Sony HCDXG-60 Service manual

HCD-XG60/XG500
SERVICE MANUAL
Ver 1.0 2001.02
HCD-XG60/XG500 is the amplifier, CD player, tape deck and tuner section in LBT-XG60/XG500.
Dolby noise reduction manufactured under license from Dolby Laboratories Licensing Corporation. “DOLBY” and the double-D symbol ; are trade­marks of Dolby Laboratories Licensing Corporation.
Photo: HCD-XG60
CD Section
TAPE Section
US Model
Canadian Model
AEP Model
UK Model
HCD-XG500
E Model
HCD-XG60
Model Name Using Similar Mechanism HCD-LX6/LX50/LX70 CD Mechanism Type CDM37M-5BD32L Base Unit Name BU-5BD32L Optical Pick-up Name KSS-213DH Model Name Using Similar Mechanism NEW Tape T r ansport Mechanism Type TCM-230PWR42
AUDIO POWER SPECIFICATIONS: (US model only)
POWER OUTPUT AND TOTAL HARMONIC DISTORTION
With 6 ohm loads both channels driven, from 120-10,000 Hz; rates 140 watts per channel minimum RMS power, with no more than 10% total harmonic distortion.
Amplifier section
Canadian model:
Continuous RMS power output (reference)
Total harmonic distortion less than 0.07%
AEP, UK models:
DIN power output (rated) 110 + 110 watts Continuous RMS power output (reference)
Music power output (reference)
Other models:
The following measured at AC 120/220/240V, 50 Hz DIN power output (rated) 150 + 150 watts
Continuous RMS power output (reference)
160 + 160 watts (6 ohms at 1 kHz, 10% THD)
(6 ohms at 1 kHz, 70 W)
(6 ohms at 1 kHz, DIN) 140 + 140 watts
(6 ohms at 1 kHz, 10% THD) 240 + 240 watts
(6 ohms at 1 kHz, 10% THD)
(6 ohms at 1 kHz, DIN) 200 + 200 watts
(6 ohms at 1 kHz, 10% THD)
Inputs DJ MIX*: (phono jacks) sensitivity 250 mV,
GUITAR IN: (phone jack) sensitivity 75 mV,
PHONO IN: (phono jacks) sensitivity 3 mV,
MIX MIC: (phone jack) sensitivity 1 mV,
VIDEO IN: (phono jacks) sensitivity 250 mV,
GAME IN: (phono jacks) sensitivity 250 mV,
MD IN: (phono jack) sensitivity 450 mV,
Outputs DJ MIX*: (phono jacks) sensitivity 250 mV,
PHONES: (stereo phone jack) accepts headphones of 8
impedance 47 kilohms
impedance 470 kilohms
impedance 47 kilohms
impedance 10 kilohms
impedance 47 kilohms
impedance 47 kilohms
impedance 47 kilohms
impedance 1 kilohms
ohms or more
COMPACT DISC DECK RECEIVER
VIDEO OUT: (phono jack) voltage 250 mV
MD OUT: (phono jacks) voltage 250 mV
FRONT SPEAKER:
* US, Canadian, AEP, UK, and Mexican models only
CD player section
System Compact disc and digital Laser Semiconductor laser
Wavelength 780 – 790 nm Frequency response 2 Hz – 20 kHz (±0.5 dB) Signal-to-noise ratio More than 90 dB Dynamic range More than 90 dB CD OPTICAL DIGITAL OUT (Square optical connector jack, rear panel) Wavelength: 660 nm Output level –18 dBm
impedance 1 kilohm
impedance 1 kilohm accepts impedance of 6 to 16 ohms
audio system (λ=780nm), Emission
duration: continuous
– Continued on next page –
9-929-577-11 Sony Corporation
2001B0500-1 Audio Entertainment Group C 2001.2 General Engineering Dept.
HCD-XG60/XG500
Tape player section
Recording system 4-track 2-channel stereo Frequency response 40 – 13,000 Hz (±3 dB), (DOLBY NR OFF)
using Sony TYPE I cassette 40 – 14,000 Hz (±3 dB), using Sony TYPE II cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range US, Canadian models: 87.5 – 108.0 MHz (100
Other models: 87.5 – 108.0 MHz Antenna FM lead antenna
Antenna terminals 75 ohm unbalanced Intermediate frequency 10.7 MHz
AM tuner section
Tuning range US, Canadian, Mexican, Argentina models:
Singapore model: 531 – 1,602 kHz
Other models:
Antenna AM loop antenna Antenna terminals External antenna terminal Intermediate frequency 450 kHz
kHz step) (50 kHz step)
530 – 1,710 kHz (with the interval set at 10 kHz) 531 – 1,710 kHz (with the interval set at 9 kHz)
(with the interval set at 9 kHz) 530 – 1,710 kHz (with the interval set at 10 kHz) 531 – 1,602 kHz (with the interval set at 9 kHz)
General
Power requirements US, Canadian models: 120 V AC, 60 Hz AEP, UK models: 230 V AC, 50/60 Hz Mexican model: 120 V AC, 50/60 Hz Other models: 120 V, 220 V or 230 – 240
Power consumption US model:
Canadian model: AEP, UK models: 220 watts
Other models: Dimensions (w/h/d) Approx. 355 x 425 x 450 Mass :
HCD-XG500 Approx. 13.5 kg HCD-XG60 Approx. 15.0 kg
Supplied accessories: AM loop antenna (1)
Design and specifications are subject to change without notice.
V AC, 50/60 Hz Adjustable with voltage selector
240 watts 320VA
0.6 watts (at the power saving mode)
180 watts
mm
FM lead antenna (1) Speaker cords (2) Speaker pads (8) Remote commander (1) Batteries (2)
2

TABLE OF CONTENTS

HCD-XG60/XG500
1. SERVICING NOTES ................................................ 5
2. GENERAL
Location of Controls ....................................................... 6
Setting the Time .............................................................. 7
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 8
3-2. Case ................................................................................. 8
3-3. Front Panel Section ......................................................... 9
3-4. Cover (TC), Tape Mechanism Deck
(TCM-230PWR42) ......................................................... 9
3-5. MAIN Board, Fan, D.C. (M901)
(Except AEP, UK Models).............................................. 10
3-6. MAIN Board (AEP, UK Models) ................................... 10
3-7. CD Mechanism Deck (CDM37M-5BD32L).................. 11
3-8. Base Unit (BU-5B32L) ................................................... 12
3-9. Disc T able........................................................................ 12
4. TEST MODE.............................................................. 13
5. MECHANICAL ADJUSTMENTS....................... 15
6. ELECTRICAL ADJUSTMENTS
Deck section .................................................................... 15
CD Section ...................................................................... 18
7-26. Printed Wiring Boards – TC-A/TC-B/CD-L/
CD-R (1)/CD-R (2) Boards – ......................................... 44
7-27. Schematic Diagram – TC-A/TC-B/CD-L/
CD-R (1)/CD-R (2) Boards – ......................................... 45
7-28. Printed Wiring Board – TRANSFORMER Section– .... 46
7-29. Schematic Diagram – TRANSFORMER Section–....... 46
7-30. IC Pin Function Description ........................................... 50
8. EXPLODED VIEWS
8-1. Case, Back Panel Section................................................ 55
8-2. Front Panel Section-1...................................................... 56
8-3. Front Panel Section-2...................................................... 57
8-4. Chassis Section ............................................................... 58
8-5. Tape Mechanism Deck Section-1
(TCM-230PWR42) ......................................................... 59
8-6. Tape Mechanism Deck Section-2
(TCM230PWR42)........................................................... 60
8-7. CD Mechanism Deck Section (CDM37M-5BD32L) .... 61
8-8. Base Unit Section (BU-5BD32L)................................... 62
9. ELECTRICAL PARTS LIST ............................... 63
7. DIAGRAMS
7-1. Block Diagram – CD SERVO Section – ....................... 19
7-2. Block Diagram – TUNER/TAPE DECK Section – ...... 20
7-3. Block Diagram – MAIN Section – ................................ 21
7-4. Block Diagram – DISPLAY/KEY CONTROL/
POWER SUPPLY Section – ........................................... 22
7-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 23
7-6. Printed Wiring Board – BD Board – ............................. 24
7-7. Schematic Diagram – BD Board – ................................ 25
7-8. Printed Wiring Boards – CD MOTOR Section – .......... 26
7-9. Schematic Diagram – CD MOTOR Section – .............. 27
7-10. Printed Wiring Board – AUDIO Board – ...................... 28
7-11. Schematic Diagram – AUDIO Board – ......................... 29
7-12. Printed Wiring Board – LEAF SW Board – .................. 30
7-13. Schematic Diagram – LEAF SW Board –..................... 30
7-14. Schematic Diagram – MAIN Board (1/3) – .................. 31
7-15. Schematic Diagram – MAIN Board (2/3) – .................. 32
7-16. Schematic Diagram – MAIN Board (3/3) – .................. 33
7-17. Printed Wiring Board – MAIN Board – ........................ 34
7-18. Printed Wiring Board – PA Board – .............................. 36
7-19. Schematic Diagram – PA Board – ................................. 37
7-20. Printed Wiring Boards – MIC/FRONT INPUT/
HEADPHONES Boards –............................................... 38
7-21. Schematic Diagram – MIC/FRONT INPUT/
HEADPHONES Boards – ............................................. 39
7-22. Printed Wiring Board – PANEL FL Board – ................ 40
7-23. Schematic Diagram – PANEL FL Board – ................... 41
7-24. Printed Wiring Boards
– PANEL VR/ILLUMINATION Boards – ..................... 42
7-25. Schematic Diagram
– PANEL VR/ILLUMINATION Boards – ..................... 43
3
HCD-XG60/XG500
r
Notes on chip component replacement
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
Keep the temperature of the soldering iron around 270 ˚C dur­ing repairing.
Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
Be careful not to apply force on the conductor when soldering or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow­ing safety check before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods.
1. A commercial leaka ge tester, such as the Simpson 229 or RCA
WT -540A. Follo w the manufacturers’ instructions to use these instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indica­tion is 0.75 V, so analog meters must have an accurate low­voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex­amples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V A C range are suit­able. (See Fig. A)
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra­diation exposure.
This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.
The following caution label is located inside the unit.
To Exposed Metal Parts on Set
1.5 k
0.15 µF
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB­LISHED BY SONY.
Earth Ground
AC voltmete (0.75 V)
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM­POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
4
SECTION 1
PART No.

SERVICING NOTES

HCD-XG60/XG500
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro­static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emis­sion, observe from more than 30 cm away from the objecti ve lens.
LASER DIODE AND FOCUS SEARCH OPERATION CHECK
Carry out the “S curve check” in “CD section adjustment” and check that the S curve waveforms is output three times.
• MODEL IDENTIFICATION – Rear Panel –
MODEL PART No.
US model 4-232-087-0 AEP and UK models 4-232-087-1 120 V AC area in E and
Argentina models Singapore model 4-232-087-3 Mexican model 4-232-087-4 Saudi Arabia model 4-232-087-5 Canadian model 4-232-087-6
4-232-087-2
[]
[]
[]
[]
[]
[]
[]
5
HCD-XG60/XG500
LOCATION OF CONTROLS – Front Panel –
SECTION 2

GENERAL

234 5 6 789
1
This section is extracted from instruction manual.
ra r; el
ek ej eh
eg ef ed
es ea e;
CD SYNC qg (16,17) DIRECT EQUALIZER 5 (18)
SALSA REGGAE SAMBA TANGO MOVIE GUITAR ROCK JAZZ DANCE
GAME DIRECTION eh (15,16,17) DISC SKIP qk (9,10,17) DISC 1~5 wj (9) DISPLAY 3 (8,11,13) DOLBY NR eh (15,16) EDIT wl (17) ENTER wh (12,27 ) ENTER/NEXT qd (8,14,17,19,22) FLAT qd (18) FLASH e; (11) FUNCTIONq; (7,9,10,16,17,23,24) GAME qa (21)
wh w; ql
AUDIO L w; (23) AUDIO R ql (23) VIDEO wa (23) GROOVE r; (18) GUITAR DISTORTION wh (21) GUITAR jack es (21) GUITAR LEVEL eg (21) H SPEED DUB qg (16) Jog dial (AMS./>) qj
(9,10,11,17) LOOP ea (7,11) MIC LEVEL ef (20) MIX GUITAR/KARAOKE ej ( 20,21) MIX MIC jack ed (20) NON STOP wk (10) P.FILE qd (18,19) PLAY MODE qk (9,10,17) PHONES jack qh POWER SAVE/DEMO
(STANDBY) 2 (8) PTY ws (14) (AEP, UK models) PUSH OPEN wf (9) REPEAT qk (9) SPECTRUM ANALYZER 4 (20)
q;
qa
qs qd
qf qg qh
qj qk
wawswdwfwgwjwkwl
SLEEP 7 (21) STEREO/MONO ws (13) SUPER WOOFER el (18) SUPER WOOFER MODE ek (18) SURROUND ra(16,18) TUNER/BAND wd(12,13,16) TUNER MEMORY wh (12) TIMER SELECT 8 (22) TUNING MODE ws (12,13) VOLUME control qs (9,13,15)
BUTTON DESCRIPTIONS
@/1 1
c/CLOCK SET 6
v/V/b/B 9 z REC qf X qf m /M, AMS./> qfeh h,H qfeh x qfqkeh HX qk
+/– wd A EJECT Z/Z B EJECT wg
6
– Rear Panel –
HCD-XG60/XG500
1
2 3
4
5
6
7
8
Remote control
123
ws
wa w; ql qk qj qh
qg qf
4 5 6
7 8
9 q;
qa
qs
qd
9
1 ANTENNA terminal 2 DJ MIX RETURN/SEND jack
(US, Canadian, AEP, UK Mexican models)
3 PHONO IN jack 4 MD IN/OUT jack 5 VIDEO/AUDIO IN jack 6 VIDEO OUT jack 7 FRONT SPEAKER terminal 8 CD DIGITAL OUT OPTICAL terminal 9 VOLTAGE SELECTOR switch
(120 V AC area in E, Saudi Arabia, Singapore, Argentina models)
Setting the time
1
Turn on the system.
2
Press c/CLOCK SET.
When you set the time for the first time, skip to the step 5.
3
Press v/V repeatedly to select SET CLOCK.
4
Press ENTER/NEXT.
5
Press v/V repeatedly to set the hour.
6
Press ENTER/NEXT.
The minute indication flashes.
7
Press v/V repeatedly to set the minute.
8
Press ENTER/NEXT.
The clock starts working.
Tip
If youve made a mistake or want to change the time, start over from step 1.
Note
The clock settings are canceled when you disconnect the power cord or if a power failure occurs.
AMS ./>, PRESET+/– 5
(9,13,14,15) CD N wa (9) CHECK 8 (10) CLEAR 7 (10) DECK A N ql (15) DECK B N qk (15) DISC SKIP 1 (9,10,17) FILE SELECT ON/OFF qf (18) FILE SELECT F/f qg (11) FLASH qs (11) FUNCTION qa LOOP qh (11) MD N qj MD X 0 MD x 9 SLEEP 2 (21) TUNER/BAND w;(12,16) VOL +/– qd (9,13,15)
(7,9,10,16,17,23,24)
BUTTON DESCRIPTIONS
@/1 3 x 4 m/M 6 X ws
7
HCD-XG60/XG500
)
• This set can be disassembled in the order shown below.

3-1. DISASSEMBLY FLOW

SET
3-2. CASE
(Page 8)
3-3. FRONT PANEL SECTION
(Page 9)
SECTION 3

DISASSEMBLY

3-4. COVER (TC),
TAPE MECHANISM DECK (TCM-230PWR42) (Page 9)
Note: Follow the disassembly procedure in the numerical order given.
3-5. MAIN BOARD,
FAN, D.C. (M901) (EXCEPT AEP, UK MODELS) (Page 10)
3-2. CASE
6

case

3-6. MAIN BOARD
(AEP, UK MODELS) (Page 10)
3-7. CD MECHANISM DECK
(CDM37M-5BD32L) (Page 11)
3-8. BASE UNIT
(BU-5BD32L) (Page 12)
3-9. DISC TABLE
2
five screws (BVTT3
(Page 12)
×
6)
1
three screws (CASE3 TP2)
5
4
5
4
1
three screws (CASE3 TP2)
3
two screws (BVTP3
×
8
8
3-3. FRONT PANEL SECTION
)
)
3
two screws (BVTP3
×
8)
4
lug
1
1
wire (flat type) (17 core) (CN304)
1
wire (flat type) (13 core) (CN431)
wire (flat type) (15 core) (CN303)
HCD-XG60/XG500
2
two connectors (CN452, 702)
3
screw (BVTP3
4
two lugs
×
8
6
7

front panel section

5
four screws (BVTP3
×
claw
8)

3-4. COVER (TC), TAPE MECHANISM DECK (TCM-230PWR42)

4
two screws (BVTP3
×
8)
2
5
screw (BVTP3
3
wire (flat type) (17 core) (CN1001)
×
8)
3
wire (flat type) (15 core (CN601)
connector (CN806)
1
five claws
2
cover (TC)
5
4
two screws (BVTP3
tape mechanism deck (TCM-230PWR42)
×
8)
9
HCD-XG60/XG500
)

3-5. MAIN BOARD, FAN, D.C. (M901) (EXCEPT AEP, UK MODELS)

1
wire (flat type) (13 core) (CN441)
3
eight screws
9
wire (flat type) (19 core) (CN411)
8
back panel
7
(BVTP3
fan, D.C. (M901)
4
×
8)
US, Canadian, Mexican models
2
jumper plug
3
3
6
3
three screws (BVTP3
3
three screws (BVTP3
screw (BVTP3
three screws (BVTP3
two screws (BVTP3
×
8)
×
8)
×
8)
×
8)
×
8)

3-6. MAIN BOARD (AEP, UK MODELS)

5
back panel
6
wire (flat type) (19 core) (CN411)
0
connector (CN412)
1
wire (flat type) (15 core) (CN441)
3
seven screws (BVTP3
qs
×
8)
connector (CN903)
5
qd
MAIN board
qa
two screws (BVTP3
two connectors (CN803, 804)
2
jumper plug
3
3
×
8)
screw (BVTP3
three screws (BVTP3
×
8
×
8)
10
4
7
connector (CN412)
8
9
two connectors (CN803, 804)
3
three screws (BVTP3
3
three screws (BVTP3
MAIN board
0
two screws (BVTP3
×
8)
×
8)
×
8)

3-7. CD MECHANISM DECK (CDM37M-5BD32L)

wire (flat type)
1
(19 core) (CN411)
4
three screws (BVTP3
×
8)
5
6
HCD-XG60/XG500
3
four screws (BVTP3
7
×
8)
Open the cable clamp.
2
connector (CN412)
9
CD mechanism deck
(CDM37M-5BD32)
8
five screws (BVTP3 × 8)
5
4
two screws (BVTP3
×
8)
11
HCD-XG60/XG500
w
e

3-8. BASE UNIT (BU-5BD32L)

3 base unit
(BU-5BD32L)
2 boss

3-9. DISC TABLE

Note: When the disc table is installed, adjust the positions of roller cam
and mark B as shown in the figure, then set to the groove of disc table.
A
1 two screws
(BVTP3 × 8)
1 BU fitting scre
3 step screw
2 two brackets (BU)
4 disc tabl
12
A
SECTION 4

TEST MODE

HCD-XG60/XG500
[MC Cold Reset]
• The cold reset clears all data including preset data stored in the
RAM to initial conditions. Execute this mode when returning the set to the customer.
Procedure:
1. Turn the power ON or set to the DEMO mode.
2. Press three buttons of [ /CLOCK SET], [ENTER/NEXT], and
?/1 simultaneously.
3. The set is reset, and displays “COLD RESET”, then becomes
DEMO mode.
[MC Hot Reset]
• This mode resets the set with the preset data kept stored in the
memory. The hot reset mode functions same as if the power cord is plugged in and out.
Procedure:
1. Turn the power ON or set to the DEMO mode.
2. Press three buttons of [ /CLOCK SET], [ENTER/NEXT],
and [DISC 1] simultaneously.
3. The set is reset, and becomes standby state.
[Change-over the AM Tuning Interval] (EXCEPT AEP, UK, and Saudi Arabia models)
• The AM tuning interval can be changed over 9 kHz or 10 kHz.
Procedure:
1. Press the ?/1 button to turn the power ON.
2. Select the function “TUNER”, and press the [TUNER/BAND]
button to select the BAND “AM”.
3. Press the ?/1 button to turn the power OFF.
4. Press the [ENTER/NEXT] and ?/1 buttons simultaneously,
and the display on the fluorescent indicator tube changes to “AM 9 K STEP” or “AM 10 K STEP”, and thus the tuning interval is changed over.
c
c
[CD Delivery Mode]
• This mode moves the optical pick-up to the position durable to vibration. Use this mode when returning the set to the customer after repair.
Procedure:
1. Press the ?/1 button to turn the power ON.
2. Press the [LOOP] and ?/1 buttons simultaneously.
3. A message “LOCK” is displayed on the fluorescent indicator
tube, and the CD delivery mode is set.
[LED and Fluorescent Indicator Tube All Lit, Key Check Mode]
Procedure:
1. Press three buttons of [ /CLOCK SET], [ENTER/NEXT],
and [DISC 2] simultaneously.
2. LEDs and fluorescent indicator tube are all turned on.
Press the [DISC 2] button, and the key check mode is acti­vated.
3. In the key check mode, the fluorescent indicator tube displays
“K 0 J0 V0”. Each time a button is pressed, “K” value in­creases. However , once a button is pressed, it is no longer taken into account. “J” value increases like 1, 2, 3 ... if turn the JOG dial clock­wise, or it decreases like 0, 9, 8 ... if turn the JOG dial counter­clockwise. “V” value increases like 1, 2, 3 ... if turn the [VOLUME] dial clockwise, or it decreases like 0, 9, 8 ... if turn the JOG dial counterclockwise.
4. To release from this mode, press three buttons in the same
manner as step 1, or disconnect the power cord.
c
13
HCD-XG60/XG500
[Aging Mode]
This mode can be used for operation check of tape deck section. Tape deck section work in parallel.
• If an error occurred: The aging operation stops and display then status.
• If no error occurs: The aging operation continues repeatedly.
Procedure:
1. Load the tapes into the decks A and B respectively.
2. Press the [FUNCTION] button to select the function “CD”.
3. Press the [PLAY MODE] b utton to set the “ ALL DISCS” mode,
and press the [REPEAT] button to “REPEAT” off.
4. Press three buttons of [ /CLOCK SET], [ENTER/NEXT],
c
and [DISC 4] simultaneously.
5. The aging mode is activated, if the indicator of disc tray num-
ber on the fluorescent indicator tube is blinking.
6. To release from the aging mode, press the ?/1 button to turn
the power OFF and operate the cold reset. (Refer to the “MC Cold Reset”)
1. Display at the Aging Mode
• Display operating state of tape deck section alternately.
• If an error occurred, stop display.
2. Tape Deck Section
• The sequence during the aging mode is following as below.
• If an error occurred, stop display that step.
Aging mode sequence (Tape deck section) :
Rewind the tape A and B
“TAPE A AG-1”
Shut off
FWD play the tape A
“TAPE A AG-2”
2 minutes
Fast forward the tape A
“TAPE A AG-3”
Shut off or 20 seconds
REV play the tape A
“TAPE A AG-4”
2 minutes
Rewind the tape A
“TAPE A AG-5”
Shut off
FWD play the tape B
“TAPE B AG-2”
2 minutes
Fast forward the tape B
“TAPE B AG-3”
Shut off or 20 seconds
REV play the tape B
“TAPE B AG-4”
2 minutes
Rewind the tape B
“TAPE B AG-5”
Shut off
Note: “TAPE * AG-*” is display of each step.
14
SECTION 5

MECHANICAL ADJUSTMENTS

HCD-XG60/XG500
SECTION 6

ELECTRICAL ADJUSTMENTS

Precaution
1. Clean the following parts with a denatured alcohol-moistened swab:
record/playback heads pinch rollers erase head rubber belts capstan idlers
2. Demagnetize the record/playback head with a head demagne­tizer.
3. Do not use a magnetized screwdriver for the adjustments.
4. After the adjustments, apply suitable locking compound to the parts adjusted.
5. The adjustments should be performed with the rated power sup­ply voltage unless otherwise noted.
Torque Measurement
Mode Torque Meter Meter Reading
FWD CQ-102C (31 to 71 g•cm)
FWD back tension
REV CQ-102RC (31 to 71 g•cm)
REV back tension
FF/REW CQ-201B (71 to 143 g•cm)
FWD tension CQ-403A (100 g or more)
REV tension CQ-403A (100 g or more)
CQ-102C (2 to 6 g•cm)
CQ-102RC (2 to 6 g•cm)
3.1~6.96 mN•m
(0.43 – 0.98 oz•inch)
0.20~0.58 mN•m
(0.03 – 0.08 oz•inch)
3.1~6.96 mN•m
(0.43 – 0.98 oz • inch)
0.20~0.58 mN•m
(0.03 – 0.08 oz • inch)
6.97~14.02 mN•m
(0.99 – 1.99 oz • inch)
9.80 mN•m
(3.53 oz or more)
9.80 mN•m
(3.53 oz or more)

DECK SECTION

0 dB = 0.775 V
Precaution
1. Demagnetize the record/playback head with a head demagne­tizer.
2. Do not use a magnetized screwdriver for the adjustments.
3. After the adjustments, apply suitable locking compound to the parts adjust.
4. The adjustments should be performed with the rated power supply voltage unless otherwise noted.
5. The adjustments should be performed in the order given in this service manual. (As a general rule, playback circuit ad­justment should be completed before performing recording circuit adjustment.)
6. The adjustments should be performed for both L-CH and R­CH.
7. Switches and controls should be set as follows unless other­wise specified.
8. Set to the DOLBY NR OFF.
9. Set to the test mode. (1) Press the ?/1 button to turn the power ON. (2) Select the function “TAPE A or B”. (3) Press the button of [ /CLOCK SET], [ENTER/NEXT],
c
and [DISC 3] simultaneously, to set the tape deck test mode and displays “TEST MODE” on the fluorescent indicator tube.
(4) To release from the test mode, press the ?/1 button.
• Test Tape
Tape Signal Used for
P-4-A100 10 kHz, – 10 dB Azimuth Adjustment
WS-48B 3 kHz, 0 dB Tape Speed Adjustment
P-4-L300 315 Hz, 0 dB Playback Level Adjustment
15
HCD-XG60/XG500
r
r
Record/Playback Head Azimuth Adjustment
DECK A DECK B
Note: Perform this adjustments for both decks
Procedure:
1. Mode: Playback (FWD)
2. Turn the adjustment screw and check output peaks. If the peaks
3. Mode: Playback
test tape P-4-A100 (10 kHz, – 10 dB)
MAIN board MD OUT jack (J701) L-CH, R-CH
set
level mete
+
do not match for L-CH and R-CH, turn the adjustment screw so that outputs match within 1dB of peak.
L-CH peak
R-CH
Screw position
peak
test tape P-4-A100 (10 kHz, – 10 dB)
L-CH
R-CH
in phase 45 ° 90 ° 135 ° 180 °
within 1dB
Output level
L-CH peak
MAIN board MD OUT jack (J701) L-CH
set
R-CH
waveform of oscilloscope
good
R-CH peak
oscilloscope
V
wrong
H
within 1dB
Screw position
Adjustment Location:Playback Head (Deck A).
Record/Playback/Erase Head (Deck B).
forward
reverse
Tape Speed Adjustment DECK B
Mode: Playback
test tape WS-48B (3 kHz, 0 dB)
set
MAIN board MD OUT jack (J701) L-CH, R-CH
frequency counter
+
1. Insert the WS-48B into the deck B.
2. Press the H button on the deck B.
3. Press the [H SPEED DUB] button in playback mode. Then at HIGH speed mode.
4. Adjust RV1001 on the LEAF SW board do that frequency counter reads 6,000 ± 180 Hz.
5. Press the [H SPEED DUB] button. Then back to NORMAL speed mode.
6. Adjust RV1002 on the LEAF SW board so that frequency counter reads 3,000 ± 90 Hz.
Adjustment Location: LEAF SW board Sample value of Wow and Flutter: 0.3% or less W.RMS (JIS)
(WS-48B)
Playback Level Adjustment DECK A DECK B
Procedure:
Mode: Playback
test tape P-4-L300 (315 Hz, 0 dB)
level mete
4. Repeat step 1 to 3 in playback (REV) mode.
5. After the adjustments, apply suitable locking compound to the pats adjusted.
16
set
MAIN board MD OUT jack (J701) L-CH
+ –
Deck A is RV311 (L-CH), Deck B is RV301 (L-CH) so that ad­justment within specification values as follows.
Specification V alues:
J101 PB level: 301.5 to 338.3 mV (– 8.2 to – 7.2 dB) level difference between the channels: within ± 0.5 dB
Adjustment Location: AUDIO board
HCD-XG60/XG500
e
r
r
RV301
RV341
RV311
IC602
CN601
RL

RV441
PB LEVEL (L)
– DECK B –
REC BIAS
PB LEVEL (L)
– DECK A –
– AUDIO BOARD (Component Side) –
REC Bias Adjustment DECK B
Procedure:
1. Mode: Record FUNCTION: VIDEO
MAIN board VIDEO AUDIO IN jack (J701) L-CH, R-CH
50 mV (– 23.8 dB)
 
600
set
blank tap CN-123
AF OSC
1) 315 Hz
2) 10 kHz
attenuator
2. Mode: Playback
recorded portion
set
MAIN board MD OUT jack (J701) L-CH, R-CH
level mete
+
3. Confirm playback the signal recorded in step 1 become speci­fication values as follows. If these values are out of specification v alues, adjust the R V341 (L-CH) and RV441 (R-CH) on the AUDIO board to repeat steps 1and 2.
Specification values:
J101 PB level: 47.2 to 53.0 mV (– 24.3 to – 23.3 dB)
Adjustment Location: MAIN board
MAIN BOARD (Conductor Side)
VIDEO
AUDIO IN
L/R
J701
REC LEVEL

IC301
RV351
R-CH
MD OUT
RV301
L-CH
L/R
        
Specification values: Playback output of 315 Hz to playback
output of 10 kHz: ± 0.5 dB
Adjustment Location: AUDIO board
REC Level Adjustment DECK B
Procedure:
1. Mode: Record FUNCTION: VIDEO
MAIN board VIDEO AUDIO IN jack (J701) L-CH, R-CH
AF OSC
315 Hz, 50 mV (– 23.8 dB)
attenuator
2. Mode: Playback
recorded portion
set
3. Confirm playback the signal recorded in step 1 become speci­fication values as follows. If these values are out of specification v alues, adjust the R V301 (L-CH) and RV351 (R-CH) on the MAIN boar d to repeat steps 1 and 2.
600
set
level mete
MAIN board MD OUT jack (J701) L-CH, R-CH
LEAF SW BOARD (Component Side)
TAPE SPEED
(NORMAL) (HIGH)
RV1002
blank tape CS-123
+

RV1001
CN1001
17
HCD-XG60/XG500
e
e
+
BD board
TP (TE) TP (VC)
oscilloscope
(DC range)
)

CD SECTION

Note:
1. CD Block is basically designed to operate without adjustment. There­fore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10 M impedance.
4. Clean the object lens b y an applicator with neutral detergent when the signal level is low than specified value with the following checks.
S-Curve Check
oscilloscop
BD board
TP (FE) TP (VC)
Procedure:
1. Connect oscilloscope to TP (FE) and TP (VC).
2. Connect between TP (FE1) and TP (VC) by lead wire.
3. Connect between TP (AGCCON) and TP (GND) by lead wire.
4. Turn the power ON.
5. Load a disc (YEDS-18) and actuate the focus search. (In con-
sequence of open and close the disc tray, actuate the focus search)
6. Cofirm that the oscilloscope wav eform (S-curve) is symmetri-
cal between A and B. And confirm peak to peak level within 4 ± 1 Vp-p.
S-curve waveform
+
symmetry
E-F Balance (1 Track Jump) Check
Procedure :
1. Connect oscilloscpe to TP (TE) and TP (VC).
2. Turn the power ON.
3. Load a disc (YEDS-18) and playback the number five track.
4. Press the H X button. (Becomes the 1 track jump mode)
5. Confirm that the level B and A (DC voltage) on the oscillo­scope waveform.
1 track jump waveform
B
0V
level = 1.3 ± 0.6 Vp-p symmetry
Specified level: × 100 = less than ± 22%
A B
center of waveform
A (DC voltage
6. After check, remove the lead wire connected in step 1.
A
within 4 ± 1 Vp-p
B
7. After check, remove the lead wire connected in step 2 and 3.
Note: • Try to measure se v eral times to make sure than the ratio of A : B
or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the brightness to obtain best waveform.
RF Level Check
oscilloscop
(AC range)
BD board
TP (RF) TP (VC)
+
Procedure:
1. Connect oscilloscope to TP (RF) and TP (VC).
2. Connect between TP (AGCCON) and TP (GND) by lead wire.
3. Turn the power ON.
4. Load a disc (YEDS-18) and press the H X button to play.
5. Confirm that the oscilloscope wav eform is clear and check RF signal level is correct or not.
6. After check, remove the lead wire connected in step 2.
Note: Clear RF signal waveform means that the shape “ ” can be clearly
distinguished at the center of the waveform.
VOLT/DIV: 200 mV TIME/DIV: 500 ns (with the 10: 1 probe in use)
level:
1.45 ± 0.3 Vp-p
Checking Location:
BD BOARD (Side B)
TP (VC)
IC102
TP (RF)
IC103
TP (TE)
TP (AGCCON) TP (FE)
TP (FE1)
TP (GND)
18
SECTION 7

DIAGRAMS

7-1. BLOCK DIAGRAM – CD SERVO Section –

HCD-XG60/XG500
DETECTOR
A
B
C
D
I-V AMP
F
E
OPTICAL PICK-UP BLOCK
(KSS-213DH)
LASER DIODE
LD
PD
LOUT1
LOUT2
XTAI
XTAO
72
75
66
67
(XG60 : Mexican/XG500)
R-CH
R-CH
R-CH
(EXCEPT XG60 : Mexican/XG500)
X101
16.9344MHz
CD DIGITALOUT
OPTICAL
OPTICAL
TRANSCEIVER
IC781
IC781
J705
L
R
L
R
SEND
RETURN
CD-L
DJ MIX
A
(Page 21)
FILTER
RF AMP,
CD D+5V
7
4
2
1
5
10
6
10
11
AUTOMATIC
POWER
CONTROL
Q101
FOCUS/TRACKING ERROR AMP
A
5
B
6
C
7
D
8
F
F I-V AMP
E
E I-V AMP
3
IC103
RF
SUMMING
AMP
FOCUS
ERROR AMP
TRACKING
ERROR AMP
LD
APC LD
AMP
RF EQ
AMP
APC PD
AMP
RFO
HOLD SW
LDON
16
FE
14
TE
13
21
22
PD
4
RFAC
ASYI
ASYO
DIGITAL
CLV
MDP
26
ASYMMETRY
CORRECTION
XRST
3
PROCESSOR
XLON
14 5 6
51
49
48
54 56
FILO
SUBCODE
DATA
53
PCO
CLTV
DIGITAL
PLL
CPU INTERFACE
XLAT
CLOK
7
SENS
8
DIGITAL SIGNAL PROCESSOR,
DIGITAL FILTER, D/A CONVERTER
55
FILI
EFM
DEMODULATOR
SERVO AUTO
SEQUENCER
SQSO
SCOR
20
1 2
16K
RAM
SQCK
IC101 (1/2)
CORRECTOR
SERVO
INTERFACE
SCLK
COUT
9 21
D/A
INTERFACE
INTERNAL BUS
ERROR
SSTP
EMPH
WFCK
GFS
64 15
27
ON :
18
S101
(LIMIT)
When the optical pick-up is inner position.
PCMD
BCK LRCK C2PO
SERIAL
IN
INTERFACE
DIGITAL
62 63 61 19
OUT
DOUT
60
DIGITAL
FILTER,
NOISE SHAPER
TO MIRR/DFCT/ FOK DETECTOR
PWM
&
INTEGRATOR
AOUT1
AOUT2
70
77
CLOCK
GENERATOR
AIN1
71
76
AIN2
BUFFER
TIMING
LOGIC
2-AXIS
DEVICE
(TRACKING)
(FOCUS)
M101
(SPINDLE)
M102
(SLED)
FOCUS/TRACKING COIL DRIVE,
SPINDLE/SLED MOTOR DRIVE
IC102
CH4OUTF
15
M
M
16
17
18
12
11
14
13
CH4OUTR
CH3OUTF
CH3OUTR
CH2OUTF
CH2OUTR
CH1OUTF
CH1OUTR
MOTOR
DRIVE
MOTOR
DRIVE
COIL
DRIVE
COIL
DRIVE
CH4SIN
CH3FIN
CH3RIN
CH2FIN
CH2RIN
CH1FIN
CH1RIN
MUTE
25
43
39
40
41
FE
TE
SE
24
23
SFDR
28
SRDR
29
5
6
2
3
20
TFDR
30
TRDR
31
FFDR
32
33
FRDR
FOCUS/TRACKING/SLED
RFDC
A/D
CONVERTER
PWM GENERATOR
SERVO DSP
FOCUS/TRACKING/SLED
DIGITAL SERVO
PROCESSOR
IC101 (2/2)
MIRR/DFCT/
FOK
DETECTOR
TO SERVO INTERFACE
FOK
MIRR
DFCT
24 22 23
33
SQ-CLK
32
SQ-DATA
19
SCOR
56
SENS
37
CD-CLK
58
XLT CD-DATA
35
HOLD
57
SYSTEM CONTROLLER
(CD MECHANISM CONTROL)
IC501 (1/4)
59
XRST
T-SENS
ENC3/UP-SW
ENC2/DISC-LED
TBL-L
TBL-R
DISC TABLE
61
68
69
63
65
SENSOR
IC202
S201
(UP)
LED DRIVE
Q201
TABLE MOTOR DRIVER
IC201
IN1
9
MOTOR
IN2
1
DRIVE
D201
(DISC No.)
OUT1
OUT2
7
3
M201
M
(TABLE)
• R-ch is omitted due to same as L-ch.
• SIGNAL PATH
: CD PLAY (ANALOG OUT)
: CD PLAY (DIGITAL OUT)
1919
HCD-XG60/XG500

7-2. BLOCK DIAGRAM – TUNER/TAPE DECK Section –

HP101
(PLAYBACK)
L-CH
R-CH
HRPE101 (1/2)
(RECORD/PLAYBACK)
L-CH
R-CH
R-CH
DECK PROCESS,
DECK A/B SELECT, PB/REC EQ AMP,
DOLBY NR AMP, ALC, AMS
RV311
PB LEVEL (L)
(DECK A)
PB EQ AMP
(DECK A)
IC611 (2/2)
PB EQ AMP
(DECK A)
IC611 (1/2)
RV301
PB LEVEL (L)
(DECK B)
PB EQ AMP
(DECK B)
IC601 (2/2)
PB EQ AMP
(DECK B)
IC601 (1/2)
REC/PB SWITCHING
IC602
1
3
R-CH
R-CH
4
A IN (L)
48
B IN (L)
46
A IN (R)
51
B IN (R)
53
BIAS (N)
33
BIAS (C)
32
BIAS (M)
31
S1004
(DECK A 120/70)
S1008
(DECK B 120/70)
IC301
R-CH
BIAS
CONTROL
CIRCUIT
B NORM/CROM
ALC ON/OFF
A 120/70
1516182022 23242517
19
NORM/HIGH
PB A/B
70
120
R-CH
NR ON/OFF
BIAS ON/OFF
RM ON/OFF
L.P.F.
BUFFER
28
27
AMS
CIRCUIT
REC/PB/PASS
LM ON/OFF
26
+
MAOUT
MSIN
MSOUT
R IN (L)
43
ALC (L)
44
DOLBY PASS
ALC
R OUT (L)
35 34
DOLBY NR
AMP
CIRCUIT
ALC
IN (L)
REC OUT (L)
39
RV301
REC LEVEL (L)
(DECK B)
EQ IN (L)
38
REC
EQ AMP
PB OUT (L)
EQ OUT
40
(L)
36
PB-L
REC-L
B
(Page 21)
C
(Page 21)
R-ch is omitted due to same as L-ch.
SIGNAL PATH
: TUNER (FM/AM)
: PLAYBACK (DECK A) : PLAYBACK (DECK B) : RECORD
RV441
REC BIAS (R)
(DECK B)
HRPE101 (2/2)
(ERASE)
(AEP, UK)
COAXIAL
FM 75
(EXCEPT AEP, UK)
FM
75
AM
R-CH
ANTENNA
2
RV341
REC BIAS (L)
(DECK B)
BIAS OSC
T621
FM/AM TUNER UNIT
FM ANT
FM ANT
AM ANT
AM ANT
(AEP, UK)
BIAS OSC Q621, 622
ST-L
ST-R
ST-MUTE
STEREO
TUNED
ST-DIN
ST-DOUT
ST-CLK
ST-CE
RDS-DATA
RDS-INT
REC BIAS
SWITCH
Q623
C331, L331
BIAS TRAP
R-CH
ST-MUTE STEREO TUNED
ST-DIN ST-DOUT ST-CLK ST-CE
RDS-DATA RDS-INT
A+7V
D+5V
(UNSW)
100
TC-RELAY
(DECK A PLAY)
8584838281 807978
ALC
PB-A/B
EQ-H/N
A-PLAY-SW
87
S1001
S1002
(DECK B PLAY)
BIAS
REC-MUTE
B-PLAY-SW
86
TC-MUTE
R/PB/PAS
NR-ON/OFF
(DECK A HALF)
S1003
77
AMS-IN
88
DETECT SENSOR
A-HALF
(DECK B HALF)
(DECK A REC)
ROTATION
(DECK A)
IC1001
91
A-SHUT
S1006
S1005
S1009
(DECK B REC)
ROTATION
DETECT SENSOR
(DECK B)
IC1002
90
B-SHUT
(CD MECHANISM CONTROL)
B-HALF
89
TRIGGER PLUNGER
PLUNGER DRIVE
SYSTEM CONTROLLER
IC501 (2/4)
DECK A
TRIGGER
(DECK A)
Q333, 334
73
A-TRG
TRIGGER PLUNGER
DECK B
TRIGGER
PLUNGER DRIVE
(DECK B)
Q331, 332
72
B-TRG
ST-CE
ST-CLK
ST-DOUT
ST-DIN
TUNED
STEREO
ST-MUTE
49 50 51 54 53 55 52 21 20
ST-CE
ST-CLK
ST-DOUT
ST-DIN
TUNED
STEREO
ST-MUTE
Q335
RDS-DATA
RDS-INT
RDS-DATA
76
CAP-M-H/L
(AEP, UK)
RDS-INT
CT-L
RV1001
TAPE SPEED
(HIGH)
CAPM-CNT2
(Page 21)
D
CAPSTAN MOTOR CONTROL SWITCH
Q1001
74
MOTOR DRIVE
RV1002
TAPE SPEED
(NORMAL)
CAPSTAN
Q336, 339
M
M1
(CAPSTAN)
2020

7-3. BLOCK DIAGRAM – MAIN Section –

HCD-XG60/XG500
VIDEO
GAME INPUT VIDEO
E
A
B
D
J701 (1/2)
L
R
L
R
L
R
J804 (2/2)
L
R
J702 (1/2)
J804 (1/2)
J702 (2/2)
DISTORTION
J802
GUITAR
J801
MIX MIC
CD-L
PB-L
ST-L
VIDEO SELECT
SWITCH,
VIDEO AMP
IC191
R-CH
R-CH
R-CH
R-CH
1 6
(Page 22)
(Page 19)
(Page 20)
(Page 20)
MD IN
PHONO
IN
VIDEO
AUDIO IN
GAME INPUT
AUDIO
AUDIO IN
VIDEO OUT
R-ch is omitted due to same as L-ch.
SIGNAL PATH
: TUNER (FM/AM)
: CD PLAY : TAPE PLAY : RECORD : MIC INPUT
DISTORTION
ON/OFF SWITCH
Q880 – 883
PHONO
EQ AMP
IC601
FUNCTION SELECT
SWITCH
IC181
X0
12
X1
14
AB
10 9
IN1 IN3
LOGIC
CTLA
CTLB
GUITAR AMP
GUITAR AMP
MIC AMP
IC850 (1/2)
66 67 68
65 69 64
X501
VOUT
32.768kHz
X502
16MHz
10
X
13
CTLC
532
CBACBA
IC853
IC852
RV601
GUITAR LEVEL
RV602
MIC LEVEL
INPUT SELECT SWITCH,
GRAPHIC EQUALIZER CONTROL,
ELECTRICAL VOLUME
IN D2 IN C2 IN B2
IN E2 IN A2 IN F2
IC101
INPUT
SELECT
SWITCH
R-CH
XC-OUT
11
XC-IN
10
13
X-OUT
X-IN
15
SYSTEM CONTROLLER
(CD MECHANISM CONTROL)
IC501 (3/4)
FUNC SEL0
46
FUNC SEL1
45
28
V MUTE
SOUND
CONTROL
CIRCUIT
493-DATA
493-CLK
493-LAT
DBFB-H/L
SW-MODE
STK-POWER
HP MUTE
LINE-MUTE
AC-CUT
RESET
PROTECT
F-RELAY
HP-IN
MIC AMP
IC850 (2/2)
47 48 38
7
34
1
93
6
22
12
27
3
36
KEY IN2
KEY IN1
60 5
D501 D534
PROTECT
SWITCH
Q804
RESET
SWITCH
+
D807
MUTING CONTROL
SWITCH
Q802, 803
Q801
2 58 57
MIC IN
+
+
KEY OUT 1 KEY OUT 2
MUTING
Q113
R-CH
L+R
REC A2
GRAPHIC
EQUALIZER
CONTROL
R-CH
30
6
59
POWER AMP
STANDBY SWITCH
Q803, 804, 834
EVER +5V
RESET SIGNAL
GENERATOR
IC801
CIRCUIT
IC801
R-CH
REC B2
F OUT2
42 41
TH831
+
R-CH
+
TEMPERATURE
DETECT SWITCH
Q831, 832
OVER LOAD
Q801, 851
DC DETECT
SWITCH
Q433, 434
COMMAND
DETECT
VOL IN2
VOLUME
CONTROL
D401
R-CH
+
CPU
INTERFACE
DATA
CLOCK
DETECT SWITCH
PROTECT SWITCH
LATCH
34
OVER LOAD
Q432
Q439
BASS BOOST
CONTROL
CIRCUIT
BB B2,
BB A2
38, 39
DBFB CONTROL
SWITCH
Q111
CONTROL SWITCH
SUPER
WOOFER
BUF
OUT2
BUF IN2
373233
FEED BACK
SWITCH
Q112
BASS WOOFER
Q115
R-CH
R-CH
OVER LOAD
DETECT SWITCH
Q437
FRONT SPEAKER PROTECT
RELAY DRIVE
Q401, 402
72
36
D803
R-CH
MUTING CONTROL
SWITCH
Q833
PROTECT SWITCH
R-CH
+
Q431
R-CH
R-CH
(US, Canadian, E)
1
2
HEADPHONE
MUTING
Q805, 855
RY401
REC-L
SPEANA
R-CH
FAN MOTOR
DRIVE
Q961, 962
RESET
C
F
J701 (2/2)
M901 (FAN)
M
TM401
FRONT SPEAKER
IMPEDANCE
USE 4 – 16
+
+
J803
PHONES
G
(Page 20)
(Page 22)
L
MD OUT
R
L
R
(Page 22)
2121
HCD-XG60/XG500

7-4. BLOCK DIAGRAM – DISPLAY/KEY CONTROL/POWER SUPPLY Section –

GRID DRIVE
Q605, 606
FL601
FLUORESCENT INDICATOR TUBE
GRID DRIVE
Q607
S601 – 607, 611 – 619, 621 – 627,
S701 – 710, 712 – 732, 741, 743 – 757
(S632 : AEP, UK)
S608
FLUORESCENT INDICATOR TUBE DRIVER,
43
KEY CONTROL
44 – 46
SEG-1 – SEG-23
28 , 27
GR-15, GR-16
42, 40 – 29
GR-2 – GR-14
GR-1
11 – 15
KEY 0 – KEY 4
4
KEY POWER ON/OFF
IC601
BPF 0 BPF 1
BPF 2 BPF 3 BPF 4
ALL BAND
GUITAR DISTORTION
RESET
LED SEL
LED DAT LED SCK
LED LATCH
17 18 19 20 21
22
73
16
(Page 21)(Page 21)
F
BAND-PASS FILTER
IC602
F02
16
F03
15
F04
14
DET
DET
P1 – P6, P7 – P10, P12 – P16
B.P.F.
17, 19 – 23, 1 – 4, 7 – 11
F05
13
F06
12
REC LEVEL
11
7
LED DRIVER
IC701
5 3 6
DATA
13 14
CLK
15
STB
LINE
REC IN
IN
SPEANA
4
6
B+ SWITCH
Q602, 603
D611 – 614, 621, 622, D700 – 710, 713 – 719, D741, 791
Q604
G
RESET
+5V (LED)
(Page 21)
E
DISTORTION
CD A+5V (SW) ,
CD D+5V (SW)
CD MECHANISM
DECK SECTION
Q914
+5V (LED)
(PANEL SECTION B+)
D+5V (UNSW)
(RDS SECTION B+)
SUB POWER
TRANSFORMER
T901
EVER +5V
SYSTEM CONTROLLER (IC501) ,
FL DRIVER (IC601) B+
TO FLUORESCENT INDICATOR TUBE
(FL601)
POWER AMP (IC801),
PROTECT CIRCUIT
(XG500)
–35V
FL DRIVER (IC601)
B–
B+ SWITCH
B+
Q913
REGULATOR
REGULATOR
–35V
Q903, 908
+5V
IC901
+VL
–VL
+VH
–VH
RECT
D902 – 905
POWER
TRANSFORMER
T951
VF
VF
RECT D832
RECT D831
RECT
D841 – 844
RECT
D833 – 836
(XG60)
EXCEPT
XG60 : Mexican
/XG500
VOLTAGE
SELECTOR
S901
RY901
POWER ON/OFF
RELAY DRIVE
Q901
AC IN
S609
POWER
SAVE/DEMO
(STANDBY)
REMOTE CONTROL
RECEIVER
IC702
S763
(JOG DIAL)
S736
VOLUME
SIRCS BUFFER
Q608, 609
ROTARY
ENCODER
S763
ROTARY
ENCODER
S736
2
1
74
75
9
10
KEY POWER SAVE/DEMO
SIRCS
JOG A
JOG B
VOL A
VOL B
LED STANDBY
XOUT
72 70
X601
12.5MHz
I2C DATA
I2C CLK
WAKE UP
D-SW
XIN
AU D+5V
M62493FP (IC101) B+
D+5V (SW)
(CD SENSOR SECTION B+)
77
78 79
8
80
LED DRIVE
Q601
S742
LID (CD)
OPEN/CLOSE
D601
SYSTEM CONTROLLER
CD MECHANISM
30
IIC-DATA
29
IIC-CLK
WAKE UP
18
CONTROL
IC501 (4/4)
STBY RELAY
CD-POWER
POWER
A+7V
TC, PANEL,
AUDIO
A–7V
5
Q906
ST +10V
(FM/AM TUNER UNIT B+)
2
FAN MOTOR B+
TC M+12V
(TC MOTOR SECTION B+)
CD M+7V
(CD MOTOR SECTION B+)
43
B+ SWITCH
Q911, 912
B+ SWITCH
Q901, 902
B– SWITCH Q903 – 905
TUNER
B+ SWITCH
Q931, 932
+7V
REGULATOR
IC933
+5V
REGULATOR
IC911
+7V
REGULATOR
IC901
–7V
REGULATOR
IC951
+10V
REGULATOR
IC931
+12V
REGULATOR
IC932
2222
HCD-XG60/XG500
d

7-5. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

Note on Printed Wiring Board:
X : parts extracted from the component side.
Y : parts extracted from the conductor side.
: Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)
Caution: Pattern face side: Parts on the pattern face side seen from (Side B) the pattern face are indicated. Parts face side: Parts on the par ts face side seen from (Side A) the parts face are indicated.
• Indication of transistor.
C Q
B
E
B
B
These are omitted.
Q
CE
These are omitted.
Q
CE
These are omitted.
Note on Schematic Diagram:
All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
All resistors are in Ω and 1/ specified.
2 : nonflammable resistor .
5 : fusible resistor.
C : panel designation.
Note:
The components identi­fied by mark 0 or dotted line with mark 0 are criti­cal for safety. Replace only with part number specified.
A : B+ Line.
B : B Line.
H : adjustment for repair.
Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc­tion tolerances.
Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal produc­tion tolerances.
Circled numbers refer to waveforms.
Signal path.
F : TUNER (FM/AM) E : TAPE PLAY (DECK A) d : TAPE PLAY (DECK B) G : RECORD J : CD PLAY (ANALOG OUT) c : CD PLAY (DEGITAL OUT) N : MIC INPUT
Abbreviation AR : Argentina model CND : Canadian model E2 : 120 V AC area in E model EA : Saudi Arabia model MX : Mexican model SP : Singapore model
4
Note:
Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié.
W or less unless otherwise
• Circuit Boards Location
PANEL FL board
PANEL VR board
ILLUMINATION board
TC-A board
MIC board
CD-L board
TC-B board
TRANS board SUB TRANS board
TUNER PACK (FM/AM TUNER UNIT)
MAIN boar
PA board
HEADPHONES board
CD-R (2) board
CD-R (1) board
FRONT INPUT board
LEAF SW board
TABLE SENSOR board
CD MOTOR board
AUDIO board
BD board
LED board
2323
HCD-XG60/XG500
7-6. PRINTED WIRING BOARD – BD Board – • See page 23 for Circuit Boards Location.
)(
TP(GND)
21
21
31
31,,
TP(VC)
TP(RF)
TP(TE)
TP
(AGCCON)
TP(FE)
TP(FE1)
)(
)(
MAIN BOARD
CN411
(Page 34)
19
21
21
31
31,,
• Semiconductor Location
Ref. No. Location
Q101 C-3
KSS-213DH
• Semiconductor Location
Ref. No. Location
IC101 C-2 IC102 B-1 IC103 B-1
2424
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