Sony MDSB-6-P Service manual

MDS-B6P

SERVICE MANUAL

Model Name Using Similar Mechanism MDS-B5
MD Mechanism Type MDM-2B6P
Base Unit Type MBU-2B6P
Optical Pick-up Type KMS-210A/J-N

SPECIFICATIONS

US Model

Canadian Model

AEP Model

UK Model

MICROFILM

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MD PLAYER

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The laser component in this product is ca­pable of emitting radiation exceeding the
limit for Class 1.

This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.

This caution label is located inside
the unit.

SAFETY CHECK-OUT

After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage. Check leakage as
described below.

LEAKAGE

The AC leakage from any exposed metal part to earth Ground and
from all exposed metal parts to any exposed metal part having a re­turn to chassis, must not exceed 0.5 mA (500 microampers). Leak­age current can be measured by any one of three methods.

1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.

2. A battery-operated A C milliammeter . The Data Precision 245 digi­tal multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a VOM
or battery-operated AC voltmeter. The “limit” indication is 0.75
V, so analog meters must have an accurate low-voltage scale. The
Simpson 250 and Sanwa SH-63Trd are examples of a passi ve VOM
that is suitable. Nearly all battery operated digital multimeters that
have a 2V AC range are suitable. (See Fig. A)

To Exposed Metal
Parts on Set

CAUTION

Use of controls or adjustments or performance of
procedures other than those specified herein may result in
hazardous radiation exposure.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be
damaged by heat.

Flexible Circuit Board Repairing

• Keep the temperature of soldering iron around 270˚C
during repairing.

• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering
or unsoldering.

SAFETY-RELATED COMPONENT WARNING !!

COMPONENTS IDENTIFIED BY MARK ! OR DO TTED LINE
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

0.15

1.5k

µ

F

Ω

Earth Ground

AC
voltmeter
(0.75V)

Fig. A. Using an AC voltmeter to check AC leakage.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE ! SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT . NE REMPLA CER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS
SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.

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TABLE OF CONTENTS

1. GENERAL

2-1. Front Panel .......................................................................... 5

2-2. Rear Panel............................................................................ 6

3-2. Connections ......................................................................... 7

3-4. Setting the Analog Output Reference Levels ...................... 8

4-1. Overview of Playback Procedures ...................................... 8

4-2. Playback Procedures............................................................ 9

4-3. Locating a Track................................................................ 10

4-4. Display Information During Playback .............................. 11

4-5. Playing Tracks Repeatedly ................................................ 11

4-6. Program Play ..................................................................... 12

4-7. Playing Tracks in Random Order (Shuffle Play)............... 13

4-8. Starting Playback Instantly (Multi-Access Function) ....... 13

4-9. Varying the Playback Speed (Variable-Speed Playback) .. 14

4-10. Error Checking .................................................................. 15

5-1. Overview of Editing Functions ......................................... 15

5-2. Erasing Tracks (Erase Function) ....................................... 16

5-3. Dividing a Recorded Track (Divide Function).................. 17

5-4. Combining Recorded Tracks (Combine Function) ........... 18

5-5. Moving Recorded Tracks (Move Function) ...................... 18

5-6. Editing Titles ..................................................................... 19

5-7. Marking the Cue Point ...................................................... 20

5-8. Trimming........................................................................... 21

6-1. The Overview of the Setup Menu ..................................... 23

6-2. Setting Up for Timer-Activated Function .......................... 23

6-3. Setting the Playback Resume Mode .................................. 24

232C Interface ................................................................... 24

6-5. Setting the Auto Cue Function .......................................... 25

6-6. Setting the Rehearsal Playback Function .......................... 25

6-7. Setting the EOM Function................................................. 26

6-8. Reading the Hours Meter .................................................. 26

6-9. Disabling the Buttons While Controlling Remotely ......... 27

7-1. Cleaning and Reset Switch................................................ 27

7-2. Display Messages .............................................................. 28

Menu Item List ............................................................................ 28

2. DISASSEMBLY

2-1. Case and Front Panel Assembly ........................................ 29

2-2. Back Panel ......................................................................... 29

2-3. Mechanism Deck ............................................................... 30

2-4. Slider ................................................................................. 30

2-5. Base Unit (MBU-2BLP), Loading Motor Assembly......... 31

2-6. Slider Assembly Mounting ................................................ 31

4. ELECTRICAL ADJUSTMENTS

4-1. Precautions for Checking Laser Diode Emission...............34

4-2. Precautions for Use of Optical Pick-up (KMS-210A) ....... 34

4-3. Precautions for Adjustments............................................... 34

4-4. Temperature Compensation Offset Adjustment .................35

4-5. Laser Power Adjustment .................................................... 35

4-6. Trav erse Adjustment...........................................................36

4-7. Focus Bias Adjustment.......................................................37

4-8. Error Rate Check ................................................................ 37

4-8-1. CD Error Rate Check.................................................... 37

4-8-2. MO Error Rate Check ................................................... 37

4-9. Focus Bias Check ...............................................................37

4-10. Adjusting Points and Connecting Points ............................ 38

5. DIAGRAMS

5-1. Circuit Boards Location .................................................... 39

5-2. Block Diagrams

• Power Section ................................................................. 40

• BD Section ...................................................................... 41

• Digital Section ................................................................ 43

• Remote Section ............................................................... 45

• Duplication Section......................................................... 47

5-3. Printed Wiring Board — BD Section — ........................... 48

5-4. Schematic Diagram — BD Section —.............................. 51

5-5. Schematic Diagram — Digital Section — ........................ 55

5-6. Printed Wiring Board — Digital Section — ...................... 59

5-7. Printed Wiring Board — ETC Section — ......................... 64

5-8. Schematic Diagram — ETC Section —............................ 65

5-9. Printed Wiring Board — Audio/Power Section —............ 68

5-10. Schematic Diagram — Audio/Power Section — .............. 71

5-11. Printed Wiring Board — Display Section — .................... 75

5-12. Schematic Diagram — Display Section — ....................... 77

5-13. IC Pin Functions ................................................................ 79

5-14. IC Block Diagrams ............................................................ 87

6. EXPLODED VIEWS

6-1. Case and Front Panel Section ............................................ 98

6-2. Chassis Section.................................................................. 99

6-3. Back Panel Section .......................................................... 100

6-4. MD Mechanism Section (MDM-2B6P) .......................... 101

6-5. MD Base Unit Section (MBU-2B6P).............................. 102

7. ELECTRICAL PARTS LIST ....................................... 103

3. TEST MODE

3-1. Setting the Test Mode ........................................................ 32

3-2. Exiting the Test Mode ....................................................... 32

3-3. Basic Operations of the Test Mode ................................... 32

3-4. Selecting the Test Mode .................................................... 32

3-4-1. Operating the Continuous Playback Mode .................. 32

3-4-2. Non-Volatile Memory Mode........................................ 32

3-5. Functions of Other Buttons ............................................... 33

3-6. Test Mode Displays........................................................... 33

3-7. Meanings of Other Displays.............................................. 33

3-8. Precautions for Use of Test Mode ..................................... 33

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SECTION 1

GENERAL

This section is extracted from
instruction manual.

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