Page 1
FLLD261
HIGH CONDUCTANCE LOW LEAKAGE DIODE
PD . . . .350 mW @ TA = 25 Deg C
BV . . . .200 V (MIN) @ IR = 5 uA
3
PACKAGE
TO-236AB (Low)
P8A
ABSOLUTE MAXIMUM RATINGS (NOTE 1)
TEMPERATURES
Storage Temperature -55 to +150 Degrees C
Operating Junction Temperature -55 to +150 Degrees C
POWER DISSIPATION (NOTES 2 & 3)
Total Device Dissipation at TA = 25 Deg C 350 mW
Derating Factor per Degree C 2.8 mW
VOLTAGES & CURRENTS
WIV Working Inverse Voltage 100 V
IO Average Rectified Current 250 mA
IF DC Forward Current 600 mA
if Recurrent Peak Forward Current 700 mA
if (surge) Peak Forward Surge Current
Pulse width = 1 second 1.0 A
Pulse width = 1 microsec 3.0 A
1 2
CONNECTION DIAGRAMS
3
21
ELECTRICAL CHARACTERISTICS (25 Degrees C Ambient Temperature unless otherwise stated)
SYM CHARACTERISTICS MIN MAX UNITS TEST CONDITIONS
BV Breakdown Voltage 200 V IR = 5.0 uA
IR Reverse Voltage Leakage Current 5.0 nA VR = 100 V
5.0 uA VR = 100 V TA = 150 Deg C
VF Forward Voltage 1.40 V IF = 200 mA
CT Diode Capacitance 4.0 pF VR = 1.0 V f = 1.0 MHZ
TRR Reverse Recovery Time 400 ns IF = IR = 50 to 400 mA
IRR = 10% IR RL = 100 ohms
TFR Forward Recovery Time 10 ns IF = 10 mA
VFM Peak Forward Voltage 0.9 V IF = 10 mA
Typ Rise Time = 5 ns +/-20%
NOTES:
1. These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
2. These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Page 2
0.019 (0.483)
0.015 (0.381)
3
0.098 (2.489)
0.083 (2.108)
0.040 (1.016)
0.035 (0.889)
3 CHARACTERS MAX
1
0.080 (2.032)
0.070 (1.778)
0.120 (3.048)
0.110 (2.794)
0.055 (1.397)
0.047 (1.194)
2
LOW PROFILE 0.041 (1.041)
0.024 (0.810)
0.018 (0.457)
(49) 0.030 (0.762)
LOW PROFILE 0.0040 (0.102)
(49) 0.0005 (0.013)
SOT-23 (DIODE)
0.0059 (0.150)
0.0035 (0.089)
TO-236AB (LOW PROFILE)
11-March-1997
Page 3
0.120” MINIMUM
(3.048)
0.030” +/- 0.005”
(0.762 +/- 0.127)
0.035” TYPICAL
(0.889)
RECOMMENDED SOLDER PADS
FOR
0.060” +/- 0.005”
(1.524 +/- 0.127)
SOT-23
Page 4
0.099” +/- 0.005”
(2.524 +/- 0.127 )
0.031” +/- 0.005”
(0.800 +/- 0.127)
0.039” +/- 0.005”
(1.000 +/- 0.127)
0.037” +/- 0.005”
(0.950 +/- 0.127 )
RECOMMENDED SOLDER PADS
FOR
0.060” +/- 0.005”
(1.524 +/- 0.127)
U.S., European & Japanese (SC-59)
SOT-23
Page 5
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The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
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CoolFET™
CROSSVOL T™
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DOME™
EcoSPARK™
E2CMOS
EnSigna
TM
TM
FACT™
FACT Quiet Series™
FAST
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
LittleFET™
MicroFET™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
POP™
PowerTrench
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SILENT SWITCHER
SMART ST ART™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
UHC™
UltraFET
VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN T O IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS P ATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORA TION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STA TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
Formative or
In Design
First Production
Full Production
Not In Production
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. H2
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