Sony CDX-CA850, CDX-CA850X, CDX-CA860X Service manual

CDX-CA850/CA850X/CA860X

SERVICE MANUAL

Ver 1.0 2001. 02

Photo: CDX-CA850X

• The tuner and CD sections have no adjustments.

AUDIO POWER SPECIFICATIONS (US Model)

POWER OUTPUT AND TOTAL HARMONIC DISTORTION

23.2 watts per channel minimum continuous average power into 4 ohms, 4 channels driven from 20 Hz to 20 kHz with no more than 5% total harmonic distortion.

CD player section

Signal-to-noise ratio 90 dB Frequency response 10 – 20,000 Hz Wow and flutter Below measurable limit Laser Diode Properties (US, Canadian Model)

Material GaAlAs Wavelength 780 nm Emission Duration Continuous Laser output power Less than 44.6 µW*

* This output is the value measured at a distance

of 200 mm from the objective lens surface on the Optical Pick-up Block.

Tuner section

Tuning range 87.5 – 107.9 MHz (US, Canadian model)

87.5 – 108.0 MHz (AEP, UK model) Antenna terminal External Antenna connector Intermediate frequency 10.7 MHz/450 kHz Usable sensitivity 8 dBf Selectivity 75 dB at 400 kHz Signal-to-noise ratio 66 dB (stereo),

72 dB (mono)

Harmonic distortion at 1 kHz

0.6% (stereo),

0.3% (mono) Separation 35 dB at 1 kHz Frequency response 30 – 15,000 Hz

AM (US, Canadian model)

Tuning range 530 – 1,710 kHz (US, Canadian model) Antenna terminal External Antenna connector Intermediate frequency 10.7 MHz/450 kHz Sensitivity 30 µV

MW/LW (AEP, UK model)

Tuning range MW: 531 – 1,602 kHz

LW: 153 – 279 kHz Aerial terminal External Aerial connector Intermediate frequency 10.7 MHz/450 kHz Sensitivity MW: 30 µV

LW : 40 µV

SPECIFICATIONS

FM/MW/LW COMPACT DISC PLAYER

US Model

Canadian Model

CDX-CA850X/CA860X

AEP Model

UK Model

CDX-CA850

Model Name Using Similar Mechanism CDX-C5000R CD Drive Mechanism Type MG-383Z-121//Q Optical Pick-up Name KSS-720A

Power amplifier section

Outputs Speaker outputs

(sure seal connectors)

Speaker impedance 4 – 8 ohms Maximum power output 52 W × 4 (at 4 ohms)

General

Outputs Audio outputs (front/rear)

Subwoofer output (mono) Power Antenna relay control lead Power amplifier control lead

Inputs Telephone ATT control lead

Illumination control lead Bus control input connector Bus audio input connector Remote controller input connector Antenna input connector

Tone controls Bass ±10 dB at 62 Hz (US, Canadian model)

Bass ±8 dB at 100 Hz (AEP, UK model) Treble ±10 dB at 16 kHz (US, Canadian model) Treble ±8 dB at 10 kHz (AEP, UK model)

Loudness +8 dB at 100 Hz

+2 dB at 10 kHz

Power requirements 12 V DC car battery

(negative ground)

– Continued on next page –

CDX-CA850

FM/AM COMPACT DISC PLAYER

CDX-CA850X/CA860X

9-870-291-11

Sony Corporation

Audio Entertainment Group

General Engineering Dept.

CDX-CA850/CA850X/CA860X

Dimensions Approx. 178 × 50 × 177 mm

(7 1/8 × 2 × 7 in.) (w/h/d)

Mounting dimensions Approx. 182 × 53 × 162 mm

(7 1/4 × 2 1/8 × 6 1/2 in.) (w/h/d)

Mass Approx. 1.3 kg

(2 lb. 10 oz.)

Supplied accessories Parts for installation and connections (1 set)

Front panel case (1) Rotary commander RM-X5S Card remote commander RM-X112 (CDX-CA850X/CA860X) RM-X113 (CDX-CA850)

Note

This unit cannot be connected to a digital preamplifier or an equalizer.

Design and specifications are subject to change without notice.

SERVICE NOTES

• US, Canadian model

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

If the optical pick-up block is defective, please replace the whole optical pick-up block. Never turn the semi-fixed resistor located at the side of optical pick-up block.

• AEP, UK model

This label is located on the bottom of the chassis.

optical pick-up bloc

semi-fixed resistor

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic breakdown and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.

This label is located on the drive unit's internal chassis.

When replacing the chassis (T.U) of mechanism deck which have the “CAUTION LABEL” attached, please be sure to put a new CAUTION LABEL (3-223-913-11) to the chassis (T.U).

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.

Notes on Chip Component Replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY P ARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!!

LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

CDX-CA850/CA850X/CA860X

1. GENERAL

........................................................................... 4

2. DISASSEMBLY

2-1. Sub Panel Assy .................................................................. 10

2-2. CD Mechanism Block ....................................................... 10

2-3. Main Board ....................................................................... 10

2-4. Heat Sink ...........................................................................11

2-5. Chassis (T) Assy................................................................ 11

2-6. Lever Section.....................................................................12

2-7. Servo Board....................................................................... 12

2-8. Arm Roller Assy................................................................ 13

2-9. Chassis (OP) Assy............................................................. 13

2-10. Optical Pick-up Block ....................................................... 14

3. DIAGRAMS

3-1. IC Pin Descriptions ........................................................... 15

3-2. Block Diagram –CD Section–........................................... 23

3-3. Block Diagram –Tuner Section–....................................... 24

3-4. Block Diagram –Display Section–.................................... 25

3-5. Circuit Boards Location .................................................... 26

3-6. Printed Wiring Boards –CD Mechanism Section–............ 28

3-7. Schematic Diagram –CD Mechanism Section (1/2)– ....... 30

3-8. Schematic Diagram –CD Mechanism Section (2/2)– ....... 31

3-9. Printed Wiring Boards –Main Section– ............................ 32

3-10. Schematic Diagram –Main Section (1/4)– ........................ 34

3-11. Schematic Diagram –Main Section (2/4)– ........................ 35

3-12. Schematic Diagram –Main Section (3/4)– ........................ 36

3-13. Schematic Diagram –Main Section (4/4)– ........................ 37

3-14. Printed Wiring Board –Sub (CD) Section– ....................... 38

3-15. Schematic Diagram –Sub (CD) Section–.......................... 39

3-16. Printed Wiring Board –Key Section–................................ 40

3-17. Schematic Diagram –Key Section–................................... 41

4. EXPLODED VIEWS

4-1. Chassis Section ................................................................. 44

4-2. Front panel Section ........................................................... 45

4-3. CD Mechanism Section (1) ............................................... 46

4-4. CD Mechanism Section (2) ............................................... 47

4-5. CD Mechanism Section (3) ............................................... 48

5. ELECTRICAL PARTS LIST ........................................ 49

CDX-CA850/CA850X/CA860X

SECTION 1

GENERAL

This section is extracted from AEP, UK model’s instruction manual.

CDX-CA850/CA850X/CA860X

Connection

CDX-CA850/CA850X/CA860X

SECTION 2

DISASSEMBLY

Note : This equipment can be removed using the following procedure.

Set Sub Panel Assy CD Mechanism Block

Chassis (T) Assy lever Section

Servo Board

Chassis (OP) Assy Optical Pick-up Block

Main Board Heat Sink

Arm Roller Assy

2-2. CD MECHANISM BLOCK

5 CD mechanism block

2 PTT 2.6x4

7 bracket (CD)

6 PTT 2.6x4

1 PTT 2.6x

Note : Follow the disassembly procedure in the numerical order given.

2-1. SUB PANEL ASSY

4 two claws

6 sub panel assy

2-3. MAIN BOARD

6 MAIN board

5 ground point screws

(PTT 2.6x6)

4 CN401

4 ground point screw

(PTT 2.6x6)

3 PTT 2.6x

2 PTT 2.6x6

3 claw

2 PTT 2.6x4

5 CN701

1 PTT 2.6x6

1 PTT 2.6x4

1010

2-4. HEAT SINK

CDX-CA850/CA850X/CA860X

5 heat sink

3 PTT 2.6x1

2-5. CHASSIS (T) ASSY

1 Unsolder the lead wires.

2 PTT 2.6x16

1 PTT 2.6x10

4 PTT 2.6x4

2 P 2x3

3 P 2x3

4 chassis (T) assy

black

red

white

CDX-CA850/CA850X/CA860X

2-6. LEVER SECTION

lever (R) sub assy

tension spring (LR)

lever (L) sub assy

guide (disc)

PS 2x4

DISC IN board

2-7. SERVO BOARD

8 loading motor assy (M903)

claws

9 PS 2x4

5 Removal the solders.

3 CN3

7 P 2x3

1 PS 2x5

2 heat sink (CD)

7 PS 2x4

4 CN2

0 SERVO board

6 Removal the solders.

3 PS 2x3

4 LOAD board

1 tension spring (RA2)

2 arm roller assy

Fig. 1

retaining ring (roller)

arm

washer(RA)

bearing (roller)

2-8. ARM ROLLER ASSY

• When installing, take note of the positions

arm (roller) and washers. (Fig. 1)

CDX-CA850/CA850X/CA860X

2-9. CHASSIS (OP) ASSY

8 compression spring (FL)

1 tension spring (KF1)

9 compression spring (FL)

2 tension spring (KR1)

7 chassis (OP) assy

5 Fit lever (D) in the

direction of the arrow.

6 Turn loading ring in the direction of the arrow.

4 damper (T)

3 damper (T)

CDX-CA850/CA850X/CA860X

2-10. OPTICAL PICK-UP BLOCK

1 P 2x3

2 sled motor assy

(M902)

3 optical pick-up block

CDX-CA850/CA850X/CA860X

SECTION 3

DIAGRAMS

3-1. IC PIN DESCRIPTIONS

• IC501 CXD2598Q (DIGITAL SER VO, DIGITAL SIGNAL PROCESSOR) (SER VO BOARD)

Pin No. Pin Name I/O Pin Description

1 DVDD — Digital power supply pin 2 DVSS — Digital ground 3 SOUT O Servo brock serial data output (Not used.) 4 SOCK O Servo brock serial data read clock output (Not used.) 5 XOLT O Servo brock serial data latch output (Not used.) 6 SQSO O Sub Q 80 bit, PCM peak and level data output. CD TEXT data output 7 SQCK I Clock input from SQSO read output. 8 SCSY I Fixed at “L”.

9 SBSO O Serial output of sub-P to W. (Not used.) 10 EXCK I Clock input from SBSO read output. (Fixed at “L”) 11 XRST I System reset (“L”: Reset) 12 STSM I System mute input (Fixed at “L”) 13 DATA I Serial data input from CPU. 14 XLAT I Latch input from CPU. Latch serial data at the falling edge. 15 CLOK I Serial data transfer clock input from CPU. 16 SENS O SENS output for CPU. 17 SCLK I Clock input from SENS serial data read. 18 ATSK I/O Input/output for anti-shock. 19 WFCK O WFCK (Write Flame Clock) output (Not used.) 20 XUGF O XUGF output (Not used.) 21 XPCK O XPCK output (Not used.) 22 GFS O GFS output 23 C2PO O C2PO output (Not used.) 24 SCOR O “H” output at either detection, sub code sync S0 or S1. 25 C4M O 4.2336 MHz output (Not used.) 26 WDCK O Word clock input f=2Fs (Not used.) 27 COUT I/O Track number count signal input/output (Not used.) 28 MIRR I/O Mirror signal input/output (Not used.) 29 DVSS — Digital ground 30 DVDD — Digital power supply pin 31 DFCT I/O Diffect signal input/output (Not used.) 32 FOK I/O Focus OK signal output 33 PWM1 I External control input of spindle motor. 34 LOCK I/O Lock signal input/output 35 MDP O Servo control output of spindle motor. 36 SSTP I Disc most inner track detection signal input 37 FSTIO I/O 2/3 frequency division output of pins ih and ij. (Not used.) 38 SFDR O Sled drive output 39 SRDR O Sled drive output 40 TFDR O Tracking drive output 41 TRDR O Tracking drive output 42 FFDR O Focus drive output 43 FRDR O Focus drive output 44 DVDD — Digital power supply pin 45 DVSS — Digital ground 46 TEST I Test pin (Fixed at “L”) 47 TES1 I Test pin (Fixed at “L”) 48 XTSL I X’tal select input (“L”: 16.9344 MHz, “H”: 33.8688 MHz) 49 VC I Center voltage input 50 FE I Focus error signal input 51 SE I Sled error signal input

CDX-CA850/CA850X/CA860X

Pin No. Pin Name I/O Pin Description

52 TE I Tracking error signal input 53 CE I Center servo analog input 54 RFDC I RF signal input 55 ADIO O Test pin (Not used.) 56 AVSSO — Analog ground 57 IGEN I Constant current input from OP amplifier. 58 AVDDO — Analog ground 59 ASYO O EFM full-swing output (“L”: VSS, “H”: VDD) 60 ASYI I Asymmetry comparate voltage input 61 RFAC I EFM signal input 62 AVSS3 — Analog ground 63 CLTV I VCO control voltage input from master. 64 FILO O Filter output for master PLL (slave=digital PLL) 65 FILI I Filter input from master PLL. 66 PCO O Charge pump output for master PLL. 67 AVDD3 — Analog power supply pin 68 BIAS I Asymmetry circuit constant current input 69 VCTL I VCO2 control input from wideband EFM PLL. (Not used.) 70 V16M O VCO2 oscillator output for wideband EFM PLL. (Not used.) 71 VPCO O Charge pump output for wideband EFM PLL. (Not used.) 72 DVSS — Digital ground 73 MD2 I Digital out ON/OFF control input (“L”: OFF, “H”: ON) 74 DOUT O Digital out output 75 ASYE I Asymmetry circuit ON/OFF input (“L”: OFF, “H”: ON) 76 DVDD — Digital power supply pin 77 LRCK O D/A interface LR clock output (f=Fs) 78 LRCKI I D/A interface LR clock input 79 PCMD O D/A interface serial data output (2’s COMP, MSB fast) 80 PCMDI I D/A interface serial data input (2’s COMP, MSB fast) 81 BCK O D/A interface bit clock output 82 BCKI I D/A interface bit clock input 83 EMPH O Emphasis ON/OFF signal output 84 EMPHI I Emphasis ON/OFF signal input (“H”: ON, “L”: OFF) 85 XVDD — Power supply for master clock. 86 XTAI I X’tal oscillator input from master clock (16.9344 MHz). 87 XTAO O X’tal oscillator output for master clock (16.9344 MHz). 88 XVSS — Ground pin for master clock. 89 AVDD1 — Analog power supply pin 90 AOUT1 O Lch analog output 91 AIN1 I Lch OPAMP input 92 LOUT1 O Lch LINE output 93 AVSS1 — Analog ground 94 AVSS2 — Analog ground 95 LOUT2 O Rch LINE output 96 AIN2 I Rch OPAMP input 97 AOUT2 O Rch analog output 98 AVDD2 — Analog power supply pin 99 RMUT O Rch “0” detect Flug (Not used.)

100 LMUT O Lch “0” detect Flug (Not used.)

CDX-CA850/CA850X/CA860X

• IC5 CXP84640-072Q (CD SYSTEM CONTROL) (SERVO BOARD)

Pin No. Pin Name I/O Pin Description

1 ITRPT — Not used in this set.

2, 3 — — Not used in this set. 4, 5 NCO — Not used in this set.

6 OPEN I Front panel open detection input

7 CLOSE O Front panel close control output

8 LINKOFF I Bus interface link input

9 NCO — Not used in this set. 10 D SW I Down switch input (SW4) 11 SSTP I Limit switch input (SW3)

12, 13 NCO — Not used in this set. 14, 15 — — Not used in this set.

16 EMPH O O De-emphasis ON/OFF control output 17 CDMON O CD mechanism deck power control output 18 CD ON O CD power control output 19 A MUT O System attenuate control output 20 LD ON O Laser power ON/OFF control output 21 CD RST O CD system reset output 22 HOLD O Hold switch output 23 AGC CONT O AGC control output 24 — — Not used in this set. 25 PH3 I Not used in this set. 26 TSTIN0 I Not used in this set. 27 TSTIN1 I Not used in this set. 28 TST.CLV I Not used in this set. 29 NCO — Not used in this set. 30 RESET I System reset input (“L”=Reset) 31 X IN I X’tal oscillator input from system clock. (10 MHz) 32 X OUT O X’tal oscillator output for system clock. (10 MHz) 33 GND — Analog ground 34 XT OUT O Not used in this set. 35 XT IN I Not used in this set. 36 AVSS — A/D converter ground 37 AVREF I A/D converter reference voltage input 38 TEP L I Not used in this set. 39 TEP H I Not used in this set. 40 SLED– I Sled drive input 41 PH2 I Not used in this set. 42 SEK/SMET I Fixed at “H” in this set. 43 GFS/MNT2 SEL I Fixed at “H” in this set. 44 SC-JIG ON/OFF I Fixed at “H” in this set. 45 SCLK O CD-TEXT data read clock output 46 LOCK I/O Lock signal input/output 47 — — Not used in this set. 48 SCK2 O Sub Q read clock output 49 SI2 I Sub Q 80 bit, PCM peak and level data 16 bit input. 50 — — Not used in this set. 51 BUS CLK I/O Bus system serial clock input/output 52 BUS SI I Bus system serial interface input 53 BUS SO O Bus system serial interface output 54 F OK I Focus OK signal input 55 GFS I GFS signal detection input 56 TEST MODE I Fixed at “H” in this set.

CDX-CA850/CA850X/CA860X

Pin No. Pin Name I/O Pin Description

57 SENS I SENS signal input 58 — — Not used in this set. 59 — — Not used in this set. 60 BU.IN I Back-up power detection input 61 BUSON I Bus on control input 62 IN SW I Disc in switch input (SW1) 63 SELF SW I Self switch input (SW2) 64 SCOR O Sub-code sync output 65 CD-CKO O CD signal process serial clock input 66 LM LOD O Loading motor control output 67 CD DATA O CD signal process serial data output 68 CD-XLAT O CD signal process serial data latch output 69 LM-EJ O Loading motor control output 70 DRV-OE O Focus/tracking coil/sled motor control output 71 MD2 O Digital out ON/OFF control output (“L”: OFF, “H”: ON) 72 VDD — Power supply pin 73 NIH I Fixed at “H” in this set. 74 V/Z I Fixed at “H” in this set. 75 PH1 I Not used in this set. 76 — — Not used in this set. 77 DOUT-SEL I Fixed at “H” in this set.

78 – 80 — — Not used in this set.

+ 42 hidden pages

Sony CDX-CA850, CDX-CA850X, CDX-CA860X Service manual

SERVICE NOTES

TABLE OF CONTENTS

GENERAL

DISASSEMBLY

5 CD mechanism block

6 sub panel assy

6 MAIN board

5 heat sink

4 chassis (T) assy

0 SERVO board

2 arm roller assy

7 chassis (OP) assy

3 optical pick-up block

DIAGRAMS