Sony CDP-CE275, CDP-CE375 Service manual
CDP-CE275/CE375
SERVICE MANUAL
Ver 1.0 2001.04
Photo: CDP-CE375
US Model
Canadian Model
CDP-CE275/CE375
AEP Model
UK Model
E Model
CDP-CE375
Australian Model
CDP-CE275/CE375
Model Name Using Similar Mechanism CDP-CE345
CD Mechanism Type CDM59-5BD27
Base Unit Name BU-5BD27
Optical Pick-up Name PXR-104X
Compact disc player
Laser Semiconductor laser ( λ = 780 nm)
Emission duration : continuous
Frequency response 2 Hz to 20 kHz ± 0.5 dB
Dynamic range More than 93 dB
Harmonic distortion Less than 0.0045%
Outputs
Jack Maximum Load
type output level impedance
ANALOG Phono 2 V Over 10
OUT jacks (at 50 kilohms) kilohms
DIGITAL Optical –18 dBm Wave
OUT output length:
(OPTICAL) connector 660 nm
PHONES Stereo 10 mW 32 ohms
(CDP-CE375 phone
only) jack
SPECIFICATIONS
General
Power requirements 120 V AC, 60 Hz
Power consumption 11 W
Dimensions (approx.) 430 x 110 x 400 mm
(w/h/d) (17 x 4 3/8 x 15 3/4 in.)
incl. projecting parts
Mass (approx.) 5 kg (11 lbs 1 oz)
Supplied accessories
Audio cord (2 phono plugs – 2 phono plugs) (1)
Remote commander (remote) (1) (CDP-CE375 only)
R6 (size AA) batteries (2) (CDP-CE375 only)
Design and specifications are subject to change without notice.
9-873-822-11
2001D0900-1
© 2001. 4
COMPACT DISC PLAYER
Sony Corporation
Audio Entertainment Group
General Engineering Dept.
CDP-CE275/CE375
TABLE OF CONTENTS
1. SERVICING NOTES ............................................... 3
2. GENERAL ................................................................... 4
3. DISASSEMBLY ......................................................... 5
4. DIAGRAMS
4-1. Note for Printed Wiring Boards
and Schematic Diagrams ................................................ 11
4-2. Printed Wiring Board – BD Board – ............................. 12
4-3. Schematic Diagram – BD Board – ................................ 13
4-4. Printed Wiring Boards – JUNCTION/SENSOR/
LOADING MOTOR Boards –........................................ 14
4-5. Schematic Diagram – JUNCTION/SENSOR/
LOADING MOTOR Boards –........................................ 15
4-6. Printed Wiring Board – MAIN Board – ........................ 16
4-7. Schematic Diagram – MAIN Board –........................... 17
4-8. Printed Wiring Boards – PANEL Section – .................. 18
4-9. Schematic Diagram – PANEL Section –....................... 19
4-10. IC Pin Function Description ........................................... 22
5. EXPLODED VIEWS ................................................ 26
6. ELECTRICAL PARTS LIST ............................... 31
SAFETY CHECK-OUT
After correcting the original service problem, perform the following safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT -540A. Follow the man ufacturers’ instructions to use these
instruments.
2. A battery-operated A C milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate lowvoltage scale. The Simpson 250 and Sanwa SH-63T rd are e xamples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2 V A C range are suitable. (See Fig. A)
To Exposed Metal
Parts on Set
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
AC
1.5 k
0.15 µF
Fig. A. Using an AC voltmeter to check AC leakage.
Ω
Earth Ground
voltmeter
(0.75 V)
ATTENTION AU COMPOSANT AYANT RAPPORT
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMA TIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
À LA SÉCURITÉ!
2
SECTION 1
table
tapering driver
*To close the disc table, turn the tapering
driver in the reverse direction (to IN direction).
gear (U/D)
gear (RV)
gear, swing
SERVICING NOTES
CDP-CE275/CE375
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
HOW T O OPEN THE DISC T ABLE WHEN PO WER
SWITCH TURNS OFF
Insert a tapering driver into the aperture of the unit bottom, and
turn it in the direction of the arrow (to OUT direction).
NOTE FOR MAIN GEAR INSTALLATION
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
MODEL IDENTIFICATION
– BACK PANEL –
Part No.
Model Part No.
CDP-CE275: US model 4-233-719-0s
CDP-CE275: Canadian model 4-233-719-1s
CDP-CE275: Australian model 4-233-719-2s
CDP-CE375: US model 4-233-718-0s
CDP-CE375: Canadian model 4-233-718-1s
CDP-CE375: AEP model 4-233-718-2s
CDP-CE375: UK model 4-233-718-3s
CDP-CE375: Australian model 4-233-718-4s
CDP-CE375: E model 4-233-718-5s
CDP-CE375: Singapore model 4-233-718-6s
3
CDP-CE275/CE375
• LOCATION OF CONTROLS
– Front panel –
SECTION 2
GENERAL
1
2
w;
ws
wa
1 POWER button
2 DISC1 – DISC5 button
3 Fluorescent indicator tube display
4 H button
5 X button
6 x button
7 EX-CHANGE button
8 DISC SKIP button
9 l AMS L control
0 A OPEN/CLOSE button
qa PHONES jack
ql
qk
3
qj
qs CLEAR button
qd CHECK button
qf EDIT button
qg M button
qh m button
qj Disc table
qk TIME button
ql REPEAT button
w; FADER button
wa PEAK SEARCH button
ws PLAY MODE button
4
qh
5
qg
6
qf
7
qd
8
qs
9
0
qa
– Rear panel –
1
1 DIGITAL OUT OPTICAL connector
2 ANALOG OUT
4
2
• The equipment can be removed using the following procedure.
CDP-CE275/CE375
SECTION 3
DISASSEMBLY
Set Case Front Panel Assy
Base Unit (BU-5BD27) Optical Pick-up
Tray, Table Assy
Note: Follow the disassembly procedure in the numerical order given.
CD Mechanism Block
Sensor Board
Jnuction Board, Loading Motor Board
3-1. CASE
two screws
2
(case 3TP2)
7
panel, loading
3
two screws
(BVTP 3x8)
4
case
6
1
two screws
(case 3TP2)
5
5
CDP-CE275/CE375
3-2. FRONT PANEL ASSY
7 claw
8 front panel assy
1 CN601
2 CN602
3 CN301
4 CN351
6 claw
5 three screws
(BVTP 3x8)
3-3. CD MECHANISM BLOCK (CDM59-5BD27)
4 two screws
(BVTP 3x8)
5 tray
6 two screws
(BVTP 3x8)
7 CDM59-5BD27
3 three screws
(BVTP 3x8)
2 CN311
1 CN302
6
3-4. BASE UNIT (BU-5BD27)
P
3 two screws
(+PTPWHM 2.6),
floating
CDP-CE275/CE375
2 two screws
(+PTPWHM 2.6), floating
7 base unit (BU-5BD27)
3-5. TRA Y , T ABLE ASSY
6 spring (932),
compression
4 holder (BU) assy
8 screw
(+PTPWHM 2.6), floating
5 spring (932),
compression
1 two screws
(+PTPWHM 2.6), floating
9 tray
5
1 two screws
(M 2.6), +BTTP
7 table assy
2 bracket (guide)
6 CN15
3 three screws
(M 2.6), +BTT
4 bracket (guide)
7
CDP-CE275/CE375
d
d
3-6. SENSOR BOARD
1 belt (rotary)
table assy
4 SENSOR boar
3 two screws
3-7. JUNCTION BO ARD , LO ADING MOTOR BOARD
6 two screws
(M 2.6), +BTTP
7 LOADING MOTOR board
2 two screws
(M 2.6), +BTTP
(M 2.6), +BTTP
4 JUNCTION boar
2 CN13
5 belt (loading)
1 CN14
3 three screws
(M 2.6), +BTTP
8
3-8. OPTICAL PICK-UP
r
CDP-CE275/CE375
2 shaft, sled
3 optical pick-up
1
4 connecto
9
CDP-CE275/CE375
MEMO
10
SECTION 4
d
DIAGRAMS
CDP-CE275/CE375
4-1. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Indication of transistor
Q
B
CE
These are omitted.
Q
B
CE
These are omitted.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
f
•
• C : panel designation.
Note:
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part
number specified.
• Voltages and waveforms are dc with respect to ground
• Voltages are taken with a VOM (Input impedance 10 MΩ).
• Waveforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
• Signal path.
• A: B+ Line
• B: B– Line
: internal component.
under no-signal conditions.
no mark : CD PLAY
Voltage variations may be noted due to normal production tolerances.
Voltage variations may be noted due to normal production tolerances.
J : CD PLAY
c : DIGITAL OUT
4
Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro
spécifié.
W or less unless otherwise
• Circuit Boards Location
LOADING MOTOR board
POWER SW board
KEY board
SENSOR board
BD board
JUNCTION board
MAIN boar
DISPLAY board
HEADPHONE board
1111
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