Datasheet FLI30x02 Datasheet (ST)

FLI30x02
Single-chip analog TV processor
Data Brief
Features
Triple 10-bit ADC
HDMI Rx (in case of FLI30602H)
Programmable digital input port (8/16 bits in
FLI30602H and 24 bits in FLI30502)
Faroudja DCDi Edge® image enhancement
suite
ACM-3D
OSD controller
Embedded microprocessor
VBI slicer
Worldwide SIF audio demodulator
Audio processing
Advanced audio enhancement
Digital audio support
I2S, SPDIF input
I2S, SPDIF output
Loud speaker, sub woofer, and headphone
Analog line in, microphone in, and line out
Tuner noise reduction
Application
LCD TVs
Portable or handheld TVs
September 2008 Rev 1 1/7
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Description FLI30x02

1 Description

The FLI30x02 ICs are highly integrated solutions for LCD TV and Digital Audio Video applications. These solutions are capable of meeting global market requirements for: video and audio decoding and processing, Sound IF demodulation, and HDMI input support. It provides Faroudja DCDi Edge suite for advanced video and color processing.
The chip incorporates a high-speed triple 10-bit ADC that can capture and process both video (SDTV or HDTV) and graphics streams. It has a highly programmable video front-end supporting multiple inputs and connection formats such as RGB, YPrPb, S-Video, CVBS, and SCART; multi-standard video decoder (NTSC, PAL, SECAM, and all sub formats); and global VBI standards and services support via VBI Slicer. The embedded microprocessor and OSD enable full system control without external devices.
The chip supports worldwide TV audio standard demodulation (SIF) including digital audio (NICAM). It also supports analog line in, line outputs, loudspeaker, sub woofer, and headphones. The audio DSP supports high end audio processing and enhancement. In addition, I2S or SPDIF input and output ports with digital processing amplifier enable a full digital processing pipe for audio thereby supporting smaller area and power for constrained applications.
HDMI integration is beneficial; it allows both video and audio processing including
5.1 CH to 2 CH audio conversions. The DCDi Edge suite of features, which include Adaptive Contrast and Color (ACC), ensure full dynamic video range support. The ACM 3D enables color manipulation for subtle changes in color to improve the image. The chip can also support DTV front-end with its digital video and audio input ports, thereby ensuring signal integrity due to full digital processing.

Figure 1. System diagram

FLI30x02
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FLI30x02 Feature attributes

2 Feature attributes

Triple 10-bit ADC
RGB/YPbPr support up to 160 MHz
SCART–RGB + fast blank support
Flexible analog front-end
Digital input port
8/16/24-bit reconfigurable input port
Faroudja DCDi Edge enhancement
Eliminates objectionable staircasing
Faroudja horizontal enhancement module
Adaptive Contrast and Color (ACC)
Active Color Management—3D (ACM-3D)
Embedded microprocessor
Turbo 186 core
Serial or parallel Flash support
2-wire slave controller, UART support
Internal RESET controller
GPIOs, low bandwidth ADC—5-input
Infrared receiver interface
Panel or digital output
18 or 24-bit TTL output
Dual LVDS up to SXGA
Energy spectrum management for reducing EMI
2D video decoder
Worldwide NTSC/PAL/SECAM support
Macrovision™ and VCR trick mode support
VBI slicer
V-Chip, closed captioning, XDS, CGMS, and WSS decode
Teletext 1.5 support
10 page (internal) support
Extended page support with external SRAM
Scaling engine
Independent H and V scaling factors
Anamorphic (non-linear) scaling
4:2:2 YPbPr or 4:4:4 RGB scaling
OSD controller
Up to 4 windows: 1, 2, or 4 bits per pixel color
Programmable font scalar to meet teletext requirements
Audio support
Two SIF inputs
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Feature attributes FLI30x02
Global audio support—BTSC, A2, NICAM, EIAJ, etc.
Audio line in, microphone in, and line out support
Loudspeaker, sub woofer, and headphone support
Audio DSP
Audio enhancement features—pseudo stereo, 5-band graphic equalizer
I2S, SPDIF digital audio input and output support
HDMI support (FLI30602H)
HDMI 1.2 compliant
Backward compatible with DVI 1.0
Supports HDCP
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FLI30x02 Ordering information

3 Ordering information

Table 1. Order codes

Part number Description
FLI30502-AC 256 PQFP
FLI30602H-AC 256 PQFP
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com.
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Revision history FLI30x02

4 Revision history

Table 2. Revision history

Date Revision Changes
08-Sep-2008 1 Initial release.
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FLI30x02
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