* The distance may vary depending on using conditions and
the manufacturer and equipment that is used.
Design and specifications are subject to change without
notice.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SPEAKER REMOTE
COMMANDER SYSTEM
Page 2
0
SECTION 1
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
1-1. CASE (RX), LOWER
5 foot (A), rubber
1 lid, battery case
6 BTP 2.6x10
7 case (RX), lower
1-2. FE, RM AND RX BOARDS
4 BTP 2.6x10
3 BTP 2.6x1
case assy (RX), upper
2 knob, volume
5 Removal the solders.
3 B 2.6x8
0 RX board
6 Removal the solder.
4
7 RM board
2 B 2.6x8
1 filter (RX)
9 FE board
8 Removal the solder.
– 2 –
Page 3
5
1-3. WIRING METHOD FOR RX BOARD
When assembling the RM-VS10, wire as shown in the figure below.
FE board
hole(boss)
install wire so as to be caught
between the hole(boss) and C7
C75
RX board
– 3 –
Page 4
SECTION 2
ELECTRICAL ADJUSTMENTS
Note:
1. The adjustments is performed in the order that they are listed.
2. When adjusting the remote commander, the transmitter is used
for adjustment.
3. 0 dB=1.0 V
2-1. Remote commander
2-1-1. Tuning adjustment
Method:
1. Supply 6 V to TP1 (6 V) from a stabilized power supply.
(TP3 (GND) is connected to the ground.)
2. Input a signal of 1 kHz and –10 dB to the transmitter (TMRIF10M) from an oscillator.
3. Connect a distortion factor meter between TP20 and TP21.
Note:The speaker should be always connected to protect the
circuit.
4. Set the volume (VR51) to the maximum position.
5. Adjust T51 so that the reading on the distortion factor
meter is minimum.
Connections and adjustment element:
Transmitter
Oscillator
AUDIO IN A
(TMR-IF10M)
1 kHz/
–10 dB
TP21
+
–
600 Ω
Distortion factor meter
+
–
– RX BOARD (CONDUCTOR SIDE) –
TP20
TP1
T51
L
R
TP3
VR51
6Vdc
Stabilized power supply
+
–
– 4 –
Page 5
SECTION 3
DIAGRAMS
RM-VS10
3-1. BLOCK DIAGRAM
FE BOARD
B+
RF AMP
INFRARED
SENSOR
Q53-55
D53
RM BOARD
+
4.5V
INFRARED
EMITTER
D51
BUFFER
Q56
RX BOARD
16
MIXERLIMITERDEMOD
LED
DRIVER
Q52
OSC
X51
4MHz
35
T51
TUNING
SYSTEM CONTROL
8
REM
10
OSC2
11
OSC1
IC52
8
B+
FM DET
IC53
15
|
21
•
23
|
26
SQUELCH
TRIGGER,
HYSTERESIS
CARBON
SWITCH
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
for Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
AMP
VR51
9
13
14
MUTE
Q57
VOL
IC54
+
7
8
5
6
1
–
+
3
–
SP1
SPEAKER
J51
EARPHONE
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
4
W or less unless otherwise
•%: indicates tolerance.
f
•
: internal component.
• C : panel designation.
• U : B+ Line.
• H : adjustment for repair.
• Power voltage is dc 4.5 V and fed with regulated dc power
supply from external power voltage jack.
• Voltage is dc with respect to ground under no-signal
+
3V REG
IC55
+
3V
32
REG
B+
D54
SPEAKER
POWER
POWER
SWITCH
Q58
+4.5V POWER
SWITCH
Q51
TIMER
IC51
76
CONTROL
+
4.5V
+4.5V
POWER
SWITCH
Q51
SPEAKER POWER
DC IN 4.5V
!
DRY BATTERY
UM-3X4
6V
J52
• Signal path
: ANALOG
: RF
(detuned) condition.
no mark : POWER on
• Voltages are tak en with a V OM (Input impedance 10 MΩ).
Voltage var iations may be noted due to normal production tolerances.
• Signal path.
F: Analog
J: RF
for Printed Wiring Boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
z
•
•
: Through hole.
f
: internal component.
• b : Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side:Parts on the pattern face side seen from
(Conductor Side)the pattern face are indicated.
Parts face side:Parts on the carbon pattern face side
(Carbon Patternseen from the carbon pattern face are
Side)indicated.
• IC BLOCK DIAGRAMS
IC53 MC3361CDIC51 BU2305F-E2
MIXER
INPUT
16
OSCILLATOR
1
CRYSTAL
OSC
MIXER
MUTE
GND
15
14
SQUELCH TRIGGER WITH
HYSTERESIS
2
MIXER
OUTPUT
3
SCAN
CONTROL
13
VCC
4
SQUELCH
IN
12
LIMITER
INPUT
5
FILTER
OUTPUT
FILTER
AMP
LIMITER
AMP
FILTER
INPUT
11
_
+
6
DECOUPLING
RECOVERED
AUDIO
10
AF
+
AMP
DEMODULATOR
+
7
QUAD
COIL
OSC1
9
8
1
23 BIT
COUNTER
OSC2
2
CONTROL
CHATTERING
PROECTOR
OSC3
3
45
GND
VDD
8
OUT
7
SET
6
RF
– 5 –– 6 –
Page 6
RM-VS10
3-2. PRINTED WIRING BOARDS • Refer to page 6 for Note.
R581-216-057-00 METAL CHIP2.2K5%1/10W
R591-216-043-91 RES-CHIP5605%1/10W
R601-216-057-00 METAL CHIP2.2K5%1/10W
R611-216-097-91 RES-CHIP100K5%1/10W
R621-216-057-00 METAL CHIP2.2K5%1/10W
IC518-759-583-17 IC BU2305F-E2
IC528-759-586-60 IC MN9807SP-E1
IC538-759-375-39 IC MC3361CD
IC548-759-701-54 IC NJM2073D
IC558-759-431-95 IC S-81230SGUP-DQB-T1
< JACK >
J511-563-836-21 JACK (EARPHONE)
J521-568-907-21 JACK, DC (POLARITY UNIFIED TYPE)
R561-216-306-11 METAL CHIP3.95%1/10W
R571-216-027-00 METAL CHIP1205%1/10W
R631-216-051-00 METAL CHIP1.2K5%1/10W
R641-216-063-91 RES-CHIP3.9K5%1/10W
R651-216-097-91 RES-CHIP100K5%1/10W
R661-216-107-00 METAL CHIP270K5%1/10W
R671-216-037-00 METAL CHIP3305%1/10W
R681-216-065-91 RES-CHIP4.7K5%1/10W
R691-216-063-91 RES-CHIP3.9K5%1/10W
R701-216-058-00 RES-CHIP2.4K5%1/10W
R711-216-071-00 METAL CHIP8.2K5%1/10W
R721-216-049-91 RES-CHIP1K5%1/10W
R731-216-025-91 RES-CHIP1005%1/10W
R741-218-628-11 METAL CHIP1505%1W
R751-216-136-00 RES-CHIP2.75%1/8W
R761-216-136-00 RES-CHIP2.75%1/8W
R771-216-001-00 METAL CHIP105%1/10W
R791-216-041-00 METAL CHIP4705%1/10W