Supermicro X11SPL-F User Manual
X11SPL-F
USER'S MANUAL
Revision 1.0b
The information in this user’s manual has been carefully reviewed and is believed to be accurate. The manufacturer
assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment
to update or to keep current the information in this manual, or to notify any person or organization of the updates.
Please Note: For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
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State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.
WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
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indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.0b
Release Date: April 04, 2018
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2018 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
Preface
Preface
About This Manual
This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the X11SPL-F motherboard.
About This Motherboard
The Supermicro X11SPL-F motherboard supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx
series (Socket P0-LGA 3647) processor with up to 28 cores and a thermal design power (TDP)
of up to165W. Built with the Intel PCH C621 chipset, the motherboard supports 6-channel,
8-DIMM DDR4 ECC RDIMM/LRDIMM memory with speeds of up to 2666MHz. It features
such technologies as the Intel Virtualization Technology for Directed I/O for improved security
and system reliability. The X11SPL-F includes PCI-Express 3.0 slots, SATA 3.0 ports, dual 1G
Base-T LAN support, and an M.2 slot (Type 2280 and 22110). This motherboard is ideal for
I/O intensive application and video surveillance. Please note that this motherboard is intended
to be installed and serviced by professional technicians only. For processor/memory updates,
please refer to our website at http://www.supermicro.com/products/.
Conventions Used in the Manual
Special attention should be given to the following symbols for proper installation and to prevent
damage done to the components or injury to yourself:
Warning! Indicates important information given to prevent equipment/property damage
or personal injury.
Warning! Indicates high voltage may be encountered while performing a procedure.
Important: Important information given to ensure proper system installation or to
relay safety precautions.
Note: Additional Information given to differentiate various models or provides information for proper system setup.
3
Super X11SPL-F User's Manual
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information)
support@supermicro.com (Technical Support)
Website: www.supermicro.com
Europe
Address: Super Micro Computer B.V.
Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: sales@supermicro.nl (General Information)
support@supermicro.nl (Technical Support)
rma@supermicro.nl (Customer Support)
Website: www.supermicro.nl
Asia-Pacic
Address: Super Micro Computer, Inc.
3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235
Taiwan (R.O.C)
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3992
Email: support@supermicro.com.tw
Website: www.supermicro.com.tw
4
Preface
Table of Contents
Chapter 1 Introduction
1.1 Checklist ...............................................................................................................................8
Quick Reference ...............................................................................................................11
Quick Reference Table ......................................................................................................12
Motherboard Features .......................................................................................................14
1.2 Processor and Chipset Overview .......................................................................................18
1.3 Special Features ................................................................................................................18
Recovery from AC Power Loss .........................................................................................18
1.4 System Health Monitoring ..................................................................................................19
Onboard Voltage Monitors ................................................................................................19
Fan Status Monitor with Firmware Control .......................................................................19
Environmental Temperature Control .................................................................................19
System Resource Alert......................................................................................................19
1.5 ACPI Features ....................................................................................................................19
1.6 Power Supply .....................................................................................................................20
1.7 Serial Port ...........................................................................................................................20
Chapter 2 Installation
2.1 Static-Sensitive Devices .....................................................................................................21
Precautions .......................................................................................................................21
Unpacking .........................................................................................................................21
2.2 Processor and Heatsink Installation ...................................................................................22
The Intel Xeon 81xx/61xx/51xx/41xx/31xx Series Processor ...........................................22
Overview of the Processor Carrier Assembly ...................................................................23
Overview of the CPU Socket ............................................................................................23
Overview of the Processor Heatsink Module ....................................................................24
Creating the Non-F Model Processor Carrier Assembly...................................................25
Assembling the Processor Heatsink Module ....................................................................26
Preparing the CPU Socket for Installation ........................................................................27
Installing the Processor Heatsink Module .........................................................................28
Removing the Processor Heatsink Module .......................................................................29
2.3 Motherboard Installation .....................................................................................................30
5
Super X11SPL-F User's Manual
Tools Needed ....................................................................................................................30
Location of Mounting Holes ..............................................................................................30
Installing the Motherboard.................................................................................................31
2.4 Memory Support and Installation .......................................................................................32
Memory Support ................................................................................................................32
General Guidelines for Optimizing Memory Performance ................................................33
DIMM Installation ..............................................................................................................34
DIMM Removal .................................................................................................................34
2.5 Rear I/O Ports ....................................................................................................................35
2.6 Front Control Panel ............................................................................................................40
2.7 Connectors .........................................................................................................................45
Power Connections ...........................................................................................................45
Headers .............................................................................................................................47
2.8 Jumper Settings .................................................................................................................56
How Jumpers Work ...........................................................................................................56
2.9 LED Indicators ....................................................................................................................59
Chapter 3 Troubleshooting
3.1 Troubleshooting Procedures ..............................................................................................62
Before Power On ..............................................................................................................62
No Power ..........................................................................................................................62
No Video ...........................................................................................................................63
System Boot Failure .......................................................................................................63
Memory Errors ..................................................................................................................63
Losing the System's Setup Conguration .........................................................................64
When the System Becomes Unstable ..............................................................................64
3.2 Technical Support Procedures ...........................................................................................66
3.3 Frequently Asked Questions ..............................................................................................67
3.4 Battery Removal and Installation .......................................................................................68
Battery Removal ................................................................................................................68
Proper Battery Disposal ....................................................................................................68
Battery Installation .............................................................................................................68
3.5 Returning Merchandise for Service ....................................................................................69
6
Preface
Chapter 4 BIOS
4.1 Introduction .........................................................................................................................70
4.2 Main Setup .........................................................................................................................71
4.3 Advanced Setup Congurations .........................................................................................73
4.4 Event Logs .......................................................................................................................100
4.5 IPMI ..................................................................................................................................102
4.6 Security .............................................................................................................................105
4.7 Boot .................................................................................................................................109
4.8 Save & Exit .......................................................................................................................112
Appendix A BIOS Codes
Appendix B Software Installation
B.1 Installing Software Programs ...........................................................................................11 6
B.2 SuperDoctor® 5 .................................................................................................................117
Appendix C Standardized Warning Statements
Battery Handling ..............................................................................................................118
Product Disposal .............................................................................................................120
Appendix D UEFI BIOS Recovery
7
Super X11SPL-F User's Manual
Chapter 1
Introduction
Congratulations on purchasing your computer motherboard from an industry leader.
Supermicro motherboards are designed to provide you with the highest standards in quality
and performance.
In additon to the motherboard, several important parts that are included in the retail box are
listed below. If anything listed is damaged or missing, please contact your retailer.
1.1 Checklist
Main Parts List
Description Part Number Quantity
Supermicro Motherboard X11SPL-F 1
I/O Shield MCP-260-00109-0N 1
SATA Cables CBL-0044L 6
Quick Reference Guide MNL-1950-QRG 1
Important Links
For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.
• Supermicro product manuals: http://www.supermicro.com/support/manuals/
• Product drivers and utilities: ftp://ftp.supermicro.com
• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm
• If you have any questions, please contact our support team at: support@supermicro.com
This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.
8
Figure 1-1. X11SPL-F Motherboard Image
Chapter 1: Introduction
Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.
9
Super X11SPL-F User's Manual
I-SGPIO2
I-SATA2
I-SATA3
I-SATA4
I-SATA5
I-SATA6
I-SATA7
JWD1
JRK1
JL1
LEDBMC
PCH SLOT1 PCI-E 3.0 X4(IN X8)
COM2
JPG1
JD1
USB10/11(3.0)
SP1
+
USB2/3
USB4/5
JOH1
I-SGPIO1
JBT1
JIPMB1
I-SATA0 I-SATA1
JSD2
JSD1
Figure 1-2. X11SPL-F Motherboard Layout
ASpeed
AST2500
CPU SLOT3 PCI-E 3.0 X8
CPU SLOT2 PCI-E 3.0 X8
FANB
CPU SLOT4 PCI-E 3.0 X8(IN X16)
BIOS
LICENSE
Intel
C621
JPME2
JPL2
JPL1
CPU SLOT6 PCI-E 3.0 X8(IN X16)
CPU SLOT5 PCI-E 3.0 X8
DESIGNED IN USA
REV:1.01
X11SPL-F
MH10
MH11
M.2 PCI-E 3.0 X4
LE3
FANA
(not drawn to scale)
UID-SW
UID-LED
CPU SLOT7 PCI-E 3.0 X8
BT1
JF1
ON
PWR UID
RST
FAIL 1
PS
USB12(3.0)
LED
NIC
JF1
2
NIC
PWRHDD
LEDLED
NMIX
FAN4
+
USB6/7
JTPM1
LEDPWR
VGA
DIMMC1
JNVI2C1
FAN3
DIMMA2
DIMMA1
DIMMB1
BAR CODE
MAC CODE
IPMI CODE
FAN2
USB8/9(3.0)
COM1
LAN1LAN2
JLAN1JLAN2
IPMI_LAN
USB0/1
DIMME1
DIMMD1
DIMMD2
DIMMF1
FAN5
CPU
JPWR1
JPWR2
JSTBY1
JPI2C1
FAN1
Note: Components not documented are for internal testing only.
10
Quick Reference
SLOT1
COM2
JWD1
JPG1
MH10
USB10/11 (3.0)
USB2/3
MH11
USB4/5
JOH1
JIPMB1
JRK1
S-SGPIO1
S-SGPIO2
I-SATA2
I-SATA3
I-SATA4
I-SATA5
I-SATA6
I-SATA7
JD1
SP1
JL1
I-SGPIO2
I-SATA2
I-SATA3
I-SATA4
I-SATA5
I-SATA6
I-SATA7
I-SATA0
JWD1
JRK1
JL1
I-SATA1
SLOT2
LEDBMC
PCH SLOT1 PCI-E 3.0 X4(IN X8)
COM2
JPG1
JD1
USB10/11(3.0)
SP1
+
USB2/3
USB4/5
JOH1
I-SGPIO1
JBT1
JIPMB1
I-SATA0 I-SATA1
JSD2
JSD1
JSD1
FANB
SLOT4
SLOT3
ASpeed
AST2500
LEDBMC
CPU SLOT3 PCI-E 3.0 X8
CPU SLOT2 PCI-E 3.0 X8
BIOS
LICENSE
Intel
C621
FANB
JPME2
JSD2
JBT1
JPME2
FANA
M.2 PCI-E 3.0 X4
JPL2
SLOT6
SLOT7
SLOT5
JPL1
JPL2
JPL1
CPU SLOT4 PCI-E 3.0 X8(IN X16)
DESIGNED IN USA
LE3
CPU SLOT6 PCI-E 3.0 X8(IN X16)
CPU SLOT5 PCI-E 3.0 X8
REV:1.01
X11SPL-F
MH10
MH11
M.2 PCI-E 3.0 X4
LE3
FANA
BT1
JTPM1
BT1
JTPM1
USB6/7
USB12 (3.0)
UID-LED
UID-SW
VGA
UID-SW
UID-LED
CPU SLOT7 PCI-E 3.0 X8
JF1
ON
PWR UID
RST
FAIL 1
PS
USB12(3.0)
LED
NIC
2
+
NIC
PWRHDD
LEDLED
USB6/7
NMIX
LEDPWR
FAN4
JF1
JF1
FAN4
LEDPWR
VGA
JNVI2C1
FAN3
FAN3
FAN2
LAN2
DIMMA2
DIMMA1
DIMMB1
DIMMC1
BAR CODE
MAC CODE
IPMI CODE
FAN2
JNVI2C1
USB8/9 (3.0)
IPMI_LAN
USB0/1
LAN1
USB8/9(3.0)
LAN1LAN2
JLAN1JLAN2
CPU
JPWR2
Chapter 1: Introduction
COM1
COM1
FAN5
FAN5
IPMI_LAN
USB0/1
DIMMF1
DIMME1
DIMMD1
DIMMD2
DIMMC1
DIMMB1
DIMMA1
DIMMA2
DIMMD2
DIMMD1
DIMME1
DIMMF1
CPU
JPWR2
JSTBY1
JPWR1
JSTBY1
FAN1
FAN1
JPWR1
JPI2C1
JPI2C1
Notes:
• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel con-
nections.
• " " indicates the location of Pin 1.
• Jumpers/LED indicators not indicated are used for testing only.
• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do
not install the onboard battery upside down to avoid possible explosion.
11
Super X11SPL-F User's Manual
Quick Reference Table
Jumper Description Default Setting
JBT1 CMOS Clear Open (Normal)
JPG1 VGA Enable/Disable Pins 1-2 (Enabled)
JPL1 LAN1 Enable/Disable Pins 1-2 (Enabled)
JPL2 LAN2 Enable/Disable Pins 1-2 (Enabled)
JPME2 ME Manufacturing Mode Pins 1-2 (Normal)
JWD1 Watchdog Timer Pins 1-2 (Reset)
LED Description Status
LE3 M.2 LED Blinking Green: Device Working
LEDBMC BMC Heartbeat LED Blinking Green: BMC Normal
LEDPWR Onboard Power LED Solid Green: Power On
UID-LED Unit Identier (UID) LED Solid Blue: Unit Identied
Connector Description
BT1 Onboard Battery
COM1, COM2 COM Port, COM Header
FAN1 ~ FAN5, FANA/FANB CPU/System Fan Headers
IPMI_LAN Dedicated IPMI LAN Port
I-SATA0 ~ I-SATA7 Intel® PCH SATA 3.0 Ports (with RAID 0, 1, 5, 10)
I-SGPIO1, I-SGPIO2 Serial Link General Purpose I/O Connection Headers
JD1 Speaker/Power LED Indicator (Pins 1-3: Power LED, Pins 4-7: Speaker)
JF1 Front Control Panel Header
JIPMB1 4-pin BMC External I2C Header (for an IPMI Card)
JL1 Chassis Intrusion Header
JNVI2C1 NVMe I2C Header
JOH1 Overheat LED Indicator
JPI2C1 Power System Management Bus (SMB) I2C Header
JPWR1 8-pin 12V CPU Power Connector
JPWR2 24-pin ATX Power Connector
JRK1 Intel RAID Key Header
JSD1, JSD2 SATA DOM Power Connectors
JSTBY1 Standby Power Header
JTPM1 Trusted Platform Module/Port 80 Connector
LAN1, LAN2 Dual 1G Base-T Ports
M.2 M.2 PCI-E 3.0 x4 or SATA 3.0 Slot (Supports M-Key 2280 and 22110)
MH10, MH11 M.2 Mounting Holes
SLOT1 PCH PCI-E 3.0 x4 (in x8) Slot
Note: Table is continued on the next page.
12
Connector Description
SLOT2, SLOT3, SLOT5, SLOT7 CPU PCI-E 3.0 x8 Slot
SLOT4, SLOT6 CPU PCI-E 3.0 x8 (in x16) Slot
SP1 Internal Speaker/Buzzer
UID-SW Unit Identier (UID) Switch
USB0/1 Back Panel Universal Serial Bus (USB) 2.0 Ports
USB2/3, USB4/5, USB6/7 Front Accessible USB 2.0 Headers
USB8/9 Back Panel USB 3.0 Ports
USB10/11 Front Accessible USB 3.0 Header
USB12 USB 3.0 Type-A Header
VGA VGA Port
Chapter 1: Introduction
13
Super X11SPL-F User's Manual
Motherboard Features
Motherboard Features
CPU
• Supports an Intel® Xeon 81xx/61xx/51xx/41xx/31xx series (Socket P0-LGA 3647) processor with up to 28 cores and a
thermal design power (TDP) of up to 165W
Note: The X11SPL-F motherboard does not support FPGA or Fabric processors.
Memory
• Up to 256GB of RDIMM, 512GB of LRDIMM, and 1TB of 3DS LRDIMM DDR4 (288-pin) ECC memory with speeds of up
to 2666MHz in eight memory slots
Note: Memory speed support depends on the processors used in the system.
DIMM Size
• Up to 128GB at 1.2V
Note: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/
motherboard.
Chipset
• Intel PCH C621
Expansion Slots
• One (1) PCI-Express 3.0 x4 (in x8) Slot (PCH SLOT1)
• Four (4) PCI-Express 3.0 x8 Slots (CPU SLOT2, SLOT3, SLOT5, SLOT7)
• Two (2) PCI-Express 3.0 x8 (in x16) Slot (CPU SLOT4, SLOT6)
Network
• Intel Ethernet Controller i210 + i210 for Dual 1G BASE-T Ports
• One (1) Dedicated IPMI LAN located on the rear I/O panel
Baseboard Management Controller (BMC)
• ASpeed AST2500 BMC
Graphics
• Graphics controller via ASpeed AST2500 BMC
I/O Devices
• Serial (COM) Port
• One (1) serial port on the rear I/O panel (COM1)
• One (1) front accessible serial port header (COM2)
• SATA 3.0 • Eight (8) SATA 3.0 ports at 6Gb/s (I-SATA0 ~ I-SATA7 with RAID 0, 1, 5, 10)
• Video (VGA) Port • One (1) VGA connection on the rear I/O panel
Note: The table above is continued on the next page.
14
Chapter 1: Introduction
Motherboard Features
Peripheral Devices
• Two (2) USB 2.0 ports on the rear I/O panel (USB0/1)
• Two (2) USB 3.0 ports on the rear I/O panel (USB8/9)
• Three (3) front accessible USB 2.0 headers with two (2) USB connections (USB2/3, USB4/5, USB6/7)
• One (1) front accessible USB 3.0 header with two (2 ) USB connections (USB10/11)
• One (1) USB 3.0 Type-A header (USB12)
BIOS
• 256Mb AMI BIOS
• ACPI 6.0, Plug and Play (PnP), BIOS rescue hot-key, SPI dual/quad speed support, riser card auto detection support,
real time clock (RTC) wakeup, and SMBIOS 3.0 or later
Power Management
• ACPI power management
• Power button override mechanism
• Power-on mode for AC power recovery
• Wake-On LAN
• Power supply monitoring
®
SPI Flash ROM
System Health Monitoring
• Onboard voltage monitoring for +1.8V, +3.3V, +5V, +/-12V, +3.3V stdby, +5V stdby, VBAT, HT, memory, PCH temperature,
system temperature, and memory temperature
• 5 CPU switch phase voltage regulator
• CPU thermal trip support
• Platform Environment Conguration Interface (PECI)/TSI
Fan Control
• Fan status monitoring via IPMI connections
• Single cooling zone
• Low-noise fan speed control
• Seven (7) 4-pin fan headers
System Management
• Trusted Platform Module (TPM) support
• SuperDoctor® 5
• Redundant power supply unit detection sensor
• Chassis intrusion header and detection
• Server Platform Service
LED Indicators
• CPU/system overheat LED
• Power/suspend-state indicator LED
• Fan failed LED
• UID/remote UID
• HDD activity LED
• LAN activity LED
Note: The table above is continued on the next page.
15
Super X11SPL-F User's Manual
Dimensions
• 12" (W) x 9.6" (L) ATX (304.8mm x 243.84mm)
Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas-
sis and heatsink specications for proper CPU TDP sizing.
Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Conguration User's Guide available at http://www.supermicro.com/support/manuals/.
Note 3: It is strongly recommended that you change BMC log-in information upon initial system power-on. The manufacture default username is ADMIN and the password
is ADMIN. For proper BMC conguration, please refer to http://www.supermicro.com/
products/info/les/IPMI/Best_Practices_BMC_Security.pdf.
Motherboard Features
16
SLOT 3
SLOT 4
SLOT 2
PCI-E X8
PCI-E X8
PCI-E X16
M.2 SSD
RJ45
RJ45
PCI-E X8 G3
PCI-E X8 G3
SLOT 1
#C-1
#B-1
#A-2
#A-1
DDRIV
2133/2666
PCI-E X8 G3
PCI-E X8
PCI-E X4 G3 (SATA X1)
LAN2
i210AT
LAN1
i210AT
Figure 1-3.
System Block Diagram
VCCP0 12v
VR13
5+1 PHASE
165W
VCCP0
SNB CORE
PCI-E X4 G3
PCI-E X1 G2
PCI-E X1 G2
DDR-IV
#3A
#3B
#1B #2B DMI3
#0~3
PCIe
#8~11
#7
#6
PECI:30
SOCKET ID:0
#2A
DMI3
Intel
PCH
(C621)
#1A
PCI-E X8 G3
#D-1
PCI-E X8 G3
SLOT 5
6.0 Gb/S
Chapter 1: Introduction
#F-1
#E-1
#D-2
DDRIV
2133/2666
PCI-E X8
SLOT 7
PCI-E X8
PCI-E X8 G3
#7
#6
#5
#4
#3
#2
#1
#0
SATA
PCI-E X16
SLOT 6
RJ45
DDR4
BMC Boot Flash
W83773G local and remote at SMBUS
LAN3
RTL8211FD-CG
SPI
VGA CONN
Temp Sensor
RGRMII
BMC
AST2500
COM1
Connector
RMII/NCSI
COM2
Header
PCI-E X1 G2
USB 2.0
ESPI
ESPI
Header
SPI(Reserved)
#5
#13 USB2.0
Switch
TPM HEADER
Debug Card
FRONT PANEL
USB2.0 #3,6
USB2.0 #4,5
USB2.0 #7,9
USB2.0 #0,1
SPI
SPI
BIOS
Front USB2.0 x 6
USB 2.0
USB 2.0
USB 3.0
SYSTEM POWER
FAN SPEED
Rear USB2.0 x 2
USB
Front USB3.0 x 2
USB
Type A USB3.0
USB
CTRL
USB
USB
Rear USB3.0 x 2
Note: This is a general block diagram and may not exactly represent the features on
your motherboard. See the previous pages for the actual specications of your motherboard.
17
Super X11SPL-F User's Manual
1.2 Processor and Chipset Overview
Built upon the functionality and capability of the Intel® Xeon 81xx/61xx/51xx/41xx/31xx series
(Socket P0-LGA 3647) processor and the Intel PCH C621 chipset, the X11SPL-F motherboard
provides system performance, power efciency, and feature sets to address the needs of
next-generation computer users. This motherboard is the perfect solution for I/O intensive
application and video surveillance.
The Intel PCH C621 chipset supports the following features:
• DDR4 288-pin memory support
• Intel Rapid Storage Technology Enterprise
• ACPI Power Management
• Digital Media Interface (DMI)
• Management Engine (ME)
• SMBus speeds of up to 400KHz for BMC connectivity
• Improved I/O capabilities to high-storage-capacity congurations
• SPI Enhancements
• Intel® Node Manager 3.0 for advanced power monitoring, capping, and management for
BMC enhancement (see note below).
• BMC supports remote management, virtualization, and the security package for enterprise
platforms
Note: Node Manager support depends on the power supply used in your system.
1.3 Special Features
Recovery from AC Power Loss
The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.
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Chapter 1: Introduction
1.4 System Health Monitoring
Onboard Voltage Monitors
An onboard voltage monitor will scan the voltages of the onboard chipset, memory, CPU,
and battery continuously. Once a voltage becomes unstable, a warning is given, or an error
message is sent to the screen. The user can adjust the voltage thresholds to dene the
sensitivity of the voltage monitor.
Fan Status Monitor with Firmware Control
The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.
Environmental Temperature Control
System Health sensors monitor temperatures and voltage settings of onboard processors
and the system in real time via the IPMI interface. Whenever the temperature of the CPU or
the system exceeds a user-dened threshold, system/CPU cooling fans will be turned on to
prevent the CPU or the system from overheating.
Note: To avoid possible system overheating, please be sure to provide adequate air-
ow to your system.
System Resource Alert
This feature is available when used with SuperDoctor 5® in the Windows OS or in the Linux
environment. SuperDoctor is used to notify the user of certain system events. For example,
you can congure SuperDoctor to provide you with warnings when the system temperature,
CPU temperatures, voltages and fan speeds go beyond a predened range.
1.5 ACPI Features
ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power
management features throughout a computer system, including its hardware, operating
system and application software. This enables the system to automatically turn on and off
peripherals such as CD-ROMs, network cards, hard disk drives and printers.
In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play, and an operating system-independent
interface for conguration control. ACPI leverages the Plug and Play BIOS data structures,
while providing a processor architecture-independent implementation that is compatible with
Windows 2012/2012R and 2016 operating systems.
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Super X11SPL-F User's Manual
1.6 Power Supply
As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates where
noisy power transmission is present.
The X11SPL-F motherboard accommodates a 24-pin ATX power supply. Although most power
supplies generally meet the specications required by the CPU, some are inadequate. In
addition, one 12V 8-pin power connection is also required to ensure adequate power supply
to the system.
Warning: To avoid damaging the power supply or the motherboard, be sure to use a
power supply that contains a 24-pin and an 8-pin power connector. Be sure to connect
the power supplies to the 24-pin power connector (JPWR2), and the 8-pin power connector (JPWR1) on the motherboard. Failure in doing so may void the manufacturer
warranty on your power supply and motherboard.
It is strongly recommended that you use a high quality power supply that meets ATX power
supply Specication 2.02 or above. It must also be SSI compliant. (For more information,
please refer to the website at http://www.ssiforum.org/).
1.7 Serial Port
The X11SPL-F motherboard supports two serial communication connections. COM Ports 1
and 2 can be used for input/output. The UART provides legacy speeds with a baud rate of
up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s,
which support high-speed serial communication devices.
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Chapter 2: Installation
Chapter 2
Installation
2.1 Static-Sensitive Devices
Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging your
system board, it is important to handle it very carefully. The following measures are generally
sufcient to protect your equipment from ESD.
Precautions
• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic bag.
• Handle the motherboard by its edges only; do not touch its components, peripheral chips,
memory modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in use.
• For grounding purposes, make sure your computer chassis provides excellent conductivity
between the power supply, the case, the mounting fasteners and the motherboard.
• Use only the correct type of onboard CMOS battery. Do not install the onboard battery
upside down to avoid possible explosion.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.
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Super X11SPL-F User's Manual
2.2 Processor and Heatsink Installation
The processor (CPU) and processor carrier should be assembled together rst to form
the processor carrier assembly. This will be attached to the heatsink to form the processor
heatsink module (PHM) before being installed onto the CPU socket.
Notes:
• Use ESD protection.
• Unplug the AC power cord from all power supplies after shutting down the system.
• Check that the plastic protective cover is on the CPU socket and none of the socket pins
are bent. If they are, contact your retailer.
• When handling the processor, avoid touching or placing direct pressure on the LGA lands
(gold contacts). Improper installation or socket misalignment can cause serious damage
to the processor or CPU socket, which may require manufacturer repairs.
• Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.
• Refer to the Supermicro website for updates on processor support.
• All graphics in this manual are for illustrations only. Your components may look different.
The Intel Xeon 81xx/61xx/51xx/41xx/31xx Series Processor
Non-Fabric Model
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Chapter 2: Installation
Overview of the Processor Carrier Assembly
The processor carrier assembly contains the Intel Xeon Non-Fabric (Non-F) processor and
a processor carrier.
1. Non-F Processor
2. Processor Carrier
Overview of the CPU Socket
The CPU socket is protected by a plastic protective cover.
1. Plastic Protective Cover
2. CPU Socket
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Super X11SPL-F User's Manual
Overview of the Processor Heatsink Module
The Processor Heatsink Module (PHM) contains a heatsink, a processor carrier, and the
Intel Xeon Non-Fabric (Non-F) processor.
1. Heatsink with Thermal Grease
2. Processor Carrier
3. Non-F Processor
Processor Heatsink Module
Bottom View
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Chapter 2: Installation
Creating the Non-F Model Processor Carrier Assembly
To install a Non-F model processor into the processor carrier, follow the steps below:
1. Hold the processor with the LGA lands (gold contacts) facing up. Locate the small, gold
triangle in the corner of the processor and the corresponding hollowed triangle on the
processor carrier. These triangles indicate pin 1. See the images below.
2. Using the triangles as a guide, carefully align and place Point A of the processor into
Point A of the carrier. Then gently ex the other side of the carrier for the processor to t
into Point B.
3. Examine all corners to ensure that the processor is rmly attached to the carrier.
CPU (Upside Down)
with CPU LGA Lands up
Align Point A of the CPU and
Point A of the Processor Carrier
Align CPU Pin 1
B
Align Point B of the CPU and
Point B of the Processor Carrier
A
Pin 1
B
A
Processor Carrier
(Upside Down)
Allow carrier to
latch onto CPU
B
A
Allow carrier to
latch onto CPU
Processor Carrier Assembly (Non-F Model)
Pin 1
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Super X11SPL-F User's Manual
Assembling the Processor Heatsink Module
After creating the processor carrier assembly for the Non-F model processor, mount it onto
the heatsink to create the processor heatsink module (PHM):
1. Note the label on top of the heatsink, which marks the heatsink mounting holes as 1,
2, 3, and 4. If this is a new heatsink, the thermal grease has been pre-applied on the
underside. Otherwise, apply the proper amount of thermal grease.
2. Turn the heatsink over with the thermal grease facing up. Hold the processor carrier
assembly so the processor's gold contacts are facing up, then align the triangle on the
assembly with hole 1 of the heatsink. Press the processor carrier assembly down. The
plastic clips of the assembly will lock outside of holes 1 and 2, while the remaining clips
will snap into their corresponding holes.
3. Examine all corners to ensure that the plastic clips on the processor carrier assembly
are rmly attached to the heatsink.
Triangle on the CPU
Triangle on the
Processor Carrier
Plastic clips 1 and 2 lock
outside the heatsink’s
mounting holes
Non-Fabric Processor Carrier Assembly
(Upside Down)
Heatsink
(Upside Down)
2
2
1
1
Remaining plastic clips snap
into the other corner holes
2
of the heatsink
1
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Chapter 2: Installation
Preparing the CPU Socket for Installation
This motherboard comes with a plastic protective cover installed on the CPU socket. Remove
it from the socket to install the Processor Heatsink Module (PHM). Gently pull up one corner
of the plastic protective cover to remove it.
CPU Socket with Plastic Protective Cover
Remove the plastic protective
cover from the CPU socket.
Do not touch or bend
the socket pins.
Socket Pins
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Super X11SPL-F User's Manual
Installing the Processor Heatsink Module
After assembling the Processor Heatsink Module (PHM), install the PHM onto the CPU socket:
1. Align hole 1 of the heatsink with the printed triangle on the CPU socket. See the left
image below.
2. Make sure all four holes of the heatsink are aligned with the socket before gently placing
the heatsink on top.
3. With a T30 Torx-bit screwdriver, gradually tighten screws #1 - #4 to ensure even
pressure. The order of the screws is shown on the label on top of the heatsink. To
avoid damaging the processor or socket, do not use a force greater than 12 lbf-in when
tightening the screws.
4. Examine all corners to ensure that the PHM is rmly attached to the socket.
Oval C
Oval D
Small Guide Post
Large Guide Post
Printed Triangle
Mounting the Processor Heatsink Module
onto the CPU socket (on the motherboard)
#1
Use a torque
of 12 lbf-in
T30 Torx Screwdriver
#4
#2
#3
Tighten the screws in
the sequence of 1, 2, 3, 4
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Chapter 2: Installation
Removing the Processor Heatsink Module
Before removing the processor heatsink module (PHM) from the motherboard, unplug the
AC power cord from all power supplies after shutting down the system. Then follow the steps
below:
1. Use a T30 Torx-bit screwdriver to loosen the four screws in a backwards sequence of
#4, #3, #2, and #1.
2. Gently lift the PHM upwards to remove it from the socket.
#1
Remove the screws in
the sequence of 4, 3, 2, 1
#4
#2
#3
Printed Triangle on Motherboard
CPU Socket
After removing the screws,
lift the Processor Heatsink
Module off the CPU socket.
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Super X11SPL-F User's Manual
2.3 Motherboard Installation
All motherboards have standard mounting holes to t different types of chassis. Make sure
that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.
Tools Needed
I-SGPIO2
I-SATA2
I-SATA3
I-SATA4
I-SATA5
I-SATA6
I-SATA7
Screwdriver
COM2
JWD1
JPG1
JD1
USB10/11(3.0)
USB2/3
USB4/5
I-SGPIO1
JRK1
JIPMB1
JL1
Phillips
(1)
ASpeed
AST2500
LEDBMC
PCH SLOT1 PCI-E 3.0 X4(IN X8)
SP1
+
JOH1
JBT1
I-SATA0 I-SATA1
JSD2
JSD1
CPU SLOT3 PCI-E 3.0 X8
CPU SLOT2 PCI-E 3.0 X8
BIOS
LICENSE
Intel
C621
FANB
JPME2
Phillips Screws
JPL2
JPL1
CPU SLOT4 PCI-E 3.0 X8(IN X16)
DESIGNED IN USA
REV:1.01
FANA
CPU SLOT6 PCI-E 3.0 X8(IN X16)
CPU SLOT5 PCI-E 3.0 X8
X11SPL-F
MH10
MH11
BT1
M.2 PCI-E 3.0 X4
JTPM1
LE3
(9)
UID-SW
UID-LED
VGA
CPU SLOT7 PCI-E 3.0 X8
JF1
ON
PWR UID
RST
FAIL 1
PS
USB12(3.0)
LED
NIC
JF1
2
NIC
PWRHDD
LEDLED
NMIX
FAN4
+
USB6/7
LEDPWR
DIMMC1
JNVI2C1
FAN3
DIMMA2
DIMMA1
DIMMB1
BAR CODE
MAC CODE
IPMI CODE
FAN2
Standoffs (9)
Only if Needed
USB8/9(3.0)
LAN1LAN2
JLAN1JLAN2
CPU
IPMI_LAN
USB0/1
DIMMD2
DIMMF1
DIMME1
DIMMD1
JPWR2
COM1
FAN1
JPWR1
JSTBY1
FAN5
JPI2C1
Location of Mounting Holes
Note: 1) To avoid damaging the motherboard and its components, please do not use
a force greater than 8 lbf-in on each mounting screw during motherboard installation.
2) Some components are very close to the mounting holes. Please take precautionary measures to avoid damaging these components when installing the motherboard
to the chassis.
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