
16
17
19
20
21
23
24
26
27
logic diagram (positive logic)
1
1OE
1D1
2OE
2D1
56
55
28
29
42
C1
1D
To 9 Other Channels
C1
1D
To 9 Other Channels
15
2
1Q1
2Q1
1CLK
2
1Q1
3
1Q2
5
1Q3
6
1Q4
8
1Q5
9
1Q6
1Q7
1Q8
2CLK
1Q10
2Q1
2Q2
2Q3
2Q4
2Q5
2Q6
2Q7
2Q8
2Q9
2Q10
†
This symbol is in accordance with ANSI/IEEE Std
91-1984 and IEC Publication 617-12.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
54AC16821,74AC16821
20-BIT BUS INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
DXXXX, SEPTEMBER 1991
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Output voltage range, V
Input clamp current, I
Output clamp current, I
Continuous output current, I
Continuous current through V
Maximum package power dissipation at T
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
54AC16821,74AC16821
Header line 2
WITH 3-STATE OUTPUTS
DXXXX, SEPTEMBER 1991
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETERTEST CONDITIONSV
IOH = –50 µA4.5 V4.44.44.4
V
OH
V
OL
PRODUCT PREVIEWPRODUCT PREVIEW
I
Control inputsVI = VCC or GND5.5 V±0.1±1±1µA
I
I
A or B ports
OZ
I
CC
C
Control inputsVI = VCC or GND5 V4.5pF
i
C
A or B portsVO = VCC or GND5 V16pF
io
†
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
‡
For I/O ports, the parameter IOZ includes the input leakage current.
IOH = –4 mA3 V2.582.42.48
IOH = –24 mA
IOH = –50 mA
IOH = –75 mA
IOL = 50 µA4.5 V0.10.10.1
IOL = 12 mA3 V0.360.50.44
IOL = 24 mA
IOL = 50 mA
IOL = 75 mA
‡
VO = VCC or GND5.5 V±0.5±10±5µA
VI = VCC or GND,IO = 05.5 V816080µA
CC
3 V2.92.92.9
5.5 V5.45.45.4
4.5 V3.943.73.8
5.5 V4.944.74.8
†
†
†
†
5.5 V3.85
5.5 V3.85
3 V0.10.10.1
5.5 V0.10.10.1
4.5 V0.360.50.44
5.5 V0.360.50.44
5.5 V1.65
5.5 V1.65
TA = 25°C54AC1682174AC16821
MINTYPMAXMINMAXMINMAX
UNIT
V
V
timing requirements over recommended operating free-air temperature range,
= 3.3 V ± 0.3 V
V
CC
TA = 25°C54AC1682174AC16821
MINMAXMINMAXMINMAX
f
Clock frequencyMHz
clock
t
Pulse duration, CLK high or lowns
w
t
Setup time, data before CLK↑ns
su
t
Hold time, data after CLK↑ns
h
timing requirements over recommended operating free-air temperature range,
= 5 V ± 0.5 V
V
CC
TA = 25°C54AC1682174AC16821
MINMAXMINMAXMINMAX
f
Clock frequencyMHz
clock
t
Pulse duration, CLK high or lowns
w
t
Setup time, data before CLK↑ns
su
t
Hold time, data after CLK↑ns
h
UNIT
UNIT
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
54AC16821,74AC16821
20-BIT BUS INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
DXXXX, SEPTEMBER 1991
switching characteristics over recommended operating free-air temperature range,
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
V
CC
PARAMETER
f
max
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
switching characteristics over recommended operating free-air temperature range,
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
V
CC
PARAMETER
f
max
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
FROMTOTA = 25°C54AC1682174AC16821
(INPUT)(OUTPUT)MINTYPMAXMINMAXMINMAX
CLK
OE
OE
FROMTOTA = 25°C54AC1682174AC16821
(INPUT)(OUTPUT)MINTYPMAXMINMAXMINMAX
CLK
OE
OE
Any Q
Any Q
Any Q
Any Q
Any Q
Any Q
UNIT
MHz
ns
ns
ns
UNIT
MHz
ns
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETERTEST CONDITIONSTYPUNIT
C
pd
Power dissipation capacitance per flip-flopCL = 50 pF, f = 1 MHz
Outputs enabled
Outputs disabled
pF
PRODUCT PREVIEW
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
54AC16821,74AC16821
20-BIT BUS INTERFACE FLIP-FLOPS
WITH 3-STATE OUTPUTS
DXXXX, SEPTEMBER 1991
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
500 Ω
S1
2 x V
Open
GND
CC
TEST
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
S1
Open
2 x V
GND
CC
500 Ω
t
su
(see Note A)
Timing Input
(See Note B)
CL = 50 pF
LOAD CIRCUIT FOR OUTPUTS
PRODUCT PREVIEW
Data Input
Input
(See Note B)
Output
t
PLH
1.5 V1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
1.5 V1.5 V
50% V
VOLTAGE WAVEFORMSVOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
1.5 V
t
CC
t
w
3 V
Input
3 V
0 V
h
3 V
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 x V
(see Note C)
Output
Waveform 2
S1 at GND
(see Note C)
t
PHL
50% V
0 V
3 V
0 V
V
CC
V
OH
OL
1.5 V1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
1.5 V1.5 V
t
CC
PZL
t
PZH
ENABLE AND DISABLE TIMES
t
PLZ
50% V
t
PHZ
50% V
CC
CC
20% V
80% V
CC
CC
0 V
3 V
0 V
≈
V
V
0 V
V
OL
OH
CC
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Zo = 50 Ω, tr ≤ 3 ns, tf≤ 3 ns.
For testing pulse duration: tr = tf = 1 to 3 ns. Pulse polarity can be either high-to-low-to-high or low-to-high-to-low.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
T exas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor
product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
TI warrants performance of its semiconductor products and related software to the specifications applicable at
the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are
utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each
device is not necessarily performed, except those mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death, personal injury, or
severe property or environmental damage (“Critical Applications”).
TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED
TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS.
Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI
products in such applications requires the written approval of an appropriate TI officer . Questions concerning
potential risk applications should be directed to TI through a local SC sales office.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards should be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein. Nor does TI warrant or represent that any license, either
express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property
right of TI covering or relating to any combination, machine, or process in which such semiconductor products
or services might be or are used.
Copyright 1996, Texas Instruments Incorporated
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