Sony DEJ-368-CK Service manual
D-EJ360/EJ368CK
SERVICE MANUAL
Ver 1.3 2004.03
Photo : D-EJ360 (YELLOW)
US Model
Canadian Model
AEP Model
E Model
D-EJ360/EJ368CK
Australian Model
D-EJ368CK
Model Name Using Similar Mechanism New
CD Mechanism Type CDM-3325ER
Optical Pick-up Type DAX-25E
SPECIFICATIONS
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength: λ = 780 nm
Emission duration: Continuous
Laser output: Less than 44.6 µW (This output is the valuemeasured at a
distance of 200 mm from the objective lens surface on the optical pick-up
block with 7 mm aperture.)
Power requirements
For the area code of the model you purchased, check the upper left side of
the bar code on the package.
• Two LR6 (size AA) batteries: 3 V DC
• AC power adaptor (DC IN 4.5 V jack): 120 V, 60 Hz
US, Canadian, Mexican, C&SA models : 120 V, 60 Hz
EJ360 : AEP, EE, E models : 220-230 V, 50/60 Hz
Australian model : 240 V, 50 Hz
EJ368CK : AEP model : 100-240 V, 50/60 Hz
Dimensions (w/h/d) (without projecting parts and controls)
Approx. 136 x 26 x 150 mm (5 3⁄8 x 1 1⁄16 x 6 in.)
Mass (excluding accessories)
Approx. 185 g (6.6 oz)
Operating temperature
5°C - 35°C (41°F - 95°F)
Supplied Accessories
D-EJ360: Headphones/earphones (1)
D-EJ368CK*:
AC power adaptor (1)
Headphones/earphones (1)
Car connecting pack (1)
Car battery cord (1)
Rotary commander (1)
Velcro tape for the CD player (2)
Velcro tape for the rotary commander (1)
* “Operating Instructions for the car kit” is enclosed.
Design and specifications are subject to change without notice.
9-877-027-04
2004C02-1
© 2004.03
Sony Corporation
Personal Audio Company
Pubulished by Sony Engineering Corporation
PORTABLE CD PLAYER
D-EJ360/EJ368CK
Ver 1.1 2003.03
TABLE OF CONTENTS
DANGER
Invisible laser radiation when open and interlock failed or defeated.
Avoid direct exposure to beam.
CAUTION
Use of controls or adjustments or performance of procedures other
than those specified herein may result in hazardous radiation
exposure.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
z
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
Specifications ............................................................................ 1
1. SERVICING NOTES ................................................... 3
2. GENERAL
Locating the Controls ......................................................... 3
3. DISASSEMBLY
3-1. Upper Lid ASSY, Cabinet (Upper) Sub ASSY ........... 4
3-2. MD ASSY, Main Board .............................................. 5
3-3. “Motor ASSY (Sled) (M902)”,
Optical Pick-up (DAX-25E),
“Motor ASSY, Turn Table (Spindle) (M901)” ............ 5
4. ELECTRICAL ADJUSTMENS ............................... 6
5. DIAGRAMS
5-1. Block Diagram ............................................................ 7
5-2. Printed Wiring Boards –MAIN Section (1/2)– ........... 8
5-3. Printed Wiring Boards –MAIN Section (2/2)– ........... 9
5-4. Schematic Diagram –MAIN SECTION (1/3)– ....... 10
5-5. Schematic Diagram –MAIN SECTION (2/3)– ........ 11
5-6. Schematic Diagram –MAIN SECTION (3/3)– ....... 12
5-7. IC Pin Function Description ..................................... 16
6. EXPLODED VIEWS
6-1. Cabinet Section ......................................................... 18
6-2. Optical pick-up Section (CDM-3325ER) ................. 19
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.
7. ELECTRICAL PARTS LIST ................................... 20
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE
PA RTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PA RT NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
2
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR
BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the charged
electrostatic load, etc. on clothing and the human body. During repair,
pay attention to electrostatic breakdown and also use the procedure in
the printed matter which is included in the repair parts.
The flexible board is easily damaged and should be handled with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on the
disc reflective surface by the objective lens in the optical pick-up block.
Therefore, when checking the laser diode emission, observe from more
than 30cm away from the objective lens.
Before Replacing the Optical pick-up Block
Please be sure to check thoroughly the parameters as per the “Optical
pick-up Block Checking Procedure” (Part No. : 9-960-027-11) issued
separately before replacing the optical Pick-up block.
Note and specifications required to check are given below.
• FOK output : IC601 yg pin
When checking FOK, remove the lead wire to disc motor.
• RF signal P-to-P value : 0.4 to 0.8Vp-p
D-EJ360/EJ368CK
Laser Diode Checking Methods
During normal operation of the equipment, emission of the laser diode
is prohibited unless the upper panel is closed while turning ON the S809
(push switch type).
The following two checking methods for the laser diode are operable.
Method :
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. Push the S809 as shown in Fig. 1 .
3. Check the object lens for confirming normal emission of the laser
diode. If not emitting, there is a trouble in the automatic power
control circuit or the optical pick-up. During normal operation, the
laser diode is turned ON about 2.5 seconds for focus searching.
S809
LOCATING THE CONTROLS
CD player (front)
OPEN
i (headphones) jack
SOUN/AVLS
P MODE/ F
VOL +*/–
*The button has a tactile dot.
SECTION 2
GENERAL
Fig.1 Method to push S809
This section is extracted from
instruction manual.
Strap holes
DC IN 4.5 V
(external power
input) jack
.>
u*
x
Display
HOLD
CD player (inside)
Battery Compartment
G-PROTECTION
3
D-EJ360/EJ3688CK
z
The equipment can be removed using the following procedure.
SECTION 3
DISASSEMBLY
MD ASSY “Motor ASSY (Sled) (M902)”, Optical pick-up (DAX-25E),
Set
Upper lid ASSY,
Cabinet (upper) sub ASSY
Main board
Note : Follow the disassembly procedure in the numerical order given.
3-1. UPPER LID ASSY, CABINET (UPPER) SUB ASSY
5
Upper lid Assy
7
Ten screws (B2)
4
2
1
Open
3
“Motor ASSY, turn table (spindle) (M901)”
• CAUTION DURING ASSEMBLY
1
Spring (L)
2
Spring (R)
6
0
Cabinet
(upper) sub ASSY
9
8
Three craws
5
6
Spring (L)
4
1
3
Spring (R)
2
4
3-2. MD ASSY, MAIN BOARD
)
7
MAIN board
1
CN601
5
MD ASSY
4
2
Connector (CN401
3
Connector (CN402)
D-EJ360/EJ3688CK
6
Cabinet (lower) sub ASSY
3-3. “MOTOR ASSY (SLED) (M902)”, OPTICAL PICK-UP (DAX-25E), “MOTOR ASSY, TURN TABLE (SPINDLE) (M901)”
1 Three screws
(B1.7x4)
2
3 Cover, Gear
8 Three screws
(B1.7x4)
6
0 Motor ASSY, Turn table
(Spindle) (M901)
5 Motor ASSY
(Sled) (M902)
9
7 Optical pick-up
(DAX-25E)
4
Chassis
5
D-EJ360/EJ368CK
)
C202
C
Q601
SECTION 4
ELECTRICAL ADJUSTMENTS
The CD section adjustments are done automatically in this set.
Precautions for Check
1. Perform check in the order given.
2. Use YEDS-18 disc (Part No.: 3-702-101-01) unless otherwise
indicated.
3. Power supply voltage requirement : DC4.5 V in DC IN jack.
(J401)
VOLUME button : Minimum
HOLD switch : OFF
Focus bias Check
Condition:
• Hold the set in horizontal state.
Connection:
oscilloscope
(AC range)
TJ601(RF)
[MAIN BOARD] (SIDE B)
C610
R6
BCE
L601
R610
TJ601(RF)
R601
R603
R611
R602
C412
C60
R409
14 13
IC603
Procedure:
1. Connect the oscilloscope to the test point TJ601(RF) on the
MAIN board.
2. Set a disc. (YEDS-18)
3. Press the u button.
4. Check the oscilloscope waveform is as shown below.
A good eye pattern means that the diamond shape (◊) in the center of the waveform can be clearly distinguished.
RF Signal reference Waveform (Eye Pattern)
VOLT/DIV : 100 mV (With the 10 : 1 probe in use
TIME/DIV : 500ns
RF level
0.4 to 0.8 Vp-p
6
To watch the eye pattern, set the oscilloscope to AC range and
increase the vertical sensitivity of the oscilloscope for easy
watch-ing.
5. Stop revolving of the disc motor by pressing the x button.
5-1. BLOCK DIAGRAM
SECTION 5
DIAGRAMS
US model EXCEPT US model
IC603
D-RAM(16M)
D-EJ360/EJ368CK
Ver 1.1 2003.03
IC602
OPTICAL
PICK-UP
BLOCK
(DAX-25E)
OP IC
OPGSW
VCC
OPSTB
RF
A
A
E
F
LD
PD
VCC1_2.2V
LD
DRIVER
Q601
VCC1_2.2V
D0-3 A0-10
2,3,24,25 9-12,15-19,21,8
16 17
DETI
RFGO
RFI
13
A
9
B
8
E
6
F
7
RFDC
88
LD
2
APC
RF
AMP
A/D
PD
3
DEMODULATOR
87,88,84,85 97-100,96-91,82
D0-D3
EFM
SERVO
PWM
FDOP
FDON
TDOP
TDON
75 74 77 76 79 78 72 73 71 504947533738
FIN-
TIN-
FIN+
TIN+
SDOP
SIN+
SDON
SIN-
CLVON
CPOL
PROCESSOR
A0-A10
SUB CODE
CLVOP
CLKDRV
SYNC
CLVOP
XRAS
XCAS
5 23 4
90 83 89
XCAS
XRAS
CLOCK
OSC
XOUT
X601
16.934MHz
XWE
XIN
XWE
XRST
44
D0-3 A0-9
1,2,24,25 9,10-12,14-18,5
SIO
SCLK
SDIN
CLK4M
SDOUT
XRAS
4 23 3
IC601
RF AMP,SERVO
DIGITAL SIGNAL PROCESSOR
D-RAM CONTROLLER
D/A CONVERTER
POFF
SCOR
48
SRWI
XBUSY_O
XCAS
XWE
DEFDCT_O
GFS
DAC
657064524345
FOK O
IC301
HEADPHONE AMP
LDACO LOUT
31
RDACO
36
DVDDIO
80
VCC2_2.0V
86
34
AVDD2 2.25V
DVDDV 1.5V
VCHK
40
51
5
VCC1_2.2V
VCPU_1.5V
LIN
14
RIN
15
MUTE
BEEP20PWRSW5VCC
1719
ROUT
+V BAT
8
629
EJ368CK
VCC2_2.0V
VCPU_2.0V
J301
i
IC403 (2/2)
POWER CONTROL
VCC2
18
SEM
SEO
VCPU_1.5V
23
22
L410
FOCUS
COIL
TRACKING
COIL
M902
SLED
MOTOR
M901
SPINDLE
MOTOR
21
D405
D402
GSW
VCC
VCC0
STNG
VIN
BATM1
BATM2
DCIN_S
LG
VCC1_2.2V
VCPU_2.0V
3074 12
BEEP_O
AMUTE_O
HOLD_I
S810
.
HOLD
OFF ON
26
HPSW_O
AD_CHGMNT
WP/AD_RMKEY
AD_BATMNT
WP/AD_DCINMNT
GPROSW
38
19
S811
G.PROTECTION
OFF ON
22
24 66
Q401
CHARGE
SWITCH
27
AVCPU
ADVREF
20
VCPU_2.0V
• SIGNAL PATH
: CD PLAY
DEFECT_I
COM0
I
COM3
6711371177
GFS_I
FOK_I
IC801
SYSTEM
CONTROL
MICON
WP/AD_KEY_1
AD_KEY_2
2523 28 40
KEY MATRIX
S801 S805
| |
S804 S808
WP/XOPEN
S809
(OPEN)
15
SRW O
SCOR_I
POFF_O
XIN
2
OPGSW O
79
XOPSTBY_O
FIN3
FIN+
F+
F-
T+
T-
S+
M
S-
W
M
V
U
+VBAT
L403
44
42
48
46
52
50
80
53
49
45
41
6
4
2
1
FO3
RO3
FO2
RO2
FO1
RO1
W
U
V
COMCOM
VM1
VM12
VM23
VM3
SPVCC
CH3
H
BRIDGE
CH2
H
BRIDGE
CH1
H
BRIDGE
CH4
H
BRIDGE
IC403 (1/2)
FOCUS/TRACKING COIL DRIVE
SLED/SPINDLE MOTOR DRIVE
LEVEL
SHIFTER
LEVEL
SHIFTER
I/F
RIN3
FIN1
RIN1
FIN2
RIN2
BRK
PWM
SYNC
LATCH
DATA
CLOCK
WAKEUP
RESETO
XRST
60
FIN-
59
SIN+
56
SIN-
55
TIN+
58
TIN-
57
CPOL
70
SLVOP
72
SYNC
34
74
FG
40
39
38
37
35
36
DEFFERENTIAL
Q407
D802
78
FG I
72
XPOWLT_O
14
SDTI_I
16
SDTO_O
17
SCK_O
18
XWAKEUP_O
66
8
XREST_I
XRST_O
76
XBUSY_I
SEG0
I
SEG15
56-41 60-57
LCD801
LIQUID
CRYSTAL
DISPLAY
17
VCC1
19
VCPU 2.0V
CHGMNT
67
VMMNT_O
DCIN
61
REGB
62
DET
63
CHGB
65
+VBAT
SWITCH
Q402, 403
Q406
20
16
Q404
25
L404
8
12
68
69
64
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION LR6)
2PCS, 3V
L401
L402
J401
DC IN 4.5V
!
77
D-EJ360/EJ368CK
Ver 1.1 2003.03
5-2. PRINTED WIRING BOARDS –MAIN Section(1/2)– • Refer to page 13 for Notes.
1
2
3 4 5 6 7
A
(SIDE A)MAIN BOARD
B
C403
C429
R419
1
L407
4
C
Q401
BCE
C410
R407
C405
VDR402
R408
C404
R403
D403
CN402
CN401
R438
C440
C439
2
D
M
M901
SPINDLE
MOTOR
E
M
M902
SLED
MOTOR
R432
1
R435
C448
L409
D406
C411
S
L410
C447
R439
Q406
C450
R444
R421
L406
C428
C409
C435
C430
C441
D409
R440
R434
R436
BCE
C804
Q407
: USES UNLEADED SOLDER.
R854
41
20
R852
R859
R627
C445
60
61
IC801
80
1
FB408
R858
FB406
40
21
R814
C814
C806
R618
R849
R845
C629
R629
R619
R805
R631
51
L604
75
R620
50
76
C620
R802
C633
C621
IC601
CN601
1
R838
R832
26
100
25
C612
1
C614
R606
15
R309
C618
C613
R605
C605
EJ368CK
R302
FB302
FB303
D308
FB201
8
EJ368CK
9
• Semiconductor
Location
Ref. No. Location
D101 E-8
D201 E-8
D302 E-8
D306 E-8
D308 E-8
D403 D-3
D406 E-4
D409 C-4
IC601 D-6
IC801 C-5
Q401 C-2
Q406 B-4
Q407 D-4
C301
D101
D201
D306
D302
R313
EJ368CK
F
OPTICAL PICK–UP
BLOCK
J301(1/2)
i
DAX–25E
1-685-955-
12
(12)
8
8
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