Sony CDX-505RF, CDX-EXCD-3RF Service Manual
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CDX-505RF/EXCD-3RF
US Model
SERVICE MANUAL
Ver 1.1 2001.08
Photo: CDX-505RF
Canadian Model
CDX-505RF/EXCD-3RF
AEP Model
UK Model
E Model
CDX-505RF
CD changer
System Compact disc digital audio system
Laser Diode Properties
Material: GaAlAs
Wavelength: 780 nm
Emission Duration: Continuous
Laser out-put Power: Less than 44.6 µW*
* This output is the value measured at a distance of 200
mm from the objective lens surface on the Optical Pick-
up Block.
Frequency response 10-20,000 Hz
Wow and flutter Below than the measurable limit
Signal-to-noise ratio 94 dB
Outputs terminals BUS control output terminal (8 pin)
Analog audio output terminal (RCA pin)
Current drain 800 mA (at playback)
800 mA (at disc loading/ejecting)
Operating temperature
–10 ºC to +55 ºC (14 ºF to 131 ºF)
Dimensions Approx. 262 × 90 × 181.5 mm
(12 1/8 × 3 5/8 × 7 1/8 in.) (w/h/d)
Mass Approx. 2.1 kg (4 lb. 10 oz.)
SPECIFICATIONS
Hideaway unit / Wired remote (RM-X57) (CDX-505RF) / Wired
remote (RM-X64) (EXCD-3RF) / Wireless remote (RM-X58)
(CDX-505RF ONLY)
Frequency 88.3 MHz/88.5 MHz/
Dimension Hideaway unit :
Mass Hideaway unit:
Supplied accessories
Model Name Using Similar Mechanism NEW
CD Drive Mechanism Type
Optical Pick-up Name
88.7 MHz/88.9 MHz/
89.1 MHz/89.3 MHz/
89.5 MHz/89.7 MHz/
89.9 MHz/ (switchable)
Approx. 124.8 × 30.0 × 99.8 mm
(5 × 1 3/16 × 4 in.) (w/h/d)
Wired remote:
Approx. 148 × 30 × 15 mm
(5 7/8 × 1 3/16 × 9/32 in.) (w/h/d)
Wireless remote:
Approx. 38.4 × 6.4 × 84.4 mm
(1 9/16 × 9/32 × 3 3/8 in.) (w/h/d)
Approx. 330 g (11.64 oz.)
Wired remote:
Approx. 120 g (4.2 oz.)
Wireless remote:
Approx. 20 g (0.7 oz.)
Disc magazine (1)
Parts for installation and connections (1 set)
Lithium battery (CR2025) (1)
MG-250A-137
KSS-521A/J2RP
COMPACT DISC CHANGER SYSTEM
9-925-526-12 Sony Corporation
2001H0500-1 e Vehicle Company
C 2001.8 Shinagawa Tec Service Manual Production Group
Design and specifications subject to change without notice.
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SERVICING NOTES
TABLE OF CONTENTS
1. GENERAL
Installation ......................................................................... 4
Connections ....................................................................... 5
Location and Function of Controls .................................... 8
2. DISASSEMBLY............................................................ 9
3. ELECTRICAL ADJUSTMENTS ........................... 15
4. DIAGRAMS
4-1. Printed W iring Board – RF Section –................................ 17
4-2. Schematic Diagram – RF Section –................................... 19
4-3. Schematic Diagram – MAIN Section –............................. 23
4-4. Printed W iring Board – MAIN Section – .......................... 27
4-5. IC Pin Function Description.............................................. 33
5. EXPLODED VIEWS ................................................... 35
6. ELECTRICAL PARTS LIST .................................... 41
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
Laser Diode Properites
• Material: GaAlAs
• Wavelength: 780 nm
• Emission Duration: continuous
• Laser Output Power: less than 44.6 µW*
* This output is the value measured at a distance of 200 mm
from the objective lens surface on the Optical Pick-up Block.
CAUTION
Use of controls or adjustments or performance of
procedures other than those specified herein may
result in hazardous radiation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED
LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANU AL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE !
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
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DISC MAGAZINE GETTING OUT PR OCEDURE ON THE
POWER SUPPLY IS OFF
Remove the CASE (LOWER) assembly beforehand
1) Press the lever (stop) assy to arrow direction.
2) Removal the magazine assy.
Note: T ake out the magazine only when the tray is completely within
the magazine. If the disk or tray is sticking out, turn on the
power and eject the magazine.
Lever (stop) ass’y
Magazine ass’y
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the
manufacturer.
Discard used batteries according to the manufacturer’s instructions.
ADVARSEL!
Lithiumbatteri-Eksplosionsfare ved fejlagtig håndtering.
Udskiftning må kun ske med batteri
af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Eksplosjonsfare ved feilaktig skifte av batteri.
Benytt samme batteritype eller en tilsvarende type
anbefalt av apparatfabrikanten.
Brukte batterier kasseres i henhold til fabrikantens
instruksjoner.
VARNING
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en ekvivalent typ som
rekommenderas av apparattillverkaren.
Kassera använt batteri enligt fabrikantens instruktion.
SECTION 1
GENERAL
This section is extracted from
CDX-505RF’s instruction manual.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
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SECTION 2
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
COVER (UPPER), FRONT PANEL ASS’Y
1
1
screw
(PTT2.6 × 6)
3
lever (FL)
screw
(PTT2.6
×
6)
1
screw
(PTT2.6
×
6)
2
case (upper)
3
1
screw
(PTT2.6
lever (FL)
×
6)
MECHANISM DECK
1
two dampers (250)
4
front panel ass’y
2
spring (FL)
1
screw
(PTT2.6
4
mechanism deck
×
6)
2
spring (FL)
3
jack flexible board
(CN901)
– 9 –
1
two dampers (250)
JACK BOARD
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Remove the jack board of
the arrow.
MAIN BOARD
1
screw
(BVTT2.6 × 5)
2
jack board
1
main flexible board
(CNJ12)
6
three screws
(ground)
7
main board
2
connector
(CNP301)
5
two screws
(P2 × 2.5)
– 10 –
4
heat sink
3
screw
(B2 × 3)
ELEVATOR MOTOR ASS’Y (M104)
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screw
1
(P2 × 2.2)
2
bracket (ELV motor)
3
elevator motor ass’y
ESCUTCHEON
2
Remove the claw
of the arrow A.
4
Remove the ditch
of the arrow B.
5
Remove the escutcheon
of the arrow C.
B
A
4
C
ditch
1
3
screw
(M2 × 3)
two claws
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CASE (UPPER) ASS’Y
1
three screws
(B2
×
3)
4
Remove the case
(upper) ass’y of the
arrow B.
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2
B
A
3
Remove the edge
of the arrow
A
.
1
two screws
(B2 × 3)
CHASSIS ASS’Y
1
screw
(B2 × 3)
3
chassis ass‘y
2
1
two polyethylene washers
1
polyethylene washer
2
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