SIEMENS S88 Service Manual Level 1-3
Release 1.0
Service Manual
S88
Level 1-3
Release Date Department Notes to change
R 1.0 15.02.2006 BenQ Mobile CC S CES New document
Technical Documentation
TD_Repair_L2.5L_S88_R1.0.pdf Page 1 of 61
Company Confidential
2006©BenQ
02/2006
Release 1.0
Table of Content
1 Key Feature................................................................................................................................3
2 Unit Description of S88.............................................................................................................4
3 Exploded View of S88 ...............................................................................................................5
4 Disassembly of S88...................................................................................................................6
5 Assembly of S88......................................................................................................................20
6 BenQ Service Equipment User Manual.................................................................................31
7 Setup of the Software..............................................................................................................32
8 Software basic settings ..........................................................................................................33
9 Software Download procedure...............................................................................................34
10 Download PPF (Handset configuration)................................................................................36
11 Backup and Restore of Wap and Network Setting...............................................................38
12 Backup and Restore of Media Center content......................................................................39
13 Unlock Tool..............................................................................................................................40
14 International Mobile Equipment Identity, IMEI......................................................................42
15 General Testing Information...................................................................................................43
16 Introduction of Service Repair Documentation Level 3 (basic) – S88.............................49
17 List of available Level 3 (basic) parts....................................................................................50
18 Hardware requirements ..........................................................................................................50
19 S88 Board Layout....................................................................................................................51
20 SIM Card Problems .................................................................................................................52
21 IO Connector Problems ..........................................................................................................53
22 Battery Connector Problems.................................................................................................. 54
23 RF Antenna Problems.............................................................................................................55
24 Micro SD Connector Problems...............................................................................................56
25 Camera Connector Problems.................................................................................................57
26 Display Problems ....................................................................................................................58
27 Charger Problems ...................................................................................................................59
28 Keypad Problems....................................................................................................................60
29 Flash light Problems...............................................................................................................61
Technical Documentation
TD_Repair_L2.5L_S88_R1.0.pdf Page 2 of 61
Company Confidential
2006©BenQ
02/2006
Release 1.0
1 Key Feature
System
Battery
Stand – by Time
Talking Time
Memory
External Memory
Display
Keypad
Function key
Camera
Connectivity
FM Radio
Camcorder
MP3 – Player
• Tri-band handset (GSM900/DCS1800/PCS1900) or
(GSM850/DCS1800/PCS1900) with internal antenna
• Li – Ion 920mAh battery
• Up to 200 hours
• 130min~450min
• NOR flash: 128MB
• NAND flash: 256MB
• Pseudo SRAM: 64MB
• Mobile SDRAM: 128MB
• Micro SD/Transflash
• Display mode: Active Matrix, OLED
• Active area: 31.152mm x 38.94mm
• Pixel pitch: 0.177mm x 0.177mm
• Number of Colours: 260K
• 12 numerical key (including *,#)
• 5-way navigation key
• Soft keys: Left and Right
• Send key
• End/Power key
• Side keys:
o Volume keys
o Camera/Video mode switch button
o Camera shutter button
• 2.0 mega pixel; CMOS Auto Focus camera for image and
video recording
• USB 1.1; Bluetooth
• Embedded in Mobile Phone
• Support MPEG 4/ 3GP
• Support MP3/AAC
• Equalizer
Technical Documentation
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02/2006
Release 1.0
2 Unit Description of S88
Technical Documentation
TD_Repair_L2.5L_S88_R1.0.pdf Page 4 of 61
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02/2006
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3 Exploded View of S88
Rear Cover
Side Screw
Battery Cover
Camera Frame
Ringer
Camera
Flex Cable
Adhesive Strip
Display
Earpiece
Battery
Screws
Lower Case
Vibramotor
Flash light
RF Control
Joystick
Keypad MMI
Flexible Keypad
Dome Keypad
Keypad
Display Cover
Technical Documentation
TD_Repair_L2.5L_S88_R1.0.pdf Page 5 of 61
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Upper Case
Shell
Key Shutter
02/2006
Release 1.0
4 Disassembly of S88
All repairs as well as disassembling and assembling have to be carried out in an ESD
protected environment and with ESD protected equipment/tools. For all activities the
international ESD regulations have to be considered.
For more details please check information in c – market
https://market.benqmobile.com/SO/welcome.lookup.asp
There you can find the document “ESD Guideline”.
Step 1
Step 2
Remove Battery
Cover.
Technical Documentation
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Step 3
Step 4
Remove Battery.
Step 5
Open Handset – Cover to remove Side
Screw. Use the Torque – Screwdriver T5.
Technical Documentation
TD_Repair_L2.5L_S88_R1.0.pdf Page 7 of 61
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02/2006
Release 1.0
Step 6
Step 7
Remove Screw.
Remove Camera Cover by using Alternative
Opening Tool carefully.
Step 8
Technical Documentation
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Step 9
Step 10
Remove screws with the Torque –
Screwdriver.
T5
Remove Lower Case Shell from Upper
Case Shell with Alternative Opening Tool.
Be very careful.
Step 11
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Step 12
Step 13
Remove Ringer by using Tweezers.
Remove Vibramotor by using Tweezers.
Step 14
Use Tweezers to disconnect the Flex Cable
from the RF Control Board sockets.
Technical Documentation
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02/2006
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Step 15
Step 16
Pull the Memory Card Cover forward to
remove the RF Control Board.
Step 17
Remove RF Control Board from Lower
Case with Alternative Opening Tool
carefully.
Technical Documentation
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Step 18
Step 19
Disconnect the Adhesive Strip with Flex
Cable from the RF Control Board by using
Tweezers carefully.
Step 20
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Step 21
Step 22
Step 23
Disconnect Flash light Flex Cable from
Camera Frame. Take care of the Flex
Cable!!!
Technical Documentation
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Step 24
Step 25
Remove Camera with Camera Frame by
pressing the hooks together.
Step 26
Disassemble Camera Frame from Camera.
Technical Documentation
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Step 27
Step 28
Remove Joystick by using Tweezers.
Step 29
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Step 30
Remove Microphone Shielding by using
Tweezers carefully.
Step 31
Step 32
Remove the Flash light Flex Cable from the
RF Control Board. Use Tweezers very
carefully!
Remove the Display by using the
Alternative Opening Tool.
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Step 30
To avoid scratches it is mandatory to place
a protection foil onto the Display!!!
Step 31
Step 32
Use Alternative Opening Tool to remove the
Keypad MMI.
Remove Keypad by using Alternative
Opening Tool.
Technical Documentation
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Step 33
Step 34
Step 35
Remove the Side Keys by pushing them
outside the frames.
Technical Documentation
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Company Confidential
2006©BenQ
02/2006
Release 1.0
Step 36
Step 37
Step 38
Remove Camera – Video - Key by using
Tweezers.
Remove the Earpiece with the Alternative
Opening Tool.
Technical Documentation
TD_Repair_L2.5L_S88_R1.0.pdf Page 19 of 61
Company Confidential
2006©BenQ
02/2006
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